Robot arm carrying suction cup for semiconductor wafers

Abstract

The utility model discloses a manipulator carrying sucker for semiconductor wafers, which belongs to the technical field of semiconductor wafers and comprises a mechanical arm, a connecting rod is mounted at one end of the mechanical arm, a mounting plate is fixedly connected to one end of the connecting rod, the manipulator carrying sucker further comprises a carrying mechanism, the carrying mechanism is arranged on the inner wall of the mounting plate, and the mounting plate is fixedly connected with the mounting plate. A plurality of uniformly arranged guide pipes are mounted on the inner wall of the mounting disc, one side of each guide pipe is communicated with a plurality of uniformly arranged sucking disc main bodies, one end of each sucking disc main body is fixedly connected with a telescopic cylinder, and the other end of each telescopic cylinder is fixedly connected with a gasket. By means of the mode, the guide pipe in the installation disc is matched with the suction cup body so that the semiconductor wafer can be adsorbed and fixed, the telescopic cylinder at one end of the suction cup body is extruded when making contact with the semiconductor wafer and is tightly attached to the semiconductor wafer, the flexible gasket is attached to the surface of the semiconductor wafer, and the suction cup can be tightly attached to the semiconductor wafer; the semiconductor wafer carrying effect of the device can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor wafer technical field, concretely relates to a kind of machine hand handling suction cup of semiconductor wafer. BACKGROUND

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuit, and its raw material is silicon. After dissolving high-purity polysilicon, it is doped into silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding and polishing, the silicon crystal rod is cut into slices to form a silicon wafer, which is a wafer. During the handling of the semiconductor wafer, a robot is needed to handle it.

[0003] At present, Chinese patent discloses a semiconductor clamping device and semiconductor handling equipment (authorized announcement number CN222270320U). The suction cup mechanism is provided with a suction hole connected to an external air source to generate suction force. The suction cup mechanism can suction the wafer from above. The fork disc mechanism can lift the wafer from below. One of the suction cup mechanism and the fork disc mechanism is selectively detachably connected to the mounting support assembly. For some process chambers suitable for using the top picking method, the suction cup mechanism is mounted on the mounting support assembly and driven by the robot to the required position to pick and transfer the wafer from top to bottom.

[0004] According to the above reference, one end of the first extension air duct is connected to the external air source, and the other end is connected to the suction hole to provide the gas provided by the external air source to the suction cup mechanism. The first sealing element is arranged between the first extension plate and the second extension plate to seal the first extension air duct, so as to avoid air leakage due to loose sealing of the first extension air duct, thereby affecting the stability of the air outlet of the suction hole and ensuring the reliability of the suction cup mechanism in suctioning the wafer. However, when the suction cup is used to handle the conventional semiconductor crystal, the suction hole is easily disturbed by external factors, which causes the suction cup to fail to handle, affects the use effect of the suction cup, and is not convenient for efficient handling of the semiconductor wafer, which reduces the use effect of the device.

[0005] Therefore, the utility model designs a kind of machine hand handling suction cup of semiconductor wafer to solve the above problems. UTILITY MODEL CONTENT

[0006] In view of the above shortcomings of the prior art, the utility model provides a machine hand handling suction cup of semiconductor wafer.

[0007] To achieve the above purpose, the utility model is realized by the following technical solutions:

[0008] The utility model provides a machine hand carrying suction disc of semiconductor wafer, including mechanical arm, one end of mechanical arm is equipped with connecting rod, one end of connecting rod is fixedly connected with mounting disc, still include carrying mechanism, carrying mechanism sets up in the inner wall of mounting disc, the inner wall of mounting disc is equipped with a plurality of even arrangement's guide pipe, one side of guide pipe is linked with a plurality of even arrangement's suction disc body, one end of suction disc body is fixedly connected with telescopic cylinder, the other end of telescopic cylinder is fixedly connected with gasket.

[0009] Further, the carrying mechanism further comprises a filter screen fixedly connected to one end of the inner wall of the telescopic cylinder, and the filter screen is arranged at one end of the suction disc body.

[0010] Further, two connecting pipes are communicated between the guide pipes.

[0011] Further, a plurality of evenly arranged protective pads are fixedly connected to one end of the mounting disc, and the suction disc body is arranged between the protective pads.

[0012] Further, a fixing ring is fixedly connected to both ends of the connecting pipe, and the fixing ring is slidingly connected to the inner wall of the mounting disc.

[0013] Further, a plurality of evenly arranged electric push rods are fixedly connected to the inner wall of the mounting disc, and one end of the electric push rod is fixedly connected to the fixing ring.

[0014] Further, a vacuum pump is mounted on the inner wall of the connecting rod, and the air inlet pipe and the air outlet pipe at one end of the vacuum pump penetrate through the outer wall of the connecting rod.

