High-temperature-resistant and easy-to-attach heat-conducting silica gel gasket

Abstract

The utility model relates to the technical field of silica gel gaskets, in particular to a high-temperature-resistant easily-attached heat-conducting silica gel gasket which comprises a positioning unit arranged on the outer side of an electronic device in a surrounding mode, and a body attached to the surface of the electronic device is arranged on the inner side of the positioning unit. The positioning unit comprises at least four positioning angle blocks, the four positioning angle blocks are arranged at the four corners of the electronic device respectively, every two positioning angle blocks are fixedly connected through two connecting arms and a middle arm, one ends of the two connecting arms are fixedly connected with the two positioning angle blocks respectively, and the other ends of the two connecting arms are movably connected into the middle arms. The high-temperature-resistant and easy-to-attach heat-conducting silica gel gasket can realize positioning when the body is attached, effectively avoids the problem that the service life of an electronic device is affected due to the fact that the body is attached obliquely, has the advantage of being easy to attach, is adjustable in overall size of the positioning unit, can adapt to the attaching work of bodies of different sizes, can tear off the upper patch and the lower patch together, and is convenient to use. And the use is more convenient.

Description

Technical Field

[0001] This utility model relates to the field of silicone pad technology, specifically a high-temperature resistant and easy-to-adhere thermally conductive silicone pad. Background Technology

[0002] Thermally conductive silicone pads are thermally conductive media materials synthesized through a special process using silicone as the base material and adding various auxiliary materials such as metal oxides. In the industry, they are also known as thermally conductive silicone mats, thermally conductive silicone sheets, and flexible thermal pads, etc. Existing thermally conductive silicone pads, due to their inherent adhesiveness, are typically applied directly to electronic components. However, due to a lack of positioning, these pads are prone to misalignment during application. This misalignment creates areas where the thermally conductive silicone pad is not in contact with the electronic components, causing heat to accumulate in these areas. This hinders the timely dissipation of heat from the electronic components and can reduce their lifespan. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a high-temperature resistant and easily bondable thermally conductive silicone pad, solving the technical problem of lack of positioning during the bonding process of thermally conductive silicone pads.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a high-temperature resistant and easy-to-adhere thermally conductive silicone pad, including a positioning unit surrounding the outside of an electronic device, and a body adhering to the surface of the electronic device on the inner side of the positioning unit;

[0005] The positioning unit includes at least four positioning corner blocks, which are respectively placed at the four corners of the electronic device. Each pair of positioning corner blocks is connected and fixed by two connecting arms and one intermediate arm. One end of each connecting arm is fixedly connected to the two positioning corner blocks, and the other end is movably connected inside the intermediate arm.

[0006] Preferably, the positioning corner block is "L" shaped, and the top of the inner side of the positioning corner block is provided with two adjacent inner inclined surfaces.

[0007] Preferably, the bottom of the positioning corner block is provided with a support protrusion extending downward.

[0008] Preferably, screws are threaded onto the sidewalls of the intermediate arm near both ends.

[0009] Preferably, the top and bottom of the body are respectively fitted with an upper patch and a lower patch of the same size as the body.

[0010] Preferably, one end of the upper patch and the lower patch are connected by a connecting piece, and the other end of the upper patch is connected by a pull tab.

[0011] By employing the above technical solution, this utility model provides a high-temperature resistant and easily bondable thermally conductive silicone pad, which has at least the following beneficial effects:

[0012] 1. This high-temperature resistant and easy-to-apply thermally conductive silicone pad, by setting a positioning unit and using the positioning corner blocks to restrict the body, limits the body from four sides when applying it, so that the body can be completely attached to the surface of the electronic device. It can realize the positioning of the body during the application process, effectively avoiding the problem of the body being misaligned and affecting the service life of the electronic device. It has the advantage of easy application, and the overall size of the positioning unit is adjustable, which can adapt to the application of bodies of different sizes.

[0013] 2. This high-temperature resistant and easy-to-adhere thermally conductive silicone pad features an upper and lower adhesive patch. Due to the adhesive nature of the pad itself, the upper and lower patches protect both sides of the pad, preventing dust or foreign objects from adhering to it. Furthermore, with the help of the connecting and pulling tabs, the upper and lower patches can be easily peeled off together by pulling the pull tab, making it more convenient to use. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application:

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention when the main body is attached;

[0016] Figure 2 This is a schematic diagram of the structure of the main body of this utility model;

[0017] Figure 3 This is a schematic diagram of the positioning unit of this utility model;

[0018] Figure 4 This is a schematic diagram of the positioning corner block of this utility model;

[0019] Figure label:

[0020] 1. Positioning unit; 101. Positioning corner block; 1011. Inner bevel; 1012. Support protrusion; 102. Connecting arm; 103. Intermediate arm; 104. Screw; 2. Body; 201. Upper patch; 202. Lower patch; 203. Connecting piece; 204. Pull piece. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Thermally conductive silicone pads are manufactured specifically for heat transfer through gaps. They can fill gaps, open up thermal channels between heat-generating and heat-dissipating parts, effectively improve heat transfer efficiency, and also play a role in insulation, shock absorption, and sealing. They can meet the design requirements of miniaturization and ultra-thinness of equipment. They are highly processable and usable, and have a wide range of applicable thicknesses, making them an excellent thermally conductive filling material.

