Passive germanium short wave infrared imaging device
By integrating key components of a germanium short-wave infrared imaging device onto a miniaturized PCB circuit board, the problems of large size, heavy weight, and low integration of short-wave infrared cameras have been solved, achieving efficient, portable, and low-cost passive imaging and expanding application scenarios.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-13
- Publication Date
- 2026-04-10
AI Technical Summary
Existing shortwave infrared cameras are large and heavy, resulting in poor portability, complex installation, low integration, and difficulty in efficient integration with miniaturized devices. This increases costs and creates technical bottlenecks, and the need for an external light source leads to high energy consumption.
The germanium shortwave infrared image sensor, readout circuit module, analog-to-digital converter module, image signal processor module, storage circuit module, and communication interface circuit module are integrated on a miniaturized PCB circuit board. The passive design relies on the spontaneous emission of the target or ambient light for imaging. Combined with high-density interconnect technology and compact mechanical design, the weight and volume are reduced, achieving high integration and stability.
It significantly reduces equipment size and weight, improves portability and flexibility, simplifies production processes, reduces costs, reduces energy consumption, enhances system collaboration efficiency and integration, and is suitable for a variety of application scenarios.
Smart Images
Figure CN224111222U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of infrared imaging technology, in particular to a passive germanium short-wave infrared imaging device. BACKGROUND
[0002] At present, there are a series of problems to be solved in short-wave infrared cameras. First of all, the short-wave infrared cameras are bulky and heavy, which seriously limits the portability of the cameras, brings great inconvenience to the users, and increases the difficulty and cost of transportation and operation. Secondly, due to the large volume and weight, special and stable support structures and larger installation space are required during installation, which not only increases the complexity of installation, but also increases the human, material and time costs required for installation, and the requirements for the installation environment are more stringent. Thirdly, in terms of device integration, the existing short-wave infrared cameras have low integration, which is difficult to efficiently integrate with other miniaturized and light-weighted devices, is not conducive to building compact and multifunctional systems, seriously hinders the further development and innovation of related technical systems, and reduces the collaborative performance and application flexibility of the overall system. SUMMARY
[0003] The present application provides a passive germanium short-wave infrared imaging device, which can integrate multiple key components on a miniaturized PCB board, significantly reducing the connection space and cables between components, avoiding the volume redundancy caused by scattered layout, effectively reducing the volume and weight of the entire device, solving the problem of large volume and heavy weight of traditional short-wave infrared cameras, improving the portability and flexibility of the device; and realizing the high integration of multiple circuit structures, compared with the previous scattered design of each component, improving the integration and stability of the system, reducing the technical bottlenecks caused by the compatibility and connection problems between components, making the collaborative work of the entire system more efficient; in addition, the integrated design also helps to simplify the production process and assembly process, reduces the cost caused by complex connection and debugging between components, improves the production efficiency and product reliability, and to some extent alleviates the problem of high cost of short-wave infrared cameras; and the passive germanium short-wave infrared imaging device of the present application images according to the spontaneous radiation characteristics of the target in the short-wave infrared band or its reflection characteristics of the ambient light, without the need for an external active light source, which can greatly save energy.
[0004] The present application provides a passive germanium short-wave infrared imaging device, which can integrate multiple key components on a miniaturized PCB board, significantly reducing the connection space and cables between components, avoiding the volume redundancy caused by scattered layout, effectively reducing the volume and weight of the entire device, solving the problem of large volume and heavy weight of traditional short-wave infrared cameras, improving the portability and flexibility of the device; and realizing the high integration of multiple circuit structures, compared with the previous scattered design of each component, improving the integration and stability of the system, reducing the technical bottlenecks caused by the compatibility and connection problems between components, making the collaborative work of the entire system more efficient; in addition, the integrated design also helps to simplify the production process and assembly process, reduces the cost caused by complex connection and debugging between components, improves the production efficiency and product reliability, and to some extent alleviates the problem of high cost of short-wave infrared cameras; and the passive germanium short-wave infrared imaging device of the present application images according to the spontaneous radiation characteristics of the target in the short-wave infrared band or its reflection characteristics of the ambient light, without the need for an external active light source, which can greatly save energy.
