Double-layer test equipment

Abstract

The utility model relates to the technical field of automation equipment, and discloses double-layer test equipment, which comprises a top plate, an upper needle plate module, a lower needle plate module, a rack module and a first driving module, the FPC board in the high-frequency signal transmission and interface module is designed to be electrically connected with the BG board in the upper needle board module through the switching probe, so that the FPC board and the BG board do not need to be repeatedly welded and desoldered, the operation convenience of the test equipment is greatly improved, the use efficiency of the equipment is improved, the reliability of the equipment is enhanced, and the test cost is reduced. Tediousness and complexity of traditional welding and dewelding processes are effectively avoided, actual test requirements can be better met, and normal use of equipment and accuracy of test results are ensured.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to a double-layer testing device. Background Technology

[0002] Currently, in existing testing equipment, when testing a device under test (DUT), the DUT is placed on the lower pin plate module, and then the drive module moves the upper pin plate module downwards to perform the press-fit test. However, in practical applications, a problem arises because the FPC board in the high-frequency signal transmission and interface module and the BG board in the upper pin plate module are connected by soldering. This means that when performing press-fit tests on different types of DUTs, if a different high-frequency signal transmission and interface module needs to be replaced, the soldering connection between the FPC board and the BG board must first be removed. After removal, the FPC board in the replaced high-frequency signal transmission and interface module must be re-soldered to the BG board in the upper pin plate module. This process is not only cumbersome and time-consuming, but also easily causes physical damage or destruction to the FPC board and BG board during soldering and desoldering, thus affecting the normal use of the testing equipment and the accuracy of the test results.

[0003] Therefore, given the aforementioned shortcomings and defects in the existing technology, it is urgent to make necessary improvements and optimizations to the existing technology in order to improve the ease of operation, efficiency and reliability of the testing equipment, so as to better meet the actual testing needs.

[0004] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0005] This invention provides a dual-layer testing device to solve the problems existing in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A dual-layer testing device includes a top plate, an upper needle plate module, a lower needle plate module, a frame module, and a first drive module; wherein,

[0008] The top plate, upper needle plate module, lower needle plate module, and frame module are arranged sequentially from top to bottom;

[0009] The lower needle plate module is disposed on the upper surface of the frame module;

[0010] The upper needle plate module is disposed on the lower surface of the top plate;

[0011] The first drive module is disposed on the frame module, and the drive end of the first drive module is connected to the top plate, for driving the top plate and the upper needle plate module to move in the vertical direction to approach the lower needle plate module and be electrically connected to the lower needle plate module;

[0012] The upper surface of the upper needle plate module is provided with a slot, and a high-frequency signal transmission and interface module is provided in the slot;

[0013] The upper pin board module includes a PCB board, a CG board, a BG board, and an Interposer board;

[0014] The high-frequency signal transmission and interface module includes an FPC board;

[0015] The FPC board, BG board, Interposer board, CG board and PCB board are arranged in order from top to bottom;

[0016] The PCB board and the CG board are electrically connected via test probes;

[0017] The CG board is in direct contact with the Interposer board to establish an electrical connection;

[0018] The Interposer board and the BG board are electrically connected via adapter probes;

[0019] The FPC board and the BG board are electrically connected via another adapter probe.

[0020] Furthermore, in the dual-layer test equipment, the high-frequency signal transmission and interface module also includes a radio frequency probe;

[0021] The radio frequency probe is electrically connected to the BG board through the FPC board.

[0022] Furthermore, in the dual-layer testing equipment, the frame module includes a base plate, a first support plate, and a second support plate;

[0023] The lower needle plate module and the first drive module are respectively mounted on the base plate;

[0024] The first tray is slidably mounted on the base plate in the horizontal direction and is detachably provided with a carrier plate module;

[0025] The second tray is slidably mounted on the first tray in the horizontal direction, and is detachably provided with another carrier module.