[0023] Due to the technical deficiency of existing technologies in lack of positioning during bonding, please refer to... Figures 1-4 This utility model provides a high-temperature resistant and easily adhered thermally conductive silicone pad. When adhering to the body 2, the positioning unit 1 limits the body 2 from four sides, allowing the body 2 to fully adhere to the surface of the electronic device. This achieves positioning of the body 2 during adhering, effectively avoiding the problem of the body 2 being misaligned and affecting the service life of the electronic device. It has the advantage of easy adhering. The pad includes a positioning unit 1 surrounding the outside of the electronic device, and a body 2 adhering to the surface of the electronic device is located on the inner side of the positioning unit 1. Furthermore, the positioning unit 1 includes at least four positioning corner blocks 101, and the four positioning corner blocks 101 are respectively placed at the four corners of the electronic device. Each pair of positioning corner blocks 101 is connected and fixed by two connecting arms 102 and one intermediate arm 103. One end of each connecting arm 102 is fixed to the two positioning corner blocks 101, and the other end is movably connected to the intermediate arm 103. In use, first adjust the positioning unit 1 to the same size as the electronic device, then place the positioning unit 1 along the outer edge of the electronic device to ensure that the positioning unit 1 is in contact with the surface of the electronic device. Then keep the positioning unit 1 still and insert one end of the body 2 along one side inside the positioning unit 1. After gradually lowering the body 2, the body 2 can be completely in contact with the surface of the electronic device.

[0024] Furthermore, when placing the main body 2, in order to ensure that one end of the main body 2 can accurately enter the inside of the positioning unit 1, the positioning corner block 101 is L-shaped, and the top of the inside of the positioning corner block 101 is provided with two adjacent inner inclined surfaces 1011; the inner inclined surfaces 1011 guide one side of the main body 2. When the main body 2 is placed, under the guidance of the inner inclined surfaces 1011, the main body 2 can smoothly slide into the positioning unit 1 and fit with the electronic device.

[0025] Furthermore, since the electronic components have a certain thickness, in order to ensure the stability of the positioning unit 1 after placement, a support protrusion 1012 extending downward is provided at the bottom of the positioning corner block 101; the support protrusion 1012 contacts the circuit board, thereby supporting the positioning unit 1.

[0026] Furthermore, after the size of the positioning unit 1 is adjusted, in order to prevent the size of the positioning unit 1 from changing, screws 104 are threadedly connected to the side walls of the intermediate arm 103 near both ends; the connecting arm 102 and the intermediate arm 103 are fixed by the screws 104, so that the positioning unit 1 will remain unchanged when it is attached to the body 2 later.

[0027] Since the main body 2 is adhesive, dust or impurities may adhere to the surface and bottom of the main body 2 before use, which may affect the complete adhesion between the main body 2 and the electronic device. To address this issue, an upper patch 201 and a lower patch 202 of the same size as the main body 2 are respectively attached to the top and bottom of the main body 2. The upper patch 201 and the lower patch 202 are used to protect both sides of the main body 2 to prevent dust or foreign objects from adhering to it.

[0028] Furthermore, after the upper patch 201 and the lower patch 202 are provided on the surface and bottom surface of the main body 2, removing the upper patch 201 and the lower patch 202 requires two processes, which is inconvenient to use. To address this issue, one end of the upper patch 201 and the lower patch 202 are connected by a connecting piece 203, and the other end of the upper patch 201 is connected to a pull tab 204. Under the action of the connecting piece 203 and the pull tab 204, the upper patch 201 and the lower patch 202 can be peeled off together by pulling the pull tab 204, which only requires one process to remove them all, making it more convenient to use.

[0029] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-temperature resistant, easily bondable, thermally conductive silicone pad, characterized in that: It includes a positioning unit (1) surrounding the outside of the electronic device, and a body (2) attached to the surface of the electronic device is provided on the inner side of the positioning unit (1). The positioning unit (1) includes at least four positioning corner blocks (101), and the four positioning corner blocks (101) are respectively placed at the four corners of the electronic device. Each pair of positioning corner blocks (101) is connected and fixed by two connecting arms (102) and an intermediate arm (103). One end of the two connecting arms (102) is fixedly connected to the two positioning corner blocks (101) respectively, and the other end is movably connected in the intermediate arm (103).

2. The high-temperature resistant and easily bondable thermally conductive silicone pad according to claim 1, characterized in that: The positioning corner block (101) is "L" shaped, and the top of the inner side of the positioning corner block (101) is provided with two adjacent inner inclined surfaces (1011).

3. The high-temperature resistant and easily bondable thermally conductive silicone pad according to claim 1, characterized in that: The bottom of the positioning corner block (101) is provided with a support protrusion (1012) extending downward.

4. The high-temperature resistant and easily bondable thermally conductive silicone pad according to claim 1, characterized in that: The intermediate arm (103) has screws (104) threaded onto the side walls near both ends.

5. The high-temperature resistant and easily bondable thermally conductive silicone pad according to claim 1, characterized in that: The top and bottom of the body (2) are respectively fitted with an upper patch (201) and a lower patch (202) of the same size as the body (2).

6. The high-temperature resistant and easily bondable thermally conductive silicone pad according to claim 5, characterized in that: One end of the upper patch (201) and the lower patch (202) are connected by a connecting piece (203), and the other end of the upper patch (201) is connected to a pull piece (204).

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