Semiconductor packaging device

Abstract

The utility model belongs to the field of semiconductor packaging, and particularly relates to a semiconductor packaging device which comprises a machine body, the outer wall of the machine body is fixedly connected with a supporting plate frame, the top of the supporting plate frame is fixedly connected with a heightening frame, the heightening frame is provided with a station assembly, the station assembly comprises a driving motor, and the driving motor is connected with the supporting plate frame. A driving motor is arranged below the heightening frame, a synchronous belt transmission assembly is arranged below the heightening frame, a synchronous block is fixedly connected to the outer wall of the synchronous belt transmission assembly, and a connecting plate is detachably connected to the outer wall of the synchronous block. The semiconductor packaging device is driven by the synchronous belt transmission assembly of the station assembly, synchronous transposition can be achieved through the two sets of inner sliding frames and outer sliding frames, when the stations in the machine body conduct packaging on semiconductor elements, the external stations can conduct feeding or discharging operation synchronously, and therefore the situation that in the production process, a machine needs to be stopped for taking and placing semiconductors is avoided, and the production efficiency is improved. The idle time of machining is effectively shortened, and the continuity of a production line is remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically a semiconductor packaging device. Background Technology

[0002] Semiconductor packaging is a crucial step in the semiconductor manufacturing process, and its efficiency and precision directly affect the performance and reliability of chips. With the development of technologies such as 5G and the Internet of Things, the demand for miniaturized and high-density packaging of semiconductor components is increasing daily.

[0003] Currently, traditional equipment adopts a single-station design, requiring machine shutdown for manual loading and unloading after each packaging process. The average downtime is relatively long, necessitating improved production efficiency. Therefore, we propose a semiconductor packaging device. Utility Model Content

[0004] The main objective of this invention is to provide a semiconductor packaging device that can solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention proposes the following technical solution:

[0006] A semiconductor packaging apparatus includes a body, a support frame fixedly connected to the outer wall of the body, an extension frame fixedly connected to the top of the support frame, and a workstation assembly disposed on the extension frame. The workstation assembly includes:

[0007] A drive motor is provided below the riser frame, and a synchronous belt drive assembly is provided below the riser frame.

[0008] Synchronizing block: The outer wall of the synchronous belt drive assembly is fixedly connected to the synchronizing block, and the outer wall of the synchronizing block is detachably connected to the connecting plate;

[0009] The mounting curved plate is detachably connected to the outer wall of the connecting plate, and the mounting curved plate is detachably connected to the inner wall of the inner slide.

[0010] An outer slide is provided on the side of the inner slide, and a placement groove is provided on the outer slide.

[0011] Preferably, there are two sets of placement slots, and two sets of placement plates are placed in the placement slots.

[0012] Preferably, a guide rod is fixedly connected to the bottom of the placement plate, and a force-bearing plate is threadedly connected to the bottom of the guide rod.

[0013] Preferably, an electric cylinder base is fixedly connected to the inner wall of the machine body, and a push plate is fixedly connected to the output end of the electric cylinder base.

[0014] Preferably, a guide post is fixedly connected to the bottom of the push plate, and a force-bearing hole is provided at the top of the push plate.

[0015] Preferably, the inner wall of the machine body is fixedly connected to a slide rail, and the slide rail is provided with a guide slider one and a guide slider two.

[0016] Preferably, the top of the first guide slider is fixedly connected to the bottom of the inner slide, and the top of the second guide slider is fixedly connected to the bottom of the outer slide.

[0017] This invention provides a semiconductor packaging device. It has the following advantages:

[0018] (1) Driven by the synchronous belt drive assembly of the work station assembly, the two sets of inner and outer slides can be synchronously switched. When the work station inside the machine is packaging semiconductor components, the outer work station can simultaneously perform loading or unloading operations, thereby avoiding the need to stop the machine to pick up and put away semiconductors during the production process, effectively shortening the idle time of processing, improving packaging efficiency, and significantly improving the continuity of the production line.

[0019] (2) The push plate is driven to rise by the electric cylinder base, and the force hole is aligned with the force plate at the bottom of the guide rod. The push plate continues to rise to the preset height, so that the placement plate on the inner slide is at the same height as the placement plate on the outer slide, which facilitates the sealing of the placement plate in the inner slide and solves the problem of the inner and outer slides being of different heights. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0022] Figure 2 This is a schematic diagram of a portion of the slide rail and guide slider of this utility model;

[0023] Figure 3 This is a schematic cross-sectional view of the inner and outer slides of this utility model.

