Cooling device in resin processing process

By using a cooling device during the resin board molding process, employing a water cooling method combining an electric push rod and a water pump nozzle, along with fan drying, the problem of low resin board molding efficiency is solved, achieving efficient and uniform cooling and rapid drying, making it suitable for mass production.

CN224116649UActive Publication Date: 2026-04-14WUXI BAHE NEW MATERIAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-13
Publication Date
2026-04-14

AI Technical Summary

Technical Problem

In the existing resin board molding process, natural and wind cooling methods are inefficient and cannot meet the needs of mass production, and there is a lack of fully enclosed immersion cooling methods.

Method used

Design a cooling device that uses an electric push rod inside a cooling box to move a limit frame and a resin plate, combined with a water pump and a nozzle assembly for water cooling, and equipped with a fan to ensure surface dryness, achieving full-enclosed cooling.

Benefits of technology

It achieves efficient and uniform cooling and rapid drying of resin boards, which is suitable for mass production needs and improves cooling efficiency and molding quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of resin plates, in particular to a cooling device in a resin processing process. The cooling device comprises a cooling box, guide grooves are formed in the two ends of the inner side of the cooling box, connecting plates are slidably connected to the inner sides of the guide grooves, a plurality of limiting frames are fixed to the top ends of the connecting plates, resin plates are slidably connected to the inner sides of the limiting frames, U-shaped frames are fixed to the top ends of the connecting plates, and electric push rods are assembled at the bottom ends of the two ends of the cooling box. The output end of the electric push rod is fixed to the U-shaped frame, and nozzle sets are assembled on the two sides of the top end of the inner side of the cooling box. According to the cooling device in the resin processing process, the limiting frame is started to drive the limiting frame and a resin plate to be conveyed into the cooling box, and then a cooling agent is injected into the cooling box, so that the processed resin plate is effectively cooled; and finally, the coolant at the bottom end in the cooling box is sprayed to the upper surface of the resin plate through the spray head group, so that the resin plate is uniformly cooled.
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Description

Technical Field

[0001] This utility model relates to the field of resin board technology, and in particular to a cooling device in the resin processing process. Background Technology

[0002] ABS resin is a high-strength, tough, and easily processed thermoplastic polymer. ABS is a terpolymer of acrylonitrile, 1,3-butadiene, and styrene. It performs normally in environments ranging from -25℃ to 60℃ and has excellent moldability, producing products with a smooth surface that is easy to dye and electroplate. It can also be blended with various resins to form blends, and is currently mainly used in alloys and plastics. During the production of ABS resin, cooling devices are required for cooling and molding.

[0003] For example, patent (CN217047241U) discloses a resin board molding equipment, including a housing. A control panel is fixedly connected to the right side of the housing, and a ventilation mechanism is fixedly connected to the upper end of the housing. A heating plate is fixedly connected inside a groove, and a breathable mesh plate is fixedly connected to the upper end of the groove. A resin molding assembly is arranged inside the support frame. This resin board molding equipment uses the resin molding assembly to injection mold resin boards. The connection between the first mounting plate, the second mounting plate, and the sealing strip makes the mounting plates fit more tightly. Resin is injected into the mounting plates through the injection hole. Then, the entire assembly is placed inside the housing. The ventilation mechanism accelerates air circulation. In humid weather, the heating plate can be turned on to dry the inside of the housing, keeping the internal environment dry, which is conducive to the rapid molding of resin and greatly improves practicality.

[0004] When using the above technology, the following technical problems were found in the existing technology: the existing resin boards are all directly injection molded using molds, and after injection molding, they are usually cooled by natural conditions and air. However, this method makes the molding efficiency of the resin boards too low and cannot meet the needs of mass production. The existing technology uses air (natural / forced air cooling) for cooling instead of full-enclosed immersion. Therefore, the cooling method can be further improved. Moreover, the resin boards can be cooled by a combination of natural air cooling, forced air cooling and water cooling. To this end, we designed a cooling device in the resin processing process to provide another technical solution to the above technical problems. Utility Model Content

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A cooling device for resin processing includes a cooling box. Guide grooves are provided at both ends of the inner side of the cooling box. A connecting plate is slidably connected to the inner side of the guide grooves. Several limiting frames are fixed to the top of the connecting plate. A resin plate is slidably connected to the inner side of the limiting frames. A U-shaped frame is fixed to the top of the connecting plate. Electric push rods are installed at the bottom ends of both ends of the cooling box. The output ends of the electric push rods are fixed to the U-shaped frame. Spray nozzle assemblies are installed on both sides of the top inner side of the cooling box.