[0026] Furthermore, the dual-layer testing device also includes a second drive module and a third drive module;

[0027] The second drive module and the third drive module are respectively disposed on the base plate;

[0028] The driving end of the second driving module is connected to the first tray and is used to drive the first tray and the second tray to move in the horizontal direction, so that the first tray and the second tray move to the underside of the upper needle plate module or to the front of the upper needle plate module.

[0029] The drive end of the third drive module is connected to the second tray and is used to drive the second tray to move in the horizontal direction, so that the second tray moves to directly below the first tray or to the front of the first tray.

[0030] Furthermore, in the dual-layer testing device, the lower needle plate module is located between the first tray and the second tray;

[0031] The lower needle plate module is equipped with a dual-headed probe, which is electrically connected to the device under test on the first tray and the device under test on the second tray, respectively.

[0032] Furthermore, in the dual-layer testing equipment, the carrier module is provided with positioning components for fixing the device under test.

[0033] Furthermore, in the dual-layer testing equipment, the positioning component includes a coarse positioning post and a fine positioning post;

[0034] The coarse positioning post is used for rough guiding and positioning;

[0035] The precision positioning post is used to further refine the guidance and positioning based on the rough guidance and positioning.

[0036] Furthermore, in the dual-layer testing device, the test probe, the adapter probe, and the dual-headed probe are all elastic probes.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] This utility model provides a dual-layer testing device. By designing an adapter probe to electrically connect the FPC board and the BG board, the repeated soldering and desoldering of the FPC board and the BG board is eliminated, thereby improving the ease of operation, efficiency and reliability of the testing device. It can better meet actual testing needs and ensure the normal use of the testing device and the accuracy of the test results.

[0039] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is one of the three-dimensional front view structural schematic diagrams of a double-layer testing device provided in this utility model embodiment;

[0042] Figure 2 This is a schematic diagram (stereoscopic rear side view) of a double-layer testing device provided in an embodiment of this utility model;

[0043] Figure 3 This is the second schematic diagram of the (stereoscopic front view) structure of a double-layer testing device provided in this embodiment of the utility model;

[0044] Figure 4 This is a side view structural schematic diagram of a dual-layer testing device provided in an embodiment of this utility model;

[0045] Figure 5 This is a three-dimensional structural diagram of the needle plate module, FPC board, and radio frequency probe provided in this embodiment of the utility model;

[0046] Figure 6 yes Figure 5 An enlarged schematic diagram of point A in the middle;

[0047] Figure 7 This is a three-dimensional structural diagram of the carrier module provided in this embodiment of the utility model.

[0048] Figure label:

[0049] Top plate 1, upper needle plate module 2, lower needle plate module 3, frame module 4, first drive module 5, high frequency signal transmission and interface module 6, test probe 7, adapter probe 8, carrier board module 9, second drive module 10, third drive module 11, positioning component 12.

[0050] PCB board 201, CG board 202, BG board 203, Interposer board 204;

[0051] Base plate 401, first support plate 402, second support plate 403;

[0052] FPC board 601, RF probe 602;

[0053] Coarse positioning post 1201, fine positioning post 1202. Detailed Implementation

[0054] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0055] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0056] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0057] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0058] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0059] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0060] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0061] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0062] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0063] In view of the deficiencies of the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacturing of this field, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies of the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.

[0064] Please refer to Figures 1-6 This utility model embodiment provides a double-layer testing device, including a top plate 1, an upper needle plate module 2, a lower needle plate module 3, a frame module 4, and a first drive module 5; the following is a detailed description of each component and their interrelationships:

[0065] First, from the perspective of the overall layout of the equipment, the top plate 1, the upper needle plate module 2, the lower needle plate module 3, and the frame module 4 are arranged in a top-to-bottom order. This hierarchical structural design not only ensures the orderly arrangement of the various components of the equipment but also provides a solid foundation for the stable operation of the equipment.

[0066] Specifically, the lower needle plate module 3 is precisely mounted on the upper surface of the frame module 4, while the upper needle plate module 2 is positioned on the lower surface of the top plate 1. This arrangement allows the upper needle plate module 2 and the lower needle plate module 3 to press together the device under test while moving relative to each other in the vertical direction, facilitating subsequent testing operations.

