Processing device of silicon stack high-power high-voltage diode

Abstract

The utility model discloses a processing device of a silicon stack high-power high-voltage diode, which comprises a base, a controller arranged on the outer side of the base, a mould pressing mechanism arranged on the top of the base, an adjusting mechanism arranged on the outer side of the base, and a dustproof mechanism arranged on the outer side of the base. The dustproof mechanism comprises a shielding plate movably connected to the top of the base, the mold pressing mechanism comprises a supporting frame, a hydraulic cylinder is fixedly connected to the top of the supporting frame, a mold pressing plate is fixedly connected to the bottom of the hydraulic cylinder, and a workpiece plate is installed at the top of the base. And by arranging the adjusting mechanism, the workpiece plate can flexibly move on the top of the base. When the positions of the diodes in the mold pressing process need to be adjusted or the diodes of different batches and different machining requirements need to be replaced, the workpiece plate can be moved through external force, the diversified machining requirements are met, and the universality of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of diode processing technology, specifically a processing device for silicon stack high-power high-voltage diodes. Background Technology

[0002] A diode is a two-electrode electronic component with asymmetric conductance. An ideal diode has zero resistance between its two electrodes (anode and cathode) when forward-biased, but infinite resistance when reverse-biased. This means current is only allowed to flow in one direction, giving the diode its unidirectional conductivity and enabling it to function as a rectifying circuit. In diode manufacturing, semiconductor materials and a mold are first prepared. The semiconductor material is then placed in the mold, and pressure is applied to shape the material into the desired diode shape within the mold. Molding equipment typically uses high temperature and high pressure to ensure the materials are firmly bonded together and possess the required electrical properties.

[0003] According to the authorized patent "CN220864617U", a molding device for diode processing includes a base. Two fixing blocks are fixedly connected to the top of the base. An electric push rod is inserted through and fixedly connected to each of the two fixing blocks. A mold is fixedly connected to the opposite end of each of the two electric push rods. A collection box is slidably connected to the back of the base. A feeding port is provided at the top of the base. A vibration structure is provided at the top of each of the two fixing blocks. This invention can automatically feed the molded diodes, effectively improving the processing efficiency of the device.

[0004] In the application of the above-mentioned technical solutions, traditional equipment often struggles to flexibly adjust the workpiece position. When faced with diode processing tasks of different batches and specifications, the fixed processing position and mode cannot meet specific molding requirements. At the same time, impurities such as dust and debris in the processing environment have consistently plagued the production quality of diodes.

[0005] Therefore, this utility model provides a processing apparatus for silicon stack high-power high-voltage diodes. Utility Model Content

[0006] To address the shortcomings of existing technologies, this invention provides a processing apparatus for silicon stack high-power high-voltage diodes, thereby solving the aforementioned problems.

[0007] To achieve the above objectives, this utility model is implemented through the following technical solution: a processing device for silicon stack high-power high-voltage diodes, including a base, a controller provided on the outside of the base, a molding mechanism installed on the top of the base, an adjustment mechanism provided on the outside of the base, and a dustproof mechanism provided on the outside of the base, the dustproof mechanism including a baffle plate movably connected to the top of the base;

[0008] The molding mechanism includes a support frame, a hydraulic cylinder is fixedly connected to the top of the support frame, a molding plate is fixedly connected to the bottom of the hydraulic cylinder, a workpiece plate is installed on the top of the base, and a workpiece groove is opened inside the workpiece plate.

[0009] The adjustment mechanism includes a connecting plate, a movable tube fixedly connected to the outer side of the connecting plate, a locking rod movably connected inside the movable tube, a compression spring fixedly connected to the locking rod, a first positioning hole and a second positioning hole opened in the side wall of the workpiece plate, a moving groove opened inside the base, a slider slidably engaged inside the moving groove, and a return spring fixedly connected to the outer side of the slider.

[0010] Preferably, a dustproof mechanism is provided on the outer side of the base. The dustproof mechanism includes a stabilizing plate, a sliding groove is provided inside the stabilizing plate, a moving block is slidably engaged inside the sliding groove, a fixing block is fixedly connected to the top of the moving block, an L-shaped rod is fixedly connected to the top of the fixing block, a baffle plate is fixedly connected to the top of the L-shaped rod, an extension plate is fixedly connected to the outer side of the fixing block, a threaded tube is fixedly connected to the outer side of the extension plate, a screw is threadedly connected inside the threaded tube, and a positioning cover is fixedly connected to the outer side of the screw.

