Semiconductor device damping press-fitting mechanism

Abstract

The utility model discloses a semiconductor device damping press-fitting mechanism, which comprises a base, a turntable, a jacking device, a guide pillar, a carrier, a stand column, a first sliding sleeve, a lifting seat, a pressing plate and a first cushion block, a plurality of guide sleeves are arranged on the turntable in an annular array mode, the guide pillar is vertically arranged in the guide sleeve, the first cushion block is arranged at the bottom of the guide pillar and located below the turntable, and the lifting seat is arranged on the base. The stand column is arranged on the base and located on one side of the rotary disc, the first sliding sleeve is arranged on the stand column in a lifting adjusting mode, the lifting base is arranged on one side of the first sliding sleeve, the pressing plate is arranged on one side of the lifting base and horizontally extends to the position above the path, rotating along with the rotary disc, of the guide column on the rotary disc, and the jacking device is arranged on the base and located below the guide column below the pressing plate. The carrier is arranged at the top of the guide column, the jacking device is used for driving the guide column and the semiconductor device to ascend, automatic press fitting of the semiconductor device is achieved, stress of the rotary disc is reduced, vibration of the rotary disc in the press fitting process is reduced, and the semiconductor devices on other carriers on the rotary disc are prevented from falling off.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device press-fit technology, and in particular to a semiconductor device shock-absorbing press-fit mechanism. Background Technology

[0002] In the semiconductor device manufacturing process, some steps require a pressing mechanism to apply pressure to the semiconductor device to ensure that it is properly assembled. For example, utility model patent application number 2019219392370 discloses a pressing mechanism for semiconductor devices that is easy to clean, which presses the semiconductor device below into place by lowering the pressure head.

[0003] To improve press-fitting production efficiency, semiconductor devices can be placed on a turntable, and the semiconductor devices can be switched by rotating the turntable to perform press-fitting in a cycle. However, each time the press head descends to press the semiconductor device, it will transmit pressure to the turntable, causing the turntable to vibrate. This affects the stability of semiconductor devices in other stations on the turntable and may even cause the semiconductor devices to fall off. Improvements are needed. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor device vibration damping pressing mechanism for automatic pressing of semiconductor devices and to reduce the vibration of the turntable during the pressing process.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A semiconductor device vibration damping and pressing mechanism includes: a base, a turntable, a lifting device, guide pillars, a carrier, a column, a first sliding sleeve, a lifting seat, a pressure plate, and a first pad. The turntable is rotatably and horizontally disposed above the base. Several guide sleeves are arranged in a circular array on the turntable. The guide pillars are vertically disposed in the guide sleeves. The first pad is disposed at the bottom of the guide pillars and below the turntable. The column is disposed on the base and located on one side of the turntable. The first sliding sleeve is adjustablely disposed on the column. The lifting seat is disposed on one side of the first sliding sleeve. The pressure plate is disposed on one side of the lifting seat and extends horizontally above the path of the guide pillars on the turntable as the turntable rotates. The lifting device is disposed on the base and located below the guide pillars below the pressure plate. The carrier is disposed on the top of the guide pillars.

[0007] The base is equipped with a cam divider that drives the turntable to rotate.

[0008] The input end of the cam divider is equipped with a motor.

[0009] The guide post has a recessed guide groove extending downward on one side, and the guide sleeve has an anti-rotation pin extending into the guide groove.

[0010] The bottom surface of the pressure plate is provided with a second pad, and the first pad and the second pad are respectively made of rubber pads.

[0011] The lifting device is a pneumatic cylinder or a hydraulic cylinder, and a push plate is provided on the top of the lifting device.

[0012] The column is provided with a second sliding sleeve located below the first sliding sleeve, and the side of the second sliding sleeve is provided with a displacement sensor that points horizontally toward the guide column above the lifting device.

[0013] The first and second sliding sleeves are respectively provided with fastening screws pointing towards the column.

[0014] The carrier has a recessed positioning groove corresponding to the semiconductor device.

