Polishing tool for peripheral end face of wafer base

Abstract

The utility model discloses a wafer base peripheral end face polishing tool which comprises two sets of front-back polishing mechanisms and two sets of left-right polishing mechanisms which are oppositely installed on the periphery of a wafer base. The front-back grinding mechanism comprises a transversely-arranged first driving assembly and a grinding scraper assembly installed on the first driving assembly, and the left-right grinding mechanism comprises a longitudinally-arranged second driving assembly and a grinding scraper assembly installed on the second driving assembly. The tops of the left and right grinding mechanisms are connected through a top plate and synchronously move along the second driving assembly, and the grinding tool is provided with a dust collection assembly. Secondary polishing is achieved through the polishing scraper driven by the air cylinder and the polishing wheel driven by the motor, the polishing effect is improved, the four end faces of the wafer base are polished at the same time, the polishing efficiency is further improved, raised dust generated at the polishing station is effectively cleaned through the arranged dust collection assembly, and cleanliness of the production environment is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a grinding fixture for the outer peripheral end face of a wafer substrate. Background Technology

[0002] Quartz crystal is an important electronic material. Quartz wafers cut along a certain direction not only have piezoelectric effect, but also excellent mechanical, electrical and temperature characteristics. Resonators, oscillators and filters designed and made with quartz crystal have outstanding advantages in frequency stabilization and selection. In wafer processing, polishing is an important step. In the existing technology, there are buffer stations and polishing stations in the same space. After the opposite side of the wafer base is polished, it needs to be rotated 90° to polish the adjacent side, which affects the polishing efficiency. Utility Model Content

[0003] To address the aforementioned technical problems, a grinding fixture for the outer peripheral end face of a wafer substrate is provided.

[0004] To achieve the above objectives, this utility model discloses a grinding fixture for the outer peripheral end face of a wafer base, including a front-to-back grinding mechanism and a left-to-right grinding mechanism installed opposite to each other. Two sets of the front-to-back grinding mechanism and the left-to-right grinding mechanism are respectively provided and installed around the wafer base. The front-to-back grinding mechanism includes a first drive component arranged laterally and a grinding scraper component installed on the first drive component. The left-to-right grinding mechanism includes a second drive component arranged longitudinally and a grinding scraper component installed on the second drive component. The tops of the left-to-right grinding mechanisms are connected through a top plate and move synchronously along the second drive component. The grinding fixture is equipped with a dust collection component.

[0005] Furthermore, the grinding scraper assembly includes a mounting base, on which a drive cylinder is mounted. The output end of the drive cylinder is connected to a mounting block. A grinding motor is mounted on the top of the mounting block. The output end of the grinding motor passes through the mounting block and is connected to a grinding wheel. Grinding scrapers are symmetrically mounted on both sides of the grinding wheel.

[0006] Furthermore, the inner side of the grinding scraper is connected to the mounting block, the outer side of the grinding scraper is floatingly connected to the mounting block via a spring, and the outer side of the grinding scraper is provided with an arc-shaped blade structure.

[0007] Furthermore, the first drive component is a lead screw motor structure, and the sliding seat in the lead screw motor structure is connected to the corresponding grinding scraper assembly mounting seat.

[0008] Furthermore, the second drive component is a gear and rack structure. A drive motor is installed below the top plate of the left and right grinding mechanisms. The output end of the drive motor is connected to a gear and meshes with a rack located on the outside of the left and right grinding mechanisms. A channel steel is provided at the bottom of the rack, with the opening of the channel steel facing the grinding scraper assembly. A guide wheel matching the channel steel is installed below the gear.

[0009] Furthermore, the vacuuming assembly includes a vacuum cleaner and a vacuuming port mounted on the mounting block end face of the grinding scraper assembly. The vacuuming port is connected to a multi-port connector on the top of the vacuum cleaner via a hose and moves synchronously with the grinding mechanism.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model discloses a grinding fixture for the outer peripheral end face of a wafer base. It achieves secondary grinding through a grinding scraper driven by a cylinder and a grinding wheel driven by a motor, thereby improving the grinding effect. It can simultaneously grind the four end faces of the wafer base, further improving the grinding efficiency. The configured dust collection component effectively cleans up the dust generated at the grinding station, ensuring a clean production environment. Attached Figure Description

[0011] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0013] Figure 2 This is a schematic diagram of the left and right grinding mechanism of this utility model.

