Lead frame for multiple chips

Abstract

The utility model discloses a lead frame for multiple chips, which belongs to the field of lead frames and comprises a frame body, a plurality of chip mounting units are arranged in the frame body, and transverse rectangular partition grooves and longitudinal circular partition grooves are arranged in the middle of the frame body. Transverse side ribs are arranged between every two adjacent columns of chip installation units arranged transversely, longitudinal side ribs are arranged between every two adjacent columns of chip installation units arranged longitudinally, each chip installation unit comprises three independent base islands arranged in the center, the three base islands are each independently provided with a pin, and the pins are arranged in the three base islands. Positioning holes are formed in the top and the bottom of the frame body. The unoccupied area of one chip mounting unit is reduced, so that the area of the base island is utilized to the maximum extent, the width is reduced, twenty rows and four columns of chip mounting units can be produced by one frame body, the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of lead frame, specifically to a lead frame for multi-chip applications. Background Technology

[0002] Leadframes are the basic material for the molding and packaging of semiconductor ICs and devices. As the chip carrier of integrated circuits, leadframes are a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to electrically connect the internal circuit leads (bonding points) of the chip with the external leads through the internal leads, forming an electrical circuit. It plays the role of a bridge connecting with external wires.

[0003] It mainly consists of two parts: chip pads and leads. The chip pads provide mechanical support for the chip during the packaging process, while the leads are the electrical and thermal pathways connecting the chip to the outside of the package. In semiconductor packaging, the lead frame also serves to support and fix the chip, protecting it from the influence of the external environment.

[0004] Previous leadframe products, while solving the problem of setting multiple base islands on the leadframe in the same space to install multiple chips, could only set up fourteen rows of chip mounting units in the same space. The width design was too wide, resulting in low space utilization. This led to a reduction in the number of chip mounting units produced at the same production cost. In addition, the distribution area of ​​the base islands inside each chip mounting unit was not much different, which was not suitable for the reasonable combination of large and small chips. Utility Model Content

[0005] To address the technical issues mentioned above, such as the limitation of only fourteen rows of chip mounting units within the same space, excessive width, low space utilization, reduced number of chip mounting units produced at the same production cost, and similar base island distribution areas within each chip mounting unit, which are unsuitable for the reasonable combination of large and small chips, this invention provides a lead frame for multi-chip applications.

[0006] A lead frame for multi-chip applications includes a frame body with multiple chip mounting units arranged inside. The frame body has a horizontal rectangular dividing slot and a vertical circular dividing slot in the middle. Horizontal side ribs are provided between two adjacent rows of horizontally arranged chip mounting units, and vertical side ribs are provided between two adjacent rows of vertically arranged chip mounting units. Each chip mounting unit includes three independent base islands located at the center, and each of the three base islands has an independent pin. Positioning holes are provided at the top and bottom of the frame body.

[0007] Furthermore, the frame body has twenty rows and four columns of chip mounting units arranged inside. Circular dividing slots are set on the longitudinal side ribs located in the middle of the four columns of chip mounting units, and rectangular dividing slots divide the frame body from top to bottom into seven rows of chip mounting units, six rows of chip mounting units, and seven rows of chip mounting units.

[0008] Furthermore, the three base islands include a first base island located in the middle, which is a large base island in the middle. Two smaller base islands are symmetrically arranged on both sides of the large base island, and a second base island is arranged below each of the two smaller base islands. The area of ​​the large base island is larger than the area of ​​the second base island, and the area of ​​the second base island is larger than the area of ​​the smaller base islands.

[0009] Furthermore, the first base island can be equipped with one or two chips, and the second base island can be equipped with one chip. The pins of the first base island and the two second base islands are oriented in opposite directions.

[0010] Furthermore, two second base islands are symmetrically arranged on both sides of the large-area base island, and the large-area base island is connected to the two small-area base islands. The first base island and the two second base islands are all equipped with arc-shaped corners.

[0011] Compared with the prior art, the beneficial effects of this utility model are: compared with the previous lead frame, the empty area in a chip mounting unit is reduced, so that the area of ​​the base island is maximized and the width is reduced. One frame body can produce twenty rows and four columns of chip mounting units, which improves production efficiency. More chip mounting units can be produced at the same cost, which is equivalent to reducing production costs. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the chip mounting unit 2 of this utility model.

[0013] Figure 2 This is a schematic diagram of the frame body of this utility model;

[0014] Figure 3 This is a partial structural diagram of the present utility model.

[0015] In the diagram: 1. Frame body; 2. Chip mounting unit; 3. Rectangular dividing slot; 4. Circular dividing slot; 5. Horizontal side rib; 6. Vertical side rib; 7. Base island; 8. Pin; 9. Positioning hole; 10. First base island; 11. Second base island; 12. Large area base island; 13. Small area base island. Detailed Implementation

[0016] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0017] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of the utility model described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0018] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0019] Furthermore, some of the aforementioned terms, besides indicating location or positional relationships, may also have other meanings. For example, the term "above" may, in certain circumstances, indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances. Additionally, the term "multiple" should mean two or more.

[0020] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments of the present invention can be combined with each other. The following will refer to the accompanying drawings. Figures 1-3 The present invention will be described in detail with reference to the embodiments.