[0007] As a preferred embodiment of the cooling device in the resin processing process provided by this utility model, a cooling mechanism for cooling the resin board is provided on one side of the cooling box. The cooling mechanism includes a filter box and a water pump fixed at the bottom of one side of the cooling box. The output end of the water pump is fixedly connected to the nozzle assembly through a hose, and the input end of the water pump is fixed to the filter box through a conduit.

[0008] In a preferred embodiment of the cooling device for resin processing provided by this utility model, a filter plate is fixed on one side inside the filter box.

[0009] In a preferred embodiment of the cooling device for resin processing provided by this utility model, several cooling pipes are fixed at the bottom of the cooling box.

[0010] In a preferred embodiment of the cooling device for resin processing provided by this utility model, support plates are fixed on both sides of the top of the cooling box, and several fans are installed inside the support plates.

[0011] In a preferred embodiment of the cooling device for resin processing provided by this utility model, a drain pipe is fixed at the bottom of the interior of the cooling box, and a hand-operated valve is fitted on the outside of the drain pipe.

[0012] It is clear without a doubt that the technical solution described above in this application can solve the technical problem that this application aims to address.

[0013] At the same time, through the above technical solutions, this utility model has at least the following beneficial effects:

[0014] This utility model provides a cooling device for resin processing. By activating an electric push rod, the limiting frame and resin plate are driven to cool the coolant inside the cooling box. The water pump is activated to transport the coolant inside the cooling box to the inside of the nozzle assembly. The filter plate inside the filter box effectively filters the coolant inside the cooling box, thereby spraying the filtered coolant onto the top of the resin plate to uniformly cool the resin plate.

[0015] By activating the electric push rod, the limit frame and resin plate are moved upwards, thereby detaching the resin plate from the coolant inside the cooling box. At this time, coolant is attached to the surface of the resin plate. Then, the fan is activated to blow away the coolant from the surface of the resin plate, thereby ensuring the dryness of the resin plate surface so that the cooled resin plate can be removed. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the structure between the cooling box and the fan of this utility model;

[0019] Figure 3 This is a schematic diagram of the structure between the nozzle assembly and the filter box of this utility model;

[0020] Figure 4 This is a schematic diagram of the structure between the electric push rod and the connecting plate of this utility model.

[0021] In the diagram: 1. Cooling box; 2. Support plate; 3. Electric push rod; 4. Fan; 5. Drain pipe; 6. Filter box; 7. Water pump; 8. Nozzle assembly; 9. Cooling pipe; 10. Limiting frame; 11. Connecting plate; 12. U-shaped frame. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0023] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0024] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] Example 1

[0027] Please refer to Figures 1-4 A cooling device for resin processing includes a cooling box 1. Guide grooves are provided at both ends of the inner side of the cooling box 1. A connecting plate 11 is slidably connected to the inner side of the guide grooves. Several limiting frames 10 are fixed to the top of the connecting plate 11. A resin plate is slidably connected to the inner side of the limiting frames 10. A U-shaped frame 12 is fixed to the top of the connecting plate 11. Electric push rods 3 are installed at the bottom ends of both ends of the cooling box 1. The output end of the electric push rod 3 is fixed to the U-shaped frame 12. Spray nozzles 8 are installed on both sides of the top of the inner side of the cooling box 1.

