Cooling device for PCB film production

Abstract

The utility model discloses a cooling device for PCB film production, which comprises a mounting seat, a conveying belt is fixedly mounted on the inner side of the upper end of the mounting seat, a mounting shell is fixedly connected to the upper surface of the mounting seat, a plurality of mounting grooves are formed in two sides of the mounting shell and are uniformly distributed, and the conveying belt is fixedly connected with the mounting shell. A rotating plate is rotationally connected to the inner side of the mounting groove, an atomizing nozzle is fixedly mounted at the end, close to the conveying belt, of the rotating plate, an adjusting mechanism is fixedly mounted at the upper end of the mounting shell, and the upper end, away from the atomizing nozzle, of the rotating plate is fixedly connected with the adjusting mechanism. Through mutual cooperation of the adjusting mechanism, the rotating plate, the atomizing nozzle and other structures, the adjusting mechanism drives the rotating plate to rotate synchronously, then adjustment of the spraying angle of the atomizing nozzle is completed, the atomizing nozzle sprays towards the two sides of a PCB film, the spraying effect is enhanced, the PCB film is covered with water mist more uniformly, and the spraying efficiency is improved. And the cooling effect is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of PCB film cooling technology, specifically a cooling device for PCB film production. Background Technology

[0002] PCB film is a key material in PCB circuit board manufacturing. It is used to prevent circuits from being corroded by the external environment, such as dust, moisture and chemicals, thereby improving the reliability and stability of the circuit board. In the production of PCB film, if the heat of the PCB film material cannot be dissipated in time, it will cause the film material to expand due to heat, which will then deform and cause damage to the PCB film.

[0003] Currently, cooling devices used in PCB film production typically cool the PCB film surface by spraying water mist from vertically placed atomizing nozzles. However, since the temperature may vary across different parts of the PCB film surface, these protrusions may create areas that block the vertical water mist, preventing the water mist from completely covering the PCB film and thus reducing the cooling effect. Summary of the Invention

[0004] This utility model provides a cooling device for PCB film production. It can drive the rotating plate to rotate synchronously by setting an adjustment mechanism, thereby adjusting the spray angle of the atomizing nozzles on both sides, so that the atomizing nozzles spray to both sides and the spraying effect is more uniform.

[0005] To achieve the above objectives, a cooling device for PCB film production is provided, comprising a mounting base, a conveyor belt fixedly mounted on the inner side of the upper end of the mounting base, a mounting shell fixedly connected to the upper surface of the mounting base, mounting grooves formed on both sides of the mounting shell, the mounting grooves being a plurality of evenly distributed, a rotating plate rotatably connected to the inner side of the mounting groove, an atomizing nozzle fixedly mounted on the end of the rotating plate near the conveyor belt, an adjusting mechanism fixedly mounted on the upper end of the mounting shell, the upper end of the rotating plate away from the atomizing nozzle being fixedly connected to the adjusting mechanism, water tanks fixedly mounted on both sides of the mounting base, pumps fixedly mounted on the upper end of the water tanks, the pumps being a plurality of corresponding to the rotating plates, a connecting pipe fixedly connected to the output end of the pumps, the connecting pipe away from the pumps passing through the lower end of the rotating plate and fixedly connected to the atomizing nozzle, and the water inlet end of the pumps being fixedly connected to the inner side of the water tanks via a water pipe. By setting up the coordination between the adjustment mechanism and the rotating plate, the adjustment mechanism drives the rotating plate to rotate synchronously, thereby adjusting the spray angle of the atomizing nozzle and allowing the atomizing nozzle to spray onto both sides of the PCB film, enhancing the spraying effect and making the water mist cover the PCB film more evenly.

[0006] According to the cooling device for PCB film production, the adjusting mechanism includes a fixed block, an adjusting groove, an adjusting rod, a sliding column, a fixed plate, a driving plate, and a pressure cylinder. The fixed block is fixedly connected to the upper end of the rotating plate away from the atomizing nozzle. Rotation of the fixed block drives the rotating plate to rotate, thereby adjusting the spray angle of the atomizing nozzle.

[0007] According to the cooling device for PCB film production, the adjusting groove is formed on the surface of the fixed block, the sliding column is slidably connected to the inner side of the adjusting groove, and the lower end of the adjusting rod is fixedly connected to the middle end of the sliding column. The adjusting rod moves up and down, thereby causing the sliding column to slide inside the adjusting groove, allowing the fixed block to tilt and rotate.

[0008] According to the cooling device for PCB film production, the fixing plate is fixedly connected to both sides of the upper end of the mounting shell, and the upper end of the adjusting rod passes through the fixing plate and extends above the fixing plate. By setting the mutual cooperation between the adjusting rod and the fixing plate, the adjusting rod is limited, allowing the adjusting rod to move up and down.

[0009] According to the cooling device for PCB film production, the pressure cylinder is fixedly installed at the center of the upper surface of the mounting housing, the drive plate is fixedly connected to the telescopic end of the pressure cylinder, and the end of the adjusting rod away from the sliding column is fixedly connected to the bottom surface of the drive plate. Through the cooperation between the adjusting rod and the drive plate, the adjusting rod moves synchronously when the drive plate moves.

