Drainage device of semiconductor cutting equipment

Abstract

The utility model discloses a drainage device of semiconductor cutting equipment, which comprises a drainage bin, a clamping plate is fixedly mounted on the inner wall of the drainage bin, a filter plate is inserted into the inner wall of the clamping plate, a filter element is detachably mounted on the inner wall of the filter plate, a slope is arranged on the inner wall of the drainage bin, and a drainage assembly is fixedly mounted on the outer wall of the bottom of the left side of the drainage bin. The drainage assembly comprises a first self-priming pump, an output shaft of the first self-priming pump is connected with a plurality of filters through a first guide pipe, the drainage assembly is arranged, the first self-priming pump is arranged in the drainage assembly, and when sewage in a drainage bin is drained, the first self-priming pump is connected with the filters through a second guide pipe; according to the device, sewage in the drainage bin can be accelerated to be sucked into the plurality of filters, so that sewage generated by cooling the semiconductor cutting equipment is conveniently filtered step by step through the plurality of filters, the reuse standard is achieved, and the water-saving effect of the equipment is conveniently improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cutting equipment technology, specifically a drainage device for semiconductor cutting equipment. Background Technology

[0002] In semiconductor manufacturing, dicing is a crucial step. Semiconductor dicing equipment typically requires coolant to cool and lubricate the dicing area during operation, ensuring precision and quality. However, this process generates a significant amount of coolant wastewater, which must be promptly discharged to prevent disruptions to equipment operation and potential damage to semiconductor devices. When wastewater cannot be easily drained and filtered for reuse, it leads to substantial water waste, hindering energy conservation and environmental protection. Utility Model Content

[0003] The purpose of this invention is to provide a drainage device for semiconductor cutting equipment to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A drainage device for a semiconductor cutting equipment includes a drainage chamber, a clamping plate fixedly installed on the inner wall of the drainage chamber, a filter plate inserted into the inner wall of the clamping plate, a filter element detachably installed on the inner wall of the filter plate, a slope provided on the inner wall of the drainage chamber, and a drainage assembly fixedly installed on the outer wall of the bottom left side of the drainage chamber. The drainage assembly includes a first self-priming pump, the output shaft of the first self-priming pump is connected to a filter through a first conduit, and a plurality of filters are provided. The output end of the end filter is connected to a filter water chamber through a second conduit.

[0006] In a preferred embodiment of this utility model, support legs are fixedly installed at the four corners of the bottom of the drainage chamber, the first self-priming pump is fixedly installed on the bottom outer wall of the drainage chamber, and the input end of the first self-priming pump is fixedly connected to the bottom inner wall of the drainage chamber through a drainage pipe.

[0007] In a preferred embodiment of this utility model, the inner wall of the filter is filled with sand and gravel, and a filter screen is detachably installed on the bottom inner wall of the filter. The filter screen is used to limit the sand and gravel. The diameter of the sand and gravel in the multiple filters is distributed from large to small. A support frame is fixedly installed on the bottom outer wall of the drainage chamber.

[0008] In a preferred embodiment of this utility model, an arc-shaped frame is welded to the outer wall of the support frame, and two arc-shaped frames are provided at the top and bottom. The top and bottom outer walls of the filter are respectively engaged with the upper and lower arc-shaped frames.

[0009] In a preferred embodiment of this utility model, the top of the filter water tank is fixedly installed on the top of the drain tank by a support rod, and a viewing window is fixedly installed on the outer wall of the front end of the filter water tank.

[0010] In a preferred embodiment of this utility model, a second self-priming pump is fixedly installed on the bottom outer wall of the filter water tank, and the input end of the second self-priming pump is connected to the inner wall of the filter water tank.

[0011] In a preferred embodiment of this utility model, the output end of the second self-priming pump is fixedly connected to a return water pipe, and the output end of the return water pipe provides supplementary spray cooling to the semiconductor cutting area through a nozzle.

[0012] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

[0013] 1. By setting up a drainage assembly, a first self-priming pump is installed in the drainage assembly to accelerate the suction of sewage in the drainage chamber into multiple filters when draining sewage. This allows the sewage after cooling the semiconductor cutting equipment to be filtered through multiple filters in stages, thereby meeting the standard for reuse and improving the water-saving effect of the equipment.