[0015] The beneficial effects of this utility model are as follows: A semiconductor device shock-absorbing pressing mechanism places the semiconductor device on a carrier, which is transferred to the bottom of the pressure plate as the turntable rotates. The lifting device drives the guide column and the semiconductor device to rise, so that the semiconductor device comes into contact with the pressure plate or the second pad on the bottom surface of the pressure plate and is pressed, thereby realizing automatic pressing of the semiconductor device and reducing the force on the turntable, thereby reducing the vibration of the turntable during the pressing process, preventing the semiconductor devices on other carriers on the turntable from falling off, and ensuring the orderly pressing of semiconductor devices. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 yes Figure 1 A schematic diagram of the structure after the central guide column rises. Detailed Implementation

[0018] The following is combined Figures 1-2 The technical solution of this utility model will be further illustrated through specific embodiments.

[0019] like Figure 1 The semiconductor device shock absorption and pressing mechanism shown is used for pressing semiconductor device 14. It includes: base 1, turntable 17, lifting device 4, guide column 19, carrier 16, column 8, first sliding sleeve 9, lifting seat 11, pressure plate 12 and first pad 5. The turntable 17 is rotatably and horizontally arranged above the base 1. In this embodiment, the base 1 is provided with a cam divider 2 that drives the turntable 17 to rotate. The input end of the cam divider 2 is provided with a motor 22. The motor 22 can be rotated by a PLC to drive the cam divider 2 to drive the turntable 17 to rotate at a certain angle.

[0020] Two to four guide sleeves 20 are arranged in a circular array on the turntable 17. The guide sleeves 20 are fixed to the turntable 17 with screws and rotate with the turntable 17. The guide post 19 is vertically arranged in the guide sleeve 20 to guide the rise and fall of the guide post 19. A downwardly extending guide groove 21 is recessed on one side of the guide post 19. An anti-rotation pin 18 extending into the guide groove 21 is provided in the guide sleeve 20. The cooperation between the anti-rotation pin 18 and the guide groove 21 can not only prevent the guide post 19 from rotating on its own, but also limit the descent stroke of the guide post 19, so as to prevent the guide post 19 from falling off the guide sleeve 20, thus ensuring high safety.

[0021] The carrier 16 is disposed on the top of the guide post 19. The carrier 16 is recessed and has a positioning groove 15 corresponding to the semiconductor device 14. The semiconductor device 14 is placed on the carrier 16 and the bottom of the semiconductor device 14 is positioned by the positioning groove 15.

[0022] The column 8 is mounted on the base 1 and located on one side of the turntable 17. The column 8 is welded or screwed to the base 1, ensuring structural stability and preventing interference from the turntable 17. The first sliding sleeve 9 is adjustablely mounted on the column 8. The lifting seat 11 is located on one side of the first sliding sleeve 9 and can be fixed to the first sliding sleeve 9 with screws. Its height is adjustable along with the first sliding sleeve 9 to accommodate the pressing stroke and improve adaptability to semiconductor devices.

[0023] like Figure 1 As shown, the pressure plate 12 is disposed on one side of the lifting seat 11 and extends horizontally to the top of the path of the guide column on the turntable 17 as the turntable rotates. The pressure plate 12 and the lifting seat 11 can adopt an integrated aluminum alloy structure, which is lightweight and has high strength.

[0024] The lifting device 4 is set on the base 1 and located below the guide column below the pressure plate. In this embodiment, the lifting device 4 is a cylinder or a hydraulic cylinder. The top of the lifting device 4 is provided with a push plate 3. The extension and retraction of the lifting device 4 is controlled by a PLC, which drives the push plate 3 to rise and fall.

[0025] The first pad 5 is placed at the bottom of the guide post 19 and below the turntable 17. During the upward movement of the push plate 3, it comes into contact with the first pad 5, which drives the guide post 19 to rise and effectively avoids impact on the guide post 19, reducing vibration.

