Case with high heat dissipation performance

Abstract

The utility model discloses a case with high heat dissipation performance, which relates to the technical field of industrial control cases and comprises an aluminum case, the aluminum case comprises a case bottom shell, a circuit board and a CPU (central processing unit), the circuit board and the CPU are mounted in the aluminum case, a heat dissipation fan is arranged above the CPU, heat dissipation fins which are arranged in parallel are fixedly mounted at the top of the aluminum case, and the heat dissipation fins are fixedly mounted at the bottom of the aluminum case. And a fan flow guide cover is fixedly mounted above the heat dissipation fins. Heat generated by the CPU / GPU can be rapidly conducted to the case shell through the aluminum case and the copper heat dissipation fins, the passive heat dissipation effect is achieved, the heat dissipation fan is integrated near the position above the heating part CPU, heat discharge is accelerated through forced airflow, the active heat dissipation effect is achieved, the heat conduction efficiency is improved, and the heat dissipation efficiency is improved. Through the combination of the passive heat dissipation mode and the active heat dissipation mode, more efficient heat dissipation can be achieved in a limited space, and the stability of equipment during high-load operation is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to industrial computer case technical field, concretely is a case with high heat dissipation. BACKGROUND

[0002] The case is a part of the industrial computer accessories, mainly places and fixes each industrial computer accessory, plays a supporting and protection effect, it is known that the heat dissipation design is a very important problem in the design of the industrial computer case, and the quality of heat dissipation directly influences the working performance of the mainboard, CPU and other internal components of the industrial computer, especially with the rapid development of high-tech industry, the operation speed of CPU is continuously greatly improved, makes its heat release also greatly increases, makes the designer more attention to the improvement of the heat dissipation device in the case.

[0003] The traditional case heat dissipation is passive: completely depends on the heat conduction of the case material (aluminum alloy), the heat dissipation fin or natural convection, and the heat dissipation efficiency is strictly limited by the ambient temperature, space layout and heat source power, and it is difficult to cope with high-power chips or intensive operation scenarios. The heat dissipation capacity is insufficient;Long time full load operation, the surface of the case and each electronic component temperature is higher, can reduce the product service life. Therefore, the utility model provides a case with high heat dissipation performance. UTILITY MODEL CONTENT

[0004] Technical problem solved

[0005] The utility model aims at making up for the deficiency of prior art, and provides a case with high heat dissipation performance.

[0006] Technical scheme

[0007] In order to realize the above-mentioned purpose, the utility model provides the following technical scheme: a case with high heat dissipation performance, including aluminum case, the aluminum case includes case bottom shell, still including the circuit board and CPU installed in the aluminum case, the CPU top is provided with the cooling fan, the top of the aluminum case is fixedly installed with the parallel arrangement heat dissipation fin, the heat dissipation fin top is fixedly installed with the fan flow guide cover, the heat generated by CPU / GPU can be quickly conducted to the case shell through the aluminum case and copper heat dissipation fin, the passive heat dissipation effect is reached, the heat dissipation fan is integrated near the top of the heating component CPU, and the heat is discharged through forced air flow, the active heat dissipation effect is reached, the heat conduction efficiency is improved, through the combination of the passive heat dissipation and active heat dissipation two ways, more efficient heat dissipation can be realized in limited space, and the stability of equipment when running under high load is guaranteed.

[0008] Preferably, the heat dissipation fin top is further provided with a through hole, and the through hole top is provided with a flow guide groove for installing the fan flow guide cover.

[0009] Preferably, the heat dissipation fin is made of copper material, the upper side of the heat dissipation fin is fixedly connected with a fixing sleeve, the fan flow guide cover is provided with a mounting hole, and a screw penetrates through the fixing sleeve and is screw-connected in the mounting hole.

[0010] Preferably, the aluminum case further comprises a case side shell fixedly connected with the case bottom shell, and a plurality of data connectors of different interfaces are mounted in the case side shell and electrically connected with the circuit board.

