Semiconductor device processing equipment

Abstract

The utility model discloses semiconductor device processing equipment which comprises a base platform, an index plate is arranged on the base platform, four wafer bearing platforms are circumferentially arranged on the index plate uniformly, a coarse grinding mechanism, a fine grinding mechanism and a polishing mechanism are sequentially arranged on the periphery of the index plate in the circumferential direction of the index plate, the coarse grinding mechanism and the fine grinding mechanism are distributed on one side of the index plate, and the polishing mechanism is arranged on the other side of the index plate. The polishing mechanism is located on the other side opposite to the index plate and is opposite to the accurate grinding mechanism in position. A centering device is arranged beside the polishing mechanism, the centering device comprises a carrying table right facing the position of the wafer bearing table located at the feeding and discharging station in the Y-axis direction, and a feeding robot used for moving a workpiece at the centering device to the wafer bearing table located at the feeding and discharging station is hung in the semiconductor device machining equipment; a cleaning mechanism and a discharging robot are further arranged on the side, away from the polishing mechanism, of the centering device, and the discharging robot is used for transferring the workpieces on the wafer bearing tables located on the feeding and discharging stations to the cleaning mechanism. The polishing mechanism does not need to occupy extra width space, so that the width of the equipment is reduced under the condition that the length of the whole equipment is basically unchanged, and the occupied space of the equipment is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device processing, and in particular to semiconductor device processing equipment. Background Technology

[0002] Patent document with application publication number JP2021082780A discloses a wafer processing equipment that integrates rough grinding, fine grinding and polishing.

[0003] In this type of equipment, the coarse grinding mechanism and the fine grinding mechanism are located on the first side of the indexing plate, and the polishing mechanism is located on the second side of the indexing plate. The first and second sides are arranged adjacent to each other. This layout causes the polishing mechanism to occupy a larger width space, which in turn makes the entire equipment wider. Utility Model Content

[0004] The purpose of this invention is to solve the above-mentioned problems in the prior art and to provide a semiconductor device processing equipment.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A semiconductor device processing equipment includes a base platform with an indexing plate. Four wafer-bearing platforms are evenly spaced on the indexing plate. A rough grinding mechanism, a fine grinding mechanism, and a polishing mechanism are sequentially arranged along the circumference of the indexing plate. The rough grinding and fine grinding mechanisms are located on one side of the indexing plate, and the polishing mechanism is located on the opposite side of the indexing plate, opposite to the fine grinding mechanism. A centering device is located next to the polishing mechanism. The centering device includes a platform directly opposite the wafer-bearing platforms at the loading / unloading station in the Y-axis direction. A loading robot is suspended within the semiconductor device processing equipment to move workpieces from the centering device to the wafer-bearing platforms at the loading / unloading station. A cleaning mechanism and an unloading robot are also located on the side of the centering device away from the polishing mechanism. The unloading robot transfers workpieces from the wafer-bearing platforms at the loading / unloading station to the cleaning mechanism.

[0007] Preferably, a roughness detection device is provided between the fine grinding mechanism and the polishing mechanism.

[0008] Preferably, a non-contact thickness measuring component is provided next to the fine grinding mechanism for measuring the thickness of the workpiece on the support platform at the fine grinding mechanism. The non-contact thickness measuring component is located on the side of the fine grinding mechanism that is biased towards the polishing mechanism, and the probe of the non-contact thickness measuring component is close to the edge of the workpiece on the support platform at the fine grinding mechanism.

[0009] Preferably, the fine grinding mechanism is provided with a roughness detection device and a TTV detection component on the side of the centering device that is biased towards the centering device. The roughness of the workpiece on the support table that moves from the polishing mechanism to the loading station is measured.

[0010] Preferably, the axis of the detection probe of the roughness detection component and TTV detection component or the roughness detection device and non-contact thickness measurement component passes through a virtual circle, and the virtual circle passes through the center of the table surface of the four bearing stages.

