AME multi-layer board and PCB composite tool

Abstract

The utility model discloses an AME multi-layer board and PCB composite tool, which comprises a lower bottom plate, an upper cover plate, a pressing block and an adjusting screw, wherein the lower bottom plate is provided with a screw hole and a bottom hole for accommodating a protruding part of an AME board; the upper cover plate is provided with pressing holes corresponding to the bottom holes and positioning holes corresponding to the screw holes. The pressing block comprises a base plate, a lower column block and an upper column block, the diameter of the base plate is equal to the inner diameter of the pressing hole, the diameter of the lower column block is smaller than that of the base plate, and the adjusting screw penetrates through the positioning hole to be in threaded connection with the screw hole. According to the utility model, the PCB can be effectively prevented from deformation at high temperature, the bonding quality and the stability of the whole structure are improved, and the risk of scrapping of the PCB is reduced. The tool provided by the utility model ensures that the AME multilayer board is tightly attached to the PCB, improves the reliability of electric connection and signal transmission, and is beneficial to the accuracy and reliability of subsequent lamination operation.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of electronic manufacturing, and relates to a tool for compounding additive manufacturing electronics (AME) multilayer board and printed circuit board (PCB). BACKGROUND

[0002] In the field of electronic manufacturing, with the continuous development of additive manufacturing electronics (AME) technology, the combination application of AME multilayer circuit board and traditional printed circuit board (PCB) becomes increasingly widespread. The compounding of AME board and PCB board can fully exert the advantages of both and realize more complex and efficient electronic circuit functions. However, in this process, many technical challenges are faced.

[0003] In the process of implementing the utility model, the AME board and PCB board bonding method mainly uses epoxy resin for bonding. First, the board needs to be pretreated to ensure that the board surface is clean, free of oil stains and dust and other impurities to improve the bonding effect. Then, the epoxy resin is evenly applied to the bonding surface of the AME board or PCB board. Then, the two boards are aligned and preliminarily bonded. In order to ensure the reliability of bonding, a certain pressure needs to be applied to the bonded board, and it is placed in an oven for heating and curing to make the epoxy resin fully cured to form a firm bonding layer.

[0004] However, there are some problems that are difficult to overcome in the actual operation process. First, the PCB board is prone to deformation in a high-temperature environment. Since the PCB board is usually composed of multiple layers of materials, the thermal expansion coefficients of these materials are different at high temperatures, which causes the PCB board to easily appear deformation phenomena such as bending and twisting when heated in the oven. Once the PCB board deforms, not only will it damage the bonding effect between the AME board and the PCB board, resulting in a decrease in bonding strength, but it may also cause poor circuit connection, affecting the performance and reliability of the entire electronic device. In severe cases, it may even cause the entire board to be scrapped, increasing production costs and reducing production efficiency.

[0005] Secondly, it is difficult to accurately control the flatness between the AME board and the PCB board. In the bonding process, the AME board and the PCB board are required to be tightly attached to ensure good electrical connection and signal transmission performance. However, due to the lack of effective positioning and fixing devices, it is difficult to ensure the flatness between the two boards, and it is easy to have a large height difference. This not only affects the subsequent lamination operation, but also may cause problems such as poor contact and signal interference in the use of electronic devices.

[0006] Therefore, there is an urgent need for an AME board and PCB board compounding tool that can effectively solve the above problems to improve the level and competitiveness of electronic manufacturing. UTILITY MODEL CONTENTS

[0007] In view of this, the utility model discloses a kind of AME plate and PCB plate composite tool, to solve the problem that PCB plate is easily deformed and difficult to control flatness in prior art under high temperature.

[0008] The inventor provides the technical scheme by long-term exploration and attempt, and multiple experiments and efforts, continuous reform and innovation to solve the above technical problems, which is to provide a kind of AME plate and PCB plate composite tool, including lower bottom plate, upper cover plate, pressing block and adjusting screw, the lower bottom plate is equipped with screw hole and bottom hole accommodating AME plate protruding part;The upper cover plate is equipped with the pressing hole corresponding with bottom hole and the positioning hole corresponding with screw hole;The pressing block includes substrate, lower column block and upper column block, the diameter of substrate is equal to the inner diameter of pressing hole, the diameter of lower column block is less than the diameter of substrate, and the adjusting screw is screwed through the positioning hole and the screw hole.

