Epoxy plate lamination forming machine

Abstract

The utility model relates to the technical field of lamination, in particular to an epoxy plate lamination forming machine, which is convenient for cleaning resin in a groove of a lower die, reduces the labor intensity, and is convenient to use and high in practicability. Comprising a bottom plate, a support, a supporting plate, a lower die and an upper die, the supporting plate is fixedly installed on the bottom plate through the support, the lower die is fixedly installed at the upper end of the supporting plate, the upper die is located above the lower die, and electric heating plates are arranged on the lower die and the upper die; the die further comprises a base plate, a lifting mechanism, a height adjusting mechanism and a material scraping mechanism, a groove is formed in the lower die, the base plate is installed in the groove of the lower die in an up-down sliding mode, the height adjusting mechanism is used for lifting the base plate, the upper die is installed on the lifting mechanism, the lifting mechanism is used for lifting the upper die, the material scraping mechanism is installed on the bottom plate, and the material scraping mechanism has the material scraping function.

Description

Technical Field

[0001] This utility model relates to the technical field of lamination, and in particular to an epoxy board lamination molding machine. Background Technology

[0002] In the process of epoxy board manufacturing, resin-coated substrates, fiberglass cloth, and decorative panels are bonded together into a whole by hot pressing using a laminating machine. This process has a wide range of applications in epoxy board production. In the prior art, utility model patent application number 202020837369.9 discloses an insulating board lamination molding device, which mainly consists of a base, a lower pressure plate, and an upper pressure plate. The lower pressure plate is provided with a groove, and both the lower and upper pressure plates are provided with heating plates. When laminating the boards, multiple stacked boards are placed in the groove of the lower pressure plate, and then the upper pressure plate is lowered to press down on the stacked boards. At the same time, the boards are heated by the upper and lower pressure plates, so that the stacked boards are hot-pressed together. However, the following problem exists in its use: when the stacked boards are hot-pressed by the upper and lower pressure plates, some of the resin used for bonding on the surface of the boards will overflow and flow into the groove of the lower pressure plate. Manually cleaning the resin in the groove is not only inconvenient but also increases labor intensity. Therefore, a lamination molding machine that can easily clean the resin in the mold is needed. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides an epoxy board lamination molding machine that facilitates the cleaning of resin in the lower mold groove, reduces labor intensity, is easy to use, and has high practicality.

[0004] This utility model discloses an epoxy board lamination molding machine, comprising a base plate, a support plate, a support plate, a lower mold, and an upper mold. The support plate is fixedly mounted on the base plate via the support plate, the lower mold is fixedly mounted on the upper end of the support plate, and the upper mold is located above the lower mold. Both the lower and upper molds are equipped with heating plates. The machine also includes a substrate, a lifting mechanism, a height adjustment mechanism, and a scraping mechanism. A groove is provided inside the lower mold, and the substrate is slidably mounted within this groove. The height adjustment mechanism is used to lift and lower the substrate. The upper mold is mounted on the lifting mechanism, which is used to lift and lower the upper mold. The scraping mechanism is mounted on the base plate and has a scraping function. The heating plates on the lower and upper molds can be either embedded within them or mounted on their outer walls. During epoxy board production, multiple resin-coated raw material boards are stacked together within the groove of the lower mold. Multiple raw material boards are placed on top of a base plate. A lifting mechanism lowers the upper mold, bringing it into contact with the top of the raw material boards. The base plate and upper mold press the boards together, while multiple lower molds and heating plates on the upper mold heat the boards in the lower mold groove, causing them to be hot-pressed together. The formed boards are then removed from the lower mold. When cleaning resin from the lower mold groove, the resin overflowing during hot pressing slides onto the base plate because the base plate is located within it and the boards are placed on top. A height adjustment mechanism raises the base plate to the upper mold, and a scraping mechanism removes the resin. This process facilitates cleaning the resin in the lower mold groove, reduces labor intensity, and is convenient and highly practical.

[0005] Preferably, the height adjustment mechanism includes a hydraulic cylinder A and a lifting rod. The hydraulic cylinder A is fixedly installed on the upper end of the base plate, and the lifting rod is slidably installed on the support plate. The base plate is fixedly installed on the upper end of the lifting rod. When adjusting the height of the base plate, the hydraulic cylinder A is opened, and the lifting rod can be used to adjust the height of the base plate, which facilitates the adjustment of the base plate height.

