Semiconductor process device

Abstract

The utility model provides a semiconductor process device, which comprises a cup-shaped cover body surrounding a wafer base, and the inner wall of the cup-shaped cover body is a hydrophilic and hydrophobic reversible layer; the ultraviolet light source is used for changing the hydrophilic and hydrophobic characteristics of the hydrophilic and hydrophobic reversible layer, and the wafer base is used for placing a wafer to be processed. According to the utility model, the inner wall of the cup-shaped cover body is the hydrophilic and hydrophobic reversible layer, and the inner wall of the cup-shaped cover body is hydrophilic when the inner wall of the cup-shaped cover body is prevented from being splashed back to a wafer to be processed on a wafer base in cooperation with the control and change of the hydrophilic and hydrophobic properties of the hydrophilic and hydrophobic reversible layer by the ultraviolet light source, so that the anti-splashing effect is improved. The yield and the performance reliability of the wafer to be processed are improved; meanwhile, when the inner wall of the cup-shaped cover body is self-cleaned, hydrophobicity is achieved, and the self-cleaning effect of the cup-shaped cover body is improved; in addition, relative lifting between the cup-shaped cover body and the wafer base is driven by the lifting driving structure, so that the ultraviolet light source can be close to each position of the inner wall of the cup-shaped cover body to obtain a uniform hydrophilic-hydrophobic property change effect.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor equipment, and in particular relates to a semiconductor process apparatus. Background Technology

[0002] Wet cleaning is a crucial step in semiconductor manufacturing, primarily aimed at removing impurities and residues generated during upstream processes. In the wet cleaning process of wafers, the cleaning solution ejected from the wafer surface is collected or drained through a hydrophobic cup-shaped shield around the wafer's outer edge.

[0003] For a long time, the final step in wet wafer cleaning has required drying the wafer, typically by rapidly rotating it until the surface is dry. However, during rapid wafer rotation, the cleaning fluid forms high-speed droplets that bounce off the inner wall of a hydrophobic cup-shaped shroud, splashing onto the wafer surface. Over time, accumulated cleaning fluid residue or a deteriorating internal environment can create contaminants on the inner wall of the cup-shaped shroud. These contaminants then fall back onto the wafer surface with the splashed cleaning fluid droplets, causing contamination.

[0004] In existing technologies, one method is to replace rotary drying with isopropanol drying to avoid backsplashing of cleaning fluid caused by rotation. However, since organic reagents need to be introduced for drying, the cleaning effect is affected by the quality of the reagents. Furthermore, isopropanol drying is costly and harmful to the human body, making it an undesirable wafer drying method. Another method is to install a gas protection ring on the top of the lifting cup-shaped shroud, thereby supplying gas from the inside of the gas protection ring to form a gas protection layer, causing the backsplashed liquid to change direction and fall back onto the inner wall of the lifting cup-shaped shroud. Although the gas protection ring can prevent liquid from backsplashing onto the wafer surface, it will generate turbulent airflow above the wafer, which may blow contaminants from the internal environment onto the wafer surface.

[0005] Therefore, there is an urgent need for a structure that can prevent liquid from splashing back onto the wafer surface from the inner wall of the cup-shaped cover without introducing additional deteriorating factors.

[0006] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating the understanding of those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because these solutions have been described in the background section of this application. Utility Model Content

[0007] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a semiconductor process apparatus to solve the problem of liquid splashing from the inner wall of the cup-shaped cover onto the wafer surface and contaminating the wafer product in the prior art.

[0008] To achieve the above and other related objectives, this utility model provides the following technical solution:

[0009] This utility model provides a semiconductor process apparatus, which includes: a cup-shaped cover body, a wafer base, and a controllable switchable ultraviolet light source;

[0010] The cup-shaped cover body is a cup-shaped outer shell surrounding the wafer base, and the inner wall of the cup-shaped cover body is a hydrophilic-hydrophobic reversible layer; the hydrophilic-hydrophobic reversible layer is a combination material of TiO2 and polydimethylsiloxane, or the hydrophilic-hydrophobic reversible layer is a combination material of ZnO2 and polyurethane; the ultraviolet light source is used to change the hydrophilic-hydrophobic properties of the hydrophilic-hydrophobic reversible layer, and the wafer base is used to place the wafer to be processed.

[0011] Optionally, the hydrophilic-hydrophobic reversible layer is a modification coating or a plasma-treated layer.