[0067] Furthermore, the first drive module 5 is cleverly mounted on the frame module 4, and its drive end is tightly connected to the top plate 1. The main function of the first drive module 5 is to drive the top plate 1 and the connected upper needle plate module 2 to move vertically. When testing is required, the first drive module 5 drives the top plate 1 and the upper needle plate module 2 to move downwards, bringing them closer to the lower needle plate module 3 and establishing an electrical connection with it.

[0068] A slot structure is specially designed on the upper surface of the upper pin plate module 2 for installing the high-frequency signal transmission and interface module 6. The inclusion of this module greatly improves the performance of the device in high-frequency signal transmission.

[0069] The upper pin board module 2 is mainly composed of PCB board 201, CG board 202, BG board 203, and Interposer board 204. These boards play a crucial role in the equipment. The Interposer board is an intermediary layer that facilitates information exchange between upper or lower layer nodes.

[0070] The high-frequency signal transmission and interface module 6 is mainly composed of FPC board 601. FPC board 601, BG board 203, Interposer board 204, CG board 202 and PCB board 201 are also arranged in order from top to bottom.

[0071] In terms of electrical connection, the PCB board 201 and the CG board 202 are electrically connected through the test probe 7; the CG board 202 and the Interposer board 204 are electrically connected through direct contact; and the Interposer board 204 and the BG board 203, as well as the FPC board 601 and the BG board 203, are electrically connected through the adapter probe 8 respectively.

[0072] Of particular note is the innovative design of this embodiment, which uses an adapter probe 8 to electrically connect the FPC board 601 and the BG board 203, significantly improving the ease of operation of the testing equipment. This connection method avoids the cumbersome and complex traditional soldering and desoldering processes, not only improving the efficiency of equipment use but also enhancing its reliability. Therefore, the dual-layer testing equipment of this embodiment can better meet actual testing needs, ensuring normal equipment use and the accuracy of test results.

[0073] Please refer to this again. Figure 6 In a specific implementation of this embodiment, the structure of the high-frequency signal transmission and interface module 6 is further refined and explained.

[0074] In this embodiment, the high-frequency signal transmission and interface module 6 includes not only the previously mentioned FPC board 601, but also the key component RF probe 602. The RF probe 602 plays a crucial role in high-frequency signal transmission and testing, responsible for receiving and transmitting high-frequency signals to ensure accurate transmission and effective reception.

[0075] The radio frequency probe 602 is electrically connected to the BG board 203 via the FPC board 601. This connection method ensures that the radio frequency probe 602 can transmit high-frequency signals stably and reliably, and also facilitates the overall layout of the equipment and the optimization of the signal path.

[0076] Please refer to this again. Figures 3-4 In a specific implementation of this embodiment, the composition of the frame module 4 and its assembly relationship with the lower needle plate module 3, the first drive module 5 and the carrier plate module 9 are described in detail.

[0077] In this embodiment, the frame module 4 serves as the supporting frame for the entire testing equipment, and its structural design is particularly critical. The frame module 4 mainly consists of three parts: a base plate 401, a first support plate 402, and a second support plate 403. These three parts cooperate with each other to form a stable foundation for the equipment.

[0078] Specifically, the lower needle plate module 3 and the first drive module 5 are both precisely mounted on the base plate 401. The lower needle plate module 3 is responsible for making an electrical connection with the device under test, while the first drive module 5 is responsible for driving the top plate 1 and the upper needle plate module 2 to move vertically to achieve docking with the lower needle plate module 3.

[0079] The first tray 402 is slidably mounted on the base plate 401 in the horizontal direction. This sliding design allows the first tray 402 to be adjusted in position according to actual needs, so as to pick up and put down the device under test. In addition, a carrier module 9 can be detachably mounted on the first tray 402. The carrier module 9 is used to support and fix the device under test, ensuring the stability and accuracy of the testing process.

