Gas cooling device for semiconductor processing

Abstract

The utility model discloses a gas cooling device for semiconductor processing. The gas cooling device is arranged between a gas outlet of a semiconductor reaction cavity and a vacuum pump. The cooling device comprises a shell, a bracket, two cover plates, a partition plate I, two partition plates II, a plurality of gas pipelines, a water inlet pipe fitting and a water outlet pipe fitting, wherein the two cover plates, the partition plate I and the two partition plates II are vertically fixed in the shell; the gas pipelines are used for transmitting semiconductor treatment process gas; the water inlet pipe fitting is used for feeding cooling water into the shell; the shell is divided into an air inlet part, a cooling part and an air outlet part through two cover plates, the cooling part is divided into a cooling cavity a and a cooling cavity b through a partition plate I, the cooling cavity a is divided into two spaces of which the bottoms are communicated through one partition plate II, and the cooling cavity b is divided into two spaces of which the bottoms are communicated through the other partition plate II. During cooling, the heat transfer area is large, and in the whole cooling process, a cooling medium is in a flowing state, so that better heat transfer efficiency can be obtained, and the rapid reduction of the gas temperature is realized.

Description

Technical Field

[0001] This utility model relates to the field of cooling technology, and in particular to a gas cooling device for semiconductor processing. Background Technology

[0002] Semiconductors processed by semiconductor processing equipment such as high-temperature furnaces, oxidation, or annealing have improved performance. In order to maintain stable pressure inside the furnace at high temperatures, the equipment's gas filling valve and exhaust valve will automatically open and close. In order to ensure that the valves are not damaged by the high-temperature gas inside the furnace, the high-temperature gas inside the furnace needs to be cooled before entering the valves.

[0003] Currently, the common practice is to wrap cooling water pipes around the intake and exhaust pipes to cool the gas flowing through them. However, due to the limited contact area between the cooling water pipes and the gas inside the pipes, the gas temperature inside the pipes cannot be effectively reduced, which in turn affects the lifespan of valves such as the charging valve and the exhaust valve. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a gas cooling device for semiconductor processing to provide a larger heat transfer area and achieve rapid reduction of the temperature of high-temperature process gas during semiconductor processing.

[0005] A gas cooling apparatus for semiconductor processing includes a housing; the cooling apparatus further includes:

[0006] Two cover plates, partition plate I, and two partition plates II are vertically fixed inside the housing; wherein, the housing is divided into an air inlet, a cooling section, and an air outlet section by the two cover plates, and the cooling section is divided into a cooling chamber a and a cooling chamber b by partition plate I. Cooling chamber a is divided into two spaces connected at the bottom by one of the partition plates II, and cooling chamber b is divided into two spaces connected at the bottom by the remaining partition plate II.

[0007] Several gas lines used to transport semiconductor processing gases are vertically welded between two cover plates.

[0008] Inlet pipe fittings for supplying cooling water into the housing; and

[0009] Water outlet pipe fittings used to drain cooling water.

[0010] As a further improvement to the above solution, the housing has an air inlet and an air outlet. The air inlet is connected to the gas outlet of the semiconductor reaction chamber, and the air outlet is connected to the air inlet of the vacuum pump.

[0011] As a further improvement to the above scheme, the partition I and the two partitions II are all located inside the cooling section, and the cover plate, partition I and partition II are arranged horizontally.

[0012] As a further improvement to the above solution, the partition I and the cover plate are the same size, and the partition I is located in the middle of the two cover plates, and the gas pipeline is vertically fixed through the partition I.

[0013] As a further improvement to the above solution, the partition II is located in the middle of the adjacent cover plate and partition I, and the bottom of partition II does not contact the bottom of the inner wall of the shell.

[0014] As a further improvement to the above solution, several gas pipes are evenly distributed in the cooling section and are arranged horizontally; one end of each gas pipe is fixedly inserted through one of the cover plates, and the other end of each gas pipe is fixedly inserted through the remaining cover plate.

[0015] As a further improvement to the above solution, both the inlet and outlet pipes are fixedly installed on the housing, with the outlet pipe located in front of the inlet pipe.

[0016] As a further improvement to the above solution, the water inlet pipe has two outlets, one of which is connected to cooling chamber a, and the other outlet is connected to cooling chamber b.

[0017] As a further improvement to the above solution, the water outlet fitting has two water inlets, one of which is connected to cooling chamber a and the other is connected to cooling chamber b; the water outlet and the water inlet are located at the corresponding positions on both sides of the corresponding partition II.