[0009] Compared with prior art, the utility model has the beneficial effects that:

[0010] Through the cooperation of lower bottom plate, upper cover plate, pressing block and adjusting screw, the deformation of PCB plate under high temperature can be effectively prevented, the bonding quality and the stability of the whole structure are improved, and the risk of board scrapping is reduced.The special design of pressing block and counterweight can accurately control the flatness between AME plate and PCB plate, ensure that the two are closely fitted, improve the reliability of electrical connection and signal transmission, and be beneficial to the accuracy and reliability of subsequent lamination operation.The setting of adjusting screw improves the adaptability and flexibility of tool, can better adapt to PCB plates and AME plates of different thicknesses, improves production efficiency and operation convenience.

[0011] On the basis of the above technical scheme, the utility model can also be improved as follows:

[0012] Further, the weight of the pressing block is 200-300g.

[0013] Preferably, the weight of the pressing block is 240g.

[0014] Compared with prior art, the beneficial effects of the above further technical scheme are that:

[0015] By accurately controlling the weight of the pressing block, more accurate pressure can be applied to the AME plate, to ensure that it is closely fitted with the PCB plate, and to improve the bonding quality and reliability.

[0016] On the basis of the above technical scheme, the utility model can also be improved as follows:

[0017] Further, the lower bottom plate is further provided with a gasket fitted with the lower surface of the PCB plate.

[0018] Preferably, the gasket comprises a first gasket and a second gasket, and the distance between the outer edges of the first gasket and the second gasket is equal to the width of the PCB.

[0019] Compared with the prior art, the beneficial effects of the further technical scheme are:

[0020] Through the cooperation of the gasket, the stability and leveling effect of the PCB can be improved, and the deformation caused by uneven local stress can be reduced.

[0021] Based on the above technical scheme, the utility model can also be improved as follows:

[0022] Further, the inner diameter of the bottom hole is equal to the diameter of the AME plate mounting hole on the PCB.

[0023] Compared with the prior art, the beneficial effects of the further technical scheme are:

[0024] The precise cooperation of the bottom hole and the AME plate mounting hole on the PCB can realize the rapid positioning and installation of the AME plate, improve the work efficiency and positioning accuracy.

[0025] Based on the above technical scheme, the utility model can also be improved as follows:

[0026] Further, the screw hole is three, located at three fixed points of an isosceles triangle, the bottom hole is located on the high line of the base of the isosceles triangle, and is eccentrically arranged with the lower bottom plate.

[0027] Compared with the prior art, the beneficial effects of the further technical scheme are:

[0028] By optimizing the layout of the screw hole and the bottom hole, the tooling structure is more compact, which can effectively reduce the overall size of the tooling, while ensuring the stability and stress uniformity of the structure.

[0029] Based on the above technical scheme, the utility model can also be improved as follows:

[0030] Further, the coverage of the PCB by the upper cover plate is greater than 90%.

[0031] Compared with the prior art, the beneficial effects of the further technical scheme are:

[0032] The upper cover plate with greater coverage can better protect the PCB, reduce the risk of external interference and pollution during operation and subsequent use, and effectively reduce the deformation probability of the PCB in a high-temperature environment, ensuring the bonding quality and the reliability of the tooling.

[0033] Based on the above technical scheme, the utility model can also be improved as follows:

[0034] Further, the lower bottom plate, the upper cover plate and the screw are made of high-temperature-resistant materials.

[0035] Compared with the prior art, the beneficial effects of the above further technical solutions are:

[0036] The lower bottom plate, the upper cover plate and the screw are made of high-temperature-resistant materials, which can ensure that the tool is stable and reliable in a high-temperature environment, avoid material deformation or damage, and thus ensure the bonding quality of the AME plate and the PCB plate.

