Wafer transmission device
By designing the transfer arm and pressing component of the wafer transfer device, and combining pressure and distance sensors, the wafer warpage height and rigidity are automatically measured, solving the vacuum establishment problem caused by wafer warpage and reducing manual measurement errors and costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QULIANG ELECTRONICS CO LTD
- Filing Date
- 2025-04-21
- Publication Date
- 2026-04-10
AI Technical Summary
In existing technologies, wafer warping causes the inability to establish a vacuum with the working platform, and the measurement of the degree of warping depends on manual operation, which has large errors and high costs.
A wafer transfer device is designed, comprising a transfer arm, a support, and first and second pressing parts. The second pressing part is equipped with a pressure sensor and a distance sensor for automatically measuring the wafer warpage height and rigidity to ensure that the wafer makes flat contact with the work platform.
It enables automatic measurement of wafer warpage height and rigidity, solves the problem of vacuum buildup caused by wafer warpage, and reduces the error and cost of manual measurement.
Smart Images
Figure CN224111604U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor, especially relates to a wafer transmission device. BACKGROUND
[0002] The description in this section is provided only for purposes of summarizing what the present disclosure discloses and not for purposes of limiting the present disclosure to what is described in this section.
[0003] At present, wafer refers to the silicon chip used for making silicon semiconductor integrated circuit, and is called wafer because of the circular shape. Various circuit component structures can be processed and made on the silicon chip, and the IC product with specific electrical function is formed. The production and manufacturing of semiconductors are constantly developing to form a perfect production process. Generally, it is chip circuit design-wafer manufacturing-wafer testing-wafer cutting and grinding-chip packaging-product chip testing. The main work of the wafer transmission mechanism is to transmit the wafer to the workbench, but generally only a small pad under the transmission arm of the grinding machine table, when the wafer is positioned on the positioning platform, the transmission arm moves the wafer to the work platform and establishes a vacuum, the small pad of the transmission arm cannot cover the edge of the wafer, if the wafer warpage is too large, the edge will be missed in the vacuum problem, the wafer material warpage is too large, which will cause the wafer and the work platform cannot establish a vacuum problem, thereby affecting the normal operation, in addition, the related data of wafer warpage degree on the production line is generally measured manually by the staff, the labor cost is high and the measurement error is large.
[0004] It should be noted that the above introduction to the technical background is only to facilitate the clear and complete description of the technical scheme of the present utility model, and to facilitate the understanding of the technical personnel in the art. The above technical scheme cannot be considered as known to the technical personnel in the art only because it is described in the background section of the present utility model. CONTENT OF THE UTILITY MODEL
[0005] The technical problem to be solved by the utility model is that, in view of the deficiency of the prior art, a wafer transmission device is provided, which can automatically measure the height and rigidity of wafer warpage during packaging, and solve the problem that the wafer cannot establish a vacuum with the work platform due to warpage.
[0006] The wafer transmission device disclosed by the embodiment of the present application is used for measuring the warpage height and warpage rigidity of the wafer carried on the work platform, and comprises:
[0007] The transmission arm is located above the work platform, and the transmission arm is used for transmitting the wafer to the work platform, and the bracket is connected with the transmission arm.
[0008] A first pressing part and a second pressing part are located above the work platform, and are used to press the wafer flat on the work platform, the first pressing part is arranged at the bottom of the transmission arm, the second pressing part is arranged at the bottom of the support, and the inner diameter of the second pressing part is greater than the outer diameter of the first pressing part.
[0009] The second pressing part is provided with a plurality of pressure sensors for measuring wafer warping rigidity and distance sensors for measuring wafer warping height.
[0010] Further, the wafer conveying device, the support comprises a first connecting rod and a second connecting rod, one end of the first connecting rod is connected with the side wall of the transmission arm, the other end of the first connecting rod is connected with the second connecting rod, and the bottom of the second connecting rod is fixedly connected with the second pressing part.
[0011] Further, the wafer conveying device, the plurality of first connecting rods are arranged in a ring matrix, and the included angle between adjacent first connecting rods is 90°.
[0012] Further, the wafer conveying device, the first pressing part and the second pressing part are concentric circular structures.
[0013] Further, the wafer conveying device, the outer diameter of the second pressing part is consistent with the diameter of the wafer.
[0014] Further, the wafer conveying device, the thickness of the first pressing part and the second pressing part is consistent.
[0015] Further, the wafer conveying device, the plurality of pressure sensors are distributed in a ring matrix with the center of the first pressing part as the center, and the included angle between adjacent pressure sensors is 90°.
[0016] Further, the wafer conveying device, the plurality of distance sensors are distributed in a ring matrix with the center of the first pressing part as the center, and the included angle between adjacent distance sensors is 90°.