[0012] Optionally, the ultraviolet light source is a structure that surrounds the sidewall of the wafer base.

[0013] Optionally, the semiconductor process apparatus further includes a first lifting drive structure, wherein the ultraviolet light source is located on the side wall of the wafer base, and the first lifting drive structure is used to drive the cup-shaped cover body to move up and down relative to the wafer base.

[0014] Optionally, the semiconductor process apparatus further includes a second lifting drive structure, wherein the ultraviolet light source is located on the side wall of the wafer base, and the second lifting drive structure is used to drive the wafer base to move up and down relative to the cup-shaped cover body.

[0015] Optionally, the semiconductor process apparatus is an integrated device that is any one or more of the following: wet cleaning equipment, photoresist spin coating equipment, photoresist edge washing equipment, or photoresist developing equipment.

[0016] Optionally, when the semiconductor process apparatus is a wet cleaning device, the semiconductor process apparatus further includes a cup-shaped cover self-cleaning structure.

[0017] Optionally, the cup-shaped self-cleaning structure is a cleaning nozzle fixed to the surface of the wafer base.

[0018] Optionally, the semiconductor process apparatus includes m cup-shaped cover bodies, where m is a positive integer greater than or equal to 2; each cup-shaped cover body concentrically surrounds the wafer base, and each cup-shaped cover body can move up and down relative to each other; the inner wall of each cup-shaped cover body is a preset corresponding hydrophilic-hydrophobic reversible layer.

[0019] Optionally, the semiconductor process apparatus includes n first lifting drive structures, where n is a positive integer less than or equal to m; each of the first lifting drive structures is used to drive the lifting motion of one of the cup-shaped cover bodies relative to the wafer base.

[0020] As described above, the semiconductor process apparatus of this invention has the following beneficial effects:

[0021] This invention features a reversible hydrophilic-hydrophobic layer on the inner wall of a cup-shaped cover. By using an ultraviolet light source to control and alter the hydrophilic-hydrophobic properties of this layer, the inner wall of the cup-shaped cover can be hydrophilic when splash prevention is required. During the spin-drying process of wafer cleaning, splashed droplets are quickly guided away along the hydrophilic coating surface, preventing contaminants on the inner wall of the cup-shaped cover from splashing back onto the wafers on the wafer base, thus improving the yield and reliability of the wafers. Simultaneously, during self-cleaning of the inner wall of the cup-shaped cover, the reversible hydrophilic-hydrophobic layer can be changed to hydrophobic, enhancing the self-cleaning effect of the cup-shaped cover itself. This ensures both the self-cleaning effect of the cup-shaped cover and the cleaning effect of the wafers being processed.

[0022] This invention uses a controllable switchable ultraviolet light source, which can change the hydrophilic and hydrophobic properties of the hydrophilic-hydrophobic reversible layer by switching the ultraviolet light source on and off and adjusting its brightness. The adjustment method is simple and convenient, and it is not likely to have additional impact on the structure inside the semiconductor process device, thus having good reliability.

[0023] This utility model utilizes a first lifting drive structure to drive the cup-shaped cover body, realizing the relative lifting motion between the wafer base and the cup-shaped cover body, so that the ultraviolet light source can approach various positions on the inner wall of the cup-shaped cover body, so as to obtain the uniform hydrophilicity and hydrophobicity change effect of the ultraviolet light source on the cup-shaped cover body.

[0024] This invention utilizes a second lifting drive structure to drive the wafer base, thereby achieving relative lifting motion between the wafer base and the cup-shaped cover body. This allows the ultraviolet light source to approach various positions on the inner wall of the cup-shaped cover body, resulting in a uniform hydrophilicity / hydrophobicity change effect of the ultraviolet light source on the cup-shaped cover body.

[0025] This invention, by setting multiple cup-shaped cover bodies, allows different cup-shaped cover bodies to be used for recycling different process reagents, thereby avoiding reactions between different reagents or affecting each other's recycling cleanliness, improving the feasibility of reagent recycling, and also increasing the service life of the cup-shaped cover bodies.

[0026] In this invention, the cup-shaped cover self-cleaning structure is used as a cleaning structure for self-cleaning the cup-shaped cover body. Therefore, by setting the cup-shaped cover self-cleaning structure to be fixed on the surface of the wafer base, the cleaning liquid for cleaning the cup-shaped cover body can be sprayed from the surface of the wafer base onto the inner wall of the cup-shaped cover body, thereby achieving self-cleaning of the inner wall of the cup-shaped cover body. Attached Figure Description

[0027] Figure 1 This diagram illustrates the bounce of a high-speed droplet when it impacts a hydrophobic cup-shaped cover in the prior art.

