Adsorption device for wafer processing

Abstract

The utility model provides an adsorption device for wafer processing, and particularly relates to the field of adsorption devices for wafer processing. The problems that in the prior art, an adsorption device for wafer processing is inconvenient to adjust, a wafer cannot be driven to conduct multi-angle adjustment, later processing of the wafer can be affected, the wafer needs to be manually and frequently adjusted, and the wafer adsorption efficiency can be reduced are solved. Comprising a mounting table, a vertical frame is mounted on the left side of the top of the mounting table, a push column is arranged in an inner cavity of the vertical frame, the top of the push column penetrates through the top of the vertical frame, a top plate is mounted at the top of the push column, a motor is mounted on the right side of the top of the top plate, and a rotating shaft is mounted at the output end of the motor. Compared with an original adsorption device, the adsorption device is convenient to adjust, can drive the wafer to carry out multi-angle adjustment, does not affect the later processing of the wafer, does not need to manually and frequently adjust the wafer, and does not reduce the adsorption efficiency of the wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to the device in the field of wafer processing adsorption device, especially a kind of for wafer processing adsorption device. BACKGROUND

[0002] Wafer is a kind of basic material in semiconductor manufacturing, usually is the wafer with silicon as main component, wafer needs to use adsorption device in processing process, is adsorbed and cleaned, wafer adsorption device is a kind of equipment used in semiconductor manufacturing process, for adsorption and processing wafer.

[0003] The existing wafer processing adsorption device is inconvenient to adjust, cannot drive wafer to adjust at multiple angles, can affect the processing of wafer later period, needs to be adjusted frequently to wafer by artificial, can reduce the efficiency of wafer adsorption.

[0004] Therefore, it is necessary to provide a wafer processing adsorption device to solve the above technical problems, and the information disclosed in this background section is only intended to increase the understanding of the overall background of the utility model, and does not necessarily be regarded as acknowledging or implying in any form that the information constitutes prior art known to those skilled in the art. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a wafer processing adsorption device to solve the problem of the wafer processing adsorption device in the prior art, which is inconvenient to adjust, cannot drive wafer to adjust at multiple angles, can affect the processing of wafer later period, needs to be adjusted frequently to wafer by artificial, and can reduce the efficiency of wafer adsorption. The preferred technical solutions in the many technical solutions provided by the utility model can produce many technical effects, which are described in detail below.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0007] The utility model provides a wafer processing adsorption device, which comprises: a mounting table, a vertical frame is installed on the left side of the top of the mounting table, a push column is arranged in the inner cavity of the vertical frame, the top of the push column penetrates the top of the vertical frame, a top plate is installed on the top of the push column, a motor is installed on the right side of the top of the top plate, a rotating shaft is installed on the output end of the motor, a fixed plate is installed on the bottom of the rotating shaft, a gas cylinder is installed on the right side of the bottom of the fixed plate, a vacuum adsorption seat is installed on the bottom of the gas cylinder, an adsorption table is installed on the bottom of the vacuum adsorption seat, the bottom of the adsorption table is fixed with the right side of the top of the mounting table, an electric sliding rail plate is installed on the bottom of the push column, sliding columns are arranged on the front side and the rear side of the top of the electric sliding rail plate, guide grooves are formed in the front side and the rear side of the sliding column, and buffer springs are sleeved on the bottom of the surface of the sliding column.

[0008] Preferably, the top and bottom of the slide column are fixed with the top and bottom of the inner cavity of the vertical frame.

[0009] Preferably, the front side and the rear side of the top of the electric slide rail plate are provided with through openings, and the inner cavities of the through openings are provided with sliding blocks, and the inner sides of the sliding blocks are slidably connected with the inner cavities of the guide grooves.

[0010] Preferably, the top of the buffer spring is fixed with the bottom of the electric slide rail plate, and the bottom of the buffer spring is fixed with the bottom of the inner cavity of the vertical frame.

[0011] Preferably, the bottom of the front side of the vertical frame is provided with an inspection plate through screws.

[0012] Preferably, the periphery of the bottom of the mounting table is provided with supporting legs, and the bottom of the supporting legs is provided with anti-skid pads.

[0013] The utility model provides a kind of for wafer processing suction device beneficial effect is: compared with original suction device, the suction device is convenient to adjust, can drive wafer to carry out multi-angle adjustment, will not affect wafer later processing, need not manually frequently adjust wafer, will not reduce the efficiency of wafer suction. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the overall structure schematic diagram of the utility model for wafer processing suction device.

[0015] Figure 2 It is the mounting table and vertical frame structure bottom view of the utility model for wafer processing suction device.

