Brewing cup

Abstract

The brewing cup comprises a cup body and a semiconductor refrigeration assembly, the cup body is provided with a first cavity, a second cavity and an assembling cavity, the first cavity and the second cavity are distributed in the axial direction of the cup body, the assembling cavity is located between the first cavity and the second cavity, and the assembling cavity communicates with the first cavity and the second cavity; the semiconductor refrigeration assembly comprises a semiconductor refrigeration piece and a cold conduction pipe and a heat conduction pipe which are connected to the two sides of the semiconductor refrigeration piece, the semiconductor refrigeration piece is located in the assembling cavity, at least part of the cold conduction pipe stretches into the first cavity from the assembling cavity, and at least part of the heat conduction pipe stretches into the second cavity from the assembling cavity; when the semiconductor chilling plate is powered on, the temperature of the cold conduction pipe is reduced, and the temperature of the heat conduction pipe is increased. According to the brewing cup, powder electuary can be fully dissolved in the second cavity, the dissolved powder electuary is cooled in the first cavity, and therefore it is guaranteed that the temperature is appropriate when the cup enters a mouth.

Description

Technical Field

[0001] This application relates to the field of cup technology, and in particular to a beverage cup. Background Technology

[0002] Given people's fast-paced lifestyles, using portable beverage cups to prepare powdered drinks such as soy milk, coffee, and milk powder for breakfast or a quick meal is a common practice. To quickly dissolve the powder and improve the solubility, people usually use hot water (above 80℃). While hot water does increase the solubility of powdered drinks, it's not advisable to drink them immediately as it can burn the user. Users should let the water cool down before drinking. Utility Model Content

[0003] Therefore, it is necessary to provide a brewing cup that is convenient for dissolving powdered powder and for users to drink from.

[0004] A beverage cup includes a cup body and a semiconductor cooling component. The cup body has a first cavity, a second cavity, and an assembly cavity located between the first cavity and the second cavity, which are distributed along its own axial direction. The assembly cavity is connected to the first cavity and the second cavity respectively. The semiconductor cooling component includes a semiconductor cooling chip and a cooling tube and a heating tube connected to both sides of the semiconductor cooling chip. The semiconductor cooling chip is located in the assembly cavity. At least a portion of the cooling tube extends from the assembly cavity into the first cavity, and at least a portion of the heating tube extends from the assembly cavity into the second cavity. When the semiconductor cooling chip is energized, the temperature of the cooling tube decreases and the temperature of the heating tube increases.

[0005] In one embodiment, the number of cooling pipes is configured to be multiple, and the multiple cooling pipes extend into the first cavity by different lengths; the number of heat pipes is configured to be multiple, and the multiple heat pipes extend into the second cavity by different lengths.

[0006] In one embodiment, the length of the cooling tube within the assembly cavity is greater than the length of the heat tube within the assembly cavity.

[0007] In one embodiment, a plurality of cold-conducting pipe groups are connected to one side of the semiconductor cooling chip, the plurality of cold-conducting pipe groups are arranged radially along the cup body, and each group of cold-conducting pipe groups includes a plurality of cold-conducting pipes spaced apart around the axis of the cup body; and / or, a plurality of heat-conducting pipe groups are connected to one side of the semiconductor cooling chip, the plurality of heat-conducting pipe groups are arranged radially along the cup body, and each group of heat-conducting pipe groups includes a plurality of heat-conducting pipes spaced apart around the axis of the cup body.

[0008] In one embodiment, the beverage cup also includes a stirring rod, at least a portion of which extends into the second cavity and is used to stir the liquid within the second cavity.

[0009] In one embodiment, the cup body has a first partition and a second partition spaced apart along its own axial direction. An assembly cavity is formed between the first partition and the second partition. The side of the first partition away from the assembly cavity forms a first cavity with the inner wall of the cup body, and the side of the second partition away from the assembly cavity forms a second cavity with the inner wall of the cup body. The first partition has a first through hole and a first mounting hole. The first through hole connects the first cavity and the assembly cavity, and the first mounting hole is used for the passage of a cooling pipe. The second partition has a second through hole and a second mounting hole. The second through hole connects the second cavity and the assembly cavity, and the second mounting hole is used for the passage of a heat pipe.

[0010] In one embodiment, the cup body includes an upper cup body and a lower cup body that are detachably connected, with a first partition disposed inside the upper cup body and a second partition disposed inside the lower cup body.