[0024] Figure 4 This is a schematic diagram of the force-bearing plate and the placement plate of this utility model.

[0025] In the diagram: 1. Machine body; 2. Support plate frame; 3. Elevator frame; 4. Workstation assembly; 41. Drive motor; 42. Synchronous belt drive assembly; 43. Synchronous block; 44. Connecting plate; 45. Mounting curved plate; 46. Inner slide; 47. Outer slide; 48. Placement slot; 5. Placement plate; 6. Guide rod; 7. Force plate; 8. Electric cylinder base; 9. Push plate; 10. Guide column; 11. Force hole; 12. Slide rail; 13. Guide slider one; 14. Guide slider two.

[0026] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figures 1-4 This utility model proposes a semiconductor packaging device, including a body 1. A support frame 2 is fixedly connected to the outer wall of the body 1. An extension frame 3 is fixedly connected to the top of the support frame 2. A workstation assembly 4 is arranged on the extension frame 3. The workstation assembly 4 includes a drive motor 41. The drive motor 41 is arranged below the extension frame 3. A synchronous belt drive assembly 42 is arranged below the extension frame 3. The synchronous belt drive assembly 42 includes a driving pulley, a driven pulley, and a synchronous belt. It is an existing assembly. The drive motor 41 is fixedly connected to the driving pulley to facilitate the rotation of the driving pulley, thereby driving the synchronous belt to move. A synchronous block 43 is fixedly connected to the outer wall of the synchronous belt drive assembly 42. A connecting plate 44 is detachably connected to the outer wall of the synchronous block 43. A mounting curved plate 45 is detachably connected to the outer wall of the connecting plate 44. Plate 45 is detachably connected to the inner wall of inner slide 46. Outer slide 47 is provided on the side of inner slide 46. Synchronous block 43, connecting plate 44, and mounting curved plate 45 are a set, and there are two sets in total. The mounting curved plate 45 on one set is fixed to inner slide 46 with screws, and the mounting curved plate 45 on the other set is fixed to outer slide 47 with screws. When the synchronous belt on synchronous belt drive assembly 42 moves, it will drive the two sets of connecting plates 44 to move, so that inner slide 46 slides from inside to outside of machine body 1, while outer slide 47 slides from outside to inside of machine body 1 (or vice versa, that is, outer slide 47 slides from inside to outside of machine body 1, while inner slide 46 slides from outside to inside of machine body 1), completing the switching work of two workstations. Placement slot 48 is provided on outer slide 47.

[0029] In this utility model, there are two sets of placement slots 48, and a placement plate 5 is placed in the placement slot 48. One placement slot 48 raises one work station, which is convenient for placing a set of placement plates 5. There are two sets of placement plates 5. One set of placement slots 48 is set on the outer slide 47, and the other set is set on the inner slide 46. The placement slot 48 set on the inner slide 46 is provided with a guide hole, and a guide rod 6 is slidably connected to the inner wall of the guide hole.

[0030] Furthermore, a guide rod 6 is fixedly connected to the bottom of the placement plate 5, and a force-bearing plate 7 is threadedly connected to the bottom of the guide rod 6. There are two sets of placement plates 5. One set is located on the outer slide 47, and the bottom of this set of placement plates 5 is not equipped with a guide rod 6 and a force-bearing plate 7. The other set is located on the inner slide 46, and the bottom of this set is equipped with a guide rod 6. The movement of the force-bearing plate 7 is guided by the guide rod 6, thereby guiding the matching placement plate 5.

[0031] Furthermore, an electric cylinder seat 8 is fixedly connected to the inner wall of the body 1, and a push plate 9 is fixedly connected to the output end of the electric cylinder seat 8. The height of the push plate 9 can be easily changed through the electric cylinder seat 8. A guide post 10 is fixedly connected to the bottom of the push plate 9, and a force-receiving hole 11 is opened on the top of the push plate 9. A chamfer is opened on the force-receiving hole 11. By letting the force-receiving plate 7 slide into the force-receiving hole 11, the push plate 9 can easily drive the force-receiving plate 7 to move, thereby changing the height of the placement plate 5, so that the placement plate 5 located on the inner slide 46 can be at the same height as the placement plate 5 on the outer slide 47.