[0011] Preferably, the heat dissipation fan is integrated on the heat dissipation fin, and the fan supports multi-grade speed regulation.

[0012] Preferably, the temperature sensor for monitoring the hardware temperature in real time is further arranged, the output end of the temperature sensor is electrically connected with the circuit board, and the circuit board is further electrically connected with the heat dissipation fan for dynamically starting and stopping the fan or adjusting the rotating speed.

[0013] Preferably, the heat dissipation fin is made of copper material, the upper side of the heat dissipation fin is fixedly connected with a fixing sleeve, the fan flow guide cover is provided with a mounting hole, and a screw penetrates through the fixing sleeve and is screw-connected in the mounting hole.

[0014] Beneficial effects:

[0015] Compared with the prior art, the case with high heat dissipation performance has the following beneficial effects:

[0016] The aluminum case and the copper heat dissipation fin can quickly conduct the heat generated by the CPU / GPU to the case shell, so that the passive heat dissipation effect is achieved, the heat dissipation fan is integrated near the CPU, the forced air flow is accelerated to discharge the heat, so that the active heat dissipation effect is achieved, the heat conduction efficiency is improved, the passive heat dissipation and the active heat dissipation are combined, higher heat dissipation efficiency can be achieved in the limited space, the stability of the equipment under high load is ensured, and the temperature sensor is further arranged to monitor the hardware temperature in real time, dynamically start and stop the fan or adjust the rotating speed, so that the heat dissipation efficiency is improved, and the energy saving property of the case is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the heat dissipation fins of this utility model;

[0020] Figure 3 This is a schematic diagram of the through hole structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the heat dissipation fins of this utility model;

[0022] Figure 5 This is a schematic diagram of the cooling fan of this utility model;

[0023] Figure 6 This is a schematic diagram of the installation structure of the fan guide cover of this utility model.

[0024] In the picture:

[0025] 1. Aluminum chassis; 2. Heat sink fins; 3. Fan airflow cover; 4. Cooling fan; 5. Screws; 6. Two screws; 101. Chassis bottom shell; 102. Chassis side shell; 103. Data connector; 104. Through hole; 201. Through hole; 202. Airflow channel; 203. Fixing sleeve; 204. Mounting hole; 301. Mounting hole. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figures 1-6 As shown, this utility model provides a technical solution: a high heat dissipation chassis, including an aluminum chassis 1, the aluminum chassis 1 including a chassis bottom shell 101, and a circuit board 7 and a CPU installed inside the aluminum chassis 1. A cooling fan 4 is provided above the CPU. The fan is a multi-speed adjustable cooling fan (e.g., low speed 2000RPM, high speed 3300RPM), with an airflow of up to 151.87CFM and noise controlled below 48dBA. The cooling fan 4 is integrated and fixed on the heat dissipation fins 2, and the fan supports multi-speed adjustment. Parallel heat dissipation fins 2 are fixedly installed on the top of the aluminum chassis 1, and a fan guide cover 3 is fixedly installed above the heat dissipation fins 2. This utility model also includes a temperature sensor for real-time monitoring of hardware temperature. The output terminal of the temperature sensor is electrically connected to the circuit board, and the circuit board is electrically connected to the cooling fan 4 for dynamically starting and stopping the fan or adjusting its speed.

[0028] Please refer to Figure 2 , the aluminum case 1 further comprises a case side shell 102 fixedly connected with the case bottom shell 101, and a plurality of data connection heads 103 of different interfaces are installed inside the case side shell 102 and electrically connected with the circuit board.

[0029] Please refer to Figure 2 , Figure 3 and Figure 4 , a through hole 201 is further arranged above the heat dissipation fin 2, a flow guide groove 202 for mounting the fan flow guide cover 3 is arranged above the through hole 201, the heat dissipation fin 2 is made of copper material, and a fixing sleeve 203 is fixedly connected above the heat dissipation fin 2.

