Substrate stripping device

Abstract

The utility model relates to a substrate peeling apparatus. The device comprises a fixing mechanism which is used for fixing a crystal ingot and can rotate so as to drive the crystal ingot fixed to the fixing mechanism to rotate; the cutting mechanism comprises a first cutting unit and a second cutting unit which are respectively used for performing laser cutting and mechanical cutting on the rotating crystal ingot; and the driving mechanism is used for sequentially and periodically and alternately driving the first cutting unit and the second cutting unit when the crystal ingot rotates by one circle so as to respectively cut the crystal ingot on the same plane. Therefore, the surface roughness of the stripped substrate can be reduced, and the stripping efficiency can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor manufacturing technology, and more specifically, to a substrate stripping apparatus. Background Technology

[0002] Silicon carbide (SiC), as a third-generation semiconductor material, has excellent properties such as high hardness, high strength, high stability, and high wear resistance, and is widely used in automotive electronics, aerospace, communications and other technical fields.

[0003] Typically, SiC substrates are separated from SiC ingots by cutting them. Currently, mechanical cutting technology is commonly used for this separation. Mechanical cutting technology is a processing technique that uses mechanical tools, such as blades or saw blades, to apply mechanical force to the material to achieve separation; it belongs to the category of cold cutting technology.

[0004] However, mechanical cutting can result in chipping, fragmentation, or microcracks, leading to a rougher cut surface, such as burrs or irregular edges. This is especially true when the material is brittle or inhomogeneous, as the surface roughness is even worse, affecting the quality of the resulting substrate. Furthermore, poor surface roughness may necessitate further processing, such as grinding or polishing, which can reduce processing efficiency.

[0005] Furthermore, the wider kerf of mechanical cutting leads to material waste. Also, the slower cutting speed results in lower processing efficiency. Utility Model Content

[0006] This section provides a general overview of this disclosure, rather than a full disclosure of the entire scope or all features of this disclosure.

[0007] One object of this disclosure is to provide a substrate stripping apparatus capable of reducing the surface roughness of the stripped substrate.

[0008] Another object of this disclosure is to provide a substrate stripping apparatus that can improve processing efficiency.

[0009] Another object of this disclosure is to provide a substrate stripping apparatus that reduces material waste.

[0010] To achieve at least one of the above objectives, a substrate stripping apparatus is provided, comprising:

[0011] A fixing mechanism is used to fix the crystal ingot and is rotatable to drive the crystal ingot fixed thereto to rotate.

[0012] The cutting mechanism includes a first cutting unit and a second cutting unit for laser cutting and mechanical cutting of a rotating ingot, respectively; and

[0013] A drive mechanism is used to sequentially and periodically drive the first cutting unit and the second cutting unit alternately each time the ingot rotates once, so as to cut the ingot on the same plane respectively.

[0014] In some implementations, the drive mechanism may be configured to drive the second cutting unit to cut only the following region of the ingot: the region was cut by the first cutting unit before the ingot.

[0015] In some embodiments, the driving mechanism may include a sensing unit and a driving unit. The sensing unit is used to sense the rotation of the crystal ingot and send a signal to the driving unit every time the crystal ingot rotates once. The driving unit is used to alternately drive the first cutting unit and the second cutting unit to cut the crystal ingot according to the signal.

[0016] In some embodiments, the sensing unit may include a trigger portion and a sensing portion, the trigger portion being fixed to a fixing mechanism and rotating with the fixing mechanism, and the sensing portion being used to send a signal to the driving unit when the trigger portion passes by it.

[0017] In some embodiments, the drive unit may include a drive motor, a transmission unit, and an extrusion horn. The drive motor includes an output shaft and is capable of rotating the output shaft clockwise and counterclockwise according to a periodic signal. The transmission unit is used to transmit the clockwise and counterclockwise rotation of the output shaft to the extrusion horn so as to drive the extrusion horn to deflect clockwise and counterclockwise synchronously. The extrusion horn is used to drive the first cutting unit and the second cutting unit to cut the ingot by alternating extrusion through clockwise and counterclockwise deflection.

