Embedded component
By employing a stacked structure in embedded components and utilizing heat sinks surrounding the inductor for multi-path heat dissipation, the problem of poor heat dissipation performance of embedded components is solved, thereby improving heat dissipation efficiency and circuit stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU POCO NEW INDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-03-05
- Publication Date
- 2026-04-14
AI Technical Summary
Embedded components have poor heat dissipation performance, and existing technologies for setting heat sinks or heat radiators on the bottom layer of the PCB are not very effective.
The inductor employs a stacked structure, including a heat sink surrounding the inductor, to achieve multi-path heat dissipation, with the heat sink dissipating heat from the sides of the inductor.
It improves the heat dissipation efficiency of embedded components, ensures the stability and reliability of inductors, and avoids circuit performance instability or component damage caused by overheating.
Smart Images
Figure CN224123217U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic components technology, and in particular to an embedded component. Background Technology
[0002] Unlike traditional surface mount technology, embedded components (SPCs) do not mount electronic components on the surface of the PCB. Instead, they are embedded within the PCB's multi-layer structure, typically in the inner layers. Embedded components reduce the space they occupy on the PCB surface, minimizing mechanical damage and the effects of environmental factors such as moisture, dust, and vibration. Furthermore, embedded components can shorten signal paths and reduce inductance and capacitance effects, thereby improving signal integrity and high-frequency performance. However, because embedded components are integrated into the PCB, their heat dissipation is generally more challenging than that of surface mount components. Currently, researchers typically place heat sinks or radiators on the bottom layer of the PCB to conduct heat generated inside the PCB through the PCB substrate and metallized thermal vias to the bottom layer, where it is then effectively dissipated to the external environment. However, heat sinks or radiators on the bottom layer of the PCB are less effective at dissipating heat. Utility Model Content
[0003] The purpose of this invention is to provide an embedded component that can dissipate heat from the side of the inductor through a heat sink, thereby achieving multi-path heat dissipation and improving the heat dissipation efficiency of the embedded component.
[0004] To achieve this objective, the present invention adopts the following technical solution:
[0005] This utility model discloses an embedded component, comprising a first conductive layer, a first outer insulating layer and a laminated body arranged in sequence. The laminated body includes at least one core board and at least one heat sink, and the laminated body has a receiving hole arranged in the stacking direction. The receiving hole is used to receive an inductor, and the end of the inductor along the stacking direction is electrically connected to the first conductive layer.
[0006] In some embodiments, there are multiple core boards and heat sinks, and the core boards and heat sinks are arranged alternately.
[0007] In some embodiments, the laminate further includes a first insulating dielectric layer filled between the core board and the heat sink.
[0008] In some specific embodiments, the heat sink is a heat dissipation layer, and the receiving hole includes a first hole on the core board, a second hole on the heat dissipation layer, and a third hole on the first insulating dielectric layer. The gap between the inductor and the first hole, the second hole, and the third hole is filled with a second insulating dielectric layer.
[0009] In some more specific embodiments, the dimensions of the first hole, the second hole, and the third hole are larger than the dimensions of the inductor, and the second insulating dielectric layer fills the gaps in the inner walls of the first hole, the second hole, the third hole, and the outer wall of the inductor.
[0010] In some specific embodiments, the heat sink is welded to the outer wall of the inductor or the heat sink is integrally formed with the inductor; and the receiving hole includes a first hole on the core board and a third hole on the first insulating dielectric layer; wherein the size of the first hole is larger than the size of the inductor, the size of the third hole is equal to the size of the inductor, and the gap between the inner wall of the first hole and the outer wall of the inductor (33) is filled with a second insulating dielectric layer; or,
[0011] The dimensions of the first hole and the third hole are larger than the dimensions of the inductor. The heat sink is welded to the inductor. The gap between the inner wall of the first hole, the inner wall of the third hole and the outer wall of the inductor is filled with a second insulating dielectric layer.
