Pressing block transfer device for semiconductor production

Abstract

The utility model discloses a briquetting transfer device for semiconductor production, which relates to the technical field of briquetting transfer, solves the problem that the briquetting is inconvenient to discharge quickly, and comprises a movable chassis, the top of the movable chassis is fixedly connected with a bearing box, and the front and rear positions of the top of the bearing box are fixedly connected with baffles. By arranging the bearing box, the guide rollers and the baffles, semiconductor pressing blocks can be stored and supported conveniently, by arranging the fixing mechanism, the semiconductor pressing blocks can be clamped and fixed, and therefore the semiconductor pressing blocks can be clamped and fixed conveniently and rapidly. According to the semiconductor pressing block transferring device, the semiconductor pressing block is arranged to be prevented from moving in the transferring process, a servo motor, a threaded rod, a threaded sleeve, a vertical plate and a push plate are arranged, the semiconductor pressing block can be pushed to move, the semiconductor pressing block is pushed down from the top of a guide roller to be discharged, and by means of the mode, the semiconductor pressing block discharging efficiency is high during transferring, and use is convenient.

Description

TECHNICAL FIELD

[0001] The utility model relates to briquetting transfer technical field especially is related to a briquetting transfer device for semiconductor production. BACKGROUND

[0002] In the semiconductor production process, the briquetting needs to be transferred, especially in the tinning and baking process, the briquetting needs to be transferred and transported, which requires the use of briquetting transfer device. Although the currently used briquetting transfer device can meet the normal use requirements, it still has some defects in actual use, for example, the currently used briquetting transfer device is not convenient to unload, and it is not convenient to unload the briquetting after transferring, and manual taking and placing of the briquetting is often required, which needs to be improved. Therefore, the present application provides a briquetting transfer device for semiconductor production. SUMMARY

[0003] In order to improve the problem of not being convenient to unload the briquetting, the utility model provides a briquetting transfer device for semiconductor production.

[0004] The utility model provides a briquetting transfer device for semiconductor production, adopts the following technical scheme:

[0005] A briquetting transfer device for semiconductor production, comprising a mobile chassis, the top of the mobile chassis is fixedly connected with a bearing box, the front and rear positions of the top of the bearing box are fixedly connected with baffles, the bottom of the opposite side of the two baffles is uniformly provided with guide rollers from left to right, the inner cavity of the bearing box is provided with a discharging mechanism, and the surface of the baffle is provided with a fixing mechanism.

[0006] The discharging mechanism comprises a partition plate, the partition plate is fixedly installed on the left side of the inner surface of the bearing box, the right side of the partition plate is fixedly connected with a servo motor, the output end of the servo motor is fixedly connected with a threaded rod, the right side of the threaded rod is rotatably connected with the connection of the right side of the inner cavity of the bearing box through a bearing, and the outer surface of the threaded rod is threadedly connected with a threaded sleeve.

[0007] By adopting the above technical scheme, the semiconductor briquetting can be pushed to move, and the semiconductor briquetting can be pushed down from the top of the guide roller for unloading. This mode has high unloading efficiency for semiconductor briquetting during transfer and is convenient to use.

[0008] Optionally, the fixing mechanism comprises a screw rod, the screw rod is threadedly connected to the surface of the baffle, one side of the screw rod is fixedly connected with a handle, and the end, away from the handle, of the screw rod is rotatably connected with a clamping plate through a bearing.

[0009] By adopting the technical scheme, the semiconductor pressing block can be clamped and fixed, and movement in the transfer process is avoided.

[0010] Optionally, the bottom of the threaded sleeve is fixedly connected with a sliding block, and the bottom of the inner cavity of the bearing box is provided with a sliding groove matched with the sliding block.

[0011] By adopting the technical scheme, the movement of the threaded sleeve can be guided and limited.

[0012] Optionally, the top of the bearing box is provided with a through groove, and the outer surface of the vertical plate is slidably connected with the inner surface of the through groove.

[0013] By adopting the technical scheme, the vertical plate can be moved conveniently.

[0014] Optionally, the left side of the bottom of the inner cavity of the bearing box is fixedly provided with a battery box, and the inner cavity of the battery box is provided with a storage battery.

[0015] By adopting the technical scheme, the servo motor can be powered.

[0016] Optionally, the surface of the clamping plate is fixedly provided with a protective pad, and the thickness of the protective pad is 3 mm.

[0017] By adopting the technical scheme, the surface of the clamping plate can be protected.