[0011] Preferably, a multi-axis loading and unloading robot is also provided on the side of the centering device near the polishing mechanism, and an abnormal material box placement position is provided on the side of the multi-axis loading and unloading robot away from the indexing plate.

[0012] Preferably, the base is provided with connecting parts located next to the coarse grinding mechanism, the fine grinding mechanism and the polishing mechanism, respectively, and the connecting parts are used to connect the tool setting device.

[0013] Preferably, the tool setting device includes a mounting frame, on which a movable body is disposed that can move relative to it along an axis parallel to the indexing plate. The movable body is connected to an elastic reset member for resetting the movable body upward after it moves down. The movable body is provided with a force receiving plate and a touch detection sensor located below the force receiving plate. The axes of the force receiving plate and the detection part of the touch detection sensor are parallel to the axis of the indexing plate.

[0014] The advantages of this utility model's technical solution are mainly reflected in:

[0015] This invention distributes the coarse grinding mechanism, fine grinding mechanism, and polishing mechanism on opposite sides of the indexing plate, so that the polishing mechanism does not need to occupy additional width space. Combined with the structural and layout improvements of the tilting device, centering device, loading robot, and unloading robot, the width of the equipment is reduced while the length of the entire equipment remains basically unchanged, which helps to reduce the space occupied by the equipment. Attached Figure Description

[0016] Figure 1 This is a top view of one embodiment of the semiconductor device processing equipment of this utility model;

[0017] Figure 2 This is a top view of another embodiment of the semiconductor device processing equipment of this utility model;

[0018] Figure 3 This is a front view of the tool setting device of this utility model;

[0019] Figure 4 This is a partial end view of the tool setting device of this utility model. Detailed Implementation

[0020] The purpose, advantages, and features of this utility model will be illustrated and explained through the following non-limiting description of preferred embodiments. These embodiments are merely typical examples of applying the technical solutions of this utility model, and all technical solutions formed by equivalent substitutions or equivalent transformations fall within the scope of protection claimed by this utility model.

[0021] In the description of the solution, it should be noted that the terms "center," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience and simplification of description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] Example 1

[0023] The semiconductor device processing equipment disclosed in this utility model will now be described in conjunction with the accompanying drawings, as shown in the attached drawings. Figure 1 As shown, it includes a base 100, on which an indexing disk 200 is provided. Four plate support platforms 300 are evenly arranged on the circumference of the indexing disk 200. A coarse grinding mechanism 400, a fine grinding mechanism 500, and a polishing mechanism 600 are arranged sequentially along the circumferential direction of the outer periphery of the indexing disk 200. The specific structures of the indexing disk 200, plate support platforms 300, coarse grinding mechanism 400, fine grinding mechanism 500, and polishing mechanism 600 are the same as those in known technologies, and will not be described in detail here.

[0024] The coarse grinding mechanism 400 and the fine grinding mechanism 500 are distributed on one side of the indexing plate 200, and the polishing mechanism 600 is located on the opposite side of the indexing plate 200 and is positioned opposite to the fine grinding mechanism 500. A centering device 700 is provided next to the polishing mechanism 600. The specific structure of the centering device 700 is known technology and will not be described in detail here. The centering device 700 includes a platform 701 that is directly opposite the receiving platform 300 in the loading and unloading station in the Y-axis direction. That is, the line connecting the center of the platform 701 and the center of the receiving platform 300 in the loading and unloading station extends along the Y-axis direction. The Y-axis direction is perpendicular to the X-axis direction, which is the extension direction of the line connecting the centers of the two receiving platforms 300 located at the coarse grinding mechanism 400 and the fine grinding mechanism 500.