[0011] In one embodiment, the beverage cup further includes a first check gasket, which is attached to the side of the first partition facing the assembly cavity, and the first check gasket has a first through hole corresponding to the first through hole. The cross-sectional area of ​​the first through hole tends to decrease along the direction from the assembly cavity to the first through hole; and / or, the beverage cup further includes a second check gasket, which is attached to the side of the first partition facing the assembly cavity, and the second check gasket has a second through hole corresponding to the second through hole. The cross-sectional area of ​​the second through hole tends to increase along the direction from the assembly cavity to the second through hole.

[0012] In one embodiment, the brewing cup also includes a stirring rod, at least a portion of which is movable in the second chamber and used to stir the solution in the second chamber.

[0013] In one embodiment, the semiconductor cooling assembly further includes a housing that covers the outer surfaces of the semiconductor cooling chip, the cold conduit, and the heat conduit.

[0014] Compared to existing technologies, the beverage cup provided in this application, by setting an assembly cavity that connects a first cavity and a second cavity respectively, with at least a portion of the cooling pipe extending from the assembly cavity into the first cavity and at least a portion of the heating pipe extending from the assembly cavity into the second cavity, allows the user to place the cup vertically with the second cavity positioned downwards along the axial direction of the cup. High-temperature water is used in the second cavity to brew the powdered beverage, improving its solubility. The user then adjusts the tilt angle of the cup or flips the cup upside down, allowing the solution in the second cavity to pass through the assembly cavity into the first cavity. In this way, the cooling pipe cools the solution and transfers the cold energy to the solution in the first cavity, lowering its temperature for easier drinking. Simultaneously, the heating pipe transfers heat to the solution in the second cavity, further improving the solubility of the powdered beverage in the second cavity. In other words, the beverage cup provided in this application can fully dissolve the powdered beverage in the second cavity and cool it in the first cavity, ensuring a suitable temperature upon consumption. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A cross-sectional view of the brewing cup provided in this application along its own axis;

[0017] Figure 2 for Figure 1 An enlarged view at point A;

[0018] Figure 3 for Figure 1 An enlarged view at point B;

[0019] Figure 4 This is a schematic diagram of the explosion of the beverage cup provided in this application;

[0020] Figure 5 A schematic diagram of the structure of the semiconductor cooling component provided in this application.

[0021] Reference numerals: 100, brewing cup; 10, cup body; 11, first cavity; 12, second cavity; 13, assembly cavity; 14, upper cup body; 15, lower cup body; 151, first partition; 152, second partition; 153, first through hole; 154, first mounting hole; 155, second through hole; 156, second mounting hole; 20, semiconductor cooling component; 201, semiconductor cooling chip; 202, cold conduction pipe assembly; 203, heat conduction pipe assembly; 21, cold conduction pipe; 22, heat conduction pipe; 23, shell; 231, main body; 232, column part; 233, motor; 30, stirring rod; 31, blade; 40, first check valve; 41, first through hole; 50, second check valve; 51, second through hole. Detailed Implementation

[0022] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0023] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0025] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0026] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0027] Please see Figure 1 This application provides a beverage cup 100, which includes a cup body 10 and a semiconductor cooling component 20. The cup body 10 has a first cavity 11, a second cavity 12 distributed along its own axial direction, and an assembly cavity 13 located between the first cavity 11 and the second cavity 12. The assembly cavity 13 is connected to the first cavity 11 and the second cavity 12 respectively. The semiconductor cooling component 20 includes a semiconductor cooling chip 201 and a cooling pipe 21 and a heating pipe 22 connected to both sides of the semiconductor cooling chip 201. The semiconductor cooling chip 201 is located in the assembly cavity 13. At least a portion of the cooling pipe 21 extends from the assembly cavity 13 into the first cavity 11, and at least a portion of the heating pipe 22 extends from the assembly cavity 13 into the second cavity 12. When the semiconductor cooling chip 201 is energized, the temperature of the cooling pipe 21 decreases and the temperature of the heating pipe 22 increases.