[0018] In some embodiments, the transmission unit may include a rotating shaft, a transmission belt, and two transmission discs. One end of the rotating shaft is connected to the extrusion horn, and the two transmission discs are respectively located at the output end of the output shaft and the other end of the rotating shaft. The transmission belt is sleeved on the two transmission discs.

[0019] In some embodiments, either the first cutting unit or the second cutting unit may include a pressing portion for receiving the pressing of the horn. The pressing portion includes a limiting portion, and the cutting mechanism further includes a limiting groove extending in a predetermined direction for receiving the limiting portion therein to restrict the movement of the limiting portion in the predetermined direction.

[0020] In some embodiments, either the first cutting unit or the second cutting unit may include a reset device for resetting the squeezed portion after the squeeze is released.

[0021] In some embodiments, the reset device may include a fixed partition and a reset spring. Either the first cutting unit or the second cutting unit includes a rod portion. The rod portions of the first cutting unit and the second cutting unit are respectively used to mount the laser cutting module and the cutting blade. The rod portion is connected to the extrusion portion and passes through the fixed partition. The reset spring is disposed between the extrusion portion and the fixed partition to reset the extrusion portion after the extrusion is released.

[0022] In some embodiments, the drive unit may also include a holding device for holding the extrusion horn in place of the extrusion portion when the extrusion horn deflects clockwise and counterclockwise.

[0023] In some embodiments, the retaining device may include a long tension spring connected to the extrusion horn and configured such that the extrusion horn retains the extrusion portion when the extrusion horn deflects clockwise and counterclockwise.

[0024] In some embodiments, the drive mechanism may further include a moving unit and a carrying unit, the cutting mechanism is mounted to the carrying unit, and the carrying unit is movable toward the ingot fixed to the fixing mechanism by the moving unit.

[0025] In some embodiments, the fixing mechanism may include an upper frustum and a lower frustum, which are used to fix the crystal ingot therebetween, and the upper and lower frustums are rotatable to drive the fixed crystal ingot to rotate.

[0026] According to the above technical solution, by first using a first cutting unit to laser-cut the ingot, it is possible to avoid chipping, fragmentation, and cracking of the ingot due to the application of mechanical force, which would otherwise cause roughness of the substrate surface. Furthermore, by immediately using a second cutting unit to mechanically cut the ingot on the cut surface created by the first cutting unit shortly after laser cutting, the protrusions generated by laser cutting can be cut off in the early stages after laser cutting. This reduces the roughness of the cut surface. In addition, since the roughness is effectively reduced, additional grinding processes can be reduced or even eliminated, thereby improving processing efficiency. Moreover, by performing laser cutting and mechanical cutting sequentially and alternately, material waste can be reduced, and peeling efficiency can be improved. Attached Figure Description

[0027] The features and advantages of embodiments of the present disclosure will become more readily understood from the following description with reference to the accompanying drawings. The drawings are not drawn to scale and some features may be enlarged or reduced to show detail of specific parts. In the drawings:

[0028] Figure 1 This is a schematic diagram of the substrate stripping apparatus according to an embodiment of the present disclosure.

[0029] Figure 2 To observe from another perspective Figure 1 The diagram shows the structure of the substrate stripping device.

[0030] Figure 3 for Figure 1 An enlarged view of circled part A in the image.

[0031] Figure 4 for Figure 1 A schematic top view of the substrate stripping device shown.

[0032] Figure 5 for Figure 4 The enlarged view of circled portion B in the image, where the upper part of this portion is omitted to clearly show the compression state of the extruded horn.

[0033] In the accompanying drawings, the same or corresponding technical features, parts or components are represented by the same or corresponding reference numerals. Detailed Implementation

[0034] The present disclosure will now be described in detail with reference to the accompanying drawings and exemplary embodiments. It should be noted that the following detailed description of the present disclosure is for illustrative purposes only and is not intended to limit the scope of the disclosure.

[0035] It should be noted that, for clarity, not all features of a particular embodiment are described or shown in the specification and drawings. Furthermore, to avoid unnecessary details obscuring the technical solutions of interest in this disclosure, only the device structures and parts closely related to the technical solutions of this disclosure are described and shown in the specification and drawings, while other details that are not closely related to the technical content of this disclosure and are known to those skilled in the art are omitted.