[0012] In some embodiments, there are multiple heat sinks, which are spaced apart around the outer contour of the inductor.
[0013] In some specific embodiments, the laminate is provided with a plurality of receiving holes spaced apart, and the heat sinks of two adjacent inductors facing each other are shared.
[0014] In some embodiments, the embedded component further includes a second outer insulating layer, a second conductive layer, a first electrode, and a second electrode. The first electrode and the second electrode are located at both ends of the inductor, and both ends of the first electrode are connected to the inductor and the first conductive layer, respectively. The two ends of the second electrode are connected to the inductor and the second conductive layer, respectively. Alternatively, the first electrode and the second electrode are located at one end of the inductor, and one end of the first electrode and the second electrode are connected to the inductor, while the other end is connected to one of the first conductive layer or the second conductive layer.
[0015] In some specific embodiments, a heat dissipation device is provided on the side of the laminate facing away from the inductor; and / or, an electronic component is provided on the side of the first conductive layer facing away from the laminate.
[0016] The beneficial effects of this utility model are as follows: Since the laminate also includes a heat sink, and the heat sink is arranged around the inductor, heat dissipation is achieved on the side of the inductor, realizing multi-path heat dissipation of the inductor and improving the heat dissipation efficiency of embedded components.
[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the embedded component according to Embodiment 1 of this utility model;
[0019] Figure 2 This is a schematic diagram of the connection structure between an inductor and multiple heat sinks according to an embodiment of the present invention;
[0020] Figure 3 This is a schematic diagram of the connection structure between two inductors and multiple heat sinks according to an embodiment of the present invention;
[0021] Figure 4 This is a schematic diagram of the embedded component according to Embodiment 2 of this utility model;
[0022] Figure 5 This is a schematic diagram of the embedded component according to Embodiment 3 of this utility model;
[0023] Figure 6 This is a schematic diagram of the embedded component according to Embodiment 4 of this utility model;
[0024] Figure 7 This is a schematic diagram of the embedded component according to Embodiment 5 of this utility model;
[0025] Figure 8 This is a schematic diagram of the embedded component according to Embodiment Six of this utility model;
[0026] Figure 9 This is a schematic diagram of the embedded component according to Embodiment Seven of this utility model;
[0027] Figure 10 This is a schematic diagram of the embedded component according to Embodiment 8 of this utility model.
[0028] Figure label:
[0029] 10. First conductive layer; 20. First outer insulating layer; 31. Core board; 311. First hole; 32. Heat sink; 321. Second hole; 33. Inductor; 34. First insulating dielectric layer; 341. Third hole; 35. Second insulating dielectric layer; 40. Second outer insulating layer; 50. Second conductive layer; 60. First electrode; 70. Second electrode; 80. Heat dissipation device; 90. Electronic component. Detailed Implementation
[0030] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0031] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0032] In the description of this embodiment, the terms "upper," "lower," "left," "right," "front," and "rear," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0033] Example 1:
[0034] This utility model discloses an embedded component, with reference to... Figure 1 As shown, the device includes a first conductive layer 10, a first outer insulating layer 20, and a laminate, which are stacked sequentially. The laminate includes at least one core plate 31 and at least one heat sink 32. The laminate has a through-hole in the stacking direction for accommodating an inductor 33. The ends of the inductor 33 along the stacking direction are electrically connected to the first conductive layer 10. It is understood that the through-hole is used for mounting and positioning the inductor 33. After a hot-pressing process, the entire laminate is compressed, and the top side of the inductor 33 forms a tight contact with the first outer insulating layer 20. Since the laminate also includes the heat sink 32, which surrounds the inductor 33, it achieves heat dissipation from the sides of the inductor 33, realizing multi-path heat dissipation of the inductor 33 and improving the heat dissipation efficiency of the embedded component.