[0006] Preferably, the lifting mechanism includes a hoisting frame, a hydraulic cylinder B, and a moving rod. The hydraulic cylinder B is fixedly mounted on the hoisting frame, and the moving rod is slidably mounted on the hoisting frame. The upper end of the moving rod is connected to the output end of the hydraulic cylinder B, and the upper mold is mounted on the lower end of the moving rod. The hoisting frame is fixedly hoisted on a support frame in the workshop. When pressing down on multiple plates in the lower mold groove, the hydraulic cylinder B is opened, and the hydraulic cylinder B lowers the upper mold through the moving rod. During the descent, the upper mold contacts multiple raw material plates in the lower mold groove, and the upper mold presses down on the multiple raw material plates in the lower mold groove. This facilitates the lifting and lowering of the upper mold.

[0007] Preferably, a pressure sensor is provided at the lower end of the moving rod, and the upper mold is fixedly installed at the lower end of the pressure sensor; with the above arrangement, when the upper mold presses down on the plate, the pressure sensor detects the downward pressure of the moving rod on the upper mold, which facilitates pressure monitoring.

[0008] Preferably, the scraping mechanism includes a vertical plate, a cylinder, a slide rod, a connecting plate, and a scraper. The vertical plate is fixedly installed on the upper end of the base plate, the cylinder is fixedly installed on the left end of the vertical plate, the slide rod is slidably installed on the vertical plate, the left end of the slide rod is connected to the output end of the cylinder, the connecting plate is fixedly installed on the right end of the slide rod, and the scraper is fixedly installed on the lower end of the connecting plate. When it is necessary to clean the resin on the upper end of the substrate, the cylinder is first opened. The cylinder, through the slide rod, causes the connecting plate to move the scraper to the right, so that the scraper moves to the right above the lower mold. Then, the substrate rises in the groove of the lower mold, so that the substrate rises to the top of the lower mold and the left part of the upper end of the substrate contacts the scraper. Then, the scraper continues to move to the right. During the movement to the right, the scraper scrapes off the resin attached to the upper end of the substrate, which facilitates the cleaning of the resin on the upper end of the substrate.

[0009] Preferably, it also includes a cylinder, and the collection box is installed at the right end of the lower mold; with the above configuration, when cleaning the resin on the upper end of the substrate, the scraped resin will slide down through the right end of the lower mold into the collection box for collection, which facilitates the cleaning of the resin on the upper end of the substrate.

[0010] Preferably, the right side of the lower mold has a sloped surface with the left end higher and the right end lower. With the above arrangement, when cleaning the resin on the upper part of the substrate, the resin that falls to the upper right side of the lower mold will slide down the sloped surface into the collection box for collection, which facilitates the collection of resin debris and improves convenience.

[0011] Compared with the prior art, the advantages of this utility model are: it facilitates the cleaning of resin in the lower mold groove, reduces labor intensity, is easy to use, and has high practicality. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the isometric structure of this utility model;

[0013] Figure 2 This is a structural diagram of the lower mold, hydraulic cylinder A, and lifting rod, etc.

[0014] Figure 3 This is a schematic diagram of the scraping mechanism;

[0015] Figure 4 This is a structural diagram of the lifting frame, hydraulic cylinder B, and moving rod, etc.

[0016] Figure 5 This is a schematic diagram of the structure of this utility model when cleaning the resin on the upper end of the substrate.

[0017] The following are labels in the attached diagram: 1. Base plate; 2. Bracket; 3. Support plate; 4. Lower mold; 5. Upper mold; 6. Base plate; 7. Hydraulic cylinder A; 8. Lifting rod; 9. Lifting frame; 10. Hydraulic cylinder B; 11. Moving rod; 12. Pressure sensor; 13. Vertical plate; 14. Cylinder; 15. Slide rod; 16. Connecting plate; 17. Scraper; 18. Collection box. Detailed Implementation

[0018] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. This utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of this utility model more thorough and complete.