[0036] As discussed earlier, during mechanical cutting, especially when dealing with hard and brittle materials such as SiC, chipping, fragmentation, or cracking can easily occur, resulting in a rough cut surface, such as burrs or irregular edges. Moreover, the mechanical force applied during mechanical cutting may also introduce residual stress into the ingot, leading to cracks during subsequent processing or use.

[0037] Furthermore, mechanical cutting produces wider kerfs, especially for hard and brittle materials, where the kerf width can reach tens of micrometers, resulting in material waste. Moreover, mechanical cutting is slower, and when cutting hard materials, it can lead to greater tool wear, resulting in lower processing efficiency.

[0038] In view of this, according to embodiments of the present disclosure, a substrate stripping apparatus 1 is provided. Hereinafter, referring to... Figures 1 to 5 The substrate stripping device 1 will be described in detail.

[0039] It should be noted that the substrate stripping device 1 can be used for substrate stripping of any suitable material, and in particular, it can be used for substrate stripping of hard and brittle materials such as SiC.

[0040] The substrate stripping device 1 includes a fixing mechanism 10, a cutting mechanism 20, and a driving mechanism 30.

[0041] The fixing mechanism 10 is used to fix the crystal ingot 2 and can rotate to drive the crystal ingot 2 fixed thereon to rotate.

[0042] Ingot 2 can be, for example, a SiC ingot, or an ingot of other hard and brittle materials. Figure 1 As shown, the ingot 2 can rotate about its central axis under the drive of the fixing mechanism 10.

[0043] The cutting mechanism 20 includes a first cutting unit 210 and a second cutting unit 220 for laser cutting and mechanical cutting of the rotating ingot 2, respectively (see...). Figure 5 ).

[0044] For example, such as Figure 5 As shown, the first cutting unit 210 may include a laser cutting module 2110, which performs laser cutting on the rotating ingot 2. The second cutting unit 220 may include a cutting blade 2210, which performs mechanical cutting on the rotating ingot 2.

[0045] The driving mechanism 30 is used to sequentially drive the first cutting unit 210 and the second cutting unit 220, and can periodically drive the first cutting unit 210 and the second cutting unit 220 alternately every time the crystal ingot 2 rotates once, so as to cut the crystal ingot 2 on the same plane respectively.

[0046] Sequential driving refers to the process of peeling off the ingot 2, where the first cutting unit 210 is driven first for laser cutting, and then the second cutting unit 220 is driven for mechanical cutting. In addition, this driving mechanism 30 also has a periodic alternation, that is, when the ingot 2 completes one revolution, the driving mechanism 30 switches between the first cutting unit 210 and the second cutting unit 220.

[0047] In other words, when the ingot 2 begins its first rotation, the drive mechanism 30 first drives the first cutting unit 210 to perform laser cutting on the ingot 2 undergoing its first rotation. When the ingot 2 completes its first rotation and is ready to begin its second rotation, the drive mechanism 30 stops driving the first cutting unit 210 and simultaneously drives the second cutting unit 220 to perform mechanical cutting on the ingot 2 undergoing its second rotation. Then, when the ingot 2 completes its second rotation and is ready to begin its third rotation, the drive mechanism 30 stops driving the second cutting unit 220 and simultaneously drives the first cutting unit 210 to perform laser cutting on the ingot 2 undergoing its third rotation, and so on, until the substrate is completely peeled off.

[0048] Furthermore, the first cutting unit 210 and the second cutting unit 220 cutting the ingot 2 on the same plane means that the cutting plane of the first cutting unit 210 and the cutting plane of the second cutting unit 220 are the same and located on the same plane. In this case, the second cutting unit 220 performs further cutting on the cutting surface or area of ​​the ingot that was just cut by the first cutting unit 210.

[0049] During the stripping process, by first using the first cutting unit 210, the ingot 2 can be initially thermally expanded and cut, thus avoiding chipping, fragmentation, and cracking of the ingot due to applied mechanical force, which would otherwise roughen the substrate surface. After laser cutting, the substrate is not actually completely separated but remains in a "connected" state. In this case, as the substrate cools and separates, "stalagmite-like" protrusions will form on the substrate surface, increasing the surface roughness. By immediately using the second cutting unit 220 to mechanically cut the ingot 2 on the same plane, i.e., the cutting surface formed by the first cutting unit 210 before the laser cutting, after one cycle of laser cutting, these protrusions can be cut off in the early stages after the laser cutting ends. This reduces the roughness of the cut surface.