[0018] As a further improvement to the above solution, the cooling device also includes a bracket for supporting the housing.

[0019] Compared with the prior art, the advantages of this utility model are: a large heat transfer area during cooling, and the cooling medium is in a flowing state throughout the cooling process, which can achieve better heat transfer efficiency and thus quickly reduce the temperature of the gas. Attached Figure Description

[0020] Figure 1 The figure shown is a plan perspective view of a gas cooling device for semiconductor processing provided by this utility model. The arrows in the figure indicate the airflow direction.

[0021] Figure 2 As shown Figure 1 Side view of the middle cover plate.

[0022] Figure 3 As shown Figure 1 The diagram shows the cooling process, with arrows indicating the direction of liquid flow.

[0023] 1. Shell; 2. Cover plate; 3. Gas pipeline; 4. Partition I; 5. Partition II; 6. Water inlet fittings; 7. Water outlet fittings.

[0024] The above description of the main component symbols, together with the accompanying drawings and specific embodiments, provides a further detailed explanation of this utility model. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. Additional aspects and advantages of this utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. It should be understood that the following description is merely illustrative and not intended to limit the utility model.

[0026] The specific embodiments of this utility model are described in detail below.

[0027] Please see Figure 1-2 This embodiment provides a gas cooling device for semiconductor processing, which is installed between the gas outlet of the semiconductor reaction chamber and a vacuum pump. The cooling device includes a housing 1, a bracket for supporting the housing 1, two cover plates 2 vertically fixed inside the housing 1, a partition plate I4 and two partition plates II5, several gas pipelines 3 for transmitting semiconductor processing gases, a water inlet pipe 6 for sending cooling water into the housing 1, and a water outlet pipe 7 for discharging cooling water.

[0028] The housing 1 has an inlet and an outlet. The inlet is connected to the gas outlet of the semiconductor reaction chamber, and the outlet is connected to the inlet of the vacuum pump. Neither the vacuum pump nor the semiconductor reaction chamber is shown in the figure. The high-temperature process gas in the semiconductor reaction chamber is extracted by the vacuum pump and then enters the cooling device of this embodiment for cooling. The cooling body is positioned at a certain height using a bracket to adapt to the height of the semiconductor reaction chamber, thereby facilitating communication between the inlet of the housing 1 and the gas outlet of the semiconductor reaction chamber.

[0029] Gas pipes 3 are vertically welded between two cover plates 2. Several gas pipes 3 are evenly distributed within the cooling section and are arranged horizontally. One end of a gas pipe 3 is fixedly inserted through one of the cover plates 2, and the other end of the gas pipe 3 is fixedly inserted through the remaining cover plate 2. The housing 1 is divided into an air inlet section, a cooling section, and an air outlet section by the two cover plates 2. The cooling section is further divided into cooling chamber a and cooling chamber b by a partition I4. Cooling chamber a is divided into two interconnected spaces at the bottom by a partition II5, and cooling chamber b is divided into two interconnected spaces at the bottom by the remaining partition II5.

[0030] Both the inlet pipe 6 and the outlet pipe 7 are fixedly installed on the housing 1, with the outlet pipe 7 located in front of the inlet pipe 6. The inlet pipe 6 has two outlets, one of which is connected to cooling chamber a, and the other is connected to cooling chamber b. The outlet pipe 7 has two inlets, one of which is connected to cooling chamber a, and the other is connected to cooling chamber b. The outlet and inlet are located on opposite sides of the corresponding partition II5. In this embodiment, the outlet pipe 7 is connected to the intake port of a water pump (not shown). The water pump draws water from the cooling section along the outlet pipe 7, thereby discharging the water carrying heat after thermal convection.

[0031] Partition I4 and two partitions II5 are all located within the cooling section, and the cover plate 2, partition I4, and partition II5 are arranged horizontally. Partition I4 and cover plate 2 are the same size, and partition I4 is located in the middle of the two cover plates 2. The gas pipe 3 is vertically fixed and runs through partition I4. Partition II5 is located in the middle of the adjacent cover plate 2 and partition I4, and the bottom of partition II5 does not contact the bottom of the inner wall of the shell 1. This embodiment is described with the height of partition II5 being 2 / 3 of the height of partition I4 as an example. Based on the aforementioned design, a space is reserved between the bottom of partition II5 and the shell 1. Cooling water flows in from one side, exchanges heat with the gas pipe 3, and then flows from the bottom to the other side through this space for drainage, thereby carrying away the heat.