[0005] The germanium short-wave infrared image sensor module is used for collecting light signals, converting the light signals into electrical signals, and sending the electrical signals to the readout circuit module; the germanium short-wave infrared image sensor module is an indium gallium arsenide short-wave infrared image sensor, a mercury cadmium telluride short-wave infrared image sensor, a lead sulfide colloidal quantum dot short-wave infrared image sensor, or a mercury telluride colloidal quantum dot short-wave infrared image sensor;
[0006] The readout circuit module is used for converting the electrical signals into analog signals and sending the analog signals to the analog-to-digital converter module;
[0007] The analog-to-digital converter module is used for converting the analog signals into digital signals and sending the digital signals to the image signal processor module;
[0008] The image signal processor module is used for converting the digital signals into image data and sending the image data to the storage circuit module;
[0009] The storage circuit module is used for storing the image data, and sending corresponding image data to the communication interface circuit module according to a received reading instruction;
[0010] The communication interface circuit module is used for sending the received image data to an external device.
[0011] Further, the communication interface circuit module is also used for receiving a control instruction sent by the external device, decoding the control instruction to obtain an effective instruction, and sending the effective instruction to a module corresponding to the effective instruction.
[0012] Further, the device further includes a power management circuit module; the power management circuit module is used for receiving and processing a power signal to obtain a basic voltage, converting the basic voltage into a plurality of power supply demand voltages according to power supply demands of the modules, and sending the power supply demand voltages to corresponding modules.
[0013] Further, the device further includes a clock circuit module;
[0014] The clock circuit module is used for sending a clock signal to the readout circuit module and the analog-to-digital converter module.
[0015] Further, the germanium short-wave infrared image sensor module, the readout circuit module, the analog-to-digital converter module, the image signal processor module, the storage circuit module, and the communication interface circuit module are all arranged on the same PCB circuit board.
[0016] Further, the PCB circuit board is a single-layer PCB circuit board or a multi-layer PCB circuit board.
[0017] Further, the device further includes a lens module and a camera shell; the PCB circuit board carrying the modules is arranged inside the camera shell;
[0018] The lens module is arranged on the camera shell;
[0019] The lens module and the germanium short-wave infrared image sensor module are in a one-to-one correspondence in position.
[0020] Further, the device further comprises a physical interface, which is arranged on the camera shell; the physical interface is connected with the external device and the communication interface circuit module respectively.
[0021] Further, the physical interface comprises a USB interface, an RJ45 network interface, and a wireless antenna; the USB interface, the RJ45 network interface, and the wireless antenna are connected with the external device and the communication interface circuit module respectively.
[0022] Further, the communication interface circuit module is specifically configured to send the received image data to the external device through the USB interface.
[0023] In summary, compared with the prior art, the technical scheme provided by the embodiments of the present application has at least the following beneficial effects:
[0024] The passive germanium short-wave infrared imaging device provided by the embodiments of the present application can integrate a plurality of key components on a miniaturized PCB circuit board, significantly reduce the connection space and cables between components, avoid the volume redundancy caused by scattered layout, effectively reduce the volume and weight of the entire device, solve the problems of large volume and heavy weight of traditional short-wave infrared cameras, improve the portability and flexibility of the device; and realize the high integration of multiple circuit structures, compared with the previous design of scattered components, improve the integration and stability of the system, reduce the technical bottlenecks caused by compatibility and connection problems between components, and make the cooperative work of the entire system more efficient; in addition, the integrated design also helps to simplify the production process and assembly process, reduces the cost caused by complex connection and debugging between components, improves the production efficiency and product reliability, and to some extent, alleviates the problem of high cost of short-wave infrared cameras; and the passive germanium short-wave infrared imaging device of the present application can image according to the spontaneous radiation characteristics of the target in the short-wave infrared band or the reflection characteristics of the target to the ambient light, without an external active light source, which can greatly save energy. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 A structure diagram of a passive germanium short-wave infrared imaging device provided for an example embodiment of the present application.
[0026] Figure 2 A structure diagram of a passive germanium short-wave infrared imaging device provided for another example embodiment of the present application.
[0027] Figure 3 A structure diagram of a passive germanium short-wave infrared imaging device provided for another example embodiment of the present application. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application.
[0029] Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.
[0030] Please refer to Figure 1 The embodiments of the present application provide a passive germanium short-wave infrared imaging device, which specifically comprises a germanium short-wave infrared image sensor module, a readout circuit module, an analog-to-digital converter module, an image signal processor module, a storage circuit module and a communication interface circuit module.