[0050] By alternately repeating the above cutting process until the substrate is completely peeled off, the surface roughness of the entire substrate can be reduced. Furthermore, since the roughness is effectively reduced, additional polishing processes can be reduced or even eliminated, thereby improving processing efficiency.

[0051] Furthermore, since laser cutting is used, and mechanical cutting is performed after laser cutting, the kerf width can be reduced, thus minimizing material waste. Moreover, because laser cutting is used, and mechanical cutting is only used to cut the protrusions of the ingot 2 in a "connected" state, the peeling efficiency can be improved, thereby increasing processing efficiency.

[0052] It is conceivable that the drive mechanism 30 can be configured to drive the second cutting unit 220 to cut only the following area of ​​the ingot 2: this area was cut by the first cutting unit 210 before the ingot.

[0053] In other words, the second cutting unit 220 only cuts the area (or cutting surface) of the ingot 2 that has just been cut by the first cutting unit 210. In this way, the second cutting unit 220 can only act on the protrusions of the ingot 2 that are in a "connected" state, rather than the parts of the ingot 2 that have not yet been cut by the first cutting unit 220. As a result, the cutting efficiency and effect can be further improved.

[0054] If the second cutting unit 220 mechanically cuts the area of ​​the crystal ingot 2 that was not cut by the first cutting unit 210, it may cause the crystal ingot 2 to produce fragments or microcracks, increasing the surface roughness of the stripped substrate.

[0055] It is also conceivable that the cutting area of ​​the second cutting unit 220 can be consistent with the cutting area of ​​the first cutting unit 210 immediately preceding it. In this way, the second cutting unit 220 can completely cut off all the protrusions formed after being cut by the first cutting unit 210 immediately preceding it, further improving the cutting effect and better reducing the surface roughness of the stripped substrate.

[0056] like Figure 1 and Figure 3 As shown more clearly in some embodiments, the drive mechanism 30 may include a sensing unit 310 and a drive unit 320. The sensing unit 310 is used to sense the rotation of the ingot 2 and send a signal to the drive unit 320 every time the ingot 2 rotates once. The drive unit 320 is used to alternately drive the first cutting unit 210 and the second cutting unit 220 to cut the ingot 2 according to the received signal.

[0057] For example, when the sensing unit 310 senses that the ingot 2 has started its first rotation, it sends a trigger signal to the driving unit 320, so that the driving unit 320 drives the first cutting unit 210 to perform laser cutting on the ingot 2 which is rotating for the first time. When the sensing unit 310 senses that the ingot 2 has completed its first rotation and is ready to start its second rotation, it sends another trigger signal to the driving unit 320, so that the driving unit 320 stops driving the first cutting unit 210 and simultaneously drives the second cutting unit 220 to perform mechanical cutting on the ingot 2 which is rotating for the second time.

[0058] For example, when the sensing unit 310 senses that the ingot 2 has rotated an odd number of times, the driving unit 320 can drive the first cutting unit 210 to perform laser cutting on the ingot 2, and when the sensing unit 310 senses that the ingot 2 has rotated an even number of times, the driving unit 320 can drive the second cutting unit 220 to perform mechanical cutting on the ingot 2, and so on, until the substrate is completely peeled off.

[0059] In this way, the alternating cutting of ingot 2 can be performed automatically, thereby reducing human intervention errors, improving the efficiency of substrate stripping, and increasing the accuracy of the switching time between laser cutting and mechanical cutting.

[0060] It is conceivable that, for example Figure 3 As shown, the sensing unit 310 may include a trigger portion 3110 and a sensing portion 3120. The trigger portion 3110 is fixed to the fixing mechanism 10 and rotates with the fixing mechanism 10. The sensing portion 3120 is used to send a signal to the driving unit 320 when the trigger portion 3110 passes by it.