[0025] Meanwhile, the semiconductor device processing equipment is equipped with a loading robot 800 for moving the workpiece at the centering device 700 to the loading / unloading station on the wafer support 300. The loading robot 800 includes a transverse module 801, which is, for example, a known linear module or a structure consisting of a motor and a lead screw. It extends along the Y-axis and from above the centering mechanism to above the indexing plate 200. The transverse module 801 is connected to a lifting assembly 802 driven by it for translation. The lifting assembly 802 can also be a linear module or a structure that can achieve the corresponding function, which will not be elaborated here. The lifting component 802 is connected to the adsorption component 803. The adsorption component 803 includes a suction cup 804. The axis of the suction cup is parallel to the axis of the indexing plate, and the axis of the suction cup passes through the line connecting the center of the table surface of the loading platform 701 and the center of the table surface of the receiving platform 300 located at the loading and unloading station. That is, the suction cup can translate and be coaxial with the loading platform 701 and the receiving platform 300 at the loading and unloading station.

[0026] On the side of the centering device 700 away from the polishing mechanism 600, a cleaning mechanism 900 and a unloading robot 001 are also provided. The cleaning mechanism 900 is used to clean the polished workpieces; its specific structure is known technology and will not be described in detail here. It is located close to the centering mechanism. The unloading robot 001 is used to transfer the workpieces on the loading / unloading station's receiving table 300 to the cleaning mechanism 900. The specific structure of the loading / unloading robot 001 is known technology and will not be described in detail here. The unloading suction cup of the loading / unloading robot 001 can rotate to be coaxial with the receiving table 300 at the loading / unloading station and coaxial with the carrying table of the cleaning mechanism 900.

[0027] The centering device 700 is also equipped with a multi-axis loading / unloading robot 002 on the side near the polishing mechanism 600. This multi-axis loading / unloading robot 002 is, for example, a Y-shaped suction arm driven by a 6-axis robot; its specific structure is known technology and will not be described in detail here. On the side of the multi-axis loading / unloading robot 002 away from the indexing plate 200, there is an abnormal material box placement position 003 for placing an abnormal material box 004 that holds abnormal workpieces. Simultaneously, two ordinary material box placement positions 005 are placed next to the abnormal material box placement position 003 for placing material boxes that hold workpieces to be processed and workpieces that are being processed normally.

[0028] Furthermore, in order to facilitate the identification of abnormal workpieces, in one embodiment, as shown in the attached... Figure 1As shown, a roughness detection device 006 is provided between the fine grinding mechanism 500 and the polishing mechanism 600. The roughness detection device 006 is, for example, a known white light interferometer, which can be suspended within the semiconductor device processing equipment. Its specific location can be set as needed and is not limited here. After the workpiece is polished at the polishing mechanism 600, the indexing table can move the workpiece toward the roughness detection device 006 and rotate the workpiece. Thus, when the workpiece passes the roughness detection device 006, the surface roughness of the workpiece can be detected and determined to be whether it meets the requirements. If it does not meet the requirements, the workpiece is loaded into the abnormal material box 004 during unloading.

[0029] As attached Figure 1 As shown, during the thinning process in the fine grinding mechanism 500, a non-contact thickness measuring component 007 is installed next to the fine grinding mechanism 500 to measure the thickness of the workpiece on the support platform 300 at the fine grinding mechanism 500. The specific structure of the non-contact thickness measuring component 007 is known technology and will not be described in detail here. Simultaneously, the non-contact thickness measuring component 007 is located on the side of the fine grinding mechanism 500 biased towards the polishing mechanism 600, and the probe of the non-contact thickness measuring component 007 is close to the edge of the workpiece on the support platform 300 at the fine grinding mechanism 500. Thus, when the workpiece, after polishing, is driven by the indexing plate 200 to rotate past the non-contact thickness measuring component 007, the signal from the non-contact thickness measuring component 007 determines whether the TTV (Total Thickness Deviation) of the workpiece meets the requirements. If it does not meet the requirements, the workpiece is cleaned and then placed into the defective material box.

[0030] Of course, in other embodiments, as shown in the appendix Figure 2 As shown, a roughness detection device 006 and a TTV detection component 008 are provided on the side of the fine grinding mechanism 500 biased towards the centering device 700. These devices measure the surface roughness and TTV of the workpiece on the loading / unloading station, which moves from the polishing mechanism 600 to the unloading station. The TTV detection component 008 can be a known non-contact thickness gauge or distance sensor, etc., and is not limited here. After the workpiece is polished at the polishing mechanism 600, it can be slowly moved to the unloading station and rotated. When the workpiece passes the roughness detection device 006 and the TTV detection component 008, the surface roughness and TTV of the workpiece are measured, and it is determined whether the workpiece meets the requirements.