[0016] Figure 3 It is the vertical frame structure sectional view of the utility model for wafer processing suction device.

[0017] Figure 4 It is the vertical frame structure bottom view of the utility model for wafer processing suction device.

[0018] In the drawing: 1, mounting table;2, vertical frame;3, push column;4, top plate;5, motor;6, rotating shaft;7, fixed plate;8, air cylinder;9, vacuum suction seat;10, suction table;11, electric slide rail plate;12, slide column;13, guide groove;14, sliding block;15, through opening;16, buffer spring. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical scheme and advantages of the utility model more clear, the technical scheme of the utility model will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope protected by the utility model.

[0020] The specific embodiments of the utility model will be described in detail below with reference to the drawings. In each drawing, the same reference signs represent the same or corresponding technical features. Each drawing is only a schematic drawing and is not necessarily drawn according to the actual proportions.

[0021] Referring to Figure 1 , Figure 2 , Figure 3 and Figure 4 , a kind of adsorption device for wafer processing, including: installation platform 1, the left side of the top of installation platform 1 is equipped with vertical frame 2, the inner cavity of vertical frame 2 is provided with push column 3, the top of push column 3 penetrates the top of vertical frame 2, the top of push column 3 is equipped with top plate 4, the right side of the top of top plate 4 is equipped with motor 5, the output end of motor 5 is equipped with rotating shaft 6, the bottom of rotating shaft 6 penetrates the right side of the bottom of top plate 4 and is equipped with fixed plate 7, the right side of the bottom of fixed plate 7 is equipped with air cylinder 8, the bottom of air cylinder 8 is equipped with vacuum adsorption seat 9, the bottom of vacuum adsorption seat 9 is equipped with adsorption platform 10, the bottom of adsorption platform 10 is fixed with the right side of the top of installation platform 1, the bottom of push column 3 is equipped with electric sliding rail plate 11, the front side and the back side of the top of electric sliding rail plate 11 are provided with slide column 12, the front side and the back side of slide column 12 are provided with guide slot 13, the bottom of the surface of slide column 12 is equipped with buffer spring 16.

[0022] Further, the top and bottom of slide column 12 are fixed with the top and bottom of the inner cavity of vertical frame 2.

[0023] In this embodiment, the worker starts electric sliding rail plate 11, and electric sliding rail plate 11 drives sliding block 14 to slide in the inner cavity of guide slot 13, and sliding block 14 drives electric sliding rail plate 11 to move upward or downward.

[0024] Further, the front side and the back side of the top of electric sliding rail plate 11 are provided with through port 15, and the front side and the back side of the inner cavity of through port 15 are equipped with sliding block 14, and the inner side of sliding block 14 is slidably connected with the inner cavity of guide slot 13.

[0025] In this embodiment, electric sliding rail plate 11 drives top plate 4, motor 5, rotating shaft 6, fixed plate 7, air cylinder 8 and vacuum adsorption seat 9 to move up and down through push column 3.

[0026] Further, the top of the buffer spring 16 is fixed with the bottom of the electric sliding rail plate 11, and the bottom of the buffer spring 16 is fixed with the bottom of the inner cavity of the vertical frame 2.

[0027] In the embodiment, the vacuum suction seat 9 driven by the air cylinder 8 can move up and down reciprocatingly, which is convenient for the suction treatment of the wafer above the suction table 10.

[0028] Further, the bottom of the front of the vertical frame 2 is provided with a maintenance plate through screws.

[0029] In the embodiment, the motor 5 drives the multi-angle adjustment of the vacuum suction seat 9 through the rotating shaft 6 and the fixed plate 7, which is convenient for the suction treatment of the wafer below.

[0030] Further, the support feet are installed around the bottom of the mounting table 1, and the bottom of the support feet is provided with anti-skid pads.

[0031] In the embodiment, the working principle of the vacuum suction seat 9 mainly depends on the low pressure difference in the vacuum environment to generate suction force, so as to achieve the purpose of adsorbing objects. By extracting the air inside, a vacuum state is formed, so that the air pressure inside the suction seat is much lower than the atmospheric pressure outside, thereby generating a pressure difference. This pressure difference causes the suction seat and the adsorbed object to generate an attractive force, realizing the adsorption and fixation of the object. The vacuum suction seat 9 can firmly adsorb and fix the wafer, which is convenient for processing and treating the wafer. Through the setting of the maintenance plate, the vertical frame 2 is convenient to open, which is convenient for the maintenance and repair of the driving part in the vertical frame 2. Through the setting of the buffer spring 16, the stability of the electric sliding rail plate 11 during movement can be increased, and the electric sliding rail plate 11 can be limited. The electric sliding rail plate 11 will not collide with the inner wall bottom of the vertical frame 2.

