Ceramic water cooling plate with high voltage resistance and efficient heat dissipation

Abstract

The utility model discloses a ceramic water-cooling plate with high pressure resistance and efficient heat dissipation, which comprises a ceramic substrate, a ceramic back plate and a sealing ring, the sealing ring is sealed between the ceramic substrate and the ceramic back plate, a cooling water channel is processed on the back surface of the ceramic substrate, the cooling water channel is sealed after the ceramic back plate covers the cooling water channel, and the ceramic back plate covers the cooling water channel. Mounting holes communicated with the cooling water channel are formed in the rear end face of the ceramic back plate, joint nuts are fixedly mounted at the mounting holes, water nozzle joints are mounted through the joint nuts, and the two mounting holes are formed in the two ends of the cooling water channel respectively; processing a fixing hole for fixing a power device on the front surface of the ceramic substrate; according to the water cooling plate, the required cooling water channel is directly processed on the ceramic substrate, cooling water can be in direct contact with the ceramic substrate, the contact area is large, the heat dissipation thermal resistance is small, and the heat dissipation efficiency is high.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of high voltage resistance, high-efficiency heat dissipation ceramic water-cooled plate. BACKGROUND

[0002] With the development of society, the progress of science, the advent of silicon thyristor marks the birth of power electronics technology, which has successively experienced rectifier era, inverter generation and frequency converter era. Among them, power MOSFET (metal-oxide semiconductor field effect transistor), IGBT (insulated gate bipolar transistor), IGCT (integrated gate-commutated thyristor) and other power semiconductor composite devices (referred to as power devices) that combine high frequency, high voltage and large current are used in engineering applications, which promotes the application of power electronics technology in many fields such as household, commercial, industrial, transportation, power system, aerospace and communication; At the same time, its wide application prospect promotes the rapid development of power electronics technology.

[0003] Now the market capacity requirement of high-voltage frequency converter and high-voltage dynamic reactive power compensation device is getting bigger and bigger, and the products with high power and large capacity usually use water cooling as the cooling method. Because the power unit device is high voltage to the outside, the cooling water must be deionized water which is not conductive when using conventional aluminum water-cooled plate. Deionized water has high requirements for cooling equipment, and the cooling equipment is relatively complex and has high cost. The conventional ceramic water-cooled plate is usually embedded with copper pipe inside, and the water channel layout cannot be too dense due to the influence of the bending radius of the copper pipe. The heat dissipation power of the water-cooled plate is small, and the combination method of copper pipe and ceramic plate is usually adhesive, so the thermal resistance is large. The heat dissipation efficiency of the conventional ceramic water-cooled plate is low. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of high voltage resistance, high-efficiency heat dissipation ceramic water-cooled plate to alleviate the high cost, high failure rate of water cooling system and low heat dissipation efficiency of ordinary ceramic water-cooled plate caused by using deionized water cooling equipment in the prior art.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] A kind of high voltage resistance, high-efficiency heat dissipation ceramic water-cooled plate, including ceramic substrate, ceramic back plate and sealing ring, the sealing ring is sealed between the ceramic substrate and ceramic back plate, cooling water channel is processed on the back of the ceramic substrate, the ceramic back plate covers and seals the cooling water channel, mounting hole communicating with the cooling water channel is processed at the rear end face of the ceramic back plate, connector nut is fixedly installed at the mounting hole, water nozzle connector is installed through the connector nut, the mounting hole is provided with two, respectively located at both ends of the cooling water channel;Fixing hole for fixing power device is processed on the front of the ceramic substrate.

[0007] Preferably, a fixing nut for fixing a fixing bolt is installed in the fixing hole.

[0008] Preferably, the contact position of the fixing nut and the fixing hole is coated with tile fixing glue.

[0009] Preferably, tile glue is coated on the back of the ceramic substrate at both sides of the cooling water channel, and the ceramic back plate is fixed by the tile glue.

[0010] Preferably, a groove is formed at the periphery of the back of the ceramic substrate, and the sealing ring is embedded in the groove.

[0011] Compared with the prior art, the utility model has the beneficial effects that:

[0012] I. The water cooling plate is directly processed into a required cooling water channel on a ceramic substrate, cooling water can directly contact the ceramic substrate, the contact area is large, the heat dissipation thermal resistance is small, and the heat dissipation efficiency is high.

[0013] II. After the sealing ring is added to the ceramic substrate, the ceramic glue is used for fixing, and the risk of water leakage of the water cooling plate can be avoided.

