Convex ceramic disc and annular belt large disc for improving wafer flatness

Abstract

The utility model discloses a convex ceramic disc and an annular belt large disc capable of improving wafer flatness, and relates to the field of wafer polishing equipment, the convex ceramic disc and the annular belt large disc comprise a convex ceramic disc and an annular belt large disc, a wafer mounting surface at the bottom of the convex ceramic disc is an arc-shaped convex surface with preset convexity; the annular belt large disc comprises a large disc body and an annular belt used for adjusting the disc type of the large disc body, the annular belt is concentrically installed on the upper surface of the large disc body, and the section of the annular belt is in a stepped isosceles trapezoid shape or a rectangular shape. And the arc-shaped convex surface of the convex ceramic disc is matched with the annular belt large disc, so that the problems of non-uniform distribution of the polishing solution and non-uniform distribution of the wafer pressure are effectively solved, and the flatness of the wafer can be effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer polishing equipment, and in particular to a convex ceramic disk and an annular belt disk for improving wafer flatness. Background Technology

[0002] The wafer fabrication process mainly includes the following six steps: Step 1: Chamfering the wafer (or other items requiring flatness processing); Step 2: Grinding the surface of the chamfered wafer; Step 3: Fixing the back of the ground wafer onto a polishing ceramic disk using an adhesive or absorbent pad; Step 4: Moving the polishing ceramic disk so that the front of the wafer on the polishing ceramic disk comes into contact with the polishing pad attached to the surface of the polishing disk, then rotating the polishing ceramic disk relative to the polishing disk, and simultaneously spraying polishing liquid onto the surface of the polishing pad on the polishing disk, so that the polishing pad polishes the front of the wafer; Step 5: Removing the polished wafer from the polishing ceramic disk and removing the adhesive from the back of the wafer; Step 6: Cleaning the wafer.

[0003] like Figure 6 As shown, the existing polishing pads and the bottom wafer mounting surface of the polishing ceramic pads have extremely high flatness. However, the flat polishing pads and polishing ceramic pads have some problems. For example, in step four above, the edge of the wafer can fully contact the fresh polishing liquid, while the center or inner side of the wafer cannot fully contact the fresh polishing liquid, which affects the final polishing level of the wafer product.

[0004] Therefore, optimizing the shape of polishing ceramic discs and / or large polishing discs to reduce the unevenness of polishing slurry distribution and decrease the mechanical action on the wafer edges during polishing, thereby improving the uniformity of wafer surface removal rate, has become a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a convex ceramic disk and an annular large disk to improve wafer flatness, thereby solving the problem that when existing polishing ceramic disks and polishing large disks are used together for polishing operations, the uniformity of the polishing slurry distribution on the wafer surface is limited, resulting in large differences in the removal rate at different parts of the wafer.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] This utility model provides a convex ceramic disk and an annular belt disk for improving wafer flatness. The convex ceramic disk has a wafer mounting surface at its bottom that is an arc-shaped protrusion with a preset convexity. The annular belt disk includes a large disk and an annular belt for polishing the wafer's front side. The annular belt is concentrically mounted on the upper surface of the large disk, and its cross-section is a stepped isosceles trapezoid or rectangular shape. The convex ceramic disk is rotatably disposed above and corresponds to the annular belt disk.

[0008] Optionally, the height of the arc-shaped raised surface of the convex ceramic disk is 0-30 micrometers.

[0009] Optionally, the diameter of the convex ceramic disk includes 305 mm, 360 mm, and 485 mm.

[0010] Optionally, the height of the arc-shaped raised surface of the convex ceramic disk is related to the diameter of the convex ceramic disk.

[0011] Optionally, the ratio of the height of the arc-shaped raised surface of the convex ceramic disk to the diameter of the convex ceramic disk is 8E-6 to 5.5E-5.

[0012] Optionally, the annular band is composed of multiple annular films.

[0013] Optionally, the height of the annular strip ranges from 10 micrometers to 200 micrometers.

[0014] Optionally, the ratio of the height of each annular membrane in the annular belt to the difference between the outer and inner diameters of that annular membrane is in the range of 0.15E-5 to 2.6E-4.

[0015] Compared with the prior art, the beneficial technical effects of this utility model are as follows:

[0016] 1) The arc-shaped raised surface of the convex ceramic disk effectively solves the problems of uneven distribution of polishing fluid and uneven distribution of wafer pressure, making the polishing removal rate of the wafer surface more uniform and ultimately obtaining a high flatness wafer.

[0017] 2) The arc-shaped raised surface of the convex ceramic disk, in conjunction with the large annular belt disk, further solves the problems of uneven distribution of polishing fluid and uneven distribution of wafer pressure, and can effectively improve the flatness of the wafer.

[0018] This device has a simple structure, is easy to operate, and is easy to promote and apply. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings.

[0020] Figure 1This is a schematic diagram illustrating the polishing principle of the convex ceramic disk and the annular belt disk used in this invention to improve wafer flatness.

[0021] Figure 2 This is a front view of the convex ceramic disc of this utility model;

[0022] Figure 3 This is a top view of the convex ceramic disc of this utility model;

[0023] Figure 4 This is a cross-sectional view of the annular belt disc of this utility model;

[0024] Figure 5 This is a top view of the annular belt disc of this utility model;

[0025] Figure 6 This is a schematic diagram of the principle of traditional wafer polishing equipment.