[0061] By fixing the trigger portion 3110 to the fixing mechanism 10, the trigger portion 3110 can rotate synchronously with the fixing mechanism 10 and the ingot 2 fixed to the fixing mechanism 10. In this case, when the trigger portion 3110 rotates one revolution, it means that the ingot 2 has also rotated one revolution. Since the trigger portion 3110 passes through a fixed position every time it rotates one revolution, by having the sensing portion 3120 sense the trigger portion 3110 passing through the fixed position, the number of revolutions of the ingot 2 can be sensed, thereby accurately sending a signal to the drive unit 320 to switch between laser cutting and mechanical cutting.

[0062] like Figures 3 to 5 As shown, in some embodiments, the drive unit 320 may include a drive motor 3210, a transmission unit 3220, and a pressing horn 3230.

[0063] The drive motor 3210 includes an output shaft 3211, which is capable of rotating clockwise and counterclockwise according to a periodic signal from the sensing unit 310. The transmission unit 3220 transmits the clockwise and counterclockwise rotation of the output shaft 3211 to the extrusion horn 3230, causing the extrusion horn 3230 to deflect clockwise and counterclockwise synchronously. The extrusion horn 3230 drives the first cutting unit 210 and the second cutting unit 220 to cut the ingot 2 through alternating clockwise and counterclockwise deflection and extrusion.

[0064] Specifically, when the ingot 2 begins its first rotation, the sensing unit 310 senses the start of rotation and sends a trigger signal to the drive motor 3210. Upon receiving the trigger signal, the drive motor 3210 starts and causes the output shaft 3211 to rotate counter-clockwise. The transmission unit 3220 transmits the counter-clockwise rotation of the output shaft 3211 to the extrusion horn 3230, causing the extrusion horn 3230 to simultaneously deflect counter-clockwise. Figure 5 (As shown in the diagram). The counter-clockwise deflecting extrusion horn 3230 presses against the first cutting unit 210 through one of its horn ends, driving it to contact the ingot 2 and perform laser cutting on the ingot 2. Similarly, when the ingot 2 begins its second rotation, the sensing unit 310 senses the end of the first rotation and the start of the second rotation, and sends a trigger signal to the drive motor 3210 again. Upon receiving the trigger signal, the drive motor 3210 causes the output shaft 3211 to rotate clockwise. Through the transmission unit 3220, the clockwise rotation of the output shaft 3211 is transmitted to the extrusion horn 3230, causing the extrusion horn 3230 to deflect clockwise synchronously. The clockwise deflecting extrusion horn 3230 presses against the second cutting unit 220 through its other horn end, driving it to contact the ingot 2 and perform mechanical cutting on the ingot 2. This process continues until the substrate is completely peeled off.

[0065] With the above structure, the number of rotations of the crystal ingot 2 can be associated with the periodic alternating drive of the first cutting unit 210 and the second cutting unit 220, which not only enables a simpler structure, but also allows for accurate switching between laser cutting and mechanical cutting.

[0066] It is understandable that other structures capable of periodic alternating drive can also be envisioned, without limitation here.

[0067] In some implementations, such as Figure 3 As shown, the transmission unit 3220 may include a rotating shaft 3221, a transmission belt 3222, and two transmission discs 3223.

[0068] One end of the rotating shaft 3221 is connected to the extruded horn 3230. Two transmission discs 3223 are respectively located at the output end of the output shaft 3211 and the other end of the rotating shaft 3221. The conveyor belt 3222 is fitted onto the two transmission discs 3223.

[0069] In this manner, the counterclockwise and clockwise rotations of the output shaft 3211 of the drive motor 3210 can be transmitted to the rotating shaft 3221 via the conveyor belt 3222, causing the rotating shaft 3221 to rotate accordingly, thereby driving the extrusion horn 3230 connected to the rotating shaft 3221 to deflect counterclockwise and clockwise synchronously. This provides a smoother power transmission, enabling the first cutting unit 210 and the second cutting unit 220 driven by this transmission to cut the ingot 2 more smoothly and thus more precisely.

[0070] It is conceivable that the transmission unit 3220 can take any other suitable form. For example, the transmission unit 3220 may include gears, hydraulic mechanisms, etc.