[0080] The second tray 403 is slidably mounted on the first tray 402 in the horizontal direction. It also adopts a sliding design, which allows the second tray 403 to be adjusted in position as needed to pick up and place the device under test. Similar to the first tray 402, another carrier module 9 can also be detachably mounted on the second tray 403 for supporting and fixing another device under test.

[0081] In summary, this embodiment achieves high flexibility, high stability, and high accuracy of the testing equipment through careful design of the frame module 4's structure and its assembly relationship with the lower needle plate module 3, the first drive module 5, and the carrier plate module 9. This design not only meets actual testing needs but also provides more possibilities for subsequent upgrades and expansions of the equipment.

[0082] Please refer to this again. Figure 2 Another specific implementation of this embodiment will be described in detail, further expanding the functionality of the dual-layer test device, particularly by introducing a second drive module 10 and a third drive module 11 to enhance the device's flexibility and testing efficiency.

[0083] In this embodiment, the dual-layer testing equipment has been improved by adding a second drive module 10 and a third drive module 11. Both drive modules are carefully mounted on the base plate 401 and are tightly integrated with the other parts of the equipment.

[0084] The drive end of the second drive module 10 is connected to the first tray 402. This design enables the second drive module 10 to drive the first tray 402, as well as the second tray 403 and the carrier module 9 mounted thereon, to move horizontally. Specifically, the second drive module 10 can drive the first tray 402 and the second tray 403 to move directly below the upper needle plate module 2 for test docking; or drive them to move in front of the upper needle plate module 2 to provide space for replacing the device under test or performing other operations.

[0085] The drive end of the third drive module 11 is connected to the second tray 403. This means that the third drive module 11 can independently drive the second tray 403 and the carrier module 9 on it to move horizontally. Similarly, the third drive module 11 can drive the second tray 403 to move directly below the first tray 402, aligning it with other components or test positions on the first tray 402; or drive the second tray 403 to move in front of the first tray 402, facilitating the individual operation or replacement of the device under test on the second tray 403.

[0086] This design enables the dual-layer test equipment to move vertically (driven by the first drive module 5) and horizontally (driven by the second drive module 10 and the third drive module 11). This multi-dimensional mobility greatly improves the equipment's flexibility and testing efficiency, allowing it to adapt to different testing needs more quickly and facilitate the replacement and operation of the device under test.

[0087] In summary, this embodiment, by introducing the second drive module 10 and the third drive module 11 and carefully designing their drive methods and connection relationships with other parts of the equipment, realizes the flexible horizontal movement of the dual-layer test equipment, further improving the equipment's testing capabilities and usage efficiency.

[0088] In one specific embodiment of this example, the position and function of the lower needle plate module 3 have been further optimized and designed.

[0089] Specifically, the lower needle plate module 3 is cleverly positioned between the first tray 402 and the second tray 403. This layout not only makes full use of the internal space of the equipment, but also makes it possible to test two devices under test simultaneously.

[0090] More importantly, the lower probe module 3 is equipped with a dual-ended probe. This dual-ended probe design is highly innovative; one end is electrically connected to the device under test (DUT) on the first tray 402, and the other end is electrically connected to the DUT on the second tray 403. In this way, when the device is being tested, the dual-ended probe can simultaneously establish electrical connections with two DUTs, achieving synchronous signal transmission and reception.

[0091] This design significantly improves testing efficiency, enabling the equipment to complete the testing of two devices under test simultaneously without requiring separate testing. This not only saves time but also reduces testing costs and increases equipment utilization.

[0092] In summary, this embodiment optimizes the position design of the lower probe module 3 and equips it with a dual-headed probe, enabling the simultaneous testing of two devices under test, thereby further improving the testing capabilities and efficiency of the equipment.

[0093] Please refer to Figure 7 In another specific embodiment of this invention, the structure of the carrier module 9 has been further refined and improved, especially by setting a positioning component 12 for fixing the device under test.