[0019] Example 1

[0020] like Figures 1 to 5 The epoxy board lamination molding machine of this utility model includes a base plate 1, a support 2, a support plate 3, a lower mold 4, an upper mold 5, a substrate 6, a lifting mechanism, a height adjustment mechanism, and a scraping mechanism. The support plate 3 is fixedly installed on the base plate 1 through the support 2. The lower mold 4 is fixedly installed on the upper end of the support plate 3. The upper mold 5 is located above the lower mold 4. Both the lower mold 4 and the upper mold 5 are provided with heating plates. The lower mold 4 has a groove. The substrate 6 is slidably installed in the groove of the lower mold 4. The height adjustment mechanism is used to lift the substrate 6. The upper mold 5 is installed on the lifting mechanism, which is used to lift the upper mold 5. The scraping mechanism is installed on the base plate 1 and has a scraping function. The heating plates on the lower mold 4 and the upper mold 5 can be embedded in the lower mold 4 and the upper mold 5, or they can be installed on the outer side walls of the lower mold 4 and the upper mold 5. When producing epoxy boards, multiple raw material boards coated with resin are placed in the groove of the lower mold 4 and stacked. Multiple raw material boards are stacked together and placed on the top of the substrate 6. Then, the upper mold 5 is lowered by the lifting mechanism so that it contacts the top of the raw material boards. The substrate 6 and the upper mold 5 press the multiple boards up and down. At the same time, the multiple lower molds 4 and the electric heating plates on the upper mold 5 heat the multiple raw material boards in the groove of the lower mold 4, so that the multiple raw material boards are hot-pressed together to form a shape. After that, the formed board is taken out from the lower mold 4. When it is necessary to clean the resin that has fallen into the groove of the lower mold 4, since the substrate 6 is located in the groove of the lower mold 4 and the multiple boards are placed on the top of the substrate 6, the resin that overflows from the multiple boards during hot pressing will slide to the top of the substrate 6. The height adjustment mechanism raises the substrate 6 to the top of the lower mold 4, and then the scraping mechanism scrapes off the resin on the top of the substrate 6. This facilitates the cleaning of the resin in the groove of the lower mold 4, reduces labor intensity, is easy to use, and has high practicality.

[0021] like Figure 2The height adjustment mechanism includes a hydraulic cylinder A7 and a lifting rod 8. The hydraulic cylinder A7 is fixedly installed on the upper end of the base plate 1, and the lifting rod 8 is slidably installed on the support plate 3. The base plate 6 is fixedly installed on the upper end of the lifting rod 8. When adjusting the height of the base plate 6, the hydraulic cylinder A7 is opened, and the height of the base plate 6 can be adjusted by the lifting rod 8, which facilitates the adjustment of the height of the base plate 6.

[0022] like Figure 1 and Figure 4 The lifting mechanism includes a hoisting frame 9, a hydraulic cylinder B10, and a moving rod 11. The hydraulic cylinder B10 is fixedly mounted on the hoisting frame 9, and the moving rod 11 is slidably mounted on the hoisting frame 9. The upper end of the moving rod 11 is connected to the output end of the hydraulic cylinder B10, and the upper mold 5 is mounted on the lower end of the moving rod 11. The hoisting frame 9 is fixedly hoisted on the support frame in the workshop. When pressing down on multiple plates in the groove of the lower mold 4, the hydraulic cylinder B10 is opened, and the hydraulic cylinder B10 lowers the upper mold 5 through the moving rod 11. During the descent, the upper mold 5 contacts multiple raw material plates in the groove of the lower mold 4, and the upper mold 5 can press down on the multiple raw material plates in the groove of the lower mold 4. This facilitates the lifting and lowering of the upper mold 5.

[0023] like Figure 4 A pressure sensor 12 is provided at the lower end of the moving rod 11, and the upper mold 5 is fixedly installed at the lower end of the pressure sensor 12. With the above arrangement, when the upper mold 5 presses down on the plate, the pressure sensor 12 detects the downward pressure of the moving rod 11 on the upper mold 5, which facilitates pressure monitoring.

[0024] like Figure 1 and Figure 5 The scraping mechanism includes a vertical plate 13, a cylinder 14, a slide rod 15, a connecting plate 16, and a scraper 17. The vertical plate 13 is fixedly installed on the upper end of the base plate 1, the cylinder 14 is fixedly installed on the left end of the vertical plate 13, the slide rod 15 is slidably installed on the vertical plate 13, the left end of the slide rod 15 is connected to the output end of the cylinder 14, the connecting plate 16 is fixedly installed on the right end of the slide rod 15, and the scraper 17 is fixedly installed on the lower end of the connecting plate 16. When it is necessary to clean the resin on the upper end of the substrate 6, first turn on the air... Cylinder 14, via slide rod 15, causes connecting plate 16 to move scraper 17 to the right, so that scraper 17 moves to the right above lower mold 4, and then substrate 6 rises in the groove of lower mold 4, so that the upper left part of substrate 6 contacts scraper 17. Then scraper 17 continues to move to the right, and during the movement to the right, scraper 17 scrapes off the resin attached to the upper part of substrate 6, which facilitates the cleaning of resin on the upper part of substrate 6.

