Wafer cleaning brush detection device

Abstract

The utility model discloses a wafer cleaning brush detection device. The wafer cleaning brush detection device comprises a clamping mechanism, a rotary adjusting mechanism, a microscopic mechanism and an imaging mechanism which are arranged on a detection table. One end or two ends of the clamping mechanism can slide, the rotary adjusting mechanism performs intervention adjustment on the mounting position of the clamping mechanism, and the microscopic mechanism captures the surface of the wafer cleaning brush detected subsequently and amplifies and displays the surface through the imaging mechanism. According to the utility model, the clamping mechanism capable of sliding and rotating and the microscopic mechanism capable of sliding and lifting are used for adapting to the wafer cleaning brushes of most sizes and types, the detection precision and strength are improved, the unqualified wafer cleaning brushes are fully screened out, the completion of the wafer cleaning process is ensured, and the quality of wafer products is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and more specifically, to a wafer cleaning brush inspection device. Background Technology

[0002] Wafer cleaning is a crucial step in semiconductor manufacturing, aiming to remove various contaminants from the wafer surface to ensure subsequent processing steps can be performed on a clean surface. As semiconductor device dimensions continue to shrink and precision requirements increase, the technical demands of wafer cleaning processes are becoming increasingly stringent. Even the smallest particles, organic matter, metal ions, or oxide residues on the wafer surface can significantly impact device performance, thereby affecting semiconductor device yield and reliability.

[0003] Wafer cleaning mainly includes the following steps: chemical dosing and soaking, spraying and brushing, rinsing and washing, and drying. Chemical dosing and soaking: Specific chemical agents, such as acidic hydrogen peroxide and ammonium hydroxide solutions, are added to the cleaning tank. These chemicals react with contaminants on the wafer surface, loosening and partially dissolving them. Spraying and brushing: In a high-pressure spraying system, high-pressure nozzles evenly spray the cleaning solution onto the wafer surface, removing attached contaminants through a combination of mechanical force and chemical action. In a brushing system, brushes rotate, working in conjunction with the cleaning solution to scrub the wafer surface. The chemical components in the cleaning solution react with the contaminants, and the brushes carry the loosened solid contaminants away from the wafer, further removing stubborn contaminants. Rinsing and washing: The wafer is rinsed in a rinsing tank to remove residual cleaning solution and dissolved contaminants, followed by washing to ensure a thorough cleaning of the wafer surface. Drying: The wafer surface is rapidly dried in a drying chamber using hot air or infrared radiation to prevent water stains and effectively remove static electricity from the wafer surface, reducing dust adsorption in subsequent processes.

[0004] During the cleaning process, a wafer cleaning brush is used. Wafer cleaning brushes are typically roller brushes that clean the wafer surface by rotating them. The surface of the wafer cleaning brush has cleaning bumps with a specific layout, size, and shape. Substandard wafer cleaning brushes can easily damage the single-crystal silicon cylinders on the wafer surface, or fail to clean contaminant residue in relevant areas, resulting in damaged or defective wafers, hindering development and affecting production. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a wafer cleaning brush detection device to solve one or more of the above-mentioned problems.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A wafer cleaning brush inspection device includes an inspection stage, on which a clamping mechanism for clamping wafer cleaning brushes of different sizes is provided. At least one end of the clamping mechanism is slidably connected to the inspection stage. The clamping mechanism is provided with a rotary mechanism for rotating the wafer cleaning brush. A microscopic mechanism and an imaging mechanism are respectively provided at both ends of the clamping mechanism. The microscopic mechanism is electrically connected to the imaging mechanism and is slidably connected to the inspection stage.

[0008] Furthermore, both the clamping mechanism and the microscopic mechanism slide laterally along the detection stage, with the microscopic mechanism located at the end closest to the inspector.

[0009] Furthermore, the clamping mechanism includes a fixed seat fixed on the testing table and a movable seat or two movable seats, the movable seats sliding relative to each other via a lead screw mechanism fixed on the testing table.

[0010] Furthermore, the lead screw mechanism includes two parallel and transversely arranged short slide rails on the lead screw seat and a short slider slidably arranged on the short slide rails. The movable seat is connected to the short slider. A spring-loaded lead screw is threaded through the movable seat and the lead screw seat. The movable seat slides transversely along the short slide rails via the lead screw.

[0011] Furthermore, the microscopic mechanism includes a microscope head with lifting function and a traveling mechanism disposed on the detection stage, wherein the microscope head slides laterally through the traveling mechanism.

[0012] Furthermore, the walking mechanism includes two parallel and laterally arranged long slide rails, a long slider slidably disposed on the long slide rails, and a track connecting the microscope head, wherein the long slider engages with the microscope head.

[0013] Furthermore, the microscope head is provided with a handle, and the microscope head is driven by the handle to slide laterally along the long slide rail.

[0014] Furthermore, the track is equipped with a motor, which drives the track to move the microscope head laterally along the long slide rail.

[0015] Furthermore, the rotary adjustment mechanism includes bearings passing through both ends of the clamping mechanism, a connector connecting to the bearings, and a throttle passing through one of the bearings. The connector clamps and locks the wafer cleaning brush, and the throttle drives the wafer cleaning brush to rotate.