[0011] Preferably, the molding plate is movably connected above the base, and the workpiece grooves are evenly distributed inside the workpiece plate. By activating the hydraulic cylinder, the hydraulic cylinder drives the molding plate to move to the top of the workpiece plate.

[0012] Preferably, the connecting plates are symmetrically distributed on the top of the base, and the locking rod is movably connected to the inside of the movable tube by a compression spring. Due to the properties of the compression spring itself, the locking rod can move inside the movable tube.

[0013] Preferably, the No. 1 positioning hole and the No. 2 positioning hole are symmetrically distributed inside the workpiece plate, and the snap-fit ​​rod matches the No. 1 positioning hole and the No. 2 positioning hole. When the snap-fit ​​rod enters the interior of the No. 1 positioning hole or the No. 2 positioning hole, it can perform positioning processing on the workpiece plate.

[0014] Preferably, the end of the reset spring away from the slider is fixedly connected to the inner wall of the moving groove, and the top of the slider is fixedly connected to the bottom of the workpiece plate. Through the cooperation of the slider and the reset spring, the workpiece plate can be movably connected to the top of the base.

[0015] Preferably, the stabilizing plate is fixedly connected to the outside of the base, and the fixing block is slidably connected to the top of the stabilizing plate through the moving block. By moving the fixing block on the top of the stabilizing plate, the L-shaped rod can drive the baffle plate to move to the top of the workpiece plate.

[0016] Preferably, the position of the shielding plate is higher than that of the workpiece plate, and the area of ​​the shielding plate is the same as that of the workpiece plate. When the shielding plate is moved above the workpiece plate, it can be used to prevent dust from entering the workpiece plate.

[0017] Beneficial effects

[0018] Compared with the prior art, the present invention has the following advantages:

[0019] (1) The processing device for the silicon stack high-power high-voltage diode has an adjustment mechanism that allows the workpiece plate to move flexibly on the top of the base. When it is necessary to adjust the position of the diode during the molding process, or to replace diodes of different batches or with different processing requirements, the workpiece plate can be moved by external force to meet diverse processing needs and improve the versatility of the device.

[0020] (2) The processing device for the silicon stack high-power high voltage diode, by means of a shielding plate that is higher than the workpiece plate and has the same area, can cover the workpiece plate in all directions, effectively blocking dust, debris and other impurities generated during the non-processing process from falling on the diode, avoiding the impact of impurities on the performance and quality of the diode, and improving the product qualification rate. Attached Figure Description

[0021] Figure 1 This is a perspective view of the present invention;

[0022] Figure 2 This is a schematic diagram of the outer structure of the protective mechanism of this utility model;

[0023] Figure 3 This is a schematic diagram of the outer side of the No. 2 protective plate of this utility model;

[0024] Figure 4 This is a schematic diagram of the bottom structure of the No. 2 protective plate of this utility model;

[0025] Figure 5 This is a utility model Figure 4 Enlarged view of the structure at point A in the middle.

[0026] In the diagram: 1. Base; 2. Controller; 3. Molding mechanism; 31. Support frame; 32. Hydraulic cylinder; 33. Molding plate; 34. Workpiece plate; 35. Workpiece groove; 4. Adjustment mechanism; 41. Connecting plate; 42. Movable tube; 43. Clip rod; 44. Compression spring; 45. Positioning hole No. 1; 46. Positioning hole No. 2; 47. Moving groove; 48. Slider; 49. Return spring; 5. Dustproof mechanism; 51. Stabilizing plate; 52. Slide groove; 53. Moving block; 54. Fixing block; 55. L-shaped rod; 56. Baffle plate; 57. Extension plate; 58. Threaded tube; 59. Screw; 510. Positioning cover. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1-5 A processing apparatus for silicon stack high-power high voltage diodes includes a base 1, a controller 2 disposed on the outside of the base 1, a molding mechanism 3 mounted on the top of the base 1, an adjustment mechanism 4 disposed on the outside of the base 1, and a dustproof mechanism 5 disposed on the outside of the base 1. The dustproof mechanism 5 includes a baffle plate 56 movably connected to the top of the base 1.

[0029] The molding mechanism 3 includes a support frame 31, a hydraulic cylinder 32 is fixedly connected to the top of the support frame 31, a molding plate 33 is fixedly connected to the bottom of the hydraulic cylinder 32, a workpiece plate 34 is installed on the top of the base 1, and a workpiece groove 35 is opened inside the workpiece plate 34.