[0037] On the basis of the above technical solutions, the utility model can also be improved as follows:

[0038] Further, it also includes a caliper for measuring the distance between the lower bottom plate and the upper cover plate in each direction.

[0039] Compared with the prior art, the beneficial effects of the above further technical solutions are:

[0040] The use of the caliper can conveniently measure the distance between the lower bottom plate and the upper cover plate, and by selecting a caliper with a suitable thickness, the height of the tool can be accurately adjusted, thereby better adapting to PCB plates and AME plates of different thicknesses and improving the versatility and adaptability of the tool.

[0041] The tool of the utility model effectively prevents the PCB plate and the AME plate from deforming during heating, and after the PCB plate and the AME plate are combined, the height difference is shortened to within 0.1 microns, improving the bonding quality and stability and ensuring the accuracy and reliability of subsequent lamination operations. BRIEF DESCRIPTION OF DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments, and it should be understood that the following drawings only show some embodiments of the utility model, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0043] Figure 1 is a front view structural schematic diagram of a preferred embodiment of the AME multilayer plate and PCB plate composite tool of the utility model.

[0044] Figure 2 is a top view structural schematic diagram of Figure 1 .

[0045] Figure 3 is a left view structural schematic diagram of Figure 1 .

[0046] Figure 4 is a right view structural schematic diagram of Figure 1is a schematic view of a stereoscopic structure of an embodiment of the PCB board.

[0047] Figure 5 is a schematic view of a stereoscopic structure of an embodiment of the PCB board.

[0048] The labels in the figures are respectively:

[0049] 100 lower bottom plate,

[0050] 110 bottom hole,

[0051] 120 screw hole,

[0052] 131 first gasket,

[0053] 132 second gasket,

[0054] 200 upper cover plate,

[0055] 210 pressing hole,

[0056] 220 positioning hole,

[0057] 300 pressing block,

[0058] 310 base plate,

[0059] 320 lower column block,

[0060] 330 upper column block,

[0061] 400 adjusting screw,

[0062] 500 composite board,

[0063] 510 PCB board,

[0064] 511 mounting hole,

[0065] 512 sink ring,

[0066] 520 AME board. DETAILED DESCRIPTION

[0067] The following will be described in combination with the accompanying drawings and a specific embodiment.

[0068] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only to represent selected embodiments of the present application.

[0069] It should be noted that similar reference numerals and letters refer to similar items in the following drawings, and therefore, once an item is defined in one drawing, it can not be further defined and explained in subsequent drawings.

[0070] The composite board 500 described in the embodiment is an electronic circuit structure obtained by bonding an additive manufacturing electronic (AME) multilayer circuit board and a traditional printed circuit board (PCB board 510) through a specific process. The PCB board 510 is provided with a mounting hole 511 for mounting the AME board 520, and is aligned with the bottom hole 110 of the lower bottom plate 100 to achieve preliminary positioning. Meanwhile, the PCB board 510 is also provided with a sink ring 512 for positioning the AME board 520 and electrically connected through a metal contact.

[0071] Referring to Figures 1 to 5 The AME board 520 and the PCB board 510 composite tool described in the embodiment is mainly composed of a lower bottom plate 100, an upper cover plate 200, a pressing block 300 and an adjusting screw 400. The lower bottom plate 100 is provided with a screw hole 120 and a bottom hole 110 for accommodating the protruding part of the AME board 520 and providing preliminary positioning; the upper cover plate 200 is provided with corresponding pressing holes 210 and positioning holes 220, which cooperate with the lower bottom plate 100 to realize pressing and fixing of the AME board 520 and the PCB board 510; the pressing block 300 is used for accurately pressing the AME board 520 to ensure that it is closely attached to the PCB board 510; and the adjusting screw 400 is used for adjusting the pressure between the upper cover plate 200 and the lower bottom plate 100 to ensure the stability and reliability of the whole tool.