[0015] Further, the gas delivery pipe is communicated with the air inlet pipe on the vacuum pump. Advantages

[0016] 1. When carrying the semiconductor wafer, the guide pipe in the mounting disc cooperates with the suction disc body to adsorb and fix the semiconductor wafer, a plurality of guide pipes are arranged in order from large to small in diameter and are communicated through two connecting pipes, the two connecting pipes are arranged in a cross shape, the guide pipes can be uniformly sucked, the telescopic cylinder at one end of the suction disc body is extruded to shrink when contacting the semiconductor wafer, the telescopic cylinder can be tightly attached to the semiconductor wafer through the elastic force carried by itself, the telescopic cylinder is attached to the surface of the semiconductor wafer through the flexible gasket, the carrying effect of the mechanical hand is improved, the filter screen in the telescopic cylinder can intercept dust in the external air to prevent the dust from affecting the use of the device, a plurality of electric push rods can adjust the position of the suction disc body through the fixing ring, the suction disc can be tightly attached to the semiconductor wafer, and the carrying effect of the device on the semiconductor wafer can be improved.

[0017] 2. The connecting rod is provided with a vacuum pump, the air outlet pipe and the air inlet pipe of the vacuum pump are arranged outside the connecting rod, the air inlet pipe is communicated with the guide pipe and the connecting pipe in the mounting disc through two gas conveying pipes, the negative pressure of the chuck body is generated, the semiconductor wafer can be adsorbed and carried, and the practical effect of the device can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings required to be used in the embodiment or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0019] Figure 1 It is a perspective view of the main body structure of the semiconductor wafer robot carrying chuck in the present application;

[0020] Figure 2 It is a perspective view of the carrying mechanism structure of the semiconductor wafer robot carrying chuck in the present application;

[0021] Figure 3 It is a perspective view of the carrying mechanism structure of the semiconductor wafer robot carrying chuck in the present application; Figure 2 It is an enlarged view of A in the figure;

[0022] Figure 4 It is an enlarged view of B in the figure; Figure 2 It is an enlarged view of B in the figure;

[0023] Figure 5 It is a perspective view of the local structure of the carrying mechanism of the semiconductor wafer robot carrying chuck in the present application.

[0024] The reference numbers in the figure represent respectively:

[0025] 1, mechanical arm; 2, connecting rod; 3, mounting disc; 4, carrying mechanism; 401, guide pipe; 402, chuck body; 403, telescopic cylinder; 404, gasket; 405, filter screen; 406, connecting pipe; 407, protective pad; 408, fixing ring; 409, electric push rod; 410, vacuum pump; 411, gas conveying pipe. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model below. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0027] The utility model will be further described in combination with embodiments below.

[0028] In some embodiments, referring to the drawings attached Figures 1-5 A machine hand carrying suction disc of semiconductor wafer, including mechanical arm 1, one end of mechanical arm 1 is installed with connecting rod 2, one end of connecting rod 2 is fixedly connected with mounting disc 3, still including carrying mechanism 4, carrying mechanism 4 is arranged in the inner wall of mounting disc 3, the inner wall of mounting disc 3 is installed with several evenly arranged pipes 401, one side of pipe 401 is communicated with several evenly arranged suction disc main bodies 402, one end of suction disc main body 402 is fixedly connected with telescopic cylinder 403, the other end of telescopic cylinder 403 is fixedly connected with gasket 404.

[0029] When carrying semiconductor wafer, through control system drive end effector, make end effector can control mounting disc 3 on mechanical arm 1 and move, with semiconductor wafer, mounting disc 3 drives telescopic cylinder 403 and gasket 404 on one end of suction disc main body 402 and contacts, and telescopic cylinder 403 is extruded, telescopic cylinder 403 is driven gasket 404 by its elasticity and adheres to semiconductor wafer surface, make suction disc main body 402 can carry out efficient adsorption to semiconductor wafer, facilitate carrying.

[0030] In some embodiments, as Figure 2 , Figure 3 and Figure 4 Indicated, as a preferred embodiment of the utility model, carrying mechanism 4 still includes filter screen 405 fixedly connected to one end of the inner wall of telescopic cylinder 403, and the filter screen 405 is arranged at one end of the suction disc main body 402.

[0031] The filter screen 405 in the telescopic cylinder 403 can intercept dust in the external air when the suction disc main body 402 is running, improving the adsorption effect of the suction disc main body 402 on the semiconductor wafer.

[0032] In the embodiments of the utility model, the two connecting pipes 406 are communicated between the plurality of pipes 401.

[0033] The plurality of pipes 401 are communicated through two connecting pipes 406, the connecting pipes 406 uniformly distribute the gas, and the adsorption effect of the chuck main body 402 is improved.

[0034] In the embodiment of the utility model, the one end of mounting disc 3 is fixedly connected with several evenly arranged protective pads 407, and the chuck main body 402 is arranged between the several protective pads 407.

[0035] When the mounting disc 3 drives the chuck main body 402 to contact the surface of the semiconductor wafer, the plurality of protective pads 407 on the mounting disc 3 can protect the chuck main body 402, so that the device can not damage the semiconductor wafer during the transportation of the semiconductor wafer.