[0030] Please refer to Figure 6 , the fan flow guide cover 3 is provided with a mounting hole 301, and the screw 5 penetrates the fixing sleeve 203 and is threadedly connected in the inside of the mounting hole 301.

[0031] Please refer to Figure 2 and Figure 4 , mounting holes 204 are arranged on both sides of the heat dissipation fin 2, and through holes 104 corresponding to the mounting holes 204 are arranged in the inside of the case side shell 102, and the screw 2 6 penetrates the through hole 104 and is threadedly connected in the inside of the mounting hole 204.

[0032] Working principle: the aluminum case 1 and the copper heat dissipation fin 2 can quickly conduct the heat generated by the CPU / GPU to the case shell for passive heat dissipation, the thermal conductivity coefficient of copper is as high as 401 W / (m·K) (aluminum is 237 W / (m·K)), the heat conduction efficiency is higher, the heat generated by the CPU during work can be transmitted to the case, and the embedded heat dissipation fan can quickly conduct the heat out; the heat dissipation fan 3 is integrated above the CPU, the heat dissipation fan 3 is directly integrated in the case heat dissipation fin by using a micro fan (56mm turbine fan), forced air flow directional heat dissipation, compared with pure passive heat dissipation, the efficiency is improved by 2-3 times, the heat is accelerated to be discharged through forced air flow, active heat dissipation is achieved, through the combination of passive heat dissipation and active heat dissipation, higher efficiency heat dissipation is realized in the limited space, the stability of the equipment during high load operation is ensured, passive heat dissipation is relied on during low load, the fan is started and the rotating speed is increased during high load; in addition, the utility model further comprises a temperature sensor for monitoring the hardware temperature in real time, dynamically starting and stopping the fan or adjusting the rotating speed, the energy saving property of the utility model is ensured on the premise of improving the heat dissipation efficiency.

[0033] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0034] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A high heat dissipation performance cabinet comprising an aluminum cabinet (1), characterized in that: The aluminum case (1) comprises a case bottom shell (101), further comprises a circuit board and a CPU installed inside the aluminum case (1), a cooling fan (4) is arranged above the CPU, parallel arranged heat dissipation fins (2) are fixedly installed on the top of the aluminum case (1), and a fan flow guide cover (3) is fixedly installed above the heat dissipation fins (2).

2. The high heat dissipation performance case according to claim 1, characterized in that: A through hole (201) is further arranged above the heat dissipation fins (2), and a flow guide groove (202) for installing the fan flow guide cover (3) is arranged above the through hole (201).

3. The high heat dissipation performance case of claim 1, wherein: The heat dissipation fins (2) are made of copper material, a fixing sleeve (203) is fixedly connected above the heat dissipation fins (2), a mounting hole (301) is arranged in the fan flow guide cover (3), and a screw (5) penetrates through the fixing sleeve (203) and is screw-connected in the mounting hole (301).

4. The high heat dissipation performance case of claim 1, wherein: The aluminum case (1) further comprises a case side shell (102) fixedly connected with the case bottom shell (101), a plurality of data connectors (103) with different interfaces are installed in the case side shell (102), and the data connectors (103) are electrically connected with the circuit board.

5. The high heat dissipation performance cabinet according to claim 1, characterized in that: The cooling fan (4) is integrally fixed on the heat dissipation fins (2), and the fan supports multi-grade speed regulation.

6. The high heat dissipation performance case of claim 1, wherein: A temperature sensor for monitoring the temperature of hardware in real time is further arranged, the output end of the temperature sensor is electrically connected with the circuit board, the circuit board is further electrically connected with the cooling fan (4) for dynamically starting and stopping the fan or adjusting the rotating speed.

7. The high heat dissipation performance cabinet according to claim 4, characterized in that: Mounting holes (204) are arranged on the two sides of the heat dissipation fins (2), through holes (104) corresponding to the mounting holes (204) are formed in the case side shell (102), and a screw (6) penetrates through the through holes (104) and is screw-connected in the mounting holes (204).

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