[0072] The lower base plate 100 is the base support part of the entire tooling, and is provided with screw holes 120 and bottom holes 110. The screw holes 120 are used to cooperate with the positioning holes 220 of the upper cover plate 200, and the connection and fixation of the upper cover plate 200 and the lower base plate 100 are realized through adjusting screws 400. The inner diameter of the bottom hole 110 is equal to the diameter of the AME plate mounting hole 511 on the PCB plate 510, which is used to place the protruding part of the AME plate 520, so as to avoid damaging the plate during pressing, and also helps to realize the preliminary positioning of the plate.

[0073] The upper cover plate 200 cooperates with the lower base plate 100, and is provided with pressing holes 210 and positioning holes 220. The pressing holes 210 are used to flatten the AME plate 520, so that the AME plate 520 is tightly attached to the PCB plate 510, and the flatness between the two is ensured; the positioning holes 220 correspond to the screw holes 120 of the lower base plate 100, and are used to cooperate with the screw holes 120 to realize the connection and fixation of the upper cover plate 200 and the lower base plate 100. The design of the upper cover plate 200 enables it to cover more than 90% of the area of the PCB plate 510, so as to better protect the PCB plate 510 from the interference and pollution of the external environment during subsequent operations, and also to further reduce the risk of deformation of the PCB plate 510 under high temperature.

[0074] The pressing block 300 includes a base plate 310, a lower column block 320 and an upper column block 330. The diameter of the base plate 310 is equal to the inner diameter of the pressing hole 210, so that it can be closely fitted in the pressing hole 210; the diameter of the lower column block 320 is smaller than that of the base plate 310, which can prevent the epoxy resin from sticking to the pressing block 300, and facilitate the smooth removal of the pressing block 300 after the bonding is completed. The design of the upper column block 330 is convenient for operation, and the pressing block 300 is put into or taken out of the pressing hole 210. The weight of the pressing block 300 is preferably 240g, and through the precise control of the weight of the pressing block 300, appropriate downward pressure can be applied to the AME plate 520, so as to ensure that the AME plate 520 is in full contact with the PCB plate 510, and improve the bonding quality and reliability. During installation, the pressing block 300 is positioned by its vertical surface and the vertical surface of the pressing hole 210 of the upper cover plate 200, and the bottom surface of the pressing block 300 is used for the final flattening operation of the AME plate 520.

[0075] The adjusting screw 400 is screwed through the positioning hole 220 of the upper cover plate 200 and the screw hole 120 of the lower base plate 100. By turning the adjusting screw 400, the pressure between the upper cover plate 200 and the lower base plate 100 can be adjusted, so as to further fix the PCB plate 510 and ensure the stability of the plate. This adjustable design improves the adaptability and flexibility of the tooling, which can better adapt to PCB plates 510 and AME plates 520 of different thicknesses, and improves the production efficiency and the convenience of operation.

[0076] In a further embodiment, a gasket is provided on the lower base plate 100 to fit the lower surface of the PCB board 510. The gasket includes a first gasket 131 and a second gasket 132, and the distance between the outer edges of the first gasket 131 and the second gasket 132 is equal to the width of the PCB board 510. Such a design is mainly to achieve stable support and uniform leveling of the PCB board 510. In use, first, the first gasket 131 and the second gasket 132 are placed on the lower base plate 100 in sequence, ensuring that the distance between their outer edges matches the width of the PCB board 510. This can ensure that the PCB board 510 can be evenly distributed on the gasket after being placed on the gasket, avoiding uneven local stress. Then, the PCB board 510 is placed on the first gasket 131 and the second gasket 132, ensuring that the lower surface of the PCB board 510 is tightly fitted with the gasket. At this time, the mounting hole 511 of the PCB board 510 is aligned with the bottom hole 110 of the lower base plate 100, preparing for the subsequent installation of the AME board 520. The gasket can increase the contact area between the PCB board 510 and the lower base plate 100, improve the stability of the PCB board 510, and reduce the shaking and displacement of the PCB board 510 during the bonding process, thereby ensuring the precision and quality of the bonding. The distance between the outer edges of the first gasket 131 and the second gasket 132 is equal to the width of the PCB board 510, which can uniformly level the PCB board 510, making the lower surface of the PCB board 510 parallel to the lower base plate 100, providing a flat foundation for the installation of the AME board 520. This can avoid excessive height difference between the AME board 520 and the PCB board 510 due to unevenness of the PCB board 510, affecting the bonding effect and subsequent lamination operation. Uniform support and leveling can reduce the risk of deformation of the PCB board 510 due to uneven local stress during heating. This helps to improve the stability and reliability of the entire tooling, reduce the probability of board scrap, and improve production efficiency and product quality.