[0010] According to the cooling device for PCB film production, the sliding column and the adjusting groove are fitted together, and the contact surface between the sliding column and the adjusting groove is set to be smooth. By setting the sliding column and the adjusting groove to fit together, the contact area between the sliding column and the sliding groove is made more uniform, and the movement of the sliding column is more stable.

[0011] According to the cooling device for PCB film production, the adjusting rod is rectangular in shape, and its outer surface is smooth. By making the adjusting rod rectangular, rotation is prevented, resulting in more stable movement.

[0012] According to the cooling device for PCB film production, the surface of the mounting groove is in contact with the inner side of the rotating plate, and the contact surface between the surface of the mounting groove and the rotating plate is made smooth. By making the contact surface between the surface of the mounting groove and the rotating plate smooth, friction is reduced, making the rotating plate more stable during rotation.

[0013] The beneficial effects of this utility model are as follows: By setting up the adjustment mechanism, the rotating plate and the atomizing nozzle and other structures to cooperate with each other, the adjustment mechanism drives the rotating plate to rotate synchronously, thereby adjusting the spray angle of the atomizing nozzle and allowing the atomizing nozzle to spray to both sides of the PCB film, thereby enhancing the spraying effect, making the water mist cover the PCB film more uniform, and greatly improving the cooling effect.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0016] Figure 1 This is a schematic diagram of the overall structure of a cooling device for PCB film production according to the present invention;

[0017] Figure 2 This is a schematic diagram of the internal cross-sectional structure of a cooling device for PCB film production according to the present invention;

[0018] Figure 3 This is a schematic diagram of the structural relationship between the adjusting rod and the sliding column of a cooling device for PCB film production according to this utility model;

[0019] Figure 4 This is a schematic diagram showing the structural relationship between the water tank and the pump in a cooling device for PCB film production according to this utility model.

[0020] Legend:

[0021] 1. Mounting base; 2. Conveyor belt; 3. Mounting housing; 4. Atomizing nozzle; 5. Rotating plate; 6. Water tank; 7. Pump; 8. Mounting groove; 9. Connecting pipe; 22. Adjusting mechanism; 2201. Fixing block; 2202. Adjusting groove; 2203. Adjusting rod; 2204. Sliding column; 2205. Fixing plate; 2206. Drive plate; 2207. Pressure cylinder. Detailed Implementation

[0022] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0023] Reference Figures 1 to 4This utility model discloses a cooling device for PCB film production, comprising a mounting base 1, a conveyor belt 2 fixedly mounted on the inner side of the upper end of the mounting base 1, a mounting shell 3 fixedly connected to the upper surface of the mounting base 1, mounting grooves 8 on both sides of the mounting shell 3, the mounting grooves 8 being a plurality of evenly distributed, a rotating plate 5 rotatably connected to the inner side of the mounting grooves 8, an atomizing nozzle 4 fixedly mounted on the end of the rotating plate 5 near the conveyor belt 2, an adjusting mechanism 22 fixedly mounted on the upper end of the mounting shell 3, the upper end of the rotating plate 5 away from the atomizing nozzle 4 being fixedly connected to the adjusting mechanism 22, water tanks 6 fixedly mounted on both sides of the mounting base 1, a pump 7 fixedly mounted on the upper end of the water tank 6, the pump 7 being a plurality of corresponding to the rotating plate 5, a connecting pipe 9 fixedly connected to the output end of the pump 7, the connecting pipe 9 away from the pump 7 passing through the lower end of the rotating plate 5 and fixedly connected to the atomizing nozzle 4, and the water inlet end of the pump 7 being fixedly connected to the inner side of the water tank 6 through a water pipe.

[0024] The surface of the mounting groove 8 is in contact with the inner side of the rotating plate 5. The contact surface between the surface of the mounting groove 8 and the rotating plate 5 is set to be smooth. The model of the conveyor belt 2 is YZ002.

[0025] The adjustment mechanism 22 includes a fixed block 2201, an adjustment groove 2202, an adjustment rod 2203, a sliding column 2204, a fixed plate 2205, a drive plate 2206, and a pressure cylinder 2207. The fixed block 2201 is fixedly connected to the upper end of the rotating plate 5 away from the atomizing nozzle 4. The adjustment groove 2202 is formed on the surface of the fixed block 2201. The sliding column 2204 is slidably connected to the inner side of the adjustment groove 2202. The lower end of the adjustment rod 2203 is fixedly connected to the middle end of the sliding column 2204.

[0026] The fixing plate 2205 is fixedly connected to both sides of the upper end of the mounting shell 3. The upper end of the adjusting rod 2203 passes through the fixing plate 2205 and extends above the fixing plate 2205. The pressure cylinder 2207 is fixedly installed at the center of the upper surface of the mounting shell 3. The drive plate 2206 is fixedly connected to the telescopic end of the pressure cylinder 2207. The end of the adjusting rod 2203 away from the sliding column 2204 is fixedly connected to the bottom surface of the drive plate 2206. The sliding column 2204 and the adjusting groove 2202 fit together. The contact surface between the sliding column 2204 and the adjusting groove 2202 is set to a smooth shape. The adjusting rod 2203 is set to a rectangular shape. The outer surface of the adjusting rod 2203 is set to a smooth shape.