[0094] In this embodiment, the carrier module 9, as a crucial component for supporting and fixing the device under test (DUT), directly affects the accuracy and stability of the test. Therefore, a positioning component 12 is carefully designed on the carrier module 9 to ensure that the DUT can be securely and accurately fixed on the carrier module 9.

[0095] The specific form of the positioning component 12 can be customized according to the shape, size and test requirements of the device under test.

[0096] By incorporating the positioning component 12, movement or shaking of the device under test (DUT) can be effectively prevented during testing, thereby ensuring the accuracy and reliability of the test. Furthermore, the design of the positioning component 12 also considers ease of operation and disassembly, making it more convenient and quick to replace the DUT or perform other operations.

[0097] In summary, this embodiment further improves the testing accuracy and stability of the equipment by setting the positioning component 12 on the carrier module 9, providing a strong guarantee for the normal use of the equipment and the accuracy of the test results.

[0098] Please refer to this again. Figure 7 The specific design of the positioning component 12 in this embodiment is described in more detail, especially the innovative design of the coarse positioning post 1201 and the fine positioning post 1202.

[0099] In this embodiment, the positioning component 12 consists of two parts: a coarse positioning post 1201 and a fine positioning post 1202. These two parts cooperate with each other to achieve accurate and stable fixation of the device under test.

[0100] The main function of the coarse positioning post 1201 is to provide rough guidance and positioning. When the device under test (DUT) is placed onto the carrier module 9, the coarse positioning post 1201 can quickly guide the DUT into the approximate correct position, providing a basis for subsequent precise positioning. The design of the coarse positioning post 1201 is usually relatively loose to accommodate minor deviations that may occur during the placement of the DUT.

[0101] The fine positioning post 1202 further refines the guiding and positioning process based on the coarse guiding and positioning. After the device under test (DUT) is roughly positioned by the coarse positioning post 1201, the fine positioning post 1202 engages with its precision positioning holes or structures to ensure that the DUT is accurately and stably fixed on the carrier module 9. The design of the fine positioning post 1202 is typically more refined to ensure the accuracy and stability of the positioning.

[0102] This two-stage coarse and fine positioning design effectively improves the positioning accuracy and stability of the device under test (DUT). The coarse positioning post 1201 quickly guides the DUT into its approximate position, while the fine positioning post 1202 ensures its accurate fixation in the final position. This design not only improves testing efficiency but also guarantees the accuracy of test results.

[0103] In summary, this embodiment, by introducing a positioning component design consisting of a coarse positioning post 1201 and a fine positioning post 1202, achieves accurate and stable fixation of the device under test, providing a strong guarantee for the normal use of the equipment and the accuracy of the test results.

[0104] In one specific embodiment of this example, the materials and characteristics of the test probe 7, the adapter probe 8, and the dual-headed probe were specially selected, namely, they are all elastic probes.

[0105] The design of flexible probes offers several advantages. First, flexible probes provide excellent contact performance. During testing, the probe needs to maintain close contact with the pins or test points of the device under test (DUT) to ensure accurate signal transmission. Due to their inherent elasticity, flexible probes can adapt to minor deformations or positional deviations of the DUT, thus maintaining stable contact.

[0106] Secondly, flexible probes have a longer service life. During frequent testing, probes undergo multiple insertions and removals, which can easily lead to wear or damage. Flexible probes, due to the elasticity and wear resistance of their material, can better resist this wear and extend their service life.

[0107] Furthermore, flexible probes also help improve the accuracy and reliability of testing. Due to their excellent contact performance and stable electrical connection, flexible probes can ensure the accurate transmission and reception of test signals, reducing errors and interference during the testing process.

[0108] In summary, this embodiment selects an elastic probe as the test probe 7, the adapter probe 8, and the dual-headed probe, which improves the contact performance, service life, and accuracy of the test.