[0032] Furthermore, a slide rail 12 is fixedly connected to the inner wall of the body 1. Guide slider 13 and guide slider 2 14 are provided on the slide rail 12. There are four slide rails 12, with two sliders in a group. Guide slider 13 and guide slider 2 14 are slidably connected to the corresponding slide rail 12, respectively guiding the movement of the inner slide 46 and the outer slide 47. The top of guide slider 13 is fixedly connected to the bottom of the inner slide 46, and the top of guide slider 2 14 is fixedly connected to the bottom of the outer slide 47.

[0033] It should be noted that the above electrical components are all existing technology products. Those skilled in the art should select, install and complete the circuit debugging work according to the needs of use to ensure that all electrical appliances can work normally. The components are all general standard parts or components known to those skilled in the art. Their structure and principle can be known by those skilled in the art through technical manuals or conventional experimental methods. No specific restrictions are made here.

[0034] In operation, the drive motor 41 starts, driving the synchronous belt transmission assembly 42 to rotate. Two sets of synchronous blocks 43, via connecting plates 44, respectively pull the inner slide 46 and the outer slide 47 along the slide rail 12. When the inner slide 46 carries the packaged placement plate 5 out of the machine body 1, the outer slide 47 simultaneously moves the placement plate 5 to be packaged into the machine body 1, completing the workstation exchange. The entire process requires no manual intervention, ensuring continuous production.

[0035] When the inner slide 46 slides into the body 1, the push plate 9 is driven to rise by the electric cylinder seat 8. The force hole 11 is aligned with the force plate 7 at the bottom of the guide rod 6. The push plate 9 continues to rise to the preset height so that the two sets of placement plates 5 are at the same height. After leveling, the packaging head descends to perform pressure welding on the chip. After completion, the electric cylinder seat 8 drives the push plate 9 to reset and enter the next cycle.

[0036] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A semiconductor packaging device, comprising a body (1), characterized in that: A support frame (2) is fixedly connected to the outer wall of the machine body (1), and an extension frame (3) is fixedly connected to the top of the support frame (2). A workstation assembly (4) is provided on the extension frame (3), and the workstation assembly (4) includes: A drive motor (41) is provided below the height-increasing frame (3), and a synchronous belt drive assembly (42) is provided below the height-increasing frame (3); Synchronous block (43), the outer wall of the synchronous belt drive assembly (42) is fixedly connected to the synchronous block (43), and the outer wall of the synchronous block (43) is detachably connected to the connecting plate (44); Mounting curved plate (45), the outer wall of the connecting plate (44) is detachably connected to the mounting curved plate (45), the mounting curved plate (45) is detachably connected to the inner wall of the inner slide (46); An outer slide (47) is provided on the side of the inner slide (46), and a placement groove (48) is provided on the outer slide (47).

2. The semiconductor packaging device according to claim 1, characterized in that: The placement slot (48) is provided in two sets, and the placement slot (48) is provided with a placement plate (5), and the placement plate (5) is provided in two sets.

3. A semiconductor packaging device according to claim 2, characterized in that: The bottom of the placement plate (5) is fixedly connected to a guide rod (6), and the bottom of the guide rod (6) is threadedly connected to a force-bearing plate (7).

4. A semiconductor packaging device according to claim 1, characterized in that: The inner wall of the body (1) is fixedly connected to an electric cylinder seat (8), and the output end of the electric cylinder seat (8) is fixedly connected to a push plate (9).

5. A semiconductor packaging device according to claim 4, characterized in that: The bottom of the push plate (9) is fixedly connected to a guide post (10), and the top of the push plate (9) is provided with a force-receiving hole (11).

6. A semiconductor packaging device according to claim 1, characterized in that: The inner wall of the body (1) is fixedly connected to a slide rail (12), and the slide rail (12) is provided with a guide slider one (13) and a guide slider two (14).

7. A semiconductor packaging apparatus according to claim 6, characterized in that: The top of the first guide slider (13) is fixedly connected to the bottom of the inner slide (46), and the top of the second guide slider (14) is fixedly connected to the bottom of the outer slide (47).

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