[0035] Optionally, there are multiple core boards 31 and heat sinks 32, and the core boards 31 and heat sinks 32 are arranged in an alternating manner. It is understandable that providing multiple core boards 31 and multiple heat sinks 32 helps improve the heat dissipation efficiency of the inductor 33, thereby improving the heat dissipation efficiency of the embedded components. (Reference) Figure 1As shown, the laminated body in this embodiment includes two core plates 31 and one heat sink 32. Of course, in an alternative embodiment, there can be one core plate 31 and one heat sink 32; in another alternative embodiment, there are three core plates 31 and two heat sinks 32, with the three core plates 31 and two heat sinks 32 arranged alternately. That is, in the embodiments of this utility model, the number of core plates 31 and heat sinks 32 can be selected according to actual needs.
[0036] Optional, see reference Figure 1 As shown, the laminate also includes a first insulating dielectric layer 34 filled between the core plate 31 and the heat sink 32. It is understood that, to ensure the heat dissipation efficiency of the heat sink 32, the heat sink 32 is typically made of metal. The first insulating dielectric layer 34 is provided between the core plate 31 and the heat sink 32 to provide additional electrical isolation, preventing electrical conduction between the heat sink 32 and the core plate 31, and to enhance structural strength and the laminate's resistance to deformation. In this embodiment, there are two core plates 31, one heat sink 32, and two first insulating dielectric layers 34, respectively connected to opposite sides of the heat sink 32.
[0037] Optional, see reference Figure 1 As shown, the heat sink 32 is a heat dissipation layer. The receiving holes include a first hole 311 on the core board 31, a second hole 321 on the heat dissipation layer, and a third hole 341 on the first insulating dielectric layer 34. The mating gaps between the inductor 33 and the first hole 311, the second hole 321, and the third hole 341 are filled with the second insulating dielectric layer 35. It can be understood that the mating gaps between the inductor 33 and the first hole 311, the second hole 321, and the third hole 341 are used to fill the second insulating dielectric layer 35 to provide additional electrical isolation and mechanical support. This can both prevent short circuits inside the embedded component and improve the deformation resistance of the entire embedded component.
[0038] Optionally, the dimensions of the first hole 311, the second hole 321, and the third hole 341 are larger than the dimensions of the inductor 33, and the second insulating dielectric layer 35 fills the gaps in the inner walls of the first hole 311, the second hole 321, the third hole 341, and the outer wall of the inductor 33. Thus, the second insulating dielectric layer 35 completely isolates the inductor 33 from the core board 31, the heat sink 32, and the first insulating dielectric layer 34, which helps improve the structural stability of the embedded component.
[0039] Optional, see reference Figure 1As shown, the embedded component also includes a first electrode 60 and a second electrode 70. The first electrode 60 and the second electrode 70 are located at one end of the inductor 33, and the two ends of the first electrode 60 are connected to the inductor 33 and the first conductive layer 10, respectively. The two ends of the second electrode 70 are also connected to the inductor 33 and the first conductive layer 10, respectively. It can be understood that by adding the first electrode 60 and the second electrode 70, stable conduction between the inductor 33 and the first conductive layer 10 can be ensured, thereby helping to ensure the reliability of the embedded component.
[0040] It should be noted that, in this embodiment, the heat sink 32 may not be a heat dissipation layer structure with a second hole 321, but may instead refer to... Figure 2 As shown, there are multiple heat sinks 32, which are arranged at intervals around the outer contour of the inductor 33. It can be understood that the heat sinks 32 are welded to the four sides of the inductor 33, and the heat of the inductor 33 can be quickly conducted to the outside through the heat sinks 32 on the four sides, which can increase the heat dissipation area and thus improve the heat dissipation efficiency.