[0014] III. The water cooling plate adopts ceramic material, which utilizes the high pressure resistance of ceramic to play a high pressure isolation role on the power device requiring heat dissipation. The water cooling of the high-voltage equipment power device does not need to use deionized water, and the cooling system is simplified. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a front view of the device;

[0016] Figure 2 It is a sectional view of A-A;

[0017] Figure 3 It is a top view of the device;

[0018] Figure 4 It is a rear view of the ceramic substrate;

[0019] Figure 5 It is a front view of the ceramic substrate. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0021] Please refer to Figures 1 to 5As shown, the utility model is a kind of high voltage, high -efficient heat dissipation ceramic water cooling plate, including ceramic substrate 1, ceramic backplate 2 and sealing ring 3, the sealing ring 3 is sealed between the ceramic substrate 1 and ceramic backplate 2, cooling water channel 11 is processed in the back of the ceramic substrate 1, the ceramic backplate 2 covers and closes the cooling water channel 11, installation hole for communicating the cooling water channel 11 is processed at the rear end surface of the ceramic backplate 2, joint nut 7 is fixedly installed at installation hole, water nozzle joint 6 is installed by the joint nut 7, the installation hole is provided with two, respectively located at both ends of the cooling water channel 11;Fixing hole 12 for fixing power device is processed in the front of the ceramic substrate 1.

[0022] The high voltage performance of the ceramic water cooling plate plays an isolating role between the power module and the cooling water.

[0023] Cooling water is directly passed in the ceramic water cooling plate, the thermal resistance is reduced, and the cooling water channel is designed and processed according to requirements, so that the heat dissipation efficiency of the ceramic water cooling plate is greatly improved.

[0024] The ceramic substrate 1 is made of high-thermal-conductivity and high-voltage aluminum nitride material or aluminum oxide material.

[0025] As shown in Figure 1 And Figure 5 The fixing nut 4 for fixing bolt is installed in the fixing hole 12.

[0026] The contact position of the fixing nut 4 and the fixing hole 12 is smeared with ceramic tile fixing glue.

[0027] On the back of the ceramic substrate 1, ceramic tile glue is smeared on both sides of the cooling water channel 11, and the ceramic backplate 2 is fixed by the ceramic tile glue.

[0028] The ceramic tile glue is smeared on both sides of the cooling water channel 11, and the both sides of the cooling water channel 11 can be sealed.

[0029] Secondly, the ceramic backplate is glued and fixed by using ceramic tile glue, so that the fixing firmness of the ceramic backplate is increased.

[0030] In order to increase the sealing property, ceramic tile glue also needs to be smeared around the ceramic substrate.

[0031] As shown in Figure 2 And Figure 4 Grooves 13 are formed around the back of the ceramic substrate 1, and the sealing ring 3 is embedded in the grooves 13.

[0032] The contents not described in detail in the description belong to the prior art known to those skilled in the art.

[0033] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A high-voltage, high-efficiency heat-dissipating ceramic water-cooling plate, characterized in that, The application relates to a ceramic substrate (1), a ceramic back plate (2) and a sealing ring (3), the sealing ring (3) being sealed between the ceramic substrate (1) and the ceramic back plate (2), a cooling water channel (11) being processed on the back of the ceramic substrate (1), the ceramic back plate (2) covering the back of the cooling water channel (11), mounting holes communicating with the cooling water channel (11) being processed at the back end face of the ceramic back plate (2), joint nuts (7) being fixedly mounted at the mounting holes, water nozzle joints (6) being mounted through the joint nuts (7), the mounting holes being provided with two, respectively at the two ends of the cooling water channel (11), fixing holes (12) for fixing power devices being processed on the front of the ceramic substrate (1).

2. The high-voltage, high-efficiency heat-dissipation ceramic water-cooling plate according to claim 1, characterized in that, A fixing nut (4) for fixing bolts is mounted in the fixing hole (12).

3. The high-voltage, high-efficiency heat-dissipation ceramic water-cooling plate according to claim 2, characterized in that, The contact position of the fixing nut (4) and the fixing hole (12) is coated with ceramic fixing glue.

4. The high-voltage, high-efficiency heat-dissipation ceramic water-cooling plate according to claim 1, characterized in that, Ceramic glue is coated on the back of the ceramic substrate (1) at the two sides of the cooling water channel (11), and the ceramic back plate (2) is fixed through the ceramic glue.

5. The high-voltage, high-efficiency heat-dissipation ceramic water-cooling plate according to claim 1, characterized in that, Grooves (13) are formed at the periphery of the back of the ceramic substrate (1), and the sealing ring (3) is embedded in the grooves (13).

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