[0036] In the embodiment of the utility model, the two ends of the two connecting pipes 406 are fixedly connected with fixing rings 408, and the fixing rings 408 are slidingly connected to the inner wall of the mounting disc 3.

[0037] The fixing ring 408 at one end of the electric push rod 409 is sleeved on one end of the connecting pipe 406, the plurality of pipes 401 are communicated through the connecting pipe 406, and the pipes 401 move when the connecting pipe 406 moves.

[0038] In the embodiment of the utility model, the inner wall of the mounting disc 3 is fixedly connected with several evenly arranged electric push rods 409, and one end of the electric push rod 409 is fixedly connected with the fixing ring 408.

[0039] The electric push rod 409 in the mounting disc 3 is driven by the control system to drive the fixing ring 408 to extend to one end, the fixing ring 408 drives the pipes 401 to move to one end through the connecting pipe 406, the position of the chuck main body 402 at one end of the pipes 401 can be adjusted, and the adsorption effect of the device is improved.

[0040] In some embodiments, as shown in Figure 5 As a preferred embodiment of the utility model, the inner wall of the connecting rod 2 is provided with a vacuum pump 410, and the air inlet pipe and the air outlet pipe at one end of the vacuum pump 410 penetrate through the outer wall of the connecting rod 2.

[0041] The vacuum pump 410 is driven to operate by the control system, the vacuum pump 410 cooperates with the gas conveying pipe 411 at one end to extract the gas in the connecting pipe 406 and the pipe 401, so that the chuck main body 402 generates negative pressure after contacting the semiconductor wafer, the semiconductor wafer can be adsorbed and transported, and the air outlet pipe at one end of the vacuum pump 410 can discharge air.

[0042] In the embodiment of the utility model, the two ends of one of the connecting pipes 406 are communicated with the gas conveying pipe 411, one end of the gas conveying pipe 411 penetrates through the mounting disc 3 and is communicated with the air inlet pipe on the vacuum pump 410.

[0043] The vacuum pump 410 exhaust pipe can be communicated with the connecting pipe 406 in the mounting disc 3 through two gas conveying pipes 411, and the connecting pipe 406 is used for exhausting the side of the suction disc main body 402 of the guide pipe 401 to generate negative pressure to adsorb and fix the semiconductor wafer.

[0044] The above examples are only used to illustrate the technical solutions of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can still be modified, or some technical features can be replaced equivalently; and these modifications or replacements will not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A machine hand carrying suction disc of semiconductor wafer, comprising a mechanical arm (1), one end of the mechanical arm (1) is provided with a connecting rod (2), one end of the connecting rod (2) is fixedly connected with a mounting disc (3), characterized in that: It further comprises a carrying mechanism (4), the carrying mechanism (4) is arranged on the inner wall of the mounting disc (3), a plurality of uniformly arranged guide pipes (401) are arranged on the inner wall of the mounting disc (3), a plurality of uniformly arranged suction disc bodies (402) are communicated with one side of the guide pipes (401), one end of the suction disc body (402) is fixedly connected with a telescopic cylinder (403), the other end of the telescopic cylinder (403) is fixedly connected with a gasket (404).

2. The robot suction pad for handling a semiconductor wafer according to claim 1, wherein The carrying mechanism (4) further comprises a filter screen (405) fixedly connected to one end of the inner wall of the telescopic cylinder (403), and the filter screen (405) is arranged on one end of the suction disc body (402).

3. The robot suction pad for handling a semiconductor wafer according to claim 1, wherein Two connecting pipes (406) are communicated between a plurality of the guide pipes (401).

4. The robot suction pad for handling a semiconductor wafer according to claim 1, wherein One end of the mounting disc (3) is fixedly connected with a plurality of uniformly arranged protective pads (407), and the suction disc body (402) is arranged between the plurality of protective pads (407).

5. The robot handling chuck for semiconductor wafers according to claim 3, wherein Both ends of the two connecting pipes (406) are fixedly connected with a fixed ring (408), and the fixed ring (408) is slidingly connected with the inner wall of the mounting disc (3).

6. The robot handling chuck for semiconductor wafers according to claim 5, wherein A plurality of uniformly arranged electric push rods (409) are fixedly connected with the inner wall of the mounting disc (3), and one end of the electric push rod (409) is fixedly connected with the fixed ring (408).

7. The robot suction pad for handling a semiconductor wafer according to claim 1, wherein A vacuum pump (410) is arranged on the inner wall of the connecting rod (2), and the air inlet pipe and the air outlet pipe of one end of the vacuum pump (410) penetrate through the outer wall of the connecting rod (2).

8. The robot suction pad for handling a semiconductor wafer according to claim 3, wherein Both ends of one of the connecting pipes (406) are communicated with a gas conveying pipe (411), one end of the gas conveying pipe (411) penetrates through the mounting disc (3) and is communicated with the air inlet pipe on the vacuum pump (410).

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