[0032] In use, the worker starts the electric sliding rail plate 11, the electric sliding rail plate 11 drives the sliding block 14 to slide in the inner cavity of the guide groove 13, and the sliding block 14 drives the electric sliding rail plate 11 to move upwards or downwards, the electric sliding rail plate 11 drives the top plate 4, the motor 5, the rotating shaft 6, the fixed plate 7, the air cylinder 8 and the vacuum suction seat 9 to move up and down through the push column 3, through the setting of the air cylinder 8, the air cylinder 8 drives the vacuum suction seat 9 to reciprocate up and down, so as to facilitate the suction treatment of the wafer above the suction table 10, through the setting of the motor 5, the motor 5 drives the vacuum suction seat 9 to adjust the multi-angle through the rotating shaft 6 and the fixed plate 7, so as to facilitate the suction treatment of the wafer below, the working principle of the vacuum suction seat 9 mainly depends on the low pressure difference in the vacuum environment to generate suction force, so as to achieve the purpose of adsorbing objects, by extracting the air inside, forming a vacuum state, so that the air pressure inside the suction seat is much lower than the atmospheric pressure outside, so as to generate a pressure difference, which makes the suction seat and the suction object generate attractive force, realizes the adsorption and fixation of the object, the vacuum suction seat 9 can firmly adsorb and fix the wafer, facilitating the processing of the wafer, through the setting of the maintenance plate, the effect of facilitating the opening of the vertical frame 2 is achieved, which is convenient for maintaining and repairing the driving part in the vertical frame 2, through the setting of the buffer spring 16, the stability of the electric sliding rail plate 11 during movement can be increased, and the electric sliding rail plate 11 can be limited, and the electric sliding rail plate 11 will not collide with the inner wall bottom of the vertical frame 2.

[0033] It is apparent for those skilled in the art that the present application is not limited to the details of the foregoing exemplary embodiments, and the present application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as illustrative and not restrictive, and the scope of the present application is defined by the appended claims rather than the foregoing description, and it is intended to encompass all changes falling within the meaning and range of equivalents of the elements of the claims. Any reference signs in the claims should not be considered as limiting the claims to which they belong.

[0034] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. An adsorption device for wafer processing, characterized in that, Include: The installation platform (1), the left side of the top of the installation platform (1) is provided with a vertical frame (2), the inner cavity of the vertical frame (2) is provided with a push column (3), the top of the push column (3) penetrates the top of the vertical frame (2), the top of the push column (3) is provided with a top plate (4), the right side of the top of the top plate (4) is provided with a motor (5), the output end of the motor (5) is provided with a rotating shaft (6), the bottom of the rotating shaft (6) penetrates the right side of the bottom of the top plate (4) and is provided with a fixed plate (7), the right side of the bottom of the fixed plate (7) is provided with a pneumatic cylinder (8), the bottom of the pneumatic cylinder (8) is provided with a vacuum suction seat (9), the bottom of the vacuum suction seat (9) is provided with a suction platform (10), the bottom of the suction platform (10) is fixed with the right side of the top of the installation platform (1), the bottom of the push column (3) is provided with an electric sliding rail plate (11), the front side and the rear side of the top of the electric sliding rail plate (11) are provided with sliding columns (12), the front side and the rear side of the sliding column (12) are provided with guide grooves (13), the bottom of the surface of the sliding column (12) is provided with a buffer spring (16).

2. The adsorption apparatus for wafer processing according to claim 1, wherein: The top and bottom of the sliding column (12) are fixed with the top and bottom of the inner cavity of the vertical frame (2).

3. The adsorption apparatus for wafer processing according to claim 1, wherein: The front side and the rear side of the top of the electric sliding rail plate (11) are provided with through openings (15), the front side and the rear side of the inner cavity of the through opening (15) are provided with sliding blocks (14), and the inner side of the sliding block (14) is connected with the inner cavity of the guide groove (13) in a sliding mode.

4. The adsorption apparatus for wafer processing according to claim 1, wherein: The top of the buffer spring (16) is fixed with the bottom of the electric sliding rail plate (11), and the bottom of the buffer spring (16) is fixed with the bottom of the inner cavity of the vertical frame (2).

5. The adsorption apparatus for wafer processing according to claim 1, wherein: The bottom of the front of the vertical frame (2) is provided with an inspection plate through screws.

6. The adsorption apparatus for wafer processing according to claim 1, wherein: The bottom of the installation platform (1) is provided with supporting legs, and the bottom of the supporting leg is provided with a non-slip pad.

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