[0025] It also includes a cylinder 14, and a collection box 18 is installed at the right end of the lower mold 4. With the above configuration, when cleaning the resin on the upper end of the substrate 6, the scraped resin will slide down through the right end of the lower mold 4 into the collection box 18 for collection, which facilitates the cleaning of the resin on the upper end of the substrate 6.

[0026] Example 2

[0027] like Figure 1 The right side of the lower mold 4 has an inclined surface, with the left end higher and the right end lower. With the above arrangement, when cleaning the resin on the upper part of the substrate 6, the resin that falls to the upper right side of the lower mold 4 will slide down the inclined surface into the collection box 18 for collection, which facilitates the collection of resin debris and improves convenience.

[0028] The hoisting frame 9, pressure sensor 12, cylinder 14 and scraper 17 of the epoxy board lamination molding machine of this utility model are all purchased from the market. Technical personnel in this industry only need to install and operate them according to the accompanying instruction manual, without requiring any creative work from those skilled in the art.

[0029] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. An epoxy board lamination molding machine, comprising a base plate (1), a bracket (2), a support plate (3), a lower mold (4), and an upper mold (5), wherein the support plate (3) is fixedly mounted on the base plate (1) via the bracket (2), the lower mold (4) is fixedly mounted on the upper end of the support plate (3), and the upper mold (5) is located above the lower mold (4), and both the lower mold (4) and the upper mold (5) are provided with heating plates; characterized in that, It also includes a substrate (6), a lifting mechanism, a height adjustment mechanism and a scraping mechanism. A groove is provided in the lower mold (4), and the substrate (6) is slidably installed in the groove of the lower mold (4). The height adjustment mechanism is used to lift the substrate (6). The upper mold (5) is installed on the lifting mechanism, and the lifting mechanism is used to lift the upper mold (5). The scraping mechanism is installed on the base plate (1) and has the function of scraping.

2. The epoxy board lamination molding machine as described in claim 1, characterized in that, The height adjustment mechanism includes a hydraulic cylinder A (7) and a lifting rod (8). The hydraulic cylinder A (7) is fixedly installed on the upper end of the base plate (1), and the lifting rod (8) is slidably installed on the support plate (3). The base plate (6) is fixedly installed on the upper end of the lifting rod (8).

3. The epoxy board lamination molding machine as described in claim 1, characterized in that, The lifting mechanism includes a hoisting frame (9), a hydraulic cylinder B (10), and a moving rod (11). The hydraulic cylinder B (10) is fixedly installed on the hoisting frame (9), and the moving rod (11) is slidably installed on the hoisting frame (9). The upper end of the moving rod (11) is connected to the output end of the hydraulic cylinder B (10), and the upper mold (5) is installed at the lower end of the moving rod (11).

4. The epoxy board lamination molding machine as described in claim 3, characterized in that, A pressure sensor (12) is provided at the lower end of the moving rod (11), and the upper mold (5) is fixedly installed at the lower end of the pressure sensor (12).

5. The epoxy board lamination molding machine as described in claim 1, characterized in that, The scraping mechanism includes a vertical plate (13), a cylinder (14), a slide rod (15), a connecting plate (16), and a scraper (17). The vertical plate (13) is fixedly installed on the upper end of the base plate (1), the cylinder (14) is fixedly installed on the left end of the vertical plate (13), the slide rod (15) is slidably installed on the vertical plate (13), the left end of the slide rod (15) is connected to the output end of the cylinder (14), the connecting plate (16) is fixedly installed on the right end of the slide rod (15), and the scraper (17) is fixedly installed on the lower end of the connecting plate (16).

6. The epoxy board lamination molding machine as described in claim 5, characterized in that, It also includes a cylinder (14) and a collection box (18) installed at the right end of the lower mold (4).

7. The epoxy board lamination molding machine as described in claim 1, characterized in that, The right side of the lower mold (4) has an inclined surface, with the left end higher and the right end lower.

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