[0030] The adjustment mechanism 4 includes a connecting plate 41, a movable tube 42 fixedly connected to the outside of the connecting plate 41, a snap-fit ​​rod 43 movably connected inside the movable tube 42, a compression spring 44 fixedly connected to the snap-fit ​​rod 43, a first positioning hole 45 and a second positioning hole 46 opened in the side wall of the workpiece plate 34, a moving groove 47 opened inside the base 1, a slider 48 slidably snapped inside the moving groove 47, and a return spring 49 fixedly connected to the outside of the slider 48.

[0031] Furthermore: the molding plate 33 is movably connected above the base 1, the workpiece grooves 35 are evenly distributed inside the workpiece plate 34, the connecting plates 41 are symmetrically distributed on the top of the base 1, the snap-fit ​​rod 43 is movably connected inside the movable tube 42 through the compression spring 44, the first positioning hole 45 and the second positioning hole 46 are symmetrically distributed inside the workpiece plate 34, and the snap-fit ​​rod 43 matches the first positioning hole 45 and the second positioning hole 46, the end of the return spring 49 away from the slider 48 is fixedly connected to the inner wall of the moving groove 47, and the top of the slider 48 is fixedly connected to the bottom of the workpiece plate 34.

[0032] It should be noted that: by activating the hydraulic cylinder 32, the hydraulic cylinder 32 drives the molding plate 33 to move to the top of the workpiece plate 34. Through the characteristics of the compression spring 44, the locking rod 43 can move inside the movable tube 42. When the locking rod 43 enters the first positioning hole 45 or the second positioning hole 46, it can position the workpiece plate 34. Through the cooperation of the slider 48 and the return spring 49, the workpiece plate 34 can be movably connected to the top of the base 1.

[0033] As a further improvement of this utility model, the dustproof mechanism 5 includes a stabilizing plate 51, a sliding groove 52 is provided inside the stabilizing plate 51, a moving block 53 is slidably engaged inside the sliding groove 52, a fixing block 54 is fixedly connected to the top of the moving block 53, an L-shaped rod 55 is fixedly connected to the top of the fixing block 54, a shielding plate 56 is fixedly connected to the top of the L-shaped rod 55, an extension plate 57 is fixedly connected to the outside of the fixing block 54, a threaded tube 58 is fixedly connected to the outside of the extension plate 57, a screw 59 is threadedly connected inside the threaded tube 58, and a positioning cover 510 is fixedly connected to the outside of the screw 59.

[0034] Furthermore: the stabilizing plate 51 is fixedly connected to the outside of the base 1, the fixing block 54 is slidably connected to the top of the stabilizing plate 51 through the moving block 53, the position of the shielding plate 56 is higher than the position of the workpiece plate 34, and the area of ​​the shielding plate 56 is the same as that of the workpiece plate 34.

[0035] It should be noted that by moving the fixing block 54 on top of the stabilizing plate 51, the L-shaped rod 55 can drive the baffle plate 56 to move to the top of the workpiece plate 34. When the baffle plate 56 moves above the workpiece plate 34, it can perform dustproof treatment on the workpiece plate 34.

[0036] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0037] Working principle: When high-power high-voltage diodes on a silicon stack need to be molded, the controller 2 sends a command to start the hydraulic cylinder 32. The hydraulic cylinder 32 operates, and its piston rod extends downward, driving the molding plate 33, which is fixedly connected to the bottom, to move downward. Since the molding plate 33 is movably connected above the base 1, and the workpiece plate 34 is installed on the top of the base 1, the workpiece plate 34 has evenly distributed workpiece grooves 35 inside, and the diode to be processed is placed in the workpiece groove 35. As the molding plate 33 presses down, pressure is applied to the diode in the workpiece groove 35, completing the molding operation.

[0038] The adjustment mechanism 4 is used to adjust the position of the workpiece plate 34. When the workpiece plate 34 needs to be moved, an external force is applied to the workpiece plate 34 to move it on the top of the base 1. At this time, the slider 48 fixedly connected below the workpiece plate 34 slides in the moving groove 47 inside the base 1, while stretching or compressing the return spring 49. When the workpiece plate 34 moves to the appropriate position, the snap-fit ​​rod 43 corresponding to the first positioning hole 45 or the second positioning hole 46 on the side wall of the workpiece plate 34 pops out from the movable tube 42 and snaps into the corresponding positioning hole under the action of the compression spring 44. Since the connecting plate 41 is symmetrically distributed on the top of the base 1, the snap-fit ​​rod 43 is movably connected to the movable tube 42 through the compression spring 44, and the snap-fit ​​rod 43 matches the first positioning hole 45 and the second positioning hole 46, thereby fixing the position of the workpiece plate 34.