[0028] Figure 2 This diagram illustrates how high-speed droplets bounce off a hydrophobic cup-shaped cover and contaminate the wafer in existing technologies.

[0029] Figure 3 The diagram shown is a schematic diagram of the semiconductor process apparatus of this utility model.

[0030] Figure 4 The diagram shows the effect of the cup-shaped cover body of the semiconductor process apparatus of this invention on droplets when it is hydrophilic.

[0031] Figure 5 The diagram shows the effect of the cup-shaped cover body of the semiconductor process apparatus of this invention on droplets when it is hydrophobic.

[0032] Figure 6 The diagram shown is a schematic representation of an example of a semiconductor process apparatus of this invention using an ultraviolet light source.

[0033] Figure 7 The diagram shown is a schematic representation of a semiconductor process apparatus according to this invention, including multiple cup-shaped cover bodies.

[0034] Figure 8 The diagram shows a structure in which the inner wall of the cup-shaped cover is hydrophilic when the semiconductor process apparatus of this invention is a wet cleaning device.

[0035] Figure 9 The diagram shows a structure in which the inner wall of the cup-shaped cover is hydrophobic when the semiconductor process apparatus of this invention is a wet cleaning device.

[0036] Figure 10 The diagram shows the structure of the semiconductor process apparatus of this utility model when it is a photoresist spin coating device.

[0037] Figure 11 The diagram shows the structure of the semiconductor process apparatus of this utility model when it is a photoresist edge washing device.

[0038] Figure 12The diagram shows the structure of the semiconductor process apparatus of this invention when it is a photoresist developing device.

[0039] Figure 13 The diagram shown illustrates the structure of the semiconductor process apparatus of this invention, which includes multiple cup-shaped cover bodies that can be raised and lowered relative to each other.

[0040] Figure 14 The diagram shown illustrates the structure of the semiconductor process apparatus of this invention, which includes multiple cup-shaped cover bodies that can be raised and lowered relative to each other.

[0041] Component designation explanation

[0042] 10. Hydrophobic cup-shaped cover; 11. Cleaning fluid; 12. Wafer; 13. Wafer base; 14. Contamination; 15. Droplet; 16. Hydrophobic interface; 17. Hydrophilic interface;

[0043] 20. Cup-shaped cover body; 21. Hydrophilic-hydrophobic reversible layer; 22. Ultraviolet light source; 23. Ultraviolet lamp strip; 24. Cup-shaped cover self-cleaning structure;

[0044] 31. Solvent nozzle; 32. Photoresist; 33. Edge cleaning solution; 34. Developer; 35. Photoresist layer. Detailed Implementation

[0045] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0046] In the detailed description of the embodiments of this utility model, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0047] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the accompanying drawings for devices in use or operation.

[0048] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are formed in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0049] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0050] During the wet cleaning process of wafer 12, the cleaning fluid 11 ejected from the surface of wafer 12 is collected or drained through the hydrophobic cup-shaped cover on the outer ring of wafer 12. The final step in the wet cleaning process of wafer 12 requires drying, commonly achieved by rapidly rotating wafer 12 until its surface is dry. However, during rapid rotation of wafer 12, the cleaning fluid 11 forms high-speed droplets 15, which... Figure 1 As shown, in the prior art, the hydrophobic cup-shaped cover 10 has hydrophobic materials (such as PTFE) on both its inner and outer surfaces to quickly remove the cleaning fluid 11. This causes high-speed droplets 15 to easily bounce off the inner wall of the hydrophobic cup-shaped cover 10 (the arrow in the figure shows the trajectory of the high-speed droplets 15 bouncing off), thus splashing onto the surface of the wafer 12. Long-term accumulation of cleaning fluid 11 residue or deterioration of the internal environment will form contaminants 14 on the inner wall of the cup-shaped cover. These contaminants 14 will fall back onto the surface of the wafer 12 along with the splashed droplets 15 of the cleaning fluid 11, thus... Figure 2 As shown, contaminant 14 is formed on the surface of wafer 12. In the prior art, the backsplatter of cleaning liquid 11 caused by rotation can be avoided by changing the spin drying to isopropanol drying, but organic reagents need to be introduced for drying, the cleaning effect is affected by the quality of the reagents, and isopropanol drying is expensive and harmful to the human body, so it is not ideal; while installing a gas protection ring on the top of the lifting cup-shaped cover can supply gas from the inside of the gas protection ring to form a gas protection layer, so that the backsplattered liquid changes direction and falls back to the inner wall of the lifting cup-shaped cover, but it will generate turbulent airflow above wafer 12, which poses a risk of blowing contaminant 14 from the internal environment onto the surface of wafer 12.