[0031] As attached Figure 1 Appendix Figure 2As shown, in order to cover the workpiece as much as possible with the roughness detection component, TTV detection component 008, and non-contact thickness measurement component 007, the axis of the detection probe of the roughness detection component and TTV detection component 008 or the roughness detection device 006 and non-contact thickness measurement component 007 passes through a virtual circle C, and the virtual circle C passes through the center of the table surface of the four support stages 300.

[0032] Furthermore, to ensure the accuracy of the inspection, before performing surface roughness and TTV inspections, the top surface of the workpiece on the bearing platform at the polishing mechanism is cleaned and dried by the cleaning component 009 next to the polishing mechanism. The cleaning component 009 includes, for example, a spray block with several nozzles. The spray block is connected to a liquid supply system (not shown in the figure) and an air supply system (not shown in the figure). Thus, after the workpiece is polished, water is sprayed onto the workpiece through the spray block, while the workpiece rotates at high speed to rinse it. After rinsing, the spray block sprays air onto the workpiece to dry it quickly.

[0033] As attached Figure 1 Appendix Figure 2 As shown, the base 100 is provided with connecting parts 010 located next to the coarse grinding mechanism 400, the fine grinding mechanism 500 and the polishing mechanism 600 respectively. The connecting parts 010 are used to connect the tool setting device 011. The tool setting device 011 is used to determine the distance that the grinding wheel needs to move down from its initial position when it just contacts the support table 300 when changing the grinding wheels of the coarse grinding mechanism 400, the fine grinding mechanism 500 and the polishing mechanism 600.

[0034] As attached Figure 3 Appendix Figure 4 As shown, the tool setting device 011 includes a mounting bracket 012. A movable body 013 is provided on the mounting bracket 012, which is movable relative to it along an axis parallel to the indexing plate 200. The movable body 013 is connected to an elastic reset member 014 for resetting the movable body 013 upward after it moves down. A force receiving plate 015 and a touch detection sensor 016 located below the force receiving plate 015 are provided on the movable body 013. The axes of the detection parts 017 of the force receiving plate 015 and the touch detection sensor 016 are parallel to the axis of the indexing plate 200.

[0035] The mounting bracket 012 includes a base plate 018, a vertical pole 019 on the base plate 018, a carrier plate 020 on the vertical pole 019, and an end block 021 on the carrier plate 020. A limiting plate 022 and a limiting bolt 023 are provided on the side of the end block 021 facing away from the carrier plate 020. The limiting plate 022 is embedded in a limiting groove 024 on the side of the movable body 013 facing the end block 021. The limiting bolt 023 passes through a strip hole 025 on the movable body 013 and is connected to the end block 021. The strip hole 025 extends along the height direction. The head 026 of the limiting bolt 023 is attached to the outer side of the movable body 013 facing away from the end block 021. Meanwhile, a connecting plate 027 perpendicular to the limiting plate 022 is also provided on the limiting plate 022. The two ends of the connecting plate 027 are respectively provided with connecting holes. The elastic reset member 014 is a tension spring. One end of the tension spring is hooked at the connecting hole, and the other end of the tension spring is hooked on the horizontal rod 028 provided on the side of the moving body 013 facing the end block 021.

[0036] A support platform 029 is provided on the side of the movable body 013 facing away from the end block 021. The force-receiving disk 015 is provided on the support platform 029. The touch detection sensor 016 is provided at the bottom of the movable body 013. The touch detection sensor 016 is, for example, a known pressure sensor or a normally open contact sensor. Its detection part 017 faces downward and the axis of the detection part 017 coincides with the axis of the force-receiving disk 015.

