Radiator assembly structure for central processing unit

Abstract

The utility model relates to the technical field of research, development and design of computer accessories, in particular to a radiator assembly structure for a central processing unit, which comprises the central processing unit, a radiator and a mainboard. The radiator is assembled on the main board and located above the central processing unit, and the radiator is arranged in a manner of deviating towards one side along the central point of the central processing unit, and has the advantages that the radiator is arranged in a manner of deviating according to a heating point of the central processing unit; therefore, the radiator can more accurately radiate heat of the heating point of the central processing unit, heat radiation efficiency is improved, heat generated by the central processing unit can be more effectively taken away, overheating of the central processing unit is prevented, and the service life of the central processing unit is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of computer accessory research and development design technology, and in particular to a heat sink assembly structure for a central processing unit. Background Technology

[0002] A central processing unit (CPU) heatsink is a device used to dissipate heat from the CPU. The CPU is the core of a computer's processing and control. It generates a lot of heat when it is working. In order to ensure the stable operation of the CPU and extend its lifespan, the heat needs to be dissipated in a timely manner.

[0003] However, in the assembly of common heat sinks, the center point of the heat sink is aligned with the center point of the central processing unit. However, the heat points of some central processing units are not located at the center point of the central processing unit, which means that the heat sink may not be able to effectively cover the heat points, resulting in poor heat dissipation. Therefore, further improvements to the existing technology are needed. Summary of the Invention

[0004] The purpose of this invention is to provide a heat sink assembly structure for a central processing unit designed to solve at least one technical problem in the background art.

[0005] To achieve the above objectives, the present invention adopts the following solution: a heat sink assembly structure for a central processing unit, comprising a central processing unit, a heat sink, and a motherboard, wherein the central processing unit is mounted on the motherboard, the heat sink is mounted on the motherboard and located above the central processing unit, and the heat sink is offset to one side along the center point of the central processing unit.

[0006] The device includes a bracket, which is mounted on the motherboard and located on one side of the central processing unit, and the heat sink is mounted on the motherboard via the bracket.

[0007] The radiator includes a heat dissipation base, which has a relief groove corresponding to the bracket, and the bracket is at least partially assembled in the relief groove.

[0008] The heat sink is located near the end of the bracket, and the central processing unit is at least partially exposed on the heat sink.

[0009] The heat dissipation base is provided with a recessed portion that extends from one or both sides of the heat dissipation base into the interior of the heat dissipation base.

[0010] The bracket is provided with a first bolt hole, and the heat dissipation base is provided with a second bolt hole corresponding to the first bolt hole. The first bolt is assembled in the first bolt hole and the second bolt hole.

[0011] The bracket is provided with mounting holes for the bolts to pass through, and the main board is provided with mounting grooves corresponding to the mounting holes. The second bolt is assembled into the mounting groove through the mounting holes.

[0012] Wherein, a locking sleeve for preventing the first bolt from loosening is fitted into the first bolt hole and / or the second bolt hole, the locking sleeve having a locking part, the first bolt having a locking groove corresponding to the locking part, the locking part being inserted into the locking groove; and / or

[0013] A locking sleeve for preventing the second bolt from loosening is fitted inside the mounting hole. The locking sleeve is provided with a locking part, and the second bolt is provided with a locking groove corresponding to the locking part. The locking part is inserted into the locking groove.

[0014] The first bolt and / or the second bolt are further fitted with an elastic element, one end of which abuts against the head of the first bolt and / or the second bolt, and the other end of which abuts against the bracket.

[0015] The bracket has one or more sets, and the multiple sets of brackets are arranged at intervals or opposite to each other.