[0051] This utility model provides a semiconductor process apparatus, such as... Figure 3 As shown, the semiconductor process apparatus includes: a cup-shaped cover body 20, a wafer base 13, and a controllable ultraviolet light source 22;

[0052] The cup-shaped cover body 20 is a cup-shaped outer shell surrounding the wafer base 13. The inner wall of the cup-shaped cover body 20 is a hydrophilic-hydrophobic reversible layer 21. The hydrophilic-hydrophobic reversible layer 21 is a combination material of TiO2 and polydimethylsiloxane (PDMS), or the hydrophilic-hydrophobic reversible layer 21 is a combination material of ZnO2 and polyurethane (PU). The ultraviolet light source 22 is used to change the hydrophilic-hydrophobic properties of the hydrophilic-hydrophobic reversible layer 21. The wafer base 13 is used to place the wafer 12 to be processed.

[0053] This invention, by setting the inner wall of the cup-shaped cover body 20 as a hydrophilic-phobic reversible layer 21, and using an ultraviolet light source 22 to control and change the hydrophilic-phobic properties of the hydrophilic-phobic reversible layer 21, allows the inner wall of the cup-shaped cover body 20 to be hydrophilic when splash prevention is required, thus enabling it to... Figure 4 As shown, the droplets 15 reaching the hydrophilic interface 17 spread out, preventing them from... Figure 5 The contaminants on the inner wall of the cup-shaped cover body 20 bounce off the conventionally used hydrophobic interface 16 as droplets 15, thus splashing back onto the wafer 12 to be processed on the wafer base 13, improving the yield and performance reliability of the wafer 12 to be processed. At the same time, during the self-cleaning of the inner wall of the cup-shaped cover body 20, the hydrophilic-hydrophobic reversible layer 21 can be changed to hydrophobicity to improve the self-cleaning effect of the cup-shaped cover body 20, thereby ensuring both the self-cleaning effect of the cup-shaped cover body 20 and the cleaning effect of the wafer 12 to be processed. Furthermore, by using a controllable switchable ultraviolet light source 22, the hydrophilic-hydrophobic properties of the hydrophilic-hydrophobic reversible layer 21 can be changed by switching the ultraviolet light source 22 on and off and adjusting its brightness. The adjustment method is simple and convenient, and it is unlikely to have additional impact on the structure within the semiconductor process device, thus having good reliability.

[0054] Preferably, the ultraviolet light source 22 can be adjusted so that when the hydrophilic-hydrophobic reversible layer 21 is hydrophilic, a superhydrophilic interface 17 is formed, and when it is hydrophobic, a superhydrophobic interface 16 is formed, so as to simultaneously optimize the cleaning effect of the cup-shaped cover body 20 on the wafer 12 and the self-cleaning effect of the cup-shaped cover.

[0055] Specifically, the hydrophilic-hydrophobic reversible layer 21 in this utility model is a known material with hydrophilic-hydrophobic reversible properties in the prior art. It is not a modification of the material, but rather an improvement on the technical effect that the cup-shaped cover body 20 can achieve as a structure by using existing materials with hydrophilic-hydrophobic reversible properties on the inner wall of the cup-shaped cover body 20 which has a self-cleaning anti-splash problem.

[0056] In one embodiment, the hydrophilic-hydrophobic reversible layer 21 is a modification coating or a plasma-treated layer.

[0057] Specifically, the hydrophilic-hydrophobic reversible layer 21 can also be provided by other suitable methods to obtain the inner wall surface of the cup-shaped cover body 20 with hydrophilic-hydrophobic reversible properties, all of which are within the protection scope of this utility model.

[0058] Specifically, the hydrophilic-hydrophobic reversible layer 21 can also be other materials with hydrophilic-hydrophobic reversible properties, all of which are within the protection scope of this utility model.

[0059] In one embodiment, the ultraviolet light source 22 is a structure that surrounds the sidewall of the wafer base 13.