[0014] Figure 3 This is a schematic diagram of the front and rear grinding mechanism of this utility model.

[0015] Figure 4 This is a schematic diagram of the grinding scraper assembly of this utility model.

[0016] In the diagram: 1 is the front and rear grinding mechanism; 11 is the first drive assembly; 2 is the left and right grinding mechanism; 21 is the second drive assembly; 211 is the drive motor; 212 is the gear; 213 is the rack; 214 is the channel steel; 215 is the guide wheel; 22 is the top plate; 3 is the grinding scraper assembly; 31 is the mounting base; 32 is the drive cylinder; 33 is the mounting block; 34 is the grinding motor; 35 is the grinding wheel; 36 is the grinding scraper; 4 is the dust collection assembly; 41 is the vacuum cleaner; 42 is the dust collection interface; 43 is the multi-port connector. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] One embodiment of this utility model is as follows: Figure 1 As shown, two sets of front and rear grinding mechanisms 1 and left and right grinding mechanisms 2 are respectively provided and installed around the wafer base. The front and rear grinding mechanism 1 includes a first drive component 11 arranged horizontally and a grinding scraper component 3 installed on the first drive component 11. The left and right grinding mechanisms 2 include a second drive component 21 arranged vertically and a grinding scraper component 3 installed on the second drive component 21. The tops of the left and right grinding mechanisms 2 are connected by a top plate 22 and move synchronously along the second drive component 21. The grinding fixture is equipped with a dust collection component 4. Secondary grinding is achieved through the grinding scraper driven by a cylinder and the grinding wheel driven by a motor, which improves the grinding effect. The four end faces of the wafer base are ground simultaneously, which further improves the grinding efficiency. The configured dust collection component effectively cleans up the dust generated at the grinding station and ensures the cleanliness of the production environment.

[0019] like Figure 3 and Figure 4 As shown, the grinding scraper assembly 3 includes a mounting base 31, on which a drive cylinder 32 is mounted. The output end of the drive cylinder 32 is connected to a mounting block 33. A grinding motor 34 is mounted on the top of the mounting block 33. The output end of the grinding motor 34 passes through the mounting block 33 and is connected to a grinding wheel 35. Grinding scrapers 36 are symmetrically mounted on both sides of the grinding wheel 35. When not grinding, the drive cylinder retracts; when grinding, the drive cylinder extends, pressing the grinding scrapers onto the workpiece surface and maintaining a certain pressure to ensure the grinding effect. The inner side of the grinding scraper 36 is connected to the mounting block 33, and the outer side of the grinding scraper 36 is floatingly connected to the mounting block 33 via a spring. The spring is positioned at... Figure 3 At the round hole on the back of the grinding scraper, where the spring is not shown in the diagram, the outer side of the grinding scraper 36 is equipped with an arc-shaped blade structure to prevent damage to the workpiece when the drive cylinder extends, while ensuring the grinding effect.

[0020] like Figure 3 As shown, the first drive component 11 is a lead screw motor structure, which causes the grinding scraper assembly to move back and forth on the workpiece for grinding. The sliding seat in the lead screw motor structure is connected to the corresponding grinding scraper assembly 3 mounting base 31.

[0021] like Figure 2As shown, the second drive assembly 21 is a gear and rack structure. A drive motor 211 is installed below the top plate 22 of the left and right grinding mechanisms 2. The output end of the drive motor 211 is connected to a gear 212, which meshes with a rack 213 located on the outside of the left and right grinding mechanisms 2. A channel steel 214 is provided at the bottom of the rack 213, and the opening of the channel steel 214 faces the grinding scraper assembly 3. A guide wheel 215 matching the channel steel 214 is installed below the gear 212. The installation form of the grinding scraper assembly in the left and right grinding mechanisms is the same as that of the front and rear grinding mechanisms. The difference is the installation direction of the mounting base. The driving method is changed to a grooved wheel guide and a gear and rack drive. The stroke of the second drive assembly is greater than that of the first drive assembly to ensure the stability and accuracy of the large stroke movement.