[0031] The germanium short-wave infrared image sensor module is used for collecting light signals, converting the light signals into electrical signals and sending the electrical signals to the readout circuit module; the germanium short-wave infrared image sensor module is an indium gallium arsenide short-wave infrared image sensor, a mercury cadmium telluride short-wave infrared image sensor, a lead sulfide colloidal quantum dot short-wave infrared image sensor or a mercury telluride colloidal quantum dot short-wave infrared image sensor.
[0032] The germanium short-wave infrared image sensor module adopts an image sensor prepared based on germanium material, uses the excellent photoelectric properties of germanium to convert short-wave infrared light signals into electrical signals, and uses the electrical signals as a signal source of the entire imaging process; the good performance of the germanium short-wave infrared image sensor module determines the quality and information amount of the original image data, and lays a good foundation for subsequent high-quality imaging.
[0033] Specifically, when the short-wave infrared light irradiates the photosensitive area of the germanium short-wave infrared image sensor module, photons interact with the germanium absorption layer in the germanium short-wave infrared image sensor module to generate electron-hole pairs. Under the action of the electric field inside the germanium short-wave infrared image sensor module, the electrons and holes are separated and move directionally, so as to form an electrical signal on the corresponding electrode; the intensity of the electrical signal is related to the intensity and other characteristics of the irradiated light, thereby completing the preliminary conversion of the light signal into an analog electrical signal and providing original data for subsequent further processing.
[0034] In addition, germanium is used as a short-wave infrared sensing material, which fully utilizes the characteristics of wide source and relatively low cost of germanium material, effectively reduces the manufacturing cost of the germanium short-wave infrared image sensor module, and further makes the production cost of the entire camera greatly reduced compared with the short-wave infrared camera using traditional InGaAs, PbS, HgTe and other sensing materials, greatly improves the performance-price ratio of the product, and is conducive to the popularization and application of the short-wave infrared camera in more fields, especially in the cost-sensitive large-scale civilian market and some emerging industry application scenarios, which can be promoted rapidly.
[0035] a readout circuit module for converting the electrical signal into an analog signal and sending to the analog-to-digital converter module.
[0036] The readout circuit module is closely matched with the germanium short-wave infrared image sensor module, responsible for reading out the electrical signal generated by the pixel array in the germanium short-wave infrared image sensor module, and performing preliminary processing on the electrical signal, such as appropriate amplification and simple filtering to remove some interference, etc., to ensure that the quality of the output electrical signal meets the requirements of further processing, and to ensure that the signal can be stably and accurately transmitted to the subsequent circuit link.
[0037] Specifically, according to the set timing and scanning mode, the readout circuit module accesses the pixel units of the germanium short-wave infrared image sensor module row by row or column by column, collects the analog electrical signal generated by each pixel. In the collection process, the internal amplifier is used to amplify the signal to the appropriate amplitude range, and some high-frequency noise, power supply ripple and other interference components are removed through the filter, and then the conditioned analog electrical signal is transmitted to the subsequent analog-to-digital converter module.
[0038] an analog-to-digital converter module for converting the analog signal into a digital signal and sending to the image signal processor module.
[0039] The analog-to-digital converter module receives the analog electrical signal from the readout circuit module, and performs sampling and quantization operations on the analog signal, so that the subsequent image signal processor module can process the image data in the form of digital signal, and is an important bridge connecting the front-end analog signal processing and the back-end digital signal processing.
[0040] Specifically, after the analog-to-digital converter module receives the analog electrical signal from the readout circuit module, it periodically samples the analog signal according to the sampling frequency set by itself, and obtains the instantaneous value of the analog signal at each sampling time. Then, through the internal quantization circuit, according to a certain quantization level, the continuous analog values obtained by sampling are converted into corresponding discrete digital values, which are output in the form of binary code. The final output digital signal stream represents the digital representation of the image information captured by the germanium short-wave infrared image sensor module, and is sent to the image signal processor module.
[0041] an image signal processor module for converting the digital signal into image data and sending to the storage circuit module.
[0042] The image signal processor module receives the digital image signal after analog-to-digital conversion, processes the digital image signal by using various complex algorithms and processing techniques, including color correction, noise reduction processing, sharpening processing, automatic exposure control, and automatic white balance adjustment, and the like, so as to optimize the quality of the output image and convert the original relatively rough image data into high-quality image data with better visual effect and better actual demand.