[0071] like Figure 3 and Figure 5 As shown, in some embodiments, either the first cutting unit 210 or the second cutting unit 220 may include a pressing portion 2120 for receiving the pressing of the pressing horn 3230. The pressing portion 2120 includes a limiting portion 2121. The cutting mechanism 20 also includes a limiting groove 230 extending in a predetermined direction for receiving the limiting portion 2121 therein to restrict the movement of the limiting portion 2121 in the predetermined direction.

[0072] When the extrusion horn 3230 deflects clockwise and counterclockwise, the extrusion portion 2120 is subjected to extrusion from the horn end of the extrusion horn 3230. At this time, the limiting portion 2121 of the extrusion portion 2120 moves along the limiting groove 230 under the extrusion action. Since the limiting groove 230 extends in a predetermined direction, the movement of the limiting portion 2121 is also restricted in that predetermined direction, so that the first cutting unit 210 and the second cutting unit 220 also move in the predetermined direction, and thus both the first cutting unit 210 and the second cutting unit 220 can cut the ingot 2 at a predetermined cutting angle. For example, the predetermined direction can be the optimal cutting direction for the first cutting unit 210 and the second cutting unit 220 for the ingot 2.

[0073] For example, such as Figure 3 and Figure 5 As shown, the extrusion portion 2120 can be an extrusion block, and the limiting portion 2121 can be a limiting slider formed on the extrusion block. The cutting mechanism 20 can, exemplarily, be provided with a lower plate 240 and an upper plate 250. A limiting groove 230 can be formed at corresponding positions on the lower plate 240 and the upper plate 250. The limiting portion 2121 is inserted into the limiting groove 230 and can slide within the limiting groove 230. Any other suitable form of the limiting groove 230 is conceivable and is not limited here.

[0074] In this way, the cutting direction of the ingot 2 can always be kept in the desired predetermined direction, and will not change due to clockwise or counterclockwise deflection of the horn end of the extrusion horn 3230. It can also prevent the cutting direction from shifting due to vibration or other reasons. As a result, the cutting accuracy can be improved, and thus the surface quality of the stripped substrate can be improved.

[0075] In some implementations, such as Figure 5 As shown, either the first cutting unit 210 or the second cutting unit 220 may include a reset device 2130, which is used to reset the squeezed portion 2120 after the squeezed horn 3230 is released.

[0076] By resetting the extrusion portion 2120 using the reset device 2130, the first cutting unit 210 (specifically, for example, the laser cutting module 2110 mentioned below) and the second cutting unit 220 (specifically, for example, the cutting blade 2210 mentioned below) can each disengage from the cut portion of the ingot 2 after cutting. This prevents the first and second cutting units 210 from adversely affecting subsequent cutting operations if they are not disengaged, thus avoiding an increase in the grain size of the substrate surface. Furthermore, resetting the extrusion portion 2120 helps the extrusion horn 3230 apply firm pressure to the first and second cutting units 210 and 220, thereby preventing wobbling and instability during cutting and improving cutting accuracy and quality.

[0077] For example, the reset device 2130 may include a fixed partition 2131 and a reset spring 2132. Either the first cutting unit 210 and the second cutting unit 220 may include a rod portion 2140. The rod portion 2140 of the first cutting unit 210 and the second cutting unit 220 are respectively used to install the laser cutting module 2110 and the cutting blade 2210. The rod portion 2140 is connected to the extrusion portion 2120 and passes through the fixed partition 2131. The reset spring 2132 is disposed between the extrusion portion 2120 and the fixed partition 2131 to reset the extrusion portion 2120 after the extrusion is released.

[0078] However, it is conceivable that the reset device 2130 may take any other suitable form, which is not limited here.

[0079] In some implementations, such as Figure 5 As shown, the drive unit 320 may also include a holding device 3240, which is used to keep the extrusion horn 3230 in the extrusion part 2120 when the extrusion horn 3230 deflects clockwise and counterclockwise.

[0080] In this way, the stability of the extrusion horn 3230 on the extrusion portion 2120 can be improved, thereby improving the cutting stability. Moreover, by setting the holding device 3240, after the extrusion horn 3230 deflects clockwise and counterclockwise, even if the drive motor 3210 is de-energized, the extrusion horn 3230 can still firmly fix the extrusion portion 2120, thus enabling the corresponding cutting unit to continue cutting the ingot 2, thereby effectively preventing the adverse effects on the cutting operation that may be caused by the lack of driving force.