[0041] refer to Figure 3 As shown, when the laminate has multiple spaced-apart receiving holes and multiple heat sinks 32 are arranged spaced around the outer contour of the inductor 33, the heat sinks 32 on the side facing each other of two adjacent inductors 33 are shared. It can be understood that by welding heat sinks 32 to the four sides of the inductor 33, the heat of the inductor 33 can be quickly conducted to the outside through the heat sinks 32 on the four sides, increasing the heat dissipation area and thus improving heat dissipation efficiency. Furthermore, by sharing the heat sink 32, the temperatures of the two inductors 33 can be balanced to some extent. When one inductor 33 generates more heat, the heat can be conducted to the heat sink 32 more quickly and affect the heat dissipation of the other inductor 33, thus promoting a more uniform temperature distribution throughout the system and preventing circuit performance instability or component damage due to overheating of a single inductor 33.
[0042] Example 2:
[0043] refer to Figure 4 As shown, the embedded components in this embodiment are generally the same as those in Embodiment 1. The difference is that the heat sink 32 is arranged in multiple spaced intervals around the outer contour of the inductor 33, and each heat sink 32 is welded to the inductor 33. In this embodiment, the receiving hole includes a first hole 311 provided on the core plate 31 and a third hole 341 provided on the first insulating dielectric layer 34. The size of the first hole 311 is larger than the size of the inductor 33. The second insulating dielectric layer 35 fills the gap between the inner wall of the first hole 311 and the outer wall of the inductor 33.
[0044] Of course, it should be noted that in this embodiment, the heat sink 32 can also be integrally formed with the inductor 33.
[0045] Example 3:
[0046] refer to Figure 5 As shown, the embedded components in this embodiment are generally the same as those in Embodiment 1. The difference is that the heat sink 32 is arranged in multiple spaced intervals around the outer contour of the inductor 33, and each heat sink 32 is welded to the inductor 33. In this embodiment, the receiving hole includes a first hole 311 provided on the core plate 31 and a third hole 341 provided on the first insulating dielectric layer 34. In this embodiment, the size of the first hole 311 and the third hole 341 is larger than the size of the inductor 33. The second insulating dielectric layer 35 fills the gap between the inner sidewall of the first hole 311, the inner sidewall of the third hole 341 and the outer wall of the inductor 33.
[0047] Of course, it should be noted that in this embodiment, the heat sink 32 can also be integrally formed with the inductor 33.
[0048] Example 4:
[0049] refer to Figure 6 As shown, the embedded components in this embodiment are largely the same as those in Embodiment 1, except that a heat dissipation device 80 is provided on the side of the laminate away from the inductor 33.
[0050] Example 5:
[0051] refer to Figure 7 As shown, the embedded components in this embodiment are largely the same as those in Embodiment 4. The difference is that the first conductive layer 10 in this embodiment is provided with an electronic component 90 on the side opposite to the laminate.
[0052] Example 6:
[0053] refer to Figure 8 As shown, the embedded component in this embodiment is largely the same as that in Embodiment 1. The difference is that the embedded component in this embodiment also includes a second outer insulating layer 40 and a second conductive layer 50. The second outer insulating layer 40 is located on the side of the laminate that is away from the first outer insulating layer 20, and the second conductive layer 50 is located on the side of the second outer insulating layer 40 that is away from the laminate. The first electrode 60 and the second electrode 70 are located at the two ends of the inductor 33 and are respectively connected to the first conductive layer 10 and the second conductive layer 50.
[0054] Example 7:
[0055] refer to Figure 9As shown, the embedded component in this embodiment is largely the same as that in Embodiment 2. The difference is that the embedded component in this embodiment also includes a second outer insulating layer 40 and a second conductive layer 50. The second outer insulating layer 40 is located on the side of the laminate that is away from the first outer insulating layer 20, and the second conductive layer 50 is located on the side of the second outer insulating layer 40 that is away from the laminate. The first electrode 60 and the second electrode 70 are located at the two ends of the inductor 33 and are respectively connected to the first conductive layer 10 and the second conductive layer 50.