[0077] In a further embodiment, the layout of the screw holes 120 adopts an isosceles triangle with three screw holes 120, and the bottom hole 110 is located on the high line of the base of the isosceles triangle and is eccentrically arranged with the lower base plate 100. Such a layout can improve the structural stability and uniformity of the tooling, avoid deformation of the PCB board 510 due to uneven stress, and also help to improve the strength and stiffness of the entire tooling.

[0078] In a further embodiment, the lower base plate 100, the upper cover plate 200, and the screws are all made of high-temperature-resistant materials to ensure the stability and reliability of the tooling in a high-temperature environment, and the bonding quality of the AME board 520 and the PCB board 510 will not be affected by the deformation or damage of the materials.

[0079] When using the composite tool, a plug gauge (not shown in the figure) can provide support for precise regulation. The operator measures the distance between the lower base plate 100 and the upper cover plate 200 in various directions using the plug gauge, and selects a plug gauge sheet of appropriate thickness to place around the screw hole according to the measurement results. This process not only helps to quickly determine the distance between the two, but also ensures the wide compatibility of the tool for the combination of PCB plates 510 and AME plates 520 of different thicknesses, significantly improving the practicality and flexibility of the tool.

[0080] The use process of the composite tool of the AME multilayer plate and the PCB plate 510 in this embodiment is as follows:

[0081] (1) Place the first gasket 131 and the second gasket 132 on the lower base plate 100. The gaskets can increase the contact area between the PCB plate 510 and the lower base plate 100, improve the stability and leveling effect of the PCB plate 510, and reduce the risk of deformation caused by uneven local stress. The distance between the outer edges of the first gasket 131 and the second gasket 132 is equal to the width of the PCB plate 510. Such a design can more accurately level the PCB plate 510 and ensure that the lower surface of the PCB plate 510 is tightly attached to the lower base plate 100.

[0082] (2) Place the PCB plate 510 on the gaskets and align the mounting hole 511 of the PCB plate 510 with the bottom hole 110 of the lower base plate 100. The inner diameter of the bottom hole 110 is equal to the diameter of the AME plate mounting hole 511 on the PCB plate 510, which can achieve fast positioning and installation of the AME plate 520 and improve work efficiency.

[0083] (3) Dot silver glue and nanoscale epoxy resin glue on the metal contacts and contacts of the AME plate 520, respectively. Silver glue and nanoscale epoxy resin glue have good conductivity and adhesion, which can ensure the reliability of the electrical connection and physical connection between the AME plate 520 and the PCB plate 510.

[0084] (4) Align the metal contacts of the AME plate 520 with the metal contacts of the PCB plate 510 to ensure accurate docking between the two. Then, select a plug gauge with the same thickness as the PCB plate 510 and place it around the screw hole. The use of the plug gauge can easily measure the distance between the lower base plate 100 and the upper cover plate 200. By selecting a plug gauge of appropriate thickness, the height of the tool can be accurately adjusted to better adapt to PCB plates 510 and AME plates 520 of different thicknesses, improving the versatility and adaptability of the tool.