[0037] During tool setting, the force plate 015 is positioned below the grinding wheel, and the touch detection sensor 016 is positioned above the support platform 300, with the distance between the touch detection sensor 016 and the support platform 300 being less than the vertical travel of the moving body 013. Then, the grinding wheel is moved downward, and the signal from the touch detection sensor 016 is acquired in real time. When the grinding wheel contacts the force plate 015 and continues to move downward, the touch detection sensor 016 moves downward synchronously. When the detection part 017 of the touch detection sensor 016 contacts the table surface of the support platform 300, the touch detection sensor 016 is triggered. At this time, the distance the grinding wheel moves downward is recorded, and the distance between the top surface of the force plate and the bottom of the touch detection sensor 016 is added to obtain the distance the grinding wheel needs to move downward from its initial position to contact the support platform 300.

[0038] This utility model has many other embodiments. All technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of this utility model.

Claims

1. A semiconductor device processing apparatus, comprising a base, wherein an indexing plate is disposed on the base, and four wafer support stages are evenly arranged on the indexing plate; a rough grinding mechanism, a fine grinding mechanism, and a polishing mechanism are sequentially arranged along the circumferential direction of the outer periphery of the indexing plate, characterized in that: The coarse grinding mechanism and the fine grinding mechanism are distributed on one side of the indexing plate, and the polishing mechanism is located on the opposite side of the indexing plate and is positioned opposite to the fine grinding mechanism. A centering device is provided next to the polishing mechanism. The centering device includes a platform that is directly opposite the wafer support platform at the loading and unloading station in the Y-axis direction. The semiconductor device processing equipment is equipped with a loading robot for moving the workpiece at the centering device to the wafer support platform at the loading and unloading station. A cleaning mechanism and a unloading robot are also provided on the side of the centering device away from the polishing mechanism. The unloading robot is used to transfer the workpiece on the wafer support platform at the loading and unloading station to the cleaning mechanism.

2. The semiconductor device processing equipment according to claim 1, characterized in that: A roughness detection device is provided between the fine grinding mechanism and the polishing mechanism.

3. The semiconductor device processing equipment according to claim 2, characterized in that: A non-contact thickness measuring component is provided next to the fine grinding mechanism for measuring the thickness of the workpiece on the support platform of the fine grinding mechanism. The non-contact thickness measuring component is located on the side of the fine grinding mechanism that is biased towards the polishing mechanism, and the probe of the non-contact thickness measuring component is close to the edge of the workpiece on the support platform of the fine grinding mechanism.

4. The semiconductor device processing equipment according to claim 1, characterized in that: The fine grinding mechanism is equipped with a roughness detection device and a TTV detection component on the side of the centering device that is biased towards the centering device. The roughness of the workpiece on the bearing table that moves from the polishing mechanism to the loading and unloading station is measured.

5. The semiconductor device processing equipment according to any one of claims 2-4, characterized in that: The axis of the detection probe of the roughness detection component and TTV detection component or the roughness detection device and non-contact thickness measurement component passes through a virtual circle, and the virtual circle passes through the center of the table surface of the four bearing stages.

6. The semiconductor device processing equipment according to claim 1, characterized in that: The centering device is also equipped with a multi-axis loading and unloading robot on the side near the polishing mechanism, and an abnormal material box placement position is provided on the side of the multi-axis loading and unloading robot away from the indexing plate.

7. The semiconductor device processing equipment according to claim 1, characterized in that: The base is provided with connecting parts located next to the coarse grinding mechanism, fine grinding mechanism and polishing mechanism respectively, and the connecting parts are used to connect the tool setting device.

8. The semiconductor device processing equipment according to claim 7, characterized in that: The tool setting device includes a mounting frame, on which a movable body is disposed that can move relative to the mounting frame along an axis parallel to the indexing plate. The movable body is connected to an elastic reset member for resetting the movable body upward after it moves down. The movable body is provided with a force receiving plate and a touch detection sensor located below the force receiving plate. The axes of the force receiving plate and the detection part of the touch detection sensor are parallel to the axis of the indexing plate.

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