[0027] Working Principle: During use, first clean the surface of conveyor belt 2 to reduce dust and impurities adhering to the PCB film surface, which could affect its quality. Then, place the PCB film requiring cooling above conveyor belt 2, allowing it to move towards the mounting housing 3. Simultaneously, start pump 7 to pump water from water tank 6 through connecting pipe 9 to the atomizing nozzle 4, allowing it to spray. At the same time, start cylinder 2207, causing drive plate 2206 to move up and down. As drive plate 2206 moves, it drives multiple adjusting rods 2203 to move synchronously, thereby driving the sliding... The moving column 2204 slides inside the adjustment groove 2202 on the surface of the fixed block 2201. Since the fixed block 2201 is fixed to the rotating plate 5, and the rotating plate 5 cooperates with the mounting groove 8, the fixed block 2201 is limited. At this time, the fixed block 2201 will rotate. When the fixed block 2201 rotates, it will drive the atomizing nozzle 4 to rotate simultaneously through the rotating plate 5. The spray angle of the atomizing nozzle 4 is adjusted according to the raised area of ​​the PCB film, so that the atomizing nozzle 4 sprays the conveyed PCB film, making the water mist more evenly cover the surface of the PCB film. After spraying and cooling, the PCB film will be conveyed out through the conveyor belt 2 and sprayed and cooled for the next PCB film.

[0028] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A cooling device for PCB film production, characterized by, The system includes a mounting base (1), a conveyor belt (2) fixedly mounted on the inner side of the upper end of the mounting base (1), a mounting shell (3) fixedly connected to the upper surface of the mounting base (1), mounting grooves (8) provided on both sides of the mounting shell (3), the mounting grooves (8) being a plurality of evenly distributed, a rotating plate (5) rotatably connected to the inner side of the mounting grooves (8), an atomizing nozzle (4) fixedly mounted on the end of the rotating plate (5) near the conveyor belt (2), an adjusting mechanism (22) fixedly mounted on the upper end of the mounting shell (3), and the rotating plate (5) being far from the upper end of the mounting shell (3). The upper end of the atomizing nozzle (4) is fixedly connected to the adjustment mechanism (22). Water tanks (6) are fixedly installed on both sides of the mounting base (1). A pump (7) is fixedly installed on the upper end of the water tank (6). Several pumps (7) are set and correspond to the rotating plate (5). The output end of the pump (7) is fixedly connected to a connecting pipe (9). The end of the connecting pipe (9) away from the pump (7) passes through the lower end of the rotating plate (5) and is fixedly connected to the atomizing nozzle (4). The water inlet end of the pump (7) is fixedly connected to the inner side of the water tank (6) through a water pipe.

2. The cooling device for PCB film production according to claim 1, characterized in that, The adjustment mechanism (22) includes a fixed block (2201), an adjustment groove (2202), an adjustment rod (2203), a sliding column (2204), a fixed plate (2205), a drive plate (2206), and a pressure cylinder (2207). The fixed block (2201) is fixedly connected to the upper side of the rotating plate (5) away from the atomizing nozzle (4).

3. The cooling device for PCB film production according to claim 2, characterized in that, The adjustment groove (2202) is formed on the surface of the fixed block (2201), the sliding column (2204) is slidably connected to the inner side of the adjustment groove (2202), and the lower end of the adjustment rod (2203) is fixedly connected to the middle end of the sliding column (2204).

4. The cooling device for PCB film production according to claim 3, characterized in that, The fixing plate (2205) is fixedly connected to both sides of the upper end of the mounting shell (3), and the upper end of the adjusting rod (2203) passes through the fixing plate (2205) and extends to the top of the fixing plate (2205).

5. The cooling device for PCB film production according to claim 4, characterized in that, The pressure cylinder (2207) is fixedly installed at the center of the upper surface of the mounting shell (3), the drive plate (2206) is fixedly connected to the telescopic end of the pressure cylinder (2207), and the end of the adjusting rod (2203) away from the sliding column (2204) is fixedly connected to the bottom surface of the drive plate (2206).

6. The cooling device for PCB film production according to claim 5, characterized in that, The sliding column (2204) and the adjusting groove (2202) fit together, and the contact surface between the sliding column (2204) and the adjusting groove (2202) is set to be smooth.

7. The cooling device for PCB film production according to claim 5, characterized in that, The adjusting rod (2203) is rectangular, and the outer surface of the adjusting rod (2203) is smooth.

8. The cooling device for PCB film production according to claim 1, characterized in that, The surface of the mounting groove (8) is in contact with the inner side of the rotating plate (5), and the contact surface between the surface of the mounting groove (8) and the rotating plate (5) is set to be smooth.

Images