[0021] A lead frame for multi-chip applications includes a frame body 1. Multiple chip mounting units 2 are arranged inside the frame body 1. The frame body 1 has horizontal rectangular dividing slots 3 and vertical circular dividing slots 4 in the middle. There are two rows of rectangular dividing slots 3, with four slots in each row, corresponding to the top of four rows of chip mounting units 2, the top of the middle six rows of chip mounting units 2, and the top of the bottom seven rows of chip mounting units 2, and are fixedly connected to horizontal side ribs 5. The circular dividing slots 4 are located in the middle of the four rows of chip mounting units 2, on the vertical side ribs 6, with a total of 12 slots.

[0022] The frame body 1 has twenty rows and four columns of chip mounting units 2 arranged inside. Circular dividing slots 4 are set on the longitudinal side ribs 6 located in the middle of the four columns of chip mounting units 2. Rectangular dividing slots 3 divide the frame body 1 from top to bottom into seven rows of chip mounting units 2, six rows of chip mounting units 2, and seven rows of chip mounting units 2. The seven rows of chip mounting units 2, six rows of chip mounting units 2, and seven rows of chip mounting units 2 are respectively adapted to the four circular dividing slots 4. According to the number of chips to be installed, the frame body 1 can be divided into several chip mounting units 2 by cutting the longitudinal side ribs 6 and the transverse side ribs 5.

[0023] A horizontal side rib 5 is provided between two adjacent columns of chip mounting units 2 arranged horizontally, and a vertical side rib 6 is provided between two adjacent columns of chip mounting units 2 arranged vertically. Positioning holes 9 are provided at the top and bottom of the frame body 1. Four positioning holes 9 are provided at the top of the frame body 1 and one positioning hole 9 is provided at the bottom of the frame body 1. Positioning can be performed when the frame body 1 is divided to avoid misalignment.

[0024] Each chip mounting unit 2 includes three independent base islands 7 located at the center. Each of the three base islands 7 has an independent pin 8. The three base islands 7 include a first base island 10 located in the middle. The first base island 10 includes a large-area base island 12 in the middle. Two small-area base islands 13 are symmetrically arranged on both sides of the large-area base island 12. A second base island 11 is arranged below each of the two small-area base islands 13. The area of ​​the large-area base island 12 is larger than the area of ​​the second base island 11, and the area of ​​the second base island 11 is larger than the area of ​​the small-area base island 13.

[0025] The chip can be mounted on three base islands 7 and connected to external electrical and thermal paths via pins 8 respectively. Smaller chips can be mounted on the two second base islands 11, while a large chip or two smaller chips can be mounted on the first base island 10.

[0026] The first base island 10 can be equipped with one or two chips, and the second base island 11 can be equipped with one chip. The pins 8 of the first base island 10 and the two second base islands 11 are oriented in opposite directions. The inner ends of the pins 8 are all connected to the base island 7, and the outer ends are respectively connected to the transverse side ribs 5.

[0027] Two second base islands 11 are symmetrically arranged on both sides of the large area base island 12. The large area base island 12 is connected to two small area base islands 13. The first base island 10 and the two second base islands 11 are all provided with arc-shaped corners. Compared with the previous lead frame design, the free area in a chip mounting unit 2 is reduced, so that the area of ​​the base island 7 is maximized and the width is reduced. One frame body 1 can produce twenty rows and four columns of chip mounting units 2, which improves production efficiency. More chip mounting units 2 can be produced at the same cost, which is equivalent to reducing production costs.

[0028] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A lead frame for multiple chips comprising a frame body (1), characterized in that: The frame body (1) has multiple chip mounting units (2) arranged inside. The frame body (1) has a horizontal rectangular dividing groove (3) and a vertical circular dividing groove (4) in the middle. Horizontal side ribs (5) are arranged between two adjacent rows of chip mounting units (2) arranged horizontally, and vertical side ribs (6) are arranged between two adjacent rows of chip mounting units (2) arranged vertically. Each chip mounting unit (2) includes three independent base islands (7) arranged at the center. Each of the three base islands (7) has an independent pin (8). Positioning holes (9) are provided at the top and bottom of the frame body (1).

2. The leadframe for a multi-chip as claimed in claim 1, wherein: The frame body (1) is arranged with twenty rows and four columns of chip mounting units (2). A circular dividing groove (4) is set on the longitudinal side rib (6) located in the middle of the four columns of chip mounting units (2). A rectangular dividing groove (3) divides the frame body (1) from top to bottom into seven rows of chip mounting units (2), six rows of chip mounting units (2), and seven rows of chip mounting units (2).

3. The leadframe for multiple chips of claim 2, wherein: The three base islands (7) include a first base island (10) located in the middle. The first base island (10) includes a large base island (12) in the middle. Two small base islands (13) are symmetrically arranged on both sides of the large base island (12). A second base island (11) is arranged below each of the two small base islands (13). The area of ​​the large base island (12) is larger than the area of ​​the second base island (11), and the area of ​​the second base island (11) is larger than the area of ​​the small base island (13).

4. The leadframe for multiple chips according to claim 3, wherein: The first base island (10) can be equipped with one or two chips, and the second base island (11) can be equipped with one chip. The pins (8) of the first base island (10) and the two second base islands (11) are oriented in opposite directions.

5. The leadframe for multiple chips of claim 4, wherein: Two second base islands (11) are symmetrically arranged on both sides of the large area base island (12). The large area base island (12) is connected to two small area base islands (13). The first base island (10) and the two second base islands (11) are all provided with arc-shaped corners.

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