[0060] This invention improves the speed and uniformity of the ultraviolet light source 22 in adjusting the hydrophilic and hydrophobic properties of the hydrophilic and hydrophobic reversible layer 21 by setting an ultraviolet light source 22 around and fixed to the side wall of the wafer base 13.

[0061] In one embodiment, such as Figure 6 As shown, the ultraviolet light source 22 is an ultraviolet lamp strip 23 surrounding the surface of the wafer base 13.

[0062] Specifically, the ultraviolet light source 22 can also be other suitable distribution shapes or distribution locations, all of which are within the protection scope of this utility model.

[0063] Specifically, the ultraviolet light source 22 can also be other stimulation sources that can control the hydrophilic and hydrophobic properties of the hydrophilic and hydrophobic reversible layer 21, such as temperature treatment, chemical reagents, etc., to control the response of the hydrophilic and hydrophobic reversible layer 21. However, these stimulation sources are likely to affect the temperature conditions, structural corrosion resistance, and chemical properties of the working environment required by the semiconductor process device itself, making it difficult to meet the application requirements in the semiconductor process device. However, appropriate stimulation sources can be selected according to the requirements to control the hydrophilic and hydrophobic properties of the hydrophilic and hydrophobic reversible layer 21 in the semiconductor process device, all of which are within the protection scope of this utility model.

[0064] In one embodiment, the semiconductor process apparatus further includes a first lifting drive structure, wherein the ultraviolet light source 22 is located on the side wall of the wafer base 13, and the first lifting drive structure is used to drive the cup-shaped cover body 20 to move up and down relative to the wafer base 13.

[0065] This invention utilizes a first lifting drive structure to drive the cup-shaped cover body 20, thereby achieving relative lifting motion between the wafer base 13 and the cup-shaped cover body 20. This allows the ultraviolet light source 22 to approach various positions on the inner wall of the cup-shaped cover body 20, resulting in a uniform hydrophilicity / hydrophobicity change effect of the ultraviolet light source 22 on the cup-shaped cover body 20.

[0066] In one embodiment, the semiconductor process apparatus further includes a second lifting drive structure, wherein the ultraviolet light source 22 is located on the side wall of the wafer base 13, and the second lifting drive structure is used to drive the wafer base 13 to move up and down relative to the cup-shaped cover body 20.

[0067] This invention utilizes a second lifting drive structure to drive the wafer base 13, thereby achieving relative lifting movement between the wafer base 13 and the cup-shaped cover body 20. This allows the ultraviolet light source 22 to approach various positions on the inner wall of the cup-shaped cover body 20, resulting in a uniform hydrophilicity / hydrophobicity change effect of the ultraviolet light source 22 on the cup-shaped cover body 20.

[0068] In one embodiment, the semiconductor process apparatus may also include both the first lifting drive structure and the second lifting drive structure to enable flexible and rapid relative lifting motion between the wafer base 13 and the cup-shaped cover body 20, thereby increasing the speed at which the hydrophilicity and hydrophobicity of the cup-shaped cover body 20 can be changed.

[0069] In one embodiment, such as Figure 7 As shown, the semiconductor process apparatus includes m cup-shaped cover bodies 20, where m is a positive integer greater than or equal to 2; each cup-shaped cover body 20 concentrically surrounds the wafer base 13, and each cup-shaped cover body 20 can move relative to each other; the inner wall of each cup-shaped cover body 20 is a preset corresponding hydrophilic and hydrophobic reversible layer 21.

[0070] By setting multiple cup-shaped cover bodies 20, this utility model allows different cup-shaped cover bodies 20 to be used to recycle different process reagents, thereby avoiding reactions between different reagents or mutual interference with each other's recycling cleanliness, improving the feasibility of reagent recycling, and also increasing the service life of the cup-shaped cover body 20.

[0071] In one embodiment, the semiconductor process apparatus includes n first lifting drive structures, where n is a positive integer less than or equal to m; each of the first lifting drive structures is used to drive the lifting motion of one of the cup-shaped cover bodies 20 relative to the wafer base 13.

[0072] Preferably, each of the cup-shaped cover bodies 20 has a corresponding first lifting drive structure, where m = n.

[0073] This invention improves the flexibility of use when using multiple cup-shaped cover bodies 20 by allowing each cup-shaped cover body 20 to be individually raised and lowered.