[0043] Specifically, after receiving the digital image data from the analog-to-digital converter module, the image signal processor module performs noise reduction processing, uses various filtering algorithms (such as mean filtering, median filtering, Gaussian filtering, etc.) to remove random noise in the image and improve the purity of the image. Then, the color correction link is performed (if there is a color-related processing requirement, even short-wave infrared imaging may involve pseudo-color processing, etc.), and the color performance of the image is adjusted by using pre-set color matrix parameters. Then, the contrast enhancement operation is performed, and the histogram stretching, equalization, and the like are used to expand the gray scale dynamic range of the image, so that the details of the bright and dark parts of the image are clearer and more distinguishable. Sharpening processing is also performed, and some edge enhancement algorithms are used to highlight the outline and other detail information of the objects in the image. After this series of processing, high-quality digital image data is output, which can be sent to the storage circuit module for storage or transmitted to the outside through the communication interface circuit module.
[0044] The storage circuit module is used for storing image data, and according to the received read instruction, the corresponding image data is sent to the communication interface circuit module.
[0045] The storage circuit module stores the image data obtained by the camera, which can temporarily store the image data during the shooting process and wait for subsequent transmission to external devices, or can permanently save the image data when the camera has a certain storage function. According to the storage capacity, read / write speed, and other characteristics, the storage circuit module can affect the storage capacity and data transmission efficiency of the camera.
[0046] Specifically, when receiving the processed image data from the image signal processor module, the storage circuit module will write the image data into the corresponding storage medium according to the pre-set storage format (such as common RAW format, JPEG format, etc., depending on the function setting of the camera) and storage address allocation rules, etc. At the same time, some configuration parameters of the camera system (such as exposure time, gain, and other setting information) will also be stored in a specific storage area, so that the corresponding state can be quickly restored when the camera is restarted or the configuration needs to be changed. When reading the image data, according to the external read instruction, the corresponding data is accurately extracted from the storage medium and output to the corresponding module, such as being transmitted to the communication interface circuit for sending the image to the outside.
[0047] The communication interface circuit module is configured to transmit the received image data to an external device.
[0048] The communication interface circuit module realizes the communication connection between the camera and the external device, facilitating the transmission of image data and the reception of external control instructions.
[0049] Specifically, on one hand, it receives image data from the storage circuit module or directly from the image signal processor module, and processes the data by packing and encoding according to the format requirements of the communication protocol (such as USB protocol, Ethernet protocol, and wireless communication protocol such as Wi-Fi, etc.), and then transmits the data through the corresponding physical interface (such as USB interface, RJ45 network port, and wireless antenna, etc.). On the other hand, it always listens to the signals on the external interface, and when it receives the control instructions (such as instructions for adjusting the focal length of the camera and changing the exposure parameters) from the external device, it will decode and verify the instructions, and then pass the valid instructions to the relevant control modules (such as power management circuit module, etc.) inside the camera that may involve parameter adjustment, to realize remote operation control of the camera.
[0050] The passive germanium short-wave infrared imaging device provided in the above embodiment can integrate multiple key components on a miniaturized PCB circuit board, significantly reducing the connection space and cables between components, avoiding the volume redundancy caused by scattered layout, effectively reducing the volume and weight of the entire device, solving the problems of large volume and heavy weight of traditional short-wave infrared cameras, improving the portability and flexibility of the device; and multiple circuit structures are highly integrated, compared with the previous design of scattered components, improving the integration and stability of the system, reducing the technical bottlenecks caused by compatibility and connection problems between components, making the collaborative work of the entire system more efficient; in addition, the integrated design also helps to simplify the production process and assembly process, reduces the cost caused by complex connection and debugging between components, improves the production efficiency and product reliability, and to some extent, alleviates the problem of high cost of short-wave infrared cameras; and the passive germanium short-wave infrared imaging device according to the present application images the spontaneous radiation characteristics of the target in the short-wave infrared band or the reflection characteristics of the target to the environment light, without the need for an external active light source, which can greatly save energy.
[0051] Specifically, the germanium short-wave infrared image sensor in the present application can also be an indium gallium arsenide short-wave infrared image sensor, a mercury cadmium telluride short-wave infrared image sensor, a lead sulfide colloidal quantum dot short-wave infrared image sensor, and a mercury telluride colloidal quantum dot short-wave infrared image sensor.