[0081] For example, the retaining device 3240 may include a long tension spring 3241 connected to the compression horn 3230 and configured such that the compression horn 3230 retains the compression portion 2120 when the compression horn 3230 deflects clockwise and counterclockwise.

[0082] For example, such as Figure 5 As shown, the extruded horn 3230 is disposed on the lower plate 240. The waist of the extruded horn 3230 is protruding. The protruding end of the protrusion is provided with a movable post 3231. The right end of the lower plate 240 is provided with a fixed post 2410. A long tension spring 3241 is connected between the movable post 3231 and the fixed post 2410.

[0083] In some implementations, such as Figure 1 and Figure 2 As shown, the drive mechanism 30 may further include a moving unit 330 and a supporting unit 340. The cutting mechanism 20 is mounted to the supporting unit 340, and the supporting unit 340 is movable toward the ingot 2 fixed to the fixing mechanism 10 via the moving unit 330.

[0084] During the cutting process, as the cut deepens, the cutting units (including the first cutting unit 210 and the second cutting unit 220) need to advance a suitable distance to contact the cut of the ingot 2 and cut the ingot 2. By mounting the cutting mechanism 20 to the support unit 340 and enabling the support unit 340 to move towards the ingot 2 via the moving unit 330, the cutting units can continue to advance towards the ingot 2 after each round of laser cutting and mechanical cutting to perform the next round of laser cutting and mechanical cutting, until the entire substrate is peeled off.

[0085] For example, the moving unit 330 can be a slide rail, and the supporting unit 340 can be disposed on the moving unit 330 and be able to slide on the moving unit 330. It is conceivable that the distance between the first cutting unit 210 and the second cutting unit 220 and the ingot 2 can be detected so that the distance can be continuously adjusted during the periodic alternating cutting process until the substrate is finally completely peeled off.

[0086] In some implementations, such as Figure 1 and Figure 2 As shown, the fixing mechanism 10 may include an upper frustum 110 and a lower frustum 120. The upper frustum 110 and the lower frustum 120 are used to fix the crystal ingot 2 therebetween, and the upper frustum 110 and the lower frustum 120 are rotatable to drive the fixed crystal ingot 2 to rotate.

[0087] The upper frustum 110 and the lower frustum 120 contact the ingot 2 from above and below, respectively, to jointly fix the ingot 2. This provides a more secure fixation of the ingot 2, preventing it from shifting or falling off during rotation and ensuring the stability of the cutting process. Furthermore, since both the upper frustum 110 and the lower frustum 120 are circular, their rotation speed is more uniform. This allows the ingot 2, fixed to them, to rotate at a uniform speed, resulting in more even stress on the ingot 2 during cutting and improving the quality of the stripped substrate.

[0088] It is conceivable that the fixing mechanism 10 may include a rotating unit 130, which drives the lower frustum 120 to rotate and drives the crystal ingot 2 and the upper frustum 110 to rotate together through the contact between the crystal ingot 2 and the lower frustum 120 and the upper frustum 110.

[0089] In some embodiments, the substrate stripping apparatus 1 may further include a support device 40 for supporting the fixing mechanism 10, the cutting mechanism 20 and the driving mechanism 30.

[0090] For example, such as Figure 1 and Figure 2 As shown, the support device 40 may include a base 410 and a frame 420, wherein the base 410 is used to support the cutting mechanism 20, the driving mechanism 30 and the lower frustum 120, and the frame 420 is used to support the upper frustum 110.

[0091] While this disclosure has been described with reference to exemplary embodiments, it should be understood that this disclosure is not limited to the specific embodiments described and shown herein. Various changes to the exemplary embodiments can be made by those skilled in the art without departing from the scope defined by the claims of this disclosure.

[0092] The features mentioned and / or shown in the foregoing description of exemplary embodiments of this disclosure may be combined in the same or similar manner with one or more other embodiments, combined with features in other embodiments, or substituted for corresponding features in other embodiments. Such combinations or substitutions should also be considered as including within the scope of protection of this disclosure.