[0018] Optionally, the connecting part of the guide roller and the baffle is rotatably connected through a bearing, and the right side of the push plate is fixedly connected with a rubber pad.

[0019] By adopting the technical scheme, the surface of the push plate can be protected.

[0020] In summary, the utility model has the following beneficial effects:

[0021] The utility model discloses a bearing box, a guide roller and a baffle are arranged, and semiconductor pressing blocks can be conveniently stored and supported, a fixing mechanism is arranged, the semiconductor pressing blocks can be clamped and fixed, movement in the transfer process is avoided, a servo motor, a threaded rod, a threaded sleeve, a vertical plate and a push plate are arranged, the semiconductor pressing blocks can be pushed to move, the semiconductor pressing blocks are pushed down from the top of the guide roller to be discharged, and the semiconductor pressing blocks can be conveniently and efficiently discharged when being transferred. DRAWINGS

[0022] Figure 1 It is a structure schematic view of the utility model;

[0023] Figure 2 It is a right view of the structure of the utility model;

[0024] Figure 3 is a sectional view of the utility model structure;

[0025] Figure 4 is a top view of the utility model structure.

[0026] In the figure: 1, mobile chassis; 2, bearing box; 3, baffle; 4, guide roller; 5, blanking mechanism; 501, partition; 502, servo motor; 503, threaded rod; 504, threaded sleeve; 505, vertical plate; 506, push plate; 6, fixing mechanism; 601, screw rod; 602, handle; 603, clamping plate; 7, sliding block; 8, sliding slot; 9, through slot. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0028] Embodiment:

[0029] Please refer to Figures 1-4 A kind of briquetting transfer device for semiconductor production, including mobile chassis 1, the top of mobile chassis 1 is fixedly connected with bearing box 2, the front and rear positions of the top of bearing box 2 are fixedly connected with baffle 3, the bottom of the opposite side of two baffles 3 is evenly provided with guide roller 4 from left to right, the inner cavity of bearing box 2 is provided with blanking mechanism 5, the surface of baffle 3 is provided with fixed mechanism 6;

[0030] Blanking mechanism 5 includes partition 501, partition 501 is fixedly installed on the left side of the inner surface of bearing box 2, the right side of partition 501 is fixedly connected with servo motor 502, the output end of servo motor 502 is fixedly connected with threaded rod 503, the right side of threaded rod 503 is rotatably connected with the connecting place of the right side of the inner cavity of bearing box 2 by bearing, the outer surface of threaded rod 503 is screw-connected with threaded sleeve 504, the top of threaded sleeve 504 is fixedly connected with vertical plate 505, the top of vertical plate 505 is fixedly connected with push plate 506.

[0031] As a kind of technical optimization scheme of the utility model, further, fixed mechanism 6 includes screw rod 601, screw rod 601 is screw-connected on the surface of baffle 3, one side of screw rod 601 is fixedly connected with handle 602, the end, away from handle 602 of screw rod 601, is rotatably connected with clamping plate 603 by bearing.

[0032] As a technical optimization scheme of the utility model, further, the bottom of threaded sleeve 504 is fixedly connected with sliding block 7, the bottom of the inner cavity of bearing box 2 is provided with sliding groove 8 matched with sliding block 7, and the outer surface of sliding block 7 is slidably connected with the inner surface of sliding groove 8.

[0033] As a technical optimization scheme of the utility model, further, the top of bearing box 2 is provided with through slot 9, and the outer surface of vertical plate 505 is slidably connected with the inner surface of through slot 9.

[0034] As a technical optimization scheme of the utility model, further, the left side of the inner cavity bottom of bearing box 2 is fixedly installed with battery box, and the inner cavity of battery box is provided with storage battery.

[0035] As a technical optimization scheme of the utility model, further, the surface of clamping plate 603 is fixedly installed with protective pad, and the thickness of protective pad is 3mm.

[0036] As a technical optimization scheme of the utility model, further, the connecting part of guide roller 4 and baffle 3 is rotatably connected through bearing, and the right side of push plate 506 is fixedly connected with rubber pad.

[0037] In the embodiment: by setting bearing box 2, guide roller 4 and baffle 3, it is convenient to store and support semiconductor briquettes, by setting handle 602, screw rod 601 and clamping plate 603, a fixing mechanism 6 is jointly constructed, semiconductor briquettes can be clamped and fixed, movement in the transfer process is avoided, by setting servo motor 502, threaded rod 503, threaded sleeve 504, vertical plate 505 and push plate 506, semiconductor briquettes can be pushed to move, and semiconductor briquettes are pushed down from the top of guide roller 4 to be discharged, the mode is high in discharging efficiency of semiconductor briquettes during transfer, and convenient to use, by setting sliding block 7 and sliding groove 8, the movement of threaded sleeve 504 can be guided and limited, by setting through slot 9, vertical plate 505 can be conveniently moved, by setting battery box and storage battery, the power supply of moving chassis 1 and servo motor 502 is facilitated, by setting protective pad, the surface of clamping plate 603 can be protected.