[0052] The application shortens the signal transmission path through high-density interconnection technology, eliminates the space occupation of traditional cable connection; the physical proximity layout of the analog-to-digital converter module and the image signal processor module reduces the analog-to-digital conversion delay, and the synchronization of the clock circuit module and the readout circuit module optimizes the timing error. Moreover, the application adopts lightweight alloy or composite material combined with compact mechanical design to reduce the weight of the shell; the low dark current characteristic of the GOI structure reduces the dependence on multi-stage TEC refrigeration and simplifies the heat dissipation module; the integrated high-efficiency DC-DC converter and dynamic power consumption control technology reduce the volume and weight of the power module. In addition, the GOI structure is fully compatible with the CMOS process, supports the integration of sensors and readout circuit modules on a single substrate, reduces the redundant space in traditional discrete design; the quantum efficiency is improved through the resonance cavity enhancement effect, and the dark current is reduced by the GOI buried oxide layer, reducing the dependence on large-volume refrigeration systems.
[0053] The passive germanium short-wave infrared imaging of the application relies on the reflection signal of the target itself after being irradiated by thermal radiation or environmental light (such as moonlight and starlight). It is mainly based on the spontaneous radiation characteristics of the target in the short-wave infrared band or its reflection characteristics of the environmental light, without the need for external active light sources. Its typical application scenarios include: long-distance target detection (such as astronomical observation and military reconnaissance, using atmospheric windows to reduce scattering and achieve long-distance detection), infrared thermal imaging (when the target temperature is high, the short-wave infrared band can receive its thermal radiation signal, such as high-temperature process monitoring), and covert imaging (in the case of insufficient visible light, passive SWIR imaging can be used for night monitoring and is not easy to be discovered).
[0054] In some embodiments, the communication interface circuit module is also configured to receive a control instruction sent by an external device; decode the control instruction to obtain an effective instruction; and send the effective instruction to a module corresponding to the effective instruction.
[0055] The communication interface circuit module provides the necessary electrical connection and physical space for the storage circuit module, so that it can reliably store the image data and related configuration parameters collected by the camera, facilitate subsequent random access and viewing, and ensure the integrity and traceability of the data.
[0056] In some embodiments, the communication interface circuit module is specifically configured to send the received image data to an external device through a USB interface.
[0057] The communication interface circuit module realizes the data transmission between the camera and an external device (such as a computer and a monitoring system), can send the stored image data externally, can also receive control instructions sent by the external device, and then decodes the control instructions to obtain effective instructions, and finally sends the effective instructions to the control module to complete the remote operation of the camera, thereby expanding the use range and application flexibility of the camera.
[0058] In some embodiments, the apparatus further comprises a power management circuit module; the power management circuit module is configured to receive and process a power signal to obtain a base voltage; convert the base voltage into a plurality of power supply voltages according to power supply requirements of respective modules; and send each power supply voltage to a corresponding module.
[0059] The power management circuit module can obtain power from an external power source (such as a battery or an external power adapter, etc.), and then convert and distribute the power according to the respective voltage and current requirements of each module in the germanium short-wave infrared camera. In addition, the power management circuit module also has perfect overvoltage and overcurrent protection mechanisms to ensure that each module can work normally and stably. At the same time, by optimizing the power management strategy, the power management circuit module can also achieve energy saving and consumption reduction, and prolong the battery life of the camera.
[0060] Specifically, the power management circuit receives an externally input power source (which can be a battery or an external power adapter, etc.), filters and stabilizes the input power source, removes the noise and voltage fluctuation components in the power source, and converts it into a stable base voltage (such as the standard voltages of 3.3V and 5V, etc.). Then, according to the different power supply requirements of each module, the base voltage is further adjusted to the specific voltage value required by each module (for example, some chips may need 1.8V power supply, and some need 2.5V, etc.) through internal voltage conversion chips and other devices for power supply. During operation, it also monitors the power consumption of each module in real time, and takes protective measures (such as cutting off the power supply, limiting the current, etc.) when it detects abnormal conditions such as overcurrent and overvoltage to avoid damaging circuit components; and can dynamically adjust the power supply power of each module according to the working state of the camera (such as standby, shooting, etc.), to realize the optimization control of power consumption.
[0061] In some embodiments, the apparatus further comprises a clock circuit module.
[0062] The clock circuit module is configured to send a clock signal to the readout circuit module and the analog-to-digital converter module.