[0016] The advantages of this utility model are: the structure of this application is offset according to the heat dissipation point of the central processing unit, so that the heat sink can more accurately dissipate heat from the heat dissipation point of the central processing unit, thereby improving the heat dissipation efficiency, and can more effectively remove the heat generated by the central processing unit, preventing the central processing unit from overheating, thereby extending the service life of the central processing unit. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the heatsink assembly structure for a central processing unit. Figure 1 ;

[0018] Figure 2 This is a schematic diagram of the heatsink assembly structure for a central processing unit. Figure 2 ;

[0019] Figure 3 This is a schematic diagram of the support structure;

[0020] Figure 4 This is a structural diagram of the first bolt and the second bolt;

[0021] Figure 5 This is a schematic diagram of the heatsink assembly structure for a central processing unit. Figure 1 . Detailed Implementation

[0022] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so as to intuitively and vividly understand each technical feature and overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0023] In the description of this utility model, if directional descriptions are involved, such as "up," "down," "front," "back," "left," "right," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, it is only for the convenience of describing this utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. When a feature is referred to as "set," "fixed," or "connected" to another feature, it can be directly set, fixed, or connected to the other feature, or it can be indirectly set, fixed, or connected to the other feature.

[0024] In the description of this utility model, the term "several" means one or more, and "multiple" means two or more. The terms "greater than," "less than," and "exceeding" should be understood as excluding the stated number. The terms "above," "below," and "within" should be understood as including the stated number. The terms "first" and "second" should be understood as distinguishing technical features and not as indicating or implying relative importance, the quantity of indicated technical features, or the sequential relationship between indicated technical features.

[0025] Furthermore, unless otherwise defined, the technical and scientific terms used in this invention have the same meanings as commonly understood by one of ordinary skill in the art. The terminology used in this invention is for the purpose of describing particular embodiments only and not for limiting the invention. It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof.

[0026] Example: Figure 1-5As shown, a heat sink assembly structure for a central processing unit (CPU) includes a CPU 1, a heat sink 2, and a motherboard 3. The CPU 1 is mounted on the motherboard 3, and the heat sink 2 is mounted on the motherboard 3 and located above the CPU 1. The heat sink 2 is offset to one side along the center point of the CPU 1. The structure of this application is offset according to the heat dissipation point of the CPU, so that the heat sink can more accurately dissipate heat from the heat dissipation point of the CPU, thereby improving heat dissipation efficiency, and can more effectively remove the heat generated by the CPU, preventing the CPU from overheating, thereby extending the service life of the CPU.

[0027] The system includes a bracket 4, which is mounted on the motherboard 3 and located on one side of the central processing unit 1. The heat sink 2 is mounted on the motherboard 3 via the bracket 3. The bracket is provided so that the heat sink can be mounted on the motherboard.

[0028] The heat sink 2 includes a heat sink base 21, which is provided with a relief groove 210 corresponding to the bracket 4. The bracket 4 is at least partially assembled in the relief groove 210. The relief groove ensures that the bracket and the heat sink base are stably assembled.

[0029] The heat sink 21 is located near the end of the bracket 4, and the central processing unit is at least partially exposed on the heat sink 21. This allows the heat sink to be offset and can more accurately target the heat dissipation points of the central processing unit, thereby improving heat dissipation efficiency. It can more effectively remove the heat generated by the central processing unit, prevent the central processing unit from overheating, and thus extend the service life of the central processing unit.

[0030] The heat dissipation base 21 is provided with a recess 211 that is recessed into the interior of the heat dissipation base 21 from one or both sides, so that the center point of the heat dissipation base is shifted to the heat point of the central processing unit.

[0031] The bracket 4 is provided with a first bolt hole 401, and the heat dissipation base 21 is provided with a second bolt hole 212 corresponding to the first bolt hole 401. The first bolt 5 is assembled in the first bolt hole 401 and the second bolt hole 212, so that the bracket and the heat dissipation base are stably assembled.

[0032] The bracket 4 is provided with a mounting hole 402 for the bolt to pass through, and the main board 3 is provided with a mounting groove 30 corresponding to the mounting hole 402. The second bolt 6 is assembled into the mounting groove 30 through the mounting hole 402, so that the bracket is stably installed on the main board.