[0056] Example 8:
[0057] refer to Figure 10 As shown, the embedded component in this embodiment is largely the same as that in Embodiment 3. The difference is that the embedded component in this embodiment also includes a second outer insulating layer 40 and a second conductive layer 50. The second outer insulating layer 40 is located on the side of the laminate that is away from the first outer insulating layer 20, and the second conductive layer 50 is located on the side of the second outer insulating layer 40 that is away from the laminate. The first electrode 60 and the second electrode 70 are located at the two ends of the inductor 33 and are respectively connected to the first conductive layer 10 and the second conductive layer 50.
[0058] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0059] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. An embedded component, characterized in that, The device includes a first conductive layer (10), a first outer insulating layer (20), and a laminate, which are stacked sequentially. The laminate includes at least one core plate (31) and at least one heat sink (32). The laminate has a receiving hole arranged along the stacking direction. The receiving hole is used to receive an inductor (33). The end of the inductor (33) along the stacking direction is electrically connected to the first conductive layer (10).
2. The embedded component according to claim 1, characterized in that, There are multiple core plates (31) and heat sinks (32), and the core plates (31) and heat sinks (32) are arranged in an alternating manner.
3. The embedded component according to claim 1, characterized in that, The laminate also includes a first insulating dielectric layer (34) filled between the core plate (31) and the heat sink (32).
4. The embedded component according to claim 3, characterized in that, The heat sink (32) is a heat dissipation layer. The receiving hole includes a first hole (311) on the core plate (31), a second hole (321) on the heat dissipation layer, and a third hole (341) on the first insulating dielectric layer (34). The gap between the inductor (33) and the first hole (311), the second hole (321), and the third hole (341) is filled with a second insulating dielectric layer (35).
5. The embedded component according to claim 4, characterized in that, The dimensions of the first hole (311), the second hole (321), and the third hole (341) are larger than the dimensions of the inductor (33), and the second insulating dielectric layer (35) fills the gaps in the inner wall of the first hole (311), the inner wall of the second hole (321), the inner wall of the third hole (341), and the outer wall of the inductor (33).
6. The embedded component according to claim 3, characterized in that, The heat sink (32) is welded to the outer wall of the inductor (33) or the heat sink (32) and the inductor (33) are integrally formed; and the receiving hole includes a first hole (311) on the core plate (31) and a third hole (341) on the first insulating dielectric layer (34); wherein the size of the first hole (311) is larger than the size of the inductor (33), the size of the third hole (341) is equal to the size of the inductor (33), and the gap between the inner wall of the first hole (311) and the outer wall of the inductor (33) is filled with a second insulating dielectric layer (35); or, The size of the first hole (311) and the third hole (341) is larger than the size of the inductor (33), and the gap between the inner wall of the first hole (311), the inner wall of the third hole (341) and the outer wall of the inductor (33) is filled with a second insulating dielectric layer (35).
7. The embedded component according to claim 1, characterized in that, There are multiple heat sinks (32), which are arranged at intervals around the outer contour of the inductor (33).
8. The embedded component according to claim 7, characterized in that, The laminate is provided with a plurality of receiving holes spaced apart, and the heat sink (32) of two adjacent inductors (33) facing each other is shared.
9. The embedded component according to any one of claims 1-8, characterized in that, The embedded component further includes a second outer insulating layer (40), a second conductive layer (50), a first electrode (60), and a second electrode (70); wherein, The first electrode (60) and the second electrode (70) are located at both ends of the inductor (33), and the two ends of the first electrode (60) are respectively connected to the inductor (33) and the first conductive layer (10), and the two ends of the second electrode (70) are respectively connected to the inductor (33) and the second conductive layer (50); or, The first electrode (60) and the second electrode (70) are located at one end of the inductor (33), and one end of the first electrode (60) and the second electrode (70) are connected to the inductor (33), and the other end is connected to one of the first conductive layer (10) or the second conductive layer (50).
10. The embedded component according to claim 1, characterized in that, A heat dissipation device (80) is provided on the side of the laminate away from the inductor (33); and / or, an electronic component (90) is provided on the side of the first conductive layer (10) away from the laminate.