[0014] 2. By using sand and gravel of different diameters as the material for filtering sewage, no consumables are generated. After the sand and gravel are used, they can be washed and reused without generating consumables, thus improving the practicality and economy of the equipment. Attached Figure Description

[0015] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0016] Figure 1 This is a schematic diagram of the main structure of a drainage device in a semiconductor cutting equipment.

[0017] Figure 2 This is a top view schematic diagram of the drainage device in a semiconductor cutting equipment.

[0018] Figure 3 A schematic diagram of the coarse filter plate structure in the drainage device of a semiconductor cutting equipment;

[0019] Figure 4 A bottom view schematic diagram of the drainage device in a semiconductor cutting equipment;

[0020] Figure 5 This is a schematic diagram of the drainage component structure in a drainage device of a semiconductor cutting equipment.

[0021] Figure 6 This is a schematic diagram of the filter water tank structure in the drainage device of a semiconductor cutting equipment.

[0022] In the diagram: Drainage chamber 100, clamping plate 110, filter plate 120, filter element 130, support leg 140.

[0023] Drainage assembly, first self-priming pump 200, drain pipe 210, first conduit 220, support frame 230, arc frame 231, filter 240, filter water tank 300, second conduit 310, support rod 320, viewing window 330, second self-priming pump 340, return water pipe 341. Detailed Implementation

[0024] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0025] Example 1: As Figures 1-4 The system includes a drainage chamber 100, a clamping plate 110 fixedly installed on the inner wall of the drainage chamber 100, a filter plate 120 inserted into the inner wall of the clamping plate 110, a filter element 130 detachably installed on the inner wall of the filter plate 120, a slope provided on the inner wall of the drainage chamber 100, and a drainage assembly fixedly installed on the outer wall of the bottom left side of the drainage chamber 100. The drainage assembly includes a first self-priming pump 200, the output shaft of the first self-priming pump 200 is connected to a filter 240 through a first conduit 220, and several filters 240 are provided. The output end of the end filter 240 is connected to the filtered water chamber 300 through a second conduit 310.

[0026] The specific application scenario of this embodiment is as follows: By setting up a drainage component, a first self-priming pump 200 is set up in the drainage component to accelerate the drainage of sewage in the drainage chamber 100 into multiple filters 240 when draining sewage. This allows the sewage after cooling the semiconductor cutting equipment to be filtered step by step through multiple filters 240, thereby meeting the standard for reuse and improving the water-saving effect of the equipment. By setting sand and gravel of different diameters as the material for filtering sewage, no consumables are generated. After the sand and gravel are used, they can be washed and reused without generating consumables, thus improving the practicality and economy of the equipment.

[0027] Example 2: As Figure 1 and Figure 4Support legs 140 are fixedly installed at the four corners of the bottom of the drainage chamber 100. The first self-priming pump 200 is fixedly installed on the bottom outer wall of the drainage chamber 100. The input end of the first self-priming pump 200 is fixedly connected to the bottom inner wall of the drainage chamber 100 through the drainage pipe 210. The inner wall of the filter 240 is filled with sand and gravel. The bottom inner wall of the filter 240 can be detachably installed with a filter screen. The filter screen is used to limit the sand and gravel. The diameter of the sand and gravel in the multiple filters 240 is distributed from large to small. The bottom outer wall of the drainage chamber 100 is fixedly installed with a support frame 230. The outer wall of the support frame 230 is welded to the arc frame 231. There are two arc frames 231 at the top and bottom. The top and bottom outer walls of the filter 240 are respectively engaged with the upper and lower arc frames 231.

[0028] The specific application scenario of this embodiment is as follows: by turning on the first self-priming pump 200, the first self-priming pump 200 delivers the wastewater filtered by the filter element 130 to the initial filter 240, where it is further filtered by the sand and gravel in the filter 240 to filter out large semiconductor cutting impurities. When the wastewater passes through several filters 240 in sequence, the sand and gravel of different coarseness are filtered in stages, so that the filtered wastewater can be reused, thereby saving water and ensuring that the semiconductor cutting equipment can continue to work even during short-term water outages.