[0074] In one embodiment, such as Figures 8-9 As shown, the semiconductor process apparatus is a wet cleaning system. Specifically, Figure 8 In order to perform high-speed rotational self-cleaning on the wafer 12 to be processed, the ultraviolet light source 22 controls the hydrophilic and hydrophobic reversible layer 21 to be a hydrophilic interface 17, so that the droplets 15 splashed onto the inner wall of the cup-shaped cover body 20 are spread out. Figure 9When the cup-shaped cover body 20 is self-cleaning, the ultraviolet light source 22 controls the hydrophilic-hydrophobic reversible layer 21 to be a hydrophobic interface 16, so that the droplets 15 splashed onto the inner wall of the cup-shaped cover body 20 are quickly guided away.

[0075] In one embodiment, such as Figure 10 As shown, the semiconductor process apparatus is a photoresist spin coating device. Specifically, the photoresist spin coating device includes a solvent nozzle 31, which can use photoresist liquid 32 to spin coat the wafer 12 to be processed to form a photoresist layer 35.

[0076] In one embodiment, such as Figure 11 As shown, the semiconductor process apparatus is a photoresist edge cleaning device. Specifically, the photoresist edge cleaning device includes a solvent nozzle 31, which can be used to clean the edge of the wafer 12 after the photoresist layer 35 has been formed using an edge cleaning solution 33.

[0077] In one embodiment, such as Figure 12 As shown, the semiconductor process apparatus is a photoresist developing apparatus. Specifically, the photoresist developing apparatus includes a solvent nozzle 31, which can develop the photoresist layer 35 formed on the wafer 12 to be processed using a developing solution 34.

[0078] In one embodiment, when the semiconductor process apparatus is a wet cleaning device, the cup-shaped cover body 20 is used to recover the cleaning solution 11 used to clean the wafer 12 after wet cleaning; when the semiconductor process apparatus is a photoresist spin coating device, the cup-shaped cover body 20 is used to recover the photoresist spin coating solution used by the photoresist spin coating device; when the semiconductor process apparatus is a photoresist edge washing device, the cup-shaped cover body 20 is used to recover the cleaning solution 11 used to clean the wafer 12 after edge removal by the photoresist edge washing device; when the semiconductor process apparatus is a photoresist developing device, the cup-shaped cover body 20 is used to recover the cleaning solution 11 used to clean the wafer 12 after developing by the photoresist developing device.

[0079] Specifically, the semiconductor process apparatus can also be any other semiconductor process equipment that requires the cup-shaped cover body 20 to recover or guide process reagents to prevent them from splashing back onto the surface of the wafer 12, all of which are within the protection scope of this utility model.

[0080] In one embodiment, the semiconductor process apparatus is an integrated device of a photoresist spin coating apparatus, a photoresist edge washing apparatus, or a photoresist developing apparatus.

[0081] In one embodiment, when the semiconductor process apparatus is an integrated device of photoresist spin coating equipment, photoresist edge washing equipment, or photoresist developing equipment, the photoresist spin coating, photoresist edge washing, and photoresist developing processes may be performed in the same process chamber. In this case, multiple cup-shaped cover bodies 20 concentrically surrounding the wafer base 13 can be provided, such as... Figures 13-14As shown, different cup-shaped cover bodies 20 can achieve relative lifting and lowering movements through their respective corresponding lifting drive structures, so that each cup-shaped cover body 20 can be exposed in the corresponding process step as needed to recover the corresponding process reagent of the corresponding process step; the inner wall of each cup-shaped cover body 20 is selected from the material of the hydrophilic-hydrophobic reversible layer 21 that does not react with the corresponding process reagent according to the different process reagents to be recovered, so that the corresponding cup-shaped cover body 20 can be used to recover the corresponding process reagent when recovering different process reagents.

[0082] Specifically, Figure 13 The diagram shown is a schematic representation of the position of the topmost cup-shaped cover body 20 relative to the other cup-shaped cover bodies 20 after it has been raised. Figure 14 The diagram shown shows all three cup-shaped cover bodies 20 in their lowest positions. The cup-shaped cover bodies 20 can be arranged in other suitable positions as needed, all of which are within the protection scope of this utility model.

[0083] In one embodiment, when the semiconductor process apparatus is a wet cleaning device, the semiconductor process apparatus further includes a cup-shaped self-cleaning structure 24.

[0084] In one embodiment, the cup-shaped self-cleaning structure 24 is a cleaning nozzle fixed to the surface of the wafer base 13.