[0026] Explanation of reference numerals in the attached diagram: 1. Convex ceramic disc; 2. Annular belt disc; 21. Large disc; 22. Annular belt; 3. Polishing disc; 4. Polishing ceramic disc; 5. Wafer; 6. Polishing fluid. Detailed Implementation

[0027] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0028] like Figure 1-5 As shown, a convex ceramic disk and annular belt disk for improving wafer flatness include a convex ceramic disk 1 and an annular belt disk 2. The wafer mounting surface at the bottom of the convex ceramic disk 1 is an arc-shaped protrusion with a preset convexity. The annular belt disk 2 includes a large disk 21 and an annular belt 22 for polishing the front side of the wafer. The annular belt 22 is concentrically mounted on the upper surface of the large disk 21. The cross-section of the annular belt 22 is stepped, isosceles trapezoidal, or rectangular. The convex ceramic disk 1 is rotatably disposed above the annular belt disk 2 and corresponds to the annular belt disk 2.

[0029] Specifically, the height of the arc-shaped raised surface of the convex ceramic disk 1 is 0-30 micrometers.

[0030] Specifically, the diameter of the convex ceramic disk 1 includes 305 mm, 360 mm and 485 mm.

[0031] It should be noted that, in practice, operators may also choose convex ceramic discs of other sizes.

[0032] Specifically, the height of the arc-shaped convex surface of the convex ceramic disk 1 is related to the diameter of the convex ceramic disk 1.

[0033] Specifically, the ratio of the height of the arc-shaped convex surface of the convex ceramic disk 1 to the diameter of the convex ceramic disk 1 is 8E-6 to 5.5E-5.

[0034] Specifically, the annular belt 22 is composed of multiple annular films.

[0035] Specifically, the height of the annular band 22 ranges from 10 micrometers to 200 micrometers.

[0036] Specifically, the ratio of the height of each annular membrane in the annular belt 22 to the difference between the outer and inner diameters of that annular membrane ranges from 0.15E-5 to 2.6E-4.

[0037] In practice, the annular film is a thin film in the shape of a ring, made using a polishing belt.

[0038] In practice, operators may also use other polishing materials to make a ring-shaped film to form the annular belt 22.

[0039] The arc-shaped raised surface of the convex ceramic disk 1 effectively solves the problems of uneven distribution of polishing fluid 6 and uneven pressure distribution of wafer 5, making the polishing removal rate of wafer 5 more uniform and ultimately obtaining a high-flatness wafer.

[0040] The arc-shaped raised surface of the convex ceramic disk 1, in conjunction with the annular belt disk 2, further solves the problems of uneven distribution of polishing fluid 6 and uneven pressure distribution of wafer 5, and can effectively improve the flatness of wafer 5.

[0041] This device has a simple structure, is easy to operate, and is easy to promote and apply.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0043] The embodiments described above are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made to the technical solutions of the present utility model by those skilled in the art without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model.

Claims

1. A convex ceramic tray and ring belt platen for improving flatness of a wafer, characterized by: The device includes a convex ceramic disc (1) and an annular belt disc (2). The wafer mounting surface at the bottom of the convex ceramic disc (1) is an arc-shaped protrusion with a preset convexity. The annular belt disc (2) includes a large disc (21) and an annular belt (22) for adjusting the shape of the polishing large disc. The annular belt (22) is installed concentrically on the upper surface of the large disc (21). The cross-section of the annular belt (22) is a stepped isosceles trapezoid or a rectangle. The convex ceramic disc (1) is rotatably disposed above the annular belt disc (2) and corresponds to the annular belt disc (2).

2. The convex ceramic disk and ring belt large disk for improving flatness of wafer according to claim 1, characterized in that: The height of the arc-shaped raised surface of the convex ceramic disk (1) is 0-30 micrometers.

3. The convex ceramic disk and ring belt large disk for improving flatness of wafer according to claim 1, characterized in that: The diameter dimensions of the convex ceramic disk (1) include 305 mm, 360 mm and 485 mm.

4. The convex ceramic disk and ring belt large disk for improving flatness of wafer according to claim 1, wherein: The height of the arc-shaped convex surface of the convex ceramic disk (1) is related to the diameter of the convex ceramic disk (1).

5. The convex ceramic disk and ring belt large disk for improving flatness of wafer according to claim 1, wherein: The ratio of the height of the arc-shaped convex surface of the convex ceramic disk (1) to the diameter of the convex ceramic disk (1) is 8E-6 to 5.5E-5.

6. The convex ceramic disk and ring belt large disk for improving flatness of wafer according to claim 1, wherein: The annular band (22) is composed of multiple annular membranes.

7. The convex ceramic disk and ring belt large disk for improving flatness of wafer according to claim 1, wherein: The height of the annular strip (22) ranges from 10 micrometers to 200 micrometers.

8. The convex ceramic disk and ring belt large disk for improving flatness of wafer according to claim 1, wherein: The ratio of the height of each annular membrane in the annular band (22) to the difference between the outer and inner diameters of the annular membrane is in the range of 0.15E-5 to 2.6E-4.

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