Claims

1. A substrate stripping device, characterized in that, include: A fixing mechanism for fixing a crystal ingot and capable of rotation to drive the crystal ingot fixed thereto to rotate; The cutting mechanism includes a first cutting unit and a second cutting unit for laser cutting and mechanical cutting of the rotating ingot, respectively; as well as A drive mechanism is used to sequentially and periodically drive the first cutting unit and the second cutting unit alternately each time the ingot rotates once, so as to cut the ingot in the same plane.

2. The substrate peeling apparatus according to claim 1, wherein The drive mechanism is configured to drive the second cutting unit to cut only the following region of the ingot: the region was cut by the first cutting unit before the ingot.

3. The substrate peeling apparatus according to claim 1 or 2, characterized by The driving mechanism includes a sensing unit and a driving unit. The sensing unit is used to sense the rotation of the crystal ingot and send a signal to the driving unit every time the crystal ingot rotates once. The driving unit is used to alternately drive the first cutting unit and the second cutting unit to cut the crystal ingot according to the signal.

4. The substrate peeling apparatus according to claim 3, wherein The sensing unit includes a triggering part and a sensing part. The triggering part is fixed to the fixing mechanism and rotates with the fixing mechanism. The sensing part is used to send the signal to the driving unit when the triggering part passes by it.

5. The substrate peeling apparatus according to claim 3, wherein The driving unit includes a drive motor, a transmission unit, and an extrusion horn. The drive motor includes an output shaft and is capable of rotating clockwise and counterclockwise according to the periodic signal. The transmission unit transmits the clockwise and counterclockwise rotation of the output shaft to the extrusion horn, thereby driving the extrusion horn to deflect clockwise and counterclockwise synchronously. The extrusion horn drives the first cutting unit and the second cutting unit to cut the ingot through alternating extrusion via the clockwise and counterclockwise deflection.

6. The substrate stripping apparatus according to claim 5, characterized in that, The transmission unit includes a rotating shaft, a transmission belt, and two transmission discs. One end of the rotating shaft is connected to the extruded bullhorn, and the two transmission discs are respectively located at the output end of the output shaft and the other end of the rotating shaft. The transmission belt is sleeved on the two transmission discs.

7. The substrate peeling apparatus according to claim 5, wherein Each of the first cutting unit and the second cutting unit includes a pressing portion for receiving the pressing of the pressing horn. The pressing portion includes a limiting portion. The cutting mechanism further includes a limiting groove extending in a predetermined direction for receiving the limiting portion therein to restrict the movement of the limiting portion in the predetermined direction.

8. The substrate peeling apparatus according to claim 7, wherein Each of the first cutting unit and the second cutting unit includes a reset device for resetting the squeezed portion after the squeeze is released.

9. The substrate peeling apparatus according to claim 8, wherein The reset device includes a fixed partition and a reset spring. Either the first cutting unit or the second cutting unit includes a rod. The rod of the first cutting unit and the second cutting unit are respectively used to install the laser cutting module and the cutting blade. The rod is connected to the extrusion part and passes through the fixed partition. The reset spring is disposed between the extrusion part and the fixed partition to reset the extrusion part after the extrusion is released.

10. The substrate peeling apparatus according to claim 7, wherein The drive unit also includes a holding device, which is used to keep the extrusion horn pressing the extrusion portion when the extrusion horn deflects clockwise and counterclockwise.

11. The substrate peeling apparatus according to claim 10, wherein The retaining device includes a long tension spring connected to the extrusion horn and configured such that when the extrusion horn undergoes the clockwise and counterclockwise deflection, the extrusion horn remains in pressure on the extrusion portion.

12. The substrate peeling apparatus according to claim 1, wherein The driving mechanism further includes a moving unit and a carrying unit. The cutting mechanism is mounted to the carrying unit, and the carrying unit is capable of moving toward the ingot fixed to the fixing mechanism via the moving unit.

13. The substrate peeling apparatus according to claim 1, wherein The fixing mechanism includes an upper frustum and a lower frustum, which are used to fix the crystal ingot therebetween, and the upper frustum and the lower frustum are rotatable to drive the fixed crystal ingot to rotate.

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