[0016] Furthermore, the throttle is connected to an external motor or wheel handle.

[0017] In summary, this utility model has the following beneficial effects:

[0018] 1. The sliding movable seat can be adjusted to accommodate wafer cleaning brushes of different lengths and sizes. By changing the connector to fit wafer cleaning brushes of different diameters, clamping and testing of most wafer cleaning brushes can be completed, making it highly adaptable.

[0019] 2. By using a sliding and lifting microscope lens in conjunction with the rotation of a rotary mechanism, the surface of the wafer cleaning brush can be fully inspected, improving the inspection accuracy;

[0020] 3. By strengthening the detection intensity and accuracy of the wafer cleaning brush, the protection and cleaning of the wafer during the brushing stage can be guaranteed, which helps to improve the quality of the finished wafer. Attached Figure Description

[0021] Figure 1 A three-dimensional structural schematic diagram of one embodiment of the present utility model;

[0022] Figure 2 A schematic diagram of the main structure in one embodiment of this utility model;

[0023] Figure 3 A schematic diagram of the microstructure in one embodiment of this utility model;

[0024] Figure 4 This is a schematic diagram of the clamping structure and the adjusting mechanism in one embodiment of the present invention.

[0025] In the diagram: 10. Testing stage; 20. Clamping mechanism; 21. Fixed seat; 22. Movable seat; 23. Lead screw mechanism; 231. Lead screw seat; 232. Short slide rail; 233. Short slider; 234. Spring; 235. Lead screw component; 30. Adjustment mechanism; 31. Bearing; 32. Connector; 33. Rotary handle; 40. Microscopic mechanism; 41. Microscope lens; 42. Walking mechanism; 421. Long slide rail; 422. Long slider; 423. Track; 50. Imaging mechanism; 60. Wafer cleaning brush. Detailed Implementation

[0026] Example 1:

[0027] The following is in conjunction with the appendix Figure 1-4 The present invention will be described in further detail below.

[0028] Wafer cleaning brush inspection device, such as Figure 1As shown, the main body is a testing platform 10 with cabinet space underneath. A seat for the testing personnel is provided at the front of the testing platform 10, and a relatively raised setting platform is provided on the platform surface near the front. An imaging mechanism 50 is located at the rear of the testing platform 10. The imaging mechanism 50 mainly consists of a large display screen and a central control console. The large display screen and the central control console are equipped with lifting, horizontal rotation, and sliding rail functions via hinges and sliders. The central control console is equipped with a touch screen and multiple buttons.

[0029] like Figure 2 and Figure 4 As shown, a clamping mechanism 20 is provided at the rear end of the setting platform. The clamping mechanism 20 includes a fixed seat 21 and a movable seat 22. The fixed seat 21 is installed on the right side of the platform, while the movable seat 22 slides horizontally left and right through a lead screw mechanism 23 specifically fixed to the left side of the platform. The basic base of the lead screw mechanism 23 is a lead screw seat 231, on which two horizontally arranged, left-right oriented short slide rails 232 are laid. Each short slide rail 232 is provided with an individual short slider 233, which slides relative to the short slide rail 232. The bottom of the movable seat 22 simultaneously abuts against the two front-to-back aligned short sliders 233. The lead screw 235 passes through both the movable seat 22 and the lead screw seat 231. A spring 234 is also provided outside the lead screw 235 to provide a certain resistance to the lead screw mechanism 23 and improve the adjustment accuracy. By adjusting the lead screw 235, the movable seat 22 slides left and right along the short slide rail 232, thus clamping wafer cleaning brushes 60 of different lengths between the movable seat 22 and the fixed seat 21. The clamping mechanism 20 also includes a rotary adjustment mechanism 30, which can rotate the clamped wafer cleaning brush 60. The rotary adjustment mechanism 30 includes a pair of bearings 31, a pair of couplings 32, and a handle 33 with a connecting rod. The bearings 31 are respectively installed in the mounting slots of the movable seat 22 and the fixed seat 21, and each bearing 31 is connected to a separate coupling 32. The coupling 32 has a self-centering back-pressing pin in its center, which can accommodate wafer cleaning brushes 60 of different diameters. The connecting rod of the handle 33 is connected to the bearing 31 on the right end of the fixed seat 21. The handle 33 drives the clamped wafer cleaning brush 60 to rotate. The handle 33 has an external wheel handle for manual adjustment.

[0030] like Figure 2 and Figure 3As shown, a microscopic mechanism 40 is provided at the front end of the setup stage. The microscopic mechanism 40 includes a microscope head 41 with lifting function and a traveling mechanism 42 located at the front. The microscope head 41 itself has a base, on which is a telescopic and fixed long rod. The top of the long rod is equipped with a fine-tuning screw slide rail assembly, so the microscope head 41 has two adjustment methods: fine adjustment and micro-adjustment, which can be used together. The microscope head 41 is a high-precision magnifying microscope assembly with dynamic capture function. The microscope head 41 is electrically connected to the imaging mechanism 50, and the magnified image it captures is transmitted to the display screen for real-time detection. The microscope head 41 slides left and right on the stage via the traveling mechanism 42. The traveling mechanism 42 includes two parallel and horizontally arranged long slide rails 421. Each long slide rail 421 is equipped with a long slider 422 that can slide left and right, and a track 423 is located at the front. The long slider 422 is connected to the base of the microscope head 41. The track 423 is equipped with a motor and is connected to the base of the microscope head 41. The motor drives the microscope head 41 base to slide left and right along the long slide rail 421 via the track 423.