[0109] Although this application frequently uses terms such as FPC board and BG board, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

[0110] This utility model provides a dual-layer testing device. By designing an adapter probe to electrically connect the FPC board and the BG board, the repeated soldering and desoldering of the FPC board and the BG board is eliminated, thereby improving the ease of operation, efficiency, and reliability of the testing device. It can better meet actual testing needs and ensure the normal use of the testing device and the accuracy of the test results.

[0111] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A dual-layer testing device, characterized in that, It includes a top plate (1), an upper needle plate module (2), a lower needle plate module (3), a frame module (4), and a first drive module (5); among which, The top plate (1), upper needle plate module (2), lower needle plate module (3), and frame module (4) are arranged sequentially from top to bottom; The lower needle plate module (3) is disposed on the upper surface of the frame module (4); The upper needle plate module (2) is disposed on the lower surface of the top plate (1); The first drive module (5) is disposed on the frame module (4), and the drive end of the first drive module (5) is connected to the top plate (1) to drive the top plate (1) and the upper needle plate module (2) to move in the vertical direction to get close to the lower needle plate module (3) and be electrically connected to the lower needle plate module (3). The upper surface of the upper needle plate module (2) is provided with a slot, and a high-frequency signal transmission and interface module (6) is provided in the slot. The upper needle board module (2) includes a PCB board (201), a CG board (202), a BG board (203), and an Interposer board (204). The high-frequency signal transmission and interface module (6) includes an FPC board (601). The FPC board (601), BG board (203), Interposer board (204), CG board (202) and PCB board (201) are arranged in order from top to bottom; The PCB board (201) and the CG board (202) are electrically connected through a test probe (7); The CG plate (202) is in direct contact with the Interposer plate (204) to establish an electrical connection; The Interposer board (204) and the BG board (203) are electrically connected via an adapter probe (8); The FPC board (601) and the BG board (203) are electrically connected via another adapter probe (8).

2. The dual-layer testing device according to claim 1, characterized in that, The high-frequency signal transmission and interface module (6) also includes a radio frequency probe (602). The radio frequency probe (602) is electrically connected to the BG board (203) through the FPC board (601).

3. The dual-layer testing device according to claim 1, characterized in that, The rack module (4) includes a base plate (401), a first support plate (402), and a second support plate (403). The lower needle plate module (3) and the first drive module (5) are respectively disposed on the base plate (401); The first tray (402) is slidably mounted on the base plate (401) in the horizontal direction and is detachably provided with a carrier module (9). The second tray (403) is slidably mounted on the first tray (402) in the horizontal direction, and is detachably provided with another carrier module (9).

4. The dual-layer testing device according to claim 3, characterized in that, It also includes a second drive module (10) and a third drive module (11); The second drive module (10) and the third drive module (11) are respectively disposed on the base plate (401); The driving end of the second driving module (10) is connected to the first tray (402) and is used to drive the first tray (402) and the second tray (403) to move in the horizontal direction so that the first tray (402) and the second tray (403) move to the underside of the upper needle plate module (2) or to the front of the upper needle plate module (2); The driving end of the third driving module (11) is connected to the second tray (403) and is used to drive the second tray (403) to move in the horizontal direction so that the second tray (403) moves to directly below the first tray (402) or to the front of the first tray (402).

5. The dual-layer testing device according to claim 3, characterized in that, The lower needle plate module (3) is located between the first tray (402) and the second tray (403); The lower needle plate module (3) is provided with a double-headed probe, which is electrically connected to the device under test on the first tray (402) and the device under test on the second tray (403), respectively.

6. The dual-layer testing device according to claim 3, characterized in that, The carrier module (9) is provided with positioning components (12) for fixing the device under test.

7. The dual-layer testing device according to claim 6, characterized in that, The positioning component (12) includes a coarse positioning post (1201) and a fine positioning post (1202). The coarse positioning post (1201) is used for coarse guiding positioning; The precision positioning post (1202) is used to further refine the guidance and positioning based on the rough guidance and positioning.

8. The dual-layer testing device according to claim 1, characterized in that, The test probe (7), the adapter probe (8), and the dual-headed probe are all elastic probes.

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