[0085] In this invention, the cup-shaped cover self-cleaning structure 24 is used as a cleaning structure for self-cleaning the cup-shaped cover body 20. Therefore, by setting the cup-shaped cover self-cleaning structure 24 to be fixed on the surface of the wafer base 13, the cleaning liquid 11 used to clean the cup-shaped cover body 20 can be sprayed from the surface of the wafer base 13 onto the inner wall of the cup-shaped cover body 20, thereby achieving self-cleaning of the inner wall of the cup-shaped cover body 20.

[0086] Specifically, the cup-shaped cover self-cleaning structure 24 can also be set in other suitable positions as needed to self-clean the cup-shaped cover body 20. The cup-shaped cover self-cleaning structure 24 can also be other suitable cleaning structures, all of which are within the protection scope of this utility model.

[0087] In summary, the semiconductor process apparatus of this invention can achieve the following: by setting the inner wall of the cup-shaped cover body as a hydrophilic-hydrophobic reversible layer, and using an ultraviolet light source to control and change the hydrophilic-hydrophobic properties of the reversible layer, the inner wall of the cup-shaped cover body can be hydrophilic when splash prevention is required, preventing contaminants on the inner wall of the cup-shaped cover body from splashing back onto the wafer to be processed, thereby improving the yield and performance reliability of the wafer to be processed; and by changing the inner wall of the cup-shaped cover body to hydrophobic during self-cleaning, the self-cleaning effect of the cup-shaped cover body can be improved; at the same time, the relative lifting and lowering between the wafer to be processed and the cup-shaped cover body is realized by using a lifting drive structure, so that the ultraviolet light source can approach various positions of the inner wall of the cup-shaped cover body to obtain a uniform hydrophilic-hydrophobic change effect.

[0088] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0089] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A semiconductor process apparatus, characterized in that, The semiconductor process apparatus includes: a cup-shaped cover body, a wafer base, and a controllable switchable ultraviolet light source; The cup-shaped cover body is a cup-shaped outer shell surrounding the wafer base, and the inner wall of the cup-shaped cover body is a hydrophilic-hydrophobic reversible layer; the ultraviolet light source is used to change the hydrophilic-hydrophobic properties of the hydrophilic-hydrophobic reversible layer, and the wafer base is used to place the wafer to be processed.

2. The semiconductor process apparatus according to claim 1, characterized in that: The hydrophilic-hydrophobic reversible layer is a modified coating or a plasma-treated layer.

3. The semiconductor process apparatus according to claim 1, characterized in that: The ultraviolet light source is a structure that surrounds and is fixed to the side wall of the wafer base.

4. The semiconductor process apparatus according to any one of claims 1-3, characterized in that: The semiconductor process apparatus further includes a first lifting drive structure, which is used to drive the cup-shaped cover body to move up and down relative to the wafer base.

5. The semiconductor process apparatus according to any one of claims 1-3, characterized in that: The semiconductor process apparatus further includes a second lifting drive structure, which is used to drive the wafer base to move up and down relative to the cup-shaped cover body.

6. The semiconductor process apparatus according to claim 1, characterized in that: The semiconductor process apparatus is an integrated device that is any one or more of the following: wet cleaning equipment, photoresist spin coating equipment, photoresist edge washing equipment, or photoresist developing equipment.

7. The semiconductor process apparatus according to claim 6, characterized in that: When the semiconductor process apparatus is a wet cleaning device, the semiconductor process apparatus further includes a cup-shaped cover self-cleaning structure.

8. The semiconductor process apparatus according to claim 7, characterized in that: The cup-shaped self-cleaning structure is a cleaning nozzle fixed to the surface of the wafer base.

9. The semiconductor process apparatus according to claim 1, characterized in that: The semiconductor process apparatus includes m cup-shaped cover bodies, where m is a positive integer greater than or equal to 2; each cup-shaped cover body concentrically surrounds the wafer base, and each cup-shaped cover body can move up and down relative to each other; the inner wall of each cup-shaped cover body is a preset corresponding hydrophilic and hydrophobic reversible layer.

10. The semiconductor process apparatus according to claim 9, characterized in that: The semiconductor process apparatus includes n first lifting drive structures, where n is a positive integer less than or equal to m; each of the first lifting drive structures is used to drive the lifting motion of one of the cup-shaped cover bodies relative to the wafer base.

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