[0039] The dustproof mechanism 5 is used to prevent dust and other impurities from falling onto the workpiece plate during non-processing. The stabilizing plate 51 is fixedly connected to the outside of the base 1. The fixing block 54 slides in the groove 52 on the top of the stabilizing plate 51 via the moving block 53. When the dustproof function is required, the moving fixing block 54 drives the L-shaped rod 55 and the shielding plate 56 fixedly connected at the top to move above the workpiece plate 34. Since the shielding plate 56 is higher than the workpiece plate 34 and has the same area as the workpiece plate 34, it can effectively block dust. At the same time, the threaded tube 58 on the extension plate 57 fixedly connected to the outside of the fixing block 54 is internally threaded with the screw 59. The positioning cover 510 fixedly connected to the outside of the screw 59 can be used to further fix the position of the dustproof mechanism to ensure its stability.

[0040] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A processing apparatus for silicon stack high-power high-voltage diodes, comprising a base (1), characterized in that: A controller (2) is provided on the outside of the base (1), a molding mechanism (3) is installed on the top of the base (1), an adjustment mechanism (4) is provided on the outside of the base (1), and a dustproof mechanism (5) is provided on the outside of the base (1). The dustproof mechanism (5) includes a baffle plate (56) movably connected to the top of the base (1). The molding mechanism (3) includes a support frame (31), a hydraulic cylinder (32) is fixedly connected to the top of the support frame (31), a molding plate (33) is fixedly connected to the bottom of the hydraulic cylinder (32), a workpiece plate (34) is installed on the top of the base (1), and a workpiece groove (35) is opened inside the workpiece plate (34). The adjustment mechanism (4) includes a connecting plate (41), a movable tube (42) is fixedly connected to the outside of the connecting plate (41), a snap-fit ​​rod (43) is movably connected inside the movable tube (42), a compression spring (44) is fixedly connected to the snap-fit ​​rod (43), a first positioning hole (45) and a second positioning hole (46) are opened in the side wall of the workpiece plate (34), a moving groove (47) is opened inside the base (1), a slider (48) is slidably snapped inside the moving groove (47), and a return spring (49) is fixedly connected to the outside of the slider (48).

2. The processing apparatus for a silicon stack high-power high-voltage diode according to claim 1, characterized in that: The dustproof mechanism (5) includes a stabilizing plate (51), the inside of which is provided with a sliding groove (52), a moving block (53) is slidably engaged inside the sliding groove (52), a fixing block (54) is fixedly connected to the top of the moving block (53), an L-shaped rod (55) is fixedly connected to the top of the fixing block (54), a shielding plate (56) is fixedly connected to the top of the L-shaped rod (55), an extension plate (57) is fixedly connected to the outside of the fixing block (54), a threaded tube (58) is fixedly connected to the outside of the extension plate (57), a screw (59) is threadedly connected inside the threaded tube (58), and a positioning cover (510) is fixedly connected to the outside of the screw (59).

3. The processing apparatus for a silicon stack high-power high-voltage diode according to claim 1, characterized in that: The molding plate (33) is movably connected above the base (1), and the workpiece groove (35) is evenly distributed inside the workpiece plate (34).

4. The processing apparatus for a silicon stack high-power high-voltage diode according to claim 1, characterized in that: The connecting plates (41) are symmetrically distributed on the top of the base (1), and the snap-fit ​​rod (43) is movably connected to the inside of the movable tube (42) by a compression spring (44).

5. The processing apparatus for a silicon stack high-power high-voltage diode according to claim 1, characterized in that: The first positioning hole (45) and the second positioning hole (46) are symmetrically distributed inside the workpiece plate (34), and the snap-fit ​​rod (43) matches the first positioning hole (45) and the second positioning hole (46).

6. The processing apparatus for a silicon stack high-power high-voltage diode according to claim 1, characterized in that: The end of the reset spring (49) away from the slider (48) is fixedly connected to the inner wall of the moving groove (47), and the top of the slider (48) is fixedly connected to the bottom of the workpiece plate (34).

7. The processing apparatus for a silicon stack high-power high-voltage diode according to claim 2, characterized in that: The stabilizing plate (51) is fixedly connected to the outside of the base (1), and the fixing block (54) is slidably connected to the top of the stabilizing plate (51) via the moving block (53).

8. The processing apparatus for a silicon stack high-power high-voltage diode according to claim 2, characterized in that: The position of the shielding plate (56) is higher than that of the workpiece plate (34), and the area of ​​the shielding plate (56) is the same as that of the workpiece plate (34).

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