Packaging device for sealing thin-wall structure

Abstract

The utility model discloses a packaging device for sealing a thin-wall structure, which belongs to the technical field of sealing and comprises a sealing furnace and a funnel assembly arranged in the sealing furnace, sealing materials are fused by the sealing furnace and then are drained into a gap of an assembly to be sealed through the funnel assembly, the funnel assembly comprises a hopper for placing the sealing materials, and the hopper is arranged in the sealing furnace. And a duct detachably attached to the hopper.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of sealing technology, especially a packaging device for sealing thin wall structure. BACKGROUND

[0002] Sodium-sulfur battery is a kind of energy storage battery with metal sodium as negative electrode, sulfur as positive electrode and β-alumina ceramic tube as electrolyte diaphragm. The metal sodium and sulfur of sodium-sulfur battery are separated by β ceramic tube as electrolyte diaphragm, and the β ceramic tube and α ceramic ring are sealed by glass.

[0003] The sealing method in prior art is to fill glass powder into the gap between β ceramic tube and α ceramic ring directly, or to fill the granulated glass powder, or to fill the granulated glass powder pressed into ring, and then to sinter and fuse. However, due to the small gap and deep depth between the tube and the ring, it is not conducive to operation, and the preliminary preparation work is troublesome. Even if the above method successfully fuses, it is not conducive to exhaust due to the narrow space, such as Figure 2 As shown, a hole is found after cutting the sealing interface, which makes the sealing easy to fail. SUMMARY

[0004] The utility model discloses a packaging device for sealing thin wall structure to solve the above problems existing in prior art.

[0005] Technical scheme: a packaging device for sealing thin wall structure, comprising a sealing furnace and a hopper assembly arranged in the sealing furnace, wherein the sealing furnace melts the sealing material and then guides it to the gap of the component to be sealed through the hopper assembly.

[0006] The hopper assembly comprises a hopper for placing the sealing material therein, and a pipeline detachably attached to the hopper.

[0007] In one embodiment, the sealing component is made of high-entropy alloy or high-temperature resistant ceramic, wherein the ceramic includes but is not limited to alumina, magnesia, magnesium-aluminum spinel and cordierite.

[0008] In one embodiment, the component to be sealed is a β ceramic tube and an α ceramic ring, which are assembled into the component to be sealed.

[0009] In one embodiment, the sealing material is glass powder.

[0010] In one embodiment, the port of the pipeline is 2-20mm higher than the gap of the component to be sealed.

[0011] In one embodiment, the port translates inwardly from the outer wall of the gap of the component to be sealed by at least 0.1mm.

[0012] In one embodiment, the pipe comprises an axial section and a diagonal section attached to the axial section, the diagonal section being in communication with the hopper through the axial section.

[0013] In one embodiment, the diagonal section is inclined 110-140° relative to the axial section, i.e. the angle between the axis of the diagonal section and the axis of the axial section is 110-140°.

[0014] In one embodiment, the port is arranged at the end of the diagonal section.

[0015] In one embodiment, the packaging device further comprises a support arranged in the sealing furnace, wherein the support is adapted to adjust the height of the hopper.

[0016] In summary, the packaging device has the following advantages:

[0017] 1. In the packaging device, the sealing material is melted by the funnel assembly and then introduced into the gap of the component to be sealed, so that the sealing interface will not have holes, and the introduction of impurities can be reduced during the sealing process.

[0018] 2. In the packaging device, the hopper and the pipe of the funnel assembly are detachably connected, so that the appropriate hopper can be replaced according to the type of sealing material.

[0019] 3. In the packaging device, the port of the pipe of the funnel assembly is higher than the gap of the component to be sealed, and the port translates inwardly from the outer wall of the gap of the component to be sealed by at least 0.1mm, so that the pipe and the component to be sealed can be prevented from adhering during the sealing process. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a schematic view of a packaging device for sealing a thin-walled structure according to an embodiment.

[0021] Figure 2 is a micrograph of a sealing interface of a sealing component sealed using the prior art.

[0022] Figure 3 is a micrograph of a sealing interface of a sealing component sealed using the packaging device.

[0023] The reference signs are: 1, funnel assembly; 10, hopper; 11, pipe; 110, axial section; 111, diagonal section; 2, support; 3, component to be sealed; 30, gap. DETAILED DESCRIPTION

[0024] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention. Example 1

[0025] like Figure 1 As shown, the encapsulation apparatus for sealing thin-walled structures disclosed in this embodiment includes a sealing furnace and a funnel assembly disposed within the sealing furnace. The sealing furnace melts the sealing material and then guides it through the funnel assembly into the gap of the component to be sealed, which can prevent the sealing interface from producing holes and reduce the introduction of impurities during the melting and sealing stage.