[0033] Wherein, a locking sleeve 7 for preventing the first bolt 5 from loosening is fitted in the first bolt hole 401 and / or the second bolt hole 212. The locking sleeve 7 is provided with a locking part 71. The first bolt 5 is provided with a locking groove 50 corresponding to the locking part 71. The locking part 71 is inserted into the locking groove 50.

[0034] and / or

[0035] A locking sleeve 7 for preventing the second bolt 6 from loosening is fitted inside the mounting hole 402. The locking sleeve 7 is provided with a locking part 71. The second bolt 6 is provided with a locking groove 50 corresponding to the locking part 71. The locking part 71 is inserted into the locking groove 50. An elastic element 8 is also fitted on the first bolt 5 and / or the second bolt 6. One end of the elastic element 8 abuts against the head of the first bolt 5 and / or the second bolt 6, and the other end of the elastic element 8 abuts against the bracket 4 to prevent the bolt from loosening.

[0036] The bracket 4 has one or more sets, and the multiple sets of bracket 4 are arranged at intervals or opposite to each other, so that the heat sink is stably mounted on the motherboard.

[0037] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A heatsink assembly structure for a central processing unit, comprising a central processing unit, a heatsink, and a motherboard, characterized in that: The central processing unit is mounted on the motherboard, and the heat sink is mounted on the motherboard and located above the central processing unit. The heat sink is offset to one side along the center point of the central processing unit.

2. The heat sink assembly structure for a central processing unit according to claim 1, characterized in that: Includes a bracket, which is mounted on the motherboard and located on one side of the central processing unit, and the heat sink is mounted on the motherboard via the bracket.

3. The heat sink assembly structure for a central processing unit according to claim 2, characterized in that: The radiator includes a heat dissipation base, which is provided with a relief groove corresponding to the bracket, and the bracket is at least partially assembled in the relief groove.

4. The heat sink assembly structure for a central processing unit according to claim 3, characterized in that: The heat sink is located near the end of the bracket, and the central processing unit is at least partially exposed on the heat sink.

5. The heat sink assembly structure for a central processing unit according to claim 3, characterized in that: The heat dissipation base is provided with a recessed portion that extends from one or both sides of the heat dissipation base into the interior of the heat dissipation base.

6. The heat sink assembly structure for a central processing unit according to claim 3, characterized in that: The bracket is provided with a first bolt hole, and the heat dissipation base is provided with a second bolt hole corresponding to the first bolt hole. The first bolt is assembled in the first bolt hole and the second bolt hole.

7. The heat sink assembly structure for a central processing unit according to claim 6, characterized in that: The bracket is provided with mounting holes for the bolts to pass through, and the main board is provided with mounting grooves corresponding to the mounting holes. The second bolt is assembled into the mounting groove through the mounting holes.

8. The heat sink assembly structure for a central processing unit according to claim 7, characterized in that: The first bolt hole and / or the first bolt hole is fitted with a locking sleeve for preventing the second bolt from loosening. The locking sleeve is provided with a locking part. The first bolt is provided with a locking groove corresponding to the locking part. The locking part is inserted into the locking groove. and / or A locking sleeve for preventing the second bolt from loosening is fitted inside the mounting hole. The locking sleeve is provided with a locking part, and the second bolt is provided with a locking groove corresponding to the locking part. The locking part is inserted into the locking groove.

9. The heat sink assembly structure for a central processing unit according to claim 7 or 8, characterized in that: An elastic element is also fitted onto the first bolt and / or the second bolt, with one end of the elastic element abutting against the head of the first bolt and / or the second bolt, and the other end of the elastic element abutting against the bracket.

10. The heat sink assembly structure for a central processing unit according to claim 2, characterized in that: The bracket has one or more sets, and the multiple sets of brackets are arranged at intervals or opposite to each other.

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