[0026] A second pad 13 is provided on the bottom surface of the pressure plate 12. Both the first pad 5 and the second pad 13 are rubber pads for elastic cushioning to prevent damage to the semiconductor device 14. The semiconductor device 14 is placed on the carrier 16 and transferred to the area below the pressure plate 12 as the turntable 17 rotates. The lifting device 4 then drives the guide column 19 and the semiconductor device 14 to rise. Figure 2As shown, the semiconductor device 14 is brought into contact with the pressure plate 12 or the second pad 13 on the bottom surface of the pressure plate and is subjected to pressure, thereby realizing the automatic pressing of the semiconductor device 14.

[0027] like Figure 2 As shown, the guide column 19 presses the semiconductor device 14 during the lifting process, reducing the force on the turntable 17, thereby reducing the vibration of the turntable 17 during the pressing process, preventing the semiconductor devices on other carriers on the turntable 17 from falling off, and ensuring the orderly pressing of the semiconductor devices.

[0028] Furthermore, a second sliding sleeve 7 is provided on the column 8, located below the first sliding sleeve. The first and second sliding sleeves 9 and 7 are respectively equipped with fastening screws 10 pointing towards the column, facilitating height adjustment and subsequent tightening of the first and second sliding sleeves 9 and 7. A displacement sensor 6 is provided on the side of the second sliding sleeve 7, pointing horizontally towards the guide column above the lifting device 4. The displacement sensor 6 detects the guide column rotating above the lifting device 4. The displacement sensor 6 is connected to the PLC controller and sends signals. When the guide column is detected to have rotated above the lifting device 4, the rotation of the motor 22 is stopped, the lifting device 4 extends, and the push plate 3 rises. During the rise, it contacts the first pad 5, driving the guide column 19 to rise, thus achieving automatic pressing of the semiconductor device.

[0029] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A semiconductor device shock absorbing press-fit mechanism, comprising: include: The system comprises a base, a turntable, a lifting device, guide columns, a carrier, a column, a first sliding sleeve, a lifting seat, a pressure plate, and a first pad. The turntable is rotatably and horizontally positioned above the base. Several guide sleeves are arranged in a circular array on the turntable. The guide columns are vertically positioned within the guide sleeves. The first pad is positioned at the bottom of the guide columns and below the turntable. The column is positioned on the base and located on one side of the turntable. The first sliding sleeve is adjustablely positioned on the column. The lifting seat is positioned on one side of the first sliding sleeve. The pressure plate is positioned on one side of the lifting seat and extends horizontally above the path of the guide columns on the turntable as the turntable rotates. The lifting device is positioned on the base and below the guide columns below the pressure plate. The carrier is positioned on top of the guide columns.

2. The shock absorbing press-pack mechanism for a semiconductor device according to claim 1, wherein The base is equipped with a cam divider that drives the turntable to rotate.

3. The shock absorbing press-pack mechanism for a semiconductor device according to claim 2, wherein The input end of the cam divider is equipped with a motor.

4. The shock absorbing press-pack mechanism for semiconductor devices according to claim 1, wherein The guide post has a recessed guide groove extending downwards on one side, and the guide sleeve has an anti-rotation pin extending into the guide groove.

5. The shock absorbing press-fit mechanism for semiconductor devices of claim 1, wherein, The bottom surface of the pressure plate is provided with a second pad, and the first pad and the second pad are respectively made of rubber pads.

6. The shock absorbing press-fit mechanism for semiconductor devices of claim 1, wherein, The lifting device uses a pneumatic cylinder or a hydraulic cylinder, and a push plate is provided on the top of the lifting device.

7. The shock absorbing press-fit mechanism for semiconductor devices of claim 1, wherein, The column is provided with a second sliding sleeve located below the first sliding sleeve, and a displacement sensor is provided on the side of the second sliding sleeve, pointing horizontally toward the guide column above the lifting device.

8. The shock absorbing press-fit mechanism for semiconductor devices of claim 7, wherein, The first and second sliding sleeves are respectively provided with fastening screws pointing towards the column.

9. The shock absorbing press-fit mechanism for semiconductor devices of claim 1, wherein, The carrier has a recessed positioning groove corresponding to the semiconductor device.

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