[0038] The utility model discloses an implementation principle is: when using, the device is moved to the delivery band unloading end on semiconductor briquetting production line through the mobile chassis 1, and semiconductor briquetting is generally placed in the tray and is transported, at this time, the tray that stores semiconductor briquetting is conveyed to the top of guide roller 4 through the delivery band, rotates the handle 602, and the handle 602 drives screw rod 601 to rotate, and screw rod 601 drives the clamping plate 603 to move, and the semiconductor briquetting tray is clamped and fixed, then utilizes mobile chassis 1 and shifts, when shifting to the specified position, the semiconductor briquetting tray is released to the limit, and the control switch of servo motor 502 is started, and servo motor 502 drives screw rod 503 to rotate, and screw rod 503 drives threaded sleeve 504 to move, and threaded sleeve 504 drives vertical plate 505 to move to right, and vertical plate 505 drives push plate 506 to move to right, and push plate 506 pushes semiconductor briquetting tray to move to right, and semiconductor briquetting tray is pushed out and unloads, and this mode is high in semiconductor briquetting unloading efficiency when shifting, and convenient to use.

[0039] The above are all preferred embodiments of the utility model, and not limit the protection scope of the utility model accordingly, so: all equivalent changes made according to the structure, shape, principle of the utility model should be covered in the protection scope of the utility model.

Claims

1. A compact transfer device for semiconductor production, comprising a mobile base plate (1), characterized in that: The top of the mobile chassis (1) is fixedly connected with a bearing box (2), the front and rear positions of the top of the bearing box (2) are fixedly connected with baffles (3), the bottom of the opposite side of the two baffles (3) is uniformly provided with guide rollers (4) from left to right, the inner cavity of the bearing box (2) is provided with a discharging mechanism (5), the surface of the baffle (3) is provided with a fixing mechanism (6); The discharging mechanism (5) comprises a partition plate (501), the partition plate (501) is fixedly installed on the left side of the inner surface of the bearing box (2), the right side of the partition plate (501) is fixedly connected with a servo motor (502), the output end of the servo motor (502) is fixedly connected with a threaded rod (503), the right side of the threaded rod (503) is rotatably connected with the connecting part of the right side of the inner cavity of the bearing box (2) through a bearing, the outer surface of the threaded rod (503) is threadedly connected with a threaded sleeve (504), the top of the threaded sleeve (504) is fixedly connected with a vertical plate (505), the top of the vertical plate (505) is fixedly connected with a push plate (506).

2. The briquette transfer device for semiconductor production according to claim 1, characterized by: The fixing mechanism (6) comprises a screw rod (601), the screw rod (601) is threadedly connected with the surface of the baffle (3), one side of the screw rod (601) is fixedly connected with a handle (602), the end, away from the handle (602), of the screw rod (601) is rotatably connected with a clamping plate (603) through a bearing.

3. The briquette transfer device for semiconductor production according to claim 1, characterized by: The bottom of the threaded sleeve (504) is fixedly connected with a sliding block (7), the bottom of the inner cavity of the bearing box (2) is provided with a sliding groove (8) matched with the sliding block (7), and the outer surface of the sliding block (7) is slidably connected with the inner surface of the sliding groove (8).

4. The briquette transfer device for semiconductor production according to claim 1, characterized by: The top of the bearing box (2) is provided with a through groove (9), and the outer surface of the vertical plate (505) is slidably connected with the inner surface of the through groove (9).

5. The compact transfer device for semiconductor production according to claim 1, characterized by: A battery box is fixedly installed on the left side of the bottom of the inner cavity of the bearing box (2), and an accumulator is arranged in the inner cavity of the battery box.

6. The compact transfer device for semiconductor production according to claim 2, characterized by: A protective pad is fixedly installed on the surface of the clamping plate (603), and the thickness of the protective pad is 3mm.

7. The compact transfer device for semiconductor production according to claim 1, characterized by: The connecting part of the guide roller (4) and the baffle (3) is rotatably connected through a bearing, and the right side of the push plate (506) is fixedly connected with a rubber pad.

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