[0028] In use, when the electric push rod 3 drives the connecting plate 11 and the limiting frame 10 to move upward along the guide groove, the processed resin board is placed inside the limiting frame 10. The limiting frame 10 is started again to drive the limiting frame 10 and the resin board to be transported into the cooling box 1. Then, coolant is injected into the cooling box 1 to effectively cool the processed resin board. Finally, the coolant at the bottom of the cooling box 1 is sprayed onto the surface of the resin board through the nozzle group 8 to cool the resin board evenly.

[0029] A cooling mechanism for cooling the resin board is provided on one side of the cooling box 1. The cooling mechanism includes a filter box 6 and a water pump 7 fixed at the bottom of one side of the cooling box 1. The output end of the water pump 7 is fixedly connected to the nozzle group 8 through a hose. The input end of the water pump 7 is fixed to the filter box 6 through a conduit. A filter plate is fixed on one side inside the filter box 6. Several cooling pipes 9 are fixed at the bottom of the cooling box 1.

[0030] Specifically, several processed resin plates are placed inside the limiting frame 10, and then the electric push rod 3 is activated to drive the limiting frame 10 and the resin plates to cool down the coolant inside the cooling box 1. At the same time, the water pump 7 is activated to transport the coolant inside the cooling box 1 to the inside of the nozzle assembly 8, and the filter plate inside the filter box 6 effectively filters the coolant inside the cooling box 1, thereby spraying the filtered coolant onto the top of the resin plates to uniformly cool the resin plates.

[0031] At this point, after the coolant exchanges heat with the surface of the resin plate, the temperature of the exchanged coolant is effectively controlled through the cooling pipe 9.

[0032] Both sides of the top of the cooling box 1 are fixed with support plates 2, and several fans 4 are installed inside the support plates 2.

[0033] By activating the electric push rod 3 and the limit frame 10 and resin plate upward, the resin plate is removed from the coolant inside the cooling box 1. At this time, coolant is attached to the surface of the resin plate. Then, the fan 4 is activated to blow away the coolant on the surface of the resin plate, thereby ensuring the dryness of the resin plate surface.

[0034] A drain pipe 5 is fixed at the bottom inside the cooling tank 1. A manual valve is installed on the outside of the drain pipe 5. The coolant inside the cooling tank 1 can be replaced effectively by turning the manual valve and drain pipe 5.

[0035] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the present utility model to specific implementations. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the present utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A cooling device in a resin processing process, characterized by, Including cooling box (1), both ends of the inside of cooling box (1) are provided with guide grooves, the inside of the guide grooves is slidably connected with connecting plate (11), the top end of connecting plate (11) is fixed with several limiting frames (10), the inside of limiting frame (10) is slidably connected with resin plate, the top end of connecting plate (11) is fixed with U-shaped frame (12), the bottom end of both ends of cooling box (1) is equipped with electric push rod (3), the output end of electric push rod (3) is fixed with U-shaped frame (12), both sides of the top end of the inside of cooling box (1) are equipped with shower group (8).

2. A cooling device for use in a resin processing process according to claim 1, characterized in that, The side of the cooling box (1) is provided with a cooling mechanism for cooling the resin plate, the cooling mechanism comprises a filter box (6) and a water pump (7) fixed on the bottom end of the side of the cooling box (1), the output end of the water pump (7) is fixedly connected with the shower group (8) through a hose, and the input end of the water pump (7) is fixedly connected with the filter box (6) through a pipeline.

3. A cooling device for use in a resin processing process according to claim 2, wherein The inside of the filter box (6) is fixed with a filter plate on one side.

4. A cooling device for resin processing according to claim 2, wherein The bottom end of the inside of the cooling box (1) is fixed with several cooling pipes (9).

5. A cooling device for use in a resin processing process according to claim 4, wherein The top end of the cooling box (1) is fixed with a support plate (2) on both sides, and the inside of the support plate (2) is equipped with several fans (4).

6. A cooling device for resin processing according to claim 2, wherein The bottom end of the inside of the cooling box (1) is fixed with a drain pipe (5), and the outside of the drain pipe (5) is equipped with a hand valve.

Citation Information

Patent Citations

  • Resin plate forming equipment

    CN217047241U