[0017] In summary, the wafer conveying device has the following advantages:
[0018] The wafer conveying device can not only cover the wafer edge to press the warped wafer flat on the work platform, but also can measure the rigidity and height of the wafer warping through the pressure sensor and the distance sensor.
[0019] For further understanding the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, the drawings provided are only for reference and illustration, and not intended to limit the present application. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.
[0021] Figure 1 is the state diagram before the wafer is pressed by the wafer conveying device in the embodiment of the present application;
[0022] Figure 2 is the state diagram of the wafer being pressed flat by the wafer conveying device in the embodiment of the present application;
[0023] Figure 3 is the structure diagram of the wafer conveying device in the embodiment of the present application.
[0024] The above drawings of the present application are as follows: 1, working platform; 2, conveying arm; 3, support; 31, first connecting rod; 32, second connecting rod; 4, first pressing part; 5, second pressing part; 6, pressure sensor; 7, distance sensor; 8, wafer. DETAILED DESCRIPTION
[0025] In order to make the person skilled in the art better understand the technical solutions in the present application, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should belong to the scope of protection of the present application.
[0026] The following is to illustrate the embodiments of the present application through specific examples, and those skilled in the art can understand the advantages and effects of the present application from the disclosure. The present application can be implemented or applied by other different specific embodiments, and each detail in the specification can be modified and changed based on different viewpoints and applications without departing from the concept of the present application. In addition, the drawings of the present application are only simple schematic illustrations, not the actual size description, and the prior declaration. The following embodiments will further illustrate the related technical content of the present application, but the disclosed content is not used to limit the protection scope of the present application.
[0027] It should be understood that although the terms "first", "second", "third" and the like may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items.
[0028] Referring to Figures 1 to 3 The embodiments of the present application disclose a wafer transmission device for measuring the warping height and warping rigidity of a wafer 8 carried on a workbench 1, comprising:
[0029] A transmission arm 2 and a support 3, the transmission arm 2 is located above the workbench 1, the transmission arm 2 is used to transmit the wafer 8 to the workbench 1, the support 3 is connected with the transmission arm 2;
[0030] A first pressing part 4 and a second pressing part 5, the first pressing part 4 and the second pressing part 5 are located above the workbench 1, the first pressing part 4 and the second pressing part 5 are used to press the wafer 8 flat on the workbench 1, the first pressing part 4 is arranged at the bottom of the transmission arm 2, the second pressing part 5 is arranged at the bottom of the support 3, and the inner diameter of the second pressing part 5 is greater than the outer diameter of the first pressing part 4;
[0031] Wherein, the second pressing part 5 is provided with a plurality of pressure sensors 6 for measuring the warping rigidity of the wafer 8 and a distance sensor 7 for measuring the warping height of the wafer 8.
[0032] Specifically, referring to Figure 3In the embodiment, the support 3 comprises a first connecting rod 31 and a second connecting rod 32, one end of the first connecting rod 31 is connected with the side wall of the transmission arm 2, the other end of the first connecting rod 31 is connected with the second connecting rod 32, and the bottom of the second connecting rod 32 is fixedly connected with the second pressing part 5. A plurality of first connecting rods 31 are arranged in a ring matrix, and the included angle between adjacent first connecting rods 31 is 90°. The design of the first connecting rod 31 in the embodiment can uniformly press the second pressing part 5 on the wafer 8, can make the wafer 8 more flatly contact with the working platform 1, and improve the processing quality.
[0033] Specifically, in the embodiment, the first pressing part 4 and the second pressing part 5 are concentric circular structures, the first pressing part 4 is a circular pad, and the second pressing part 5 is an annular pad.
[0034] Specifically, in the embodiment, the outer diameter of the second pressing part 5 is consistent with the diameter of the wafer 8, which can uniformly press the wafer 8 on the working platform 1, and establish a vacuum between the wafer 8 and the working platform 1.
[0035] Specifically, in the embodiment, the thickness of the first pressing part 4 and the second pressing part 5 is consistent, so that the first pressing.
[0036] Specifically, referring to Figure 3 In the embodiment, a plurality of pressure sensors 6 are arranged in a ring matrix with the center of the first pressing part 4 as the center, and the included angle between adjacent pressure sensors 6 is 90°; a plurality of distance sensors 7 are arranged in a ring matrix with the center of the first pressing part 4 as the center, and the included angle between adjacent distance sensors 7 is 90°, so that the force is uniform and the measurement error is small.