[0028] It should be noted that the semiconductor cooling chip 201 and the cold conducting pipe 21 and heat conducting pipe 22 connected to its two sides form a semiconductor cooler. When the semiconductor cooling chip 201 is energized, the temperature of the cold conducting pipe 21 will decrease and the temperature of the heat conducting pipe 22 will increase due to the Peltier effect. By setting the assembly cavity 13 to connect the first cavity 11 and the second cavity 12 respectively, and at least a portion of the cooling pipe 21 extends from the assembly cavity 13 into the first cavity 11, and at least a portion of the heating pipe 22 extends from the assembly cavity 13 into the second cavity 12, the user can place the cup body 10 vertically and place the second cavity 12 below along the axial direction of the cup body 10 during the use of the beverage cup 100. High-temperature water is used in the second cavity 12 to brew the powdered powder to improve the solubility of the powdered powder. Then, the tilt angle of the beverage cup 100 is adjusted or the cup body 10 is flipped up and down so that the solution in the second cavity 12 can enter the first cavity 11 through the assembly cavity 13. In this way, the cooling pipe 21 cools down and transfers the cold energy to the solution in the first cavity 11, so that the temperature of the solution in the first cavity 11 is lowered, making it convenient for the user to drink the solution in the first cavity 11. In addition, the heating pipe 22 will also transfer heat to the solution in the second cavity 12 to further improve the solubility of the powdered powder in the second cavity 12. That is, the beverage cup 100 provided in this application can fully dissolve the powdered powder in the second chamber 12 and cool the dissolved powdered powder in the first chamber 11, thereby ensuring that the temperature is suitable when drinking.

[0029] Among them, the cooling pipe 21 and the heat pipe 22 can be made of copper to improve their thermal conductivity.

[0030] In one embodiment, the length of the cooling pipe 21 within the assembly cavity 13 is greater than the length of the heat pipe 22 within the assembly cavity 13. Thus, the solution entering the first cavity 11 through the assembly cavity 13 can fully contact the cooling pipe 21, thereby facilitating the cooling of the solution.

[0031] Alternatively, in one embodiment, as Figure 1 and Figure 5 As shown, multiple cooling pipes 21 are configured, and the lengths of the multiple cooling pipes 21 extending into the first cavity 11 are different. This allows for cooling of solutions of different volumes within the first cavity 11. Similarly, multiple heat pipes 22 are configured, and the lengths of the multiple heat pipes 22 extending into the second cavity 12 are different. This allows for heating of solutions of different volumes within the second cavity 12.

[0032] In one embodiment, a plurality of cooling tube groups 202 are connected to one side of the semiconductor cooling chip 201. The plurality of cooling tube groups 202 are arranged radially along the cup body 10, and each cooling tube group 202 includes a plurality of cooling tubes 21 spaced apart around the axis of the cup body 10. In each cooling tube group 202, the plurality of cooling tubes 21 have the same height, and the heights of the cooling tubes 21 in two adjacent cooling tube groups 202 are not the same.

[0033] In one embodiment, a plurality of heat pipe groups 203 are connected to one side of the semiconductor cooling chip 201. The plurality of heat pipe groups 203 are arranged radially along the cup body 10, and each heat pipe group 203 includes a plurality of heat pipes 22 spaced apart around the axis of the cup body 10. In each heat pipe group 203, the plurality of heat pipes 22 have the same height, and the heights of the heat pipes 22 in two adjacent heat pipe groups 203 are different.

[0034] Optionally, in one embodiment, the heat pipe 22 and the cold pipe 21 are located at both ends of the semiconductor cooling chip 201 along the radial direction of the cup body 10.

[0035] like Figure 1 and Figure 4 As shown, the thermoelectric cooling assembly 20 also includes a housing 23, which covers the outer surfaces of the thermoelectric cooling chip 201, the cold conducting pipe 21, and the heat conducting pipe 22. The housing 23 protects the thermoelectric cooling chip 201, the cold conducting pipe 21, and the heat conducting pipe 22 from contamination and interference from the solution environment. Specifically, the thermoelectric cooling chip 201, the cold conducting pipe 21, and the heat conducting pipe 22 can be sealed and fixed in the housing 23 by adhesive bonding and nesting.

[0036] Specifically, the housing 23 includes a cylindrical main body 231 and columnar parts 232 connected to both sides of the main body 231. The semiconductor cooling chip 201 is located inside the main body 231, and the cold conduction pipe 21 and the heat conduction pipe 22 are respectively installed in the corresponding columnar parts 232.