[0031] Adjust the position of the movable base 22 to clamp the target wafer cleaning brush 60 between the two connectors 32. Using the image on the large display screen, adjust the height of the microscope head 41 to one end of the wafer cleaning brush 60, and slowly move it to the other end via the motor-driven conveyor belt 423 to inspect the surface of the wafer cleaning brush 60. After inspecting a complete length, manually rotate the wafer cleaning brush 60 to re-inspect the unobserved areas, repeating this process until the wafer cleaning brush 60 has been completely inspected.

[0032] Example 2:

[0033] The difference from Embodiment 1 is that no motor is provided for the track 423. The track 423 mainly serves to assist in guidance and enhance stability. A handle is provided on the base of the microscope head 41, and the microscope head 41 is manually moved by the handle to complete the sliding adjustment.

[0034] Example 3:

[0035] The difference from Embodiment 1 is that the throttle 33 is connected to the motor and the necessary transmission components. By means of motor drive, the wafer cleaning brush 60 is rotated at a fixed angle by default.

[0036] Example 4:

[0037] The difference from Embodiment 1 is that the fixed seat 21 is replaced with a movable seat 22 and equipped with a separate lead screw mechanism 23. Both movable seats 22 on both sides can slide and adjust. Under the premise that the size of the detection table 10 remains unchanged, the clamping mechanism 20 can be adjusted over a larger range.

[0038] It should be noted that this specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

Claims

1. Wafer cleaning brush detection device, comprising a detection table (10), characterized in that: The detection stage (10) is provided with a clamping mechanism (20) for clamping wafer cleaning brushes (60) of different sizes. At least one end of the clamping mechanism (20) is slidably connected to the detection stage (10). The clamping mechanism (20) is provided with a rotary mechanism (30) for rotating the wafer cleaning brushes (60). The two ends of the clamping mechanism (20) are respectively provided with a microscopic mechanism (40) and an imaging mechanism (50). The microscopic mechanism (40) is electrically connected to the imaging mechanism (50), and the microscopic mechanism (40) is slidably connected to the detection stage (10).

2. The wafer cleaning brush inspection apparatus of claim 1, wherein: Both the clamping mechanism (20) and the microscopic mechanism (40) slide laterally along the detection stage (10), with the microscopic mechanism (40) located at the end closest to the testing personnel.

3. The wafer cleaning brush inspection apparatus of claim 2, wherein: The clamping mechanism (20) includes a fixed seat (21) fixed on the testing table (10) and a movable seat (22) or two movable seats (22), which slide relative to each other through a screw mechanism (23) fixed on the testing table (10).

4. The wafer cleaning brush inspection apparatus of claim 3, wherein: The lead screw mechanism (23) includes two parallel and transversely arranged short slide rails (232) on the lead screw seat (231) and a short slider (233) slidably arranged on the short slide rails (232). The movable seat (22) is connected to the short slider (233). A lead screw member (235) with a spring (234) is passed through the movable seat (22) and the lead screw seat (231). The movable seat (22) slides laterally along the short slide rails (232) through the lead screw member (235).

5. The wafer cleaning brush inspection apparatus of claim 2, wherein: The microscopic mechanism (40) includes a microscope head (41) with lifting function and a walking mechanism (42) provided on the detection stage (10). The microscope head (41) slides laterally through the walking mechanism (42).

6. The wafer cleaning brush inspection apparatus of claim 5, wherein: The walking mechanism (42) includes two parallel and transversely arranged long slide rails (421), a long slider (422) slidably arranged on the long slide rails (421), and a track (423) connecting the microscope head (41). The long slider (422) docks with the microscope head (41).

7. The wafer cleaning brush inspection apparatus of claim 6, wherein: The microscope head (41) is provided with a handle, and the microscope head (41) is driven by the handle to slide laterally along the long slide rail (421).

8. The wafer cleaning brush inspection apparatus of claim 6, wherein: The track (423) is equipped with a motor, which drives the track (423) to move the microscope head (41) laterally along the long slide rail (421).

9. The wafer cleaning brush inspection apparatus of claim 2, wherein: The rotary mechanism (30) includes bearings (31) passing through both ends of the clamping mechanism (20), a connector (32) connecting to the bearings (31), and a throttle (33) passing through one of the bearings (31). The connector (32) clamps and locks the wafer cleaning brush (60), and the throttle (33) drives the wafer cleaning brush (60) to spin.

10. The wafer cleaning brush inspection apparatus of claim 9, wherein: The throttle (33) is connected to an external motor or wheel handle.

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