[0022] The vacuuming assembly 4 includes a vacuum cleaner 41 and a vacuuming port 42 mounted on the end face of the mounting block 33 of the polishing scraper assembly 3. The vacuuming port 42 is connected to the multi-port connector 43 on the top of the vacuum cleaner 41 via a hose and moves synchronously with the polishing mechanism.

[0023] Working principle: During the grinding process, the drive cylinder extends and compresses the spring on the back of the grinding scraper, pressing the grinding scraper onto the surface of the corresponding workpiece. As the grinding scraper assembly moves back and forth along the first drive assembly and the second drive assembly, the grinding scraper performs a first grinding operation. The grinding wheel in the middle of the grinding scraper is driven by the grinding motor to perform a second grinding operation, improving the grinding effect. During the grinding process, the dust suction interface above the grinding scraper is connected to a vacuum cleaner through a hose, effectively cleaning up the generated dust.

[0024] Several points need to be clarified: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly, and can refer to mechanical or electrical connections, or internal connections between two components, or direct connections. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships, and the relative positional relationships may change when the absolute position of the described objects changes. Second, in this document, relational terms such as "first" and "second" are only used to distinguish one entity from another entity, and do not necessarily require or imply any such actual relationship or order between these entities.

[0025] The examples above are merely illustrative of this utility model and do not constitute a limitation on the scope of protection of this utility model. All designs that are the same as or similar to this utility model are within the scope of protection of this utility model.

Claims

1. A polishing fixture for the outer peripheral end face of a wafer substrate, comprising a front-to-back polishing mechanism (1) and a left-to-right polishing mechanism (2) mounted opposite to each other, characterized in that, The front and rear polishing mechanism (1) and the left and right polishing mechanism (2) are respectively provided in two sets and installed around the wafer base. The front and rear polishing mechanism (1) includes a first drive component (11) arranged horizontally and a polishing scraper component (3) installed on the first drive component (11). The left and right polishing mechanism (2) includes a second drive component (21) arranged vertically and a polishing scraper component (3) installed on the second drive component (21). The top of the left and right polishing mechanism (2) is connected through a top plate (22) and moves synchronously along the second drive component (21). The polishing fixture is equipped with a dust collection component (4).

2. The wafer susceptor peripheral edge face polishing tooling of claim 1, wherein: The grinding scraper assembly (3) includes a mounting base (31), a drive cylinder (32) is mounted on the mounting base (31), the output end of the drive cylinder (32) is connected to a mounting block (33), a grinding motor (34) is provided on the top of the mounting block (33), the output end of the grinding motor (34) passes through the mounting block (33) and is connected to the grinding wheel (35), and grinding scrapers (36) are symmetrically mounted on both sides of the grinding wheel (35).

3. The wafer susceptor peripheral edge face polishing tooling of claim 2, wherein: The inner side of the grinding scraper (36) is connected to the mounting block (33), and the outer side of the grinding scraper (36) is floatingly connected to the mounting block (33) through a spring. The outer side of the grinding scraper (36) is provided with an arc-shaped blade structure.

4. The wafer susceptor peripheral edge face polishing tooling of claim 1, wherein: The first drive component (11) is a lead screw motor structure, and the sliding seat in the lead screw motor structure is connected to the mounting seat (31) of the corresponding grinding scraper component (3).

5. The wafer susceptor peripheral edge face polishing tooling of claim 1, wherein: The second drive assembly (21) is a gear and rack structure. A drive motor (211) is installed below the top plate (22) of the left and right grinding mechanism (2). The output end of the drive motor (211) is connected to a gear (212) and meshes with a rack (213) located outside the left and right grinding mechanism (2). A channel steel (214) is provided at the bottom of the rack (213). The opening of the channel steel (214) faces the grinding scraper assembly (3). A guide wheel (215) matching the channel steel (214) is installed below the gear (212).

6. The wafer susceptor peripheral edge face polishing tooling of claim 1, wherein: The vacuuming assembly (4) includes a vacuum cleaner (41) and a vacuuming port (42) mounted on the end face of the mounting block (33) of the grinding scraper assembly (3). The vacuuming port (42) is connected to the multi-port connector (43) on the top of the vacuum cleaner (41) via a hose and moves synchronously with the grinding mechanism.

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