[0037] Please see Figures 1 to 3The cup body 10 has a first partition 151 and a second partition 152 spaced apart along its own axial direction. An assembly cavity 13 is formed between the first partition 151 and the second partition 152. The side of the first partition 151 facing away from the assembly cavity 13 forms a first cavity 11 with the inner wall of the cup body 10, and the side of the second partition 152 facing away from the assembly cavity 13 forms a second cavity 12 with the inner wall of the cup body 10. The first partition 151 has a first through hole 153 and a first mounting hole 154. The first through hole 153 connects the first cavity 11 and the assembly cavity 13, and the first mounting hole 154 is used for the passage of a cooling pipe 21. The second partition 152 has a second through hole 155 and a second mounting hole 156. The second through hole 155 connects the second cavity 12 and the assembly cavity 13, and the second mounting hole 156 is used for the passage of a heat pipe 22. It can be understood that the first through hole 153 and the second through hole 155 are respectively used for the flow of solution.

[0038] Alternatively, in one embodiment, as Figure 4 As shown, the cup body 10 includes an upper cup body 14 and a lower cup body 15 that are detachably connected. A first partition 151 is disposed inside the upper cup body 14, and a second partition 152 is disposed inside the lower cup body 15. This allows the user to easily open the upper cup body 14 and the lower cup body 15, and to prepare powdered medicine in the lower cup body 15.

[0039] Specifically, the upper cup body 14 and the lower cup body 15 can be nested together through their respective openings, and can be connected by threads or snaps. The lower cup body 15 can be configured as a transparent shell, and the outer wall of the lower cup body 15 is provided with graduation lines to facilitate the user's control of the solution volume.

[0040] The beverage cup 100 also includes a first check valve 40 and a second check valve 50. The first check valve 40 is attached to the side of the first partition 151 facing the assembly cavity 13, and the first check valve 40 has a first through hole 41 corresponding to the first through hole 153. Along the direction from the assembly cavity 13 to the first through hole 153, the cross-sectional area of ​​the first through hole 41 tends to decrease. The second check valve 50 is attached to the side of the first partition 151 facing the assembly cavity 13, and the second check valve 50 has a second through hole 51 corresponding to the second through hole 155. Along the direction from the assembly cavity 13 to the second through hole 155, the cross-sectional area of ​​the second through hole 51 tends to increase.

[0041] Understandably, by setting the cross-sectional area of ​​the first through-hole 41 to decrease along the direction from assembly cavity 13 to the first through-hole 153, the solution can easily enter the first cavity 11 from assembly cavity 13 through the first through-hole 41, and this also helps to prevent the solvent in the first cavity 11 from flowing back into assembly cavity 13 along the first through-hole 41. Similarly, by setting the cross-sectional area of ​​the second through-hole 51 to increase along the direction from assembly cavity 13 to the second through-hole 155, the solution can easily enter the assembly cavity 13 from the second cavity 12 through the second through-hole 51, and this also helps to prevent the solvent in assembly cavity 13 from flowing back into the second cavity 12 along the second through-hole 51. This prevents the cooled solution in the first cavity 11 from flowing back into the second cavity 12 under gravity, thus preventing the solution from being repeatedly heated and cooled, which would affect the taste.

[0042] Specifically, the end of the first through hole 41 facing the assembly cavity 13 is configured as a flared opening, and the end of the second through hole 51 facing away from the assembly cavity 13 is configured as a flared opening. The first check gasket 40 and the second check gasket 50 can be configured as heat-resistant silicone pads.

[0043] like Figure 1 and Figure 4 As shown, the beverage cup also includes a stirring rod 30, at least a portion of which is movable within the second chamber 12 and used to stir the liquid within the second chamber 12.

[0044] Specifically, the stirring rod 30 is movably inserted through the first partition 151, the shell 23 and the second partition 152 respectively, with one end of the stirring rod 30 located in the first cavity 11 and the other end located in the second cavity 12.

[0045] Optionally, the stirring rod 30 is provided with multiple blades 31 at one end of the second cavity 12, and a motor 233 is provided in the housing 23. The motor 233 is connected to the stirring rod 30 and is used to drive the stirring rod 30 to rotate around its own axis. As the stirring rod 30 rotates around its own axis, the blades 31 rotate synchronously, which is beneficial for quickly dissolving powdered powder.