[0032] In this embodiment, the air inlet, cooling section, and air outlet are independent of each other to prevent cooling water from overflowing from the cooling section, while the high-temperature process gas flows between the air inlet, cooling section, and air outlet through gas pipeline 3. Cooling chamber a and cooling chamber b are independent of each other and cooperate with water inlet pipe 6 and water outlet pipe 7, so that two cooling systems are formed in the cooling section. The two cooling systems work synchronously, thereby reducing cooling time and improving cooling efficiency.

[0033] Please refer to the following: Figure 3 The cooling device of this embodiment has the following cooling process: High-temperature gas in the semiconductor reaction chamber enters the cooling section through the inlet. Simultaneously, cooling water is split into two streams along the inlet pipe 6, filling cooling chamber a and cooling chamber b respectively. The cooling water fills the cooling section and exchanges heat with the gas pipeline 3 located within the cooling section, thus cooling the high-temperature gas passing through this section of gas pipeline 3. The gas temperature decreases as it passes through the cooling section and is then discharged directionally along the outlet. During the aforementioned heat exchange process, because the gas pipeline 3 is immersed in cooling water, the heat transfer area is large, and the cooling water flows in from one side and drains from the bottom to the other side. Throughout the cooling process, the cooling medium is in a flowing state, achieving good heat transfer efficiency and rapidly reducing the gas temperature.

[0034] In summary, the cooling device of this embodiment has the following advantages compared with the current method of cooling by wrapping cooling water pipes around the intake and exhaust pipes: the heat transfer area is large during cooling, and the cooling medium is in a flowing state throughout the cooling process, which can achieve better heat transfer efficiency and thus quickly reduce the temperature of the gas.

[0035] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A gas cooling device for semiconductor processing, comprising a housing (1); characterized in that The cooling device also includes: Two cover plates (2), partition I (4) and two partition II (5) are fixedly placed inside the housing (1); wherein the housing (1) is divided into an air inlet, a cooling section and an air outlet by the two cover plates (2), and the cooling section is divided into a cooling chamber a and a cooling chamber b by the partition I (4). The cooling chamber a is divided into two spaces connected at the bottom by one of the partitions II (5), and the cooling chamber b is divided into two spaces connected at the bottom by the remaining partition II (5); Several gas pipes (3) for transmitting semiconductor processing gases are vertically welded between two cover plates (2); Water inlet pipe (6) for supplying cooling water into the housing (1); and (7) Water outlet pipe fittings used to discharge cooling water.

2. The gas cooling device for semiconductor processing according to claim 1, wherein The housing (1) has an air inlet and an air outlet. The air inlet is connected to the gas outlet of the semiconductor reaction chamber, and the air outlet is connected to the air inlet of the vacuum pump.

3. The gas cooling device for semiconductor processing according to claim 1, wherein The partition I (4) and the two partitions II (5) are all located inside the cooling section, and the cover plate (2), partition I (4) and partition II (5) are arranged horizontally.

4. The gas cooling device for semiconductor processing according to claim 3, wherein The partition I (4) and the cover plate (2) are the same size, and the partition I (4) is located in the middle of the two cover plates (2). The gas pipeline (3) is vertically fixed and installed through the partition I (4).

5. The gas cooling device for semiconductor processing according to claim 4, wherein The partition II (5) is located in the middle of the adjacent cover plate (2) and partition I (4), and the bottom of the partition II (5) does not contact the bottom of the inner wall of the shell (1).

6. The gas cooling device for semiconductor processing according to claim 1, wherein Several gas pipes (3) are evenly distributed in the cooling section, and the gas pipes (3) are arranged horizontally; The gas pipeline (3) is fixedly installed through one of the cover plates (2) at one end, and the gas pipeline (3) is fixedly installed through the remaining cover plate (2) at the other end.

7. The gas cooling device for semiconductor processing according to claim 1, wherein The inlet pipe (6) and outlet pipe (7) are both fixedly installed on the housing (1), and the outlet pipe (7) is located in front of the inlet pipe (6).

8. The gas cooling device for semiconductor processing according to claim 7, wherein The water inlet pipe (6) has two outlets, one of which is connected to the cooling chamber a, and the other outlet is connected to the cooling chamber b.

9. The gas cooling device for semiconductor processing according to claim 8, wherein The water outlet fitting (7) has two water inlets, one of which is connected to the cooling chamber a, and the other water inlet is connected to the cooling chamber b. The outlet and inlet are located on the corresponding sides of the partition II (5).

10. The gas cooling device for semiconductor processing according to claim 1, wherein The cooling device also includes a bracket for supporting the housing (1).

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