[0063] The clock circuit module provides a unified and stable clock signal for each core module in the camera, so that signal acquisition, signal readout, signal processing, and analog-to-digital conversion operations can be carried out in an orderly manner according to accurate and unified rhythms, ensuring the accuracy and stability of the entire imaging process, and avoiding image data errors or processing abnormalities caused by clock desynchronization and other problems.
[0064] Specifically, the clock circuit module internally contains a clock generating element such as a crystal oscillator, generates a stable high-frequency clock signal (for example, a clock signal of tens of megahertz or even higher frequency) through the oscillation characteristics of the crystal oscillator, and then distributes the clock signal to various modules of the camera that need the clock signal through clock distribution and buffering circuits and the like in a suitable path and manner (for example, the readout circuit module needs to read the pixel signals of the image sensor in a time sequence according to the clock signal; the analog-to-digital converter module needs a clock signal to determine the sampling time, etc.), and each module synchronizes its own working rhythm according to the received clock signal to ensure that the entire system runs smoothly.
[0065] Referring to Figure 2 In some embodiments, the germanium short-wave infrared image sensor module, the readout circuit module, the analog-to-digital converter module, the image signal processor module, the storage circuit module, and the communication interface circuit module are all arranged on the same PCB circuit board.
[0066] In some embodiments, the various modules are arranged on the same PCB circuit board, which can significantly reduce the delay time of signal transmission between the various modules, and the small PCB circuit board makes the various modules highly integrated, has a highly integrated and compact layout, effectively reduces the volume and weight of the camera while ensuring that the performance of the various modules is not affected. This makes the camera easy to be carried on a small mobile platform (such as a miniature unmanned aerial vehicle, a portable handheld device, etc.), greatly expands its application scenarios, improves the flexibility and convenience of use, and facilitates rapid deployment and operation in different environments.
[0067] In some embodiments, the PCB circuit board is a single-layer PCB circuit board or a multi-layer PCB circuit board.
[0068] In some embodiments, the PCB circuit board provides a physical carrying platform for the various modules, integrates these components together in a reasonable layout and wiring manner, so that they can be compactly assembled in a small-sized camera space to form a complete and cooperatively working camera system. The PCB circuit board plays an indispensable core supporting role in the small-sized germanium short-wave infrared camera, ensuring the realization and stable operation of the camera in various functions from signal acquisition to final imaging and external interaction.
[0069] Referring to Figure 3 In some embodiments, the device further includes a lens module and a camera housing; the PCB circuit board carrying the various modules is arranged inside the camera housing; the lens module is arranged on the camera housing; and the lens module and the germanium short-wave infrared image sensor module are in a corresponding position to each other.
[0070] The functions of the lens module include light focusing, light collection and enhancement, aberration correction, waveband selection and filtering, and field of view angle control, etc., and the lens module can transmit passive light source to the germanium short-wave infrared image sensor module to ensure the quality of the input light source.
[0071] In some embodiments, the device further comprises a physical interface arranged on the camera shell; the physical interface is connected to the external device and the communication interface circuit module respectively. The physical interface includes a USB interface, an RJ45 network interface, and a wireless antenna; the USB interface, the RJ45 network interface, and the wireless antenna are connected to the external device and the communication interface circuit module respectively.
[0072] The USB interface can realize high-speed transmission of image data between the camera and the external device (such as a computer and a mobile hard disk, etc.); the USB interface provides power support for the camera, meeting the power required for the operation of the camera, and increasing the flexibility of the use of the camera; when the camera is connected to the USB interface of the external device, the external device can automatically identify the camera device, and can interact with the camera through the relevant communication protocol of the USB interface, realizing the configuration operation of the camera, and facilitating the user to make personalized settings and management of the camera according to the actual demand.
[0073] The RJ45 network interface can build the connection between the camera and the wired network, so that the camera can access the local area network or the Internet environment; after accessing the network through the RJ45 network interface, the external device (such as a remote computer, a server, and a mobile phone, etc.) can remotely access the camera through the network protocol, not only can obtain the image data collected by the camera, but also can remotely control the camera, facilitating the centralized and remote management, greatly expanding the use range and application scene of the camera, and making it can be integrated into a more complex network monitoring and detection system.