[0085] (5) Cover the upper cover plate 200, make the pressure hole 210 of the upper cover plate 200 correspond to the position of the AME plate 520. Then, screw on the adjusting screw 400, adjust the pressure between the upper cover plate 200 and the lower bottom plate 100 through the threaded connection of the adjusting screw 400 and the screw hole 120, so that the pressing block 300 can tightly press the PCB plate 510. The pressing block 300 is pressed flat on the AME plate 520 through the bottom surface thereof, and the vertical surface of the pressing block 300 is positioned with the vertical surface of the pressure hole 210 of the upper cover plate 200, so as to ensure the accurate installation and use of the pressing block 300.

[0086] (6) Put the whole tooling into the oven, and keep it at 100 DEG C for 6 hours after it is raised from room temperature. In the oven, the silver glue and the epoxy resin glue will gradually solidify to form a firm bonding layer, and the AME plate 520 and the PCB plate 510 are tightly bonded together. Through the whole process, the deformation of the plate in the subsequent operation can be effectively prevented, the flatness is controlled, and the stability and success rate of the whole structure are improved.

[0087] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0088] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0089] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0090] In the utility model, unless another definite provision and limitation, first feature is "on" or "under" second feature can include that first and second features are in direct contact, also can include that first and second features are not in direct contact but are in contact through other feature between them. Moreover, first feature "on", "above" and "on" second feature include that first feature is directly above and obliquely above second feature, or only indicate that horizontal height of first feature is higher than second feature. First feature "under", "below" and "under" second feature include that first feature is directly below and obliquely below second feature, or only indicate that horizontal height of first feature is less than second feature.

[0091] The above is only the preferred embodiment of the utility model, it should be pointed out that the above preferred embodiment should not be regarded as the limitation of the utility model, the protection scope of the utility model should be accurate in the range defined by the claims. For ordinary skilled person in the art, without departing from the spirit and scope of the utility model, can also make a number of improvements and refinements, these improvements and refinements should also be regarded as the protection scope of the utility model.

Claims

1. An AME multilayer board and PCB board composite tooling, characterized in that, The device comprises a lower base plate, an upper cover plate, a pressing block and an adjusting screw, the lower base plate is provided with screw holes and bottom holes for accommodating protruding parts of the AME plate; the upper cover plate is provided with pressing holes corresponding to the bottom holes and positioning holes corresponding to the screw holes; the pressing block comprises a base plate, a lower column block and an upper column block, the diameter of the base plate is equal to the inner diameter of the pressing hole, the diameter of the lower column block is smaller than that of the base plate, and the adjusting screw is threadedly connected with the screw holes through the positioning holes.

2. The AME multilayer board and PCB board composite tooling of claim 1, wherein, The weight of the pressing block is 200-300g.

3. The AME multilayer board and PCB board composite tooling of claim 2, wherein, The weight of the pressing block is 240g.

4. The AME multilayer board and PCB board composite tooling of claim 1, wherein, The lower base plate is further provided with a gasket adhering to the lower surface of the PCB plate.

5. The AME multilayer board and PCB board composite tooling of claim 4, wherein, The gasket comprises a first gasket and a second gasket, and the distance between the outer edges of the first gasket and the second gasket is equal to the width of the PCB plate.

6. The AME multilayer board and PCB board composite tooling of claim 1, wherein, The inner diameter of the bottom hole is equal to the diameter of the mounting hole of the AME plate on the PCB plate.

7. The AME multilayer board and PCB board composite tooling of claim 1, wherein, The screw holes are three, located at three fixed points of an isosceles triangle, the bottom hole is located on the high line of the bottom of the isosceles triangle, and is eccentrically arranged with the lower base plate.

8. The AME multilayer board and PCB board composite tooling of claim 1, wherein, The coverage of the PCB plate covered by the upper cover plate is greater than 90%.

9. The AME multilayer board and PCB board composite tooling of claim 1, wherein, The lower base plate, the upper cover plate and the screw are made of high-temperature-resistant materials.

10. The AME multilayer board and PCB board composite tooling of claim 1, wherein, The device further comprises a caliper for measuring the spacing in each direction between the lower base plate and the upper cover plate.

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