[0026] The funnel assembly includes a hopper for holding sealing material therein, and a pipe detachably attached to the hopper. The sealing furnace melts the sealing material in the hopper and guides it through the pipe into the gap of the assembly to be sealed, thereby sealing the assembly.

[0027] In addition, the hopper and the pipe are detachably connected, which makes it easy to replace the appropriate hopper according to the type of sealing material.

[0028] The component to be sealed is made of high-temperature resistant ceramics, such as alumina, magnesium oxide, magnesium aluminum spinel, cordierite. Furthermore, the component to be sealed is a β ceramic tube and an α ceramic ring, which are assembled to form the component to be sealed. Therefore, the sealing material can be glass powder.

[0029] like Figure 1 As shown, the pipe includes an axial section and an inclined section attached to the axial section. The inclined section is connected to the hopper through the axial section. The inclined section is inclined at 125° relative to the axial section, that is, the angle between the axis of the inclined section and the axis of the axial section is 125°. The purpose of this angle setting is to control the flow rate of the sealing material. If the angle is too small, the flow rate of the sealing material will be slow, which will affect the sealing effect. If the angle is too large, the flow rate of the sealing material will be too fast, which will cause it to overflow from the gap of the component to be sealed.

[0030] like Figure 1 As shown, one end of the pipe is 6mm higher than the gap of the component to be sealed, and the end is shifted 0.5mm inward from the outer wall of the gap of the component to be sealed. Furthermore, the end is located at the end of the inclined section, which can prevent the pipe from sticking to the component to be sealed during the fusion sealing stage, and at the same time avoid the pipe from contaminating the component to be sealed.

[0031] Fusion sealing test:

[0032] The components to be sealed in the above embodiment 1 are placed into the sealing furnace according to the above position requirements;

[0033] The appropriate amount of glass powder is weighed into the hopper, and the sealing furnace is closed. It should be noted that the glass powder will not fall into the gap of the component to be sealed due to mutual attraction along the pipeline;

[0034] The glass powder is melted into a glass liquid by heating to 900-990 ℃ within 200-300 min, and the glass liquid is allowed to flow into the gap of the component to be sealed through the pipeline at this temperature for 40-60 min;

[0035] The temperature is lowered to 580-620 ℃ within 60-80 min and kept for 20-30 min, and then lowered to room temperature within 190-210 min, and the sealing is completed.

[0036] As shown in Figure 3 The sealed component to be sealed is cut in the axial direction after sealing, and no obvious holes are observed at the sealing interface.

[0037] The preferred embodiments of the present application are described in detail above in combination with the drawings, but the present application is not limited to the specific details in the above embodiments. Within the technical concept of the present application, various equivalent transformations of the technical solutions of the present application can be made, and these equivalent transformations all belong to the protection scope of the present application.

Claims

1. A sealing device for sealing a thin-walled structure, characterized in that A sealing furnace and a funnel assembly disposed in the sealing furnace, wherein the sealing furnace melts a sealing material and the funnel assembly guides the melted sealing material to a gap of a component to be sealed; The funnel assembly includes a hopper for placing the sealing material therein, and a pipe detachably attached to the hopper.

2. A packaging device for sealing thin walled structures according to claim 1, wherein, The pipe has one end port which is 2-20mm higher than the gap of the component to be sealed.

3. A sealing device for sealing a thin-walled structure according to claim 2, characterized in that The end port translates inwardly from the outer wall of the gap of the component to be sealed by at least 0.1mm.

4. The encapsulation apparatus for encapsulating thin walled structures of claim 1, wherein, The pipe includes an axial segment and an inclined segment attached to the axial segment, and the inclined segment is in communication with the hopper through the axial segment.

5. A sealing device for sealing a thin-walled structure according to claim 4, characterized in that The inclined segment is inclined to the axial segment by 110-140°.

6. The encapsulation apparatus for encapsulating thin walled structures of claim 1, wherein, A support disposed in the sealing furnace is further included, wherein the support is adapted to adjust the height of the hopper.

7. The encapsulation apparatus for encapsulating thin walled structures of claim 1, wherein, The sealing assembly is made of high-entropy alloy or high-temperature resistant ceramic.

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