[0074] Specifically, the wireless antenna can send the image data and other information generated by the germanium short-wave infrared camera in the form of wireless signals, communicate with nearby wireless access points (such as wireless routers), and then realize data transmission with other wireless devices (such as mobile phones, tablets, and remote servers). This wireless transmission method breaks the shackles of cables, increases the convenience and flexibility of camera use, so that the camera can be freely moved to a certain range for shooting, and also facilitates deployment in some environments where wiring is difficult; the wireless antenna cooperates with the corresponding wireless communication protocol (such as Wi-Fi and Bluetooth, different cameras may use different protocols), so that the camera can participate in wireless networking and become part of the wireless local area network. In some complex application scenarios, multiple wireless cameras can work cooperatively through wireless networking, for example, in an intelligent security system, multiple wireless germanium short-wave infrared cameras can be distributed to cover a larger monitoring area, and the collected image data can be aggregated to a unified monitoring platform for processing and analysis, enhancing the monitoring capability and intelligence level of the entire system. At the same time, the wireless antenna also facilitates the connection and interaction between the germanium short-wave infrared camera and other smart devices, realizing the expansion of functions, such as controlling the camera through a mobile phone APP and receiving image warning information pushed by the camera.
[0075] The technical features of the above embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present disclosure.
[0076] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, some modifications and improvements can be made, which are all within the scope of the present application. Therefore, the scope of the patent of the present application should be subject to the appended claims.
Claims
1. A passive germanium short-wave infrared imaging device, characterized by, The germanium short-wave infrared image sensor module, the readout circuit module, the analog-to-digital converter module, the image signal processor module, the storage circuit module and the communication interface circuit module are arranged on the same PCB circuit board. The germanium short-wave infrared image sensor module is used for collecting light signals and converting the light signals into electrical signals and sending the electrical signals to the readout circuit module; the germanium short-wave infrared image sensor module is an indium gallium arsenide short-wave infrared image sensor, a mercury cadmium telluride short-wave infrared image sensor, a lead sulfide colloidal quantum dot short-wave infrared image sensor or a mercury telluride colloidal quantum dot short-wave infrared image sensor. The readout circuit module is used for converting the electrical signals into analog signals and sending the analog signals to the analog-to-digital converter module. The analog-to-digital converter module is used for converting the analog signals into digital signals and sending the digital signals to the image signal processor module. The image signal processor module is used for converting the digital signals into image data and sending the image data to the storage circuit module. The storage circuit module is used for storing the image data and sending corresponding image data to the communication interface circuit module according to received reading instructions. The communication interface circuit module is used for sending the received image data to an external device.
2. The passive Ge short-wave infrared imaging device of claim 1, wherein, The communication interface circuit module is also used for receiving a control instruction sent by an external device, decoding the control instruction to obtain an effective instruction and sending the effective instruction to a module corresponding to the effective instruction.
3. The passive Ge short-wave infrared imaging device of claim 1, wherein, The power management circuit module is also included and is used for receiving and processing a power signal to obtain a basic voltage, converting the basic voltage into a plurality of power supply demand voltages according to power supply demands of the modules and sending the power supply demand voltages to corresponding modules.
4. The passive Ge short-wave infrared imaging device of claim 1, wherein, The clock circuit module is also included. The clock circuit module is used for sending a clock signal to the readout circuit module and the analog-to-digital converter module.
5. The passive Ge short-wave infrared imaging device of claim 1, wherein, The germanium short-wave infrared image sensor module, the readout circuit module, the analog-to-digital converter module, the image signal processor module, the storage circuit module and the communication interface circuit module are arranged on the same PCB circuit board.
6. The passive Ge short-wave infrared imaging device of claim 5, wherein, The PCB circuit board is a single-layer PCB circuit board or a multi-layer PCB circuit board.
7. The passive Ge short-wave infrared imaging device of claim 5, wherein, The lens module and the camera shell are also included; the PCB circuit board carrying the modules is arranged inside the camera shell. The lens module is arranged on the camera shell. The lens module and the germanium short-wave infrared image sensor module correspond to each other in position.
8. The passive Ge short-wave infrared imaging device of claim 7, wherein, A physical interface is also included and is arranged on the camera shell; the physical interface is connected to an external device and the communication interface circuit module, respectively.
9. The passive Ge short-wave infrared imaging device of claim 8, wherein, The physical interface includes a USB interface, an RJ45 network interface and a wireless antenna; the USB interface, the RJ45 network interface and the wireless antenna are connected to an external device and the communication interface circuit module, respectively.
10. The passive Ge short-wave infrared imaging device of claim 9, wherein, The communication interface circuit module is specifically used for sending the received image data to an external device through the USB interface.