[0046] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A brew cup characterized by, The beverage cup (100) includes a cup body (10) and a semiconductor cooling component (20). The cup body (10) has a first cavity (11), a second cavity (12) distributed along its own axis, and an assembly cavity (13) located between the first cavity (11) and the second cavity (12). The assembly cavity (13) is connected to the first cavity (11) and the second cavity (12) respectively. The semiconductor cooling assembly (20) includes a semiconductor cooling chip (201) and a cooling pipe (21) and a heat pipe (22) connected to both sides of the semiconductor cooling chip (201). The semiconductor cooling chip (201) is located in the assembly cavity (13). At least a portion of the cooling pipe (21) extends from the assembly cavity (13) into the first cavity (11), and at least a portion of the heat pipe (22) extends from the assembly cavity (13) into the second cavity (12). When the semiconductor cooling chip (201) is powered on, the temperature of the cold pipe (21) decreases and the temperature of the heat pipe (22) increases.

2. The brewing cup according to claim 1, characterized in that, The number of the cooling tubes (21) is configured to be multiple, and the lengths of the multiple cooling tubes (21) extending into the first cavity (11) are different; The number of heat pipes (22) is configured to be multiple, and the lengths of the multiple heat pipes (22) extending into the second cavity (12) are different.

3. The brew cup of claim 2, wherein, The length of the cooling tube (21) located in the assembly cavity (13) is greater than the length of the heat tube (22) located in the assembly cavity (13).

4. The brew cup of claim 2, wherein, The semiconductor cooling chip (201) is connected to a plurality of cooling tube groups (202) on one side. The plurality of cooling tube groups (202) are arranged radially along the cup body (10), and each cooling tube group (202) includes a plurality of cooling tubes (21) spaced apart around the axis of the cup body (10). And / or, one side of the semiconductor cooling chip (201) is connected to a plurality of heat pipe groups (203), the plurality of heat pipe groups (203) are arranged radially along the cup body (10), and each heat pipe group (203) includes a plurality of heat pipes (22) spaced apart around the axis of the cup body (10).

5. The brew cup of claim 1, wherein, The beverage cup also includes a stirring rod (30), at least a portion of which extends into the second cavity (12) and is used to stir the liquid in the second cavity (12).

6. The brew cup of claim 1, wherein, The cup body (10) is provided with a first partition (151) and a second partition (152) spaced apart along its own axis. The first partition (151) and the second partition (152) form the assembly cavity (13). The side of the first partition (151) away from the assembly cavity (13) forms the first cavity (11) with the inner wall of the cup body (10). The side of the second partition (152) away from the assembly cavity (13) forms the second cavity (12) with the inner wall of the cup body (10). The first partition (151) has a first through hole (153) and a first mounting hole (154). The first through hole (153) connects the first cavity (11) and the assembly cavity (13). The first mounting hole (154) is used for the cold conduction pipe (21) to pass through. The second partition (152) has a second through hole (155) and a second mounting hole (156). The second through hole (155) connects the second cavity (12) and the assembly cavity (13). The second mounting hole (156) is used for the heat conduction pipe (22) to pass through.

7. The brew cup of claim 6, wherein, The cup body (10) includes an upper cup body (14) and a lower cup body (15) that are detachably connected. The first partition (151) is located inside the upper cup body (14), and the second partition (152) is located inside the lower cup body (15).

8. The brew cup of claim 6, wherein, The beverage cup also includes a first check valve (40), which is attached to the side of the first partition (151) facing the assembly cavity (13). The first check valve (40) has a first through hole (41) corresponding to the first through hole (153). Along the direction from the assembly cavity (13) to the first through hole (153), the cross-sectional area of ​​the first through hole (41) tends to decrease. And / or, the beverage cup further includes a second check pad (50), the second check pad (50) is attached to the side of the first partition (151) facing the assembly cavity (13), and the second check pad (50) has a second through hole (51) corresponding to the second through hole (155). Along the direction from the assembly cavity (13) to the second through hole (155), the cross-sectional area of ​​the second through hole (51) tends to increase.

9. The brew cup of claim 1, wherein, The beverage cup also includes a stirring rod (30), at least a portion of which is movable in the second chamber (12) and used to stir the solution in the second chamber (12).

10. The brew cup of claim 1, wherein, The semiconductor cooling assembly (20) also includes a housing (23), which covers the outer surfaces of the semiconductor cooling chip (201), the cold pipe (21) and the heat pipe (22).

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