[0037] In the embodiment, referring to Figure 3 In the embodiment, a second pressing part 5 with an inner diameter of 150 mm and an outer diameter of 300 mm is added to the periphery of the first pressing part 4, pressure sensors 6 and distance sensors 7 are installed at 0°, 90°, 180° and 270° positions of the second pressing part 5 with a diameter of 200 mm and 300 mm, the second pressing part 5 is connected with the transmission arm 2 by using a support 3, the thickness of the second pressing part 5 is consistent with the thickness of the first pressing part 4, and the material is made of peek (polyether ether ketone). Peek is a kind of high polymer material, which has high mechanical strength, high temperature resistance, good toughness and rigidity. The second pressing part 5 in the embodiment can not only cover the edge of the wafer 8 to press the warped wafer 8 on the working platform 1, but also can measure the rigidity and height of the warped wafer 8 through the pressure sensors 6 and the distance sensors 7.
[0038] By the above structure, referring toFigure 2 When the transfer arm 2 with the wafer 8 just hits the work platform 1, the pressure value of the pressure sensor 6 is 0, and the distance sensor 7 records the first height value of the first pressing part 4; then the transfer arm 2 is lowered, the pressure sensor 6 is continuously stressed until the wafer 8 material completely adheres to the work platform 1, and the transfer arm 2 cannot be lowered any more, at this time, the distance sensor 7 records the second height value of the first pressing part 4, the device also includes a control mechanism (not shown in the figure), the control mechanism calculates the height difference between the first height value and the second height value to obtain the height of the wafer 8 warping, and at the same time, when the wafer 8 material completely adheres to the work platform 1, the control mechanism reads the pressure value on the pressure sensor 6, so as to obtain a force reflecting the wafer 8 material warping, that is, the rigidity of the wafer 8 warping.
[0039] The wafer transfer device provided by the embodiment can also be applied to a patch machine, and when the wafer is finished with front surface patching and UV, and is placed on the patching platform, the rigidity and warping height of the wafer after grinding can also be measured; the transfer arm of a stealth laser machine can also adopt the wafer transfer device provided by the embodiment, and when the wafer is finished with positioning in the stealth laser machine, the transfer arm grasps the material and places it on the work platform, and the sensor on the wafer transfer device can measure the rigidity and warping height of the wafer.
[0040] The above disclosed content is only the preferred feasible embodiment of the utility model, and does not limit the patent application range of the utility model, so that equivalent technical changes made by applying the utility model specification and drawing content are all included in the patent application range of the utility model.
[0041] Each embodiment in the specification is described in a progressive manner, and the same or similar parts between each embodiment can be referred to each other, and each embodiment mainly describes the difference from other embodiments.
[0042] Although the application is described through the embodiments, those skilled in the art know that the application has many modifications and changes without departing from the spirit of the application, and it is hoped that the attached embodiments include these modifications and changes without departing from the application.
Claims
1. A wafer transfer device capable of measuring the warpage height and warpage stiffness of a wafer supported on a work platform, characterized by, The utility model relates to a wafer flat pressing device, which comprises: a transfer arm above the work platform, used for transferring the wafer to the work platform, and a support connected with the transfer arm; a first pressing part and a second pressing part above the work platform, used for pressing the wafer flat on the work platform, the first pressing part is arranged at the bottom of the transfer arm, the second pressing part is arranged at the bottom of the support, and the inner diameter of the second pressing part is greater than the outer diameter of the first pressing part; wherein the second pressing part is provided with a plurality of pressure sensors for measuring the wafer warping rigidity and distance sensors for measuring the wafer warping height.
2. The wafer transfer device of claim 1, wherein, The support comprises a first connecting rod and a second connecting rod, one end of the first connecting rod is connected with the side wall of the transfer arm, the other end of the first connecting rod is connected with the second connecting rod, and the bottom of the second connecting rod is fixedly connected with the second pressing part.
3. The wafer transfer device of claim 2, wherein, A plurality of first connecting rods are arranged in a ring matrix, and the included angle between adjacent first connecting rods is 90°.
4. The wafer transfer device of claim 1, wherein, The first pressing part and the second pressing part are concentric circular structures.
5. The wafer transfer device of claim 1, wherein, The outer diameter of the second pressing part is consistent with the diameter of the wafer.
6. The wafer transfer device of claim 1, wherein, The thickness of the first pressing part and the second pressing part is consistent.
7. The wafer transfer device of claim 1, wherein, A plurality of pressure sensors are arranged in a ring matrix with the center of the first pressing part as the center, and the included angle between adjacent pressure sensors is 90°.
8. The wafer transfer device of claim 1, wherein, A plurality of distance sensors are arranged in a ring matrix with the center of the first pressing part as the center, and the included angle between adjacent distance sensors is 90°.