[0029] Example 3: As Figure 4 and Figure 5 The top of the filter water tank 300 is fixedly installed on the top of the drain tank 100 by a support rod 320. A viewing window 330 is fixedly installed on the outer wall of the front end of the filter water tank 300. A second self-priming pump 340 is fixedly installed on the outer wall of the bottom end of the filter water tank 300. The input end of the second self-priming pump 340 is connected to the inner wall of the filter water tank 300. The output end of the second self-priming pump 340 is fixedly connected to the return water pipe 341. The output end of the return water pipe 341 provides supplementary spray cooling to the semiconductor cutting area through a nozzle.

[0030] The specific application scenario of this embodiment is as follows: the cleanliness of the filtered water in the filter water tank 300 is checked by viewing the window 330, and then the water in the filter water tank 300 is transported to the semiconductor cutting section for spraying by turning on the second self-priming pump 340 to cool and dissipate heat on the cutting wafer.

[0031] The working principle of this utility model is as follows: When used by those skilled in the art, the spray water used to cool the semiconductor cutting equipment is introduced into the drainage chamber 100. The sewage flows to the filter plate 120 under the action of gravity through the ramp. After being filtered by the filter element 130, the first self-priming pump 200 is turned on, so that the sewage filtered by the filter element 130 is transported to the initial filter 240. The sewage is further filtered by the sand and gravel in the filter 240, filtering out large semiconductor cutting impurities. When the sewage passes through several filters 240 in sequence, the sand and gravel of different coarseness are filtered in stages, so that the filtered sewage can be reused. The filtered water is transported to the filter water chamber 300. The cleanliness of the filtered water in the filter water chamber 300 is checked by viewing the window 330. Then, the second self-priming pump 340 is turned on to transport the water in the filter water chamber 300 to the semiconductor cutting part for spraying, cooling and heat dissipating the cutting blade.

[0032] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A drainage device of a semiconductor cutting apparatus, comprising a drainage bin (100), an inner wall of the drainage bin (100) fixedly mounting a clamping plate (110), and an inner wall of the clamping plate (110) being connected to a filter plate (120) through a plug-in connection, characterized in that, The filter plate (120) has a filter element (130) that can be detachably installed on its inner wall. The drainage chamber (100) has a slope on its inner wall. A drainage assembly is fixedly installed on the bottom outer wall of the left side of the drainage chamber (100). The drainage assembly includes a first self-priming pump (200). The output shaft of the first self-priming pump (200) is connected to a filter (240) through a first conduit (220). The filter (240) has several units. The output end of the end filter (240) is connected to the filter water chamber (300) through a second conduit (310).

2. The drain device for a semiconductor dicing apparatus according to claim 1, wherein The drainage chamber (100) has four fixed support legs (140) at the bottom corners. The first self-priming pump (200) is fixedly installed on the bottom outer wall of the drainage chamber (100). The input end of the first self-priming pump (200) is fixedly connected to the bottom inner wall of the drainage chamber (100) through the drainage pipe (210).

3. The semiconductor dicing apparatus according to claim 2, wherein The inner wall of the filter (240) is filled with sand and gravel. A filter screen is detachably installed on the bottom inner wall of the filter (240). The filter screen is used to limit the sand and gravel. The diameter of the sand and gravel in the multiple filters (240) is distributed from large to small. A support frame (230) is fixedly installed on the bottom outer wall of the drainage chamber (100).

4. The semiconductor dicing apparatus according to claim 3, wherein The outer wall of the support frame (230) is welded to the arc frame (231), and there are two arc frames (231) at the top and bottom. The top and bottom outer walls of the filter (240) are respectively engaged with the two arc frames (231).

5. The drain device for a semiconductor dicing apparatus according to claim 1, wherein The top of the filter water tank (300) is fixedly installed on the top of the drain tank (100) by a support rod (320), and a viewing window (330) is fixedly installed on the outer wall of the front end of the filter water tank (300).

6. The drain device for a semiconductor dicing apparatus according to claim 5, wherein A second self-priming pump (340) is fixedly installed on the bottom outer wall of the filter water tank (300), and the input end of the second self-priming pump (340) is connected to the inner wall of the filter water tank (300).

7. The semiconductor dicing apparatus according to claim 6, wherein The output end of the second self-priming pump (340) is fixedly connected to the return water pipe (341), and the output end of the return water pipe (341) provides supplementary spray cooling to the semiconductor cutting area through a nozzle.

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