Fixing tool for testing semiconductor butterfly valve

By using a clamping method to fix the semiconductor butterfly valve, and utilizing components such as a testing and fixing platform and clamping mold, the problem of complex operation of flange bolt fixing method is solved, thus improving testing efficiency and equipment applicability.

CN224136887UActive Publication Date: 2026-04-17WUXI NAGAI ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WUXI NAGAI ELECTRONICS CO LTD
Filing Date
2025-06-13
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

The current method of fixing semiconductor butterfly valves with flange bolts is cumbersome, resulting in low testing efficiency. Furthermore, the mismatched fixing structure affects the practicality of the testing equipment.

Method used

Semiconductor butterfly valves are fixed by clamping. Components such as a test fixture, movable frame, test tube, connecting plate, clamping mold, and synchronous telescopic cylinder are used to achieve simple and quick fixing and disassembly, which can adapt to the testing of butterfly valves of different sizes.

Benefits of technology

It improves the efficiency of semiconductor butterfly valve testing, simplifies the operation process, and enhances the applicability of the testing equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductor butterfly valve fixing, in particular to a fixing tool for testing a semiconductor butterfly valve. According to the technical scheme, the device comprises a detection fixing table and a clamping plate mold, an arc-shaped supporting block is fixed to the upper end of the detection fixing table, movable frames are installed at the positions, located on the two sides of the arc-shaped supporting block, of the upper end of the detection fixing table, detection pipes are installed on the movable frames, and connecting plates are fixed to the ends of the detection pipes; the clamping plate mold is fixed to the connecting plate through a dismounting assembly, and a fixing frame is fixed to the side, away from the movable frame, of the upper end of the detection fixing table. The semiconductor butterfly valve is fixed in a two-end clamping mode, bolt locking is not needed, operation is simpler, the working efficiency can be greatly improved when a plurality of semiconductor butterfly valves are detected, the clamping plate die used for clamping the semiconductor butterfly valves is of a detachable structure, and the clamping plate die is convenient to use. And the semiconductor butterfly valves with different sizes can be fixed more conveniently.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor butterfly valve fixing technology, specifically a fixing tool for testing semiconductor butterfly valves. Background Technology

[0002] A semiconductor butterfly valve is a special valve designed specifically for semiconductor manufacturing processes. It is mainly used to control the flow of gas and liquid during production, and can precisely control the flow rate of gas and liquid to ensure the stability and consistency of the process.

[0003] In the production and processing of semiconductor butterfly valves, testing is an essential step. During testing, better fixation of the valve body is crucial for improving testing efficiency. While fixing the valve body to the testing platform using flange bolts ensures stable testing, the operation is relatively cumbersome, and its efficiency is relatively reduced during batch testing. If the flanges of the testing fixing structure are not compatible, effective fixation cannot be achieved, which reduces the practicality of the testing equipment's fixing structure. Utility Model Content

[0004] The purpose of this invention is to provide a fixing tool for testing semiconductor butterfly valves, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: It includes a testing platform and a clamping mold. An arc-shaped support block is fixed to the upper end of the testing platform. Movable frames are installed on both sides of the upper end of the testing platform and on both sides of the arc-shaped support block. A testing tube is installed on the movable frame, and a connecting plate is fixed to the end of the testing tube. The clamping mold is fixed to the connecting plate via a disassembly assembly. A fixed frame is fixed to the upper end of the testing platform and on the side furthest from the movable frame. A synchronous telescopic cylinder for driving the movable frame to slide synchronously is installed on the fixed frame.

[0006] Preferably, the connecting plate has an insertion hole at the center of one side, the clamping plate mold has an insertion tube on the back that matches the insertion hole, the insertion tube is surrounded by a sealing ring, and the clamping plate mold has a sealing gasket on one side.

[0007] Preferably, the disassembly and assembly assembly includes a positioning groove and a positioning rod. The positioning groove is formed on the connecting plate, and the positioning rod is fixed on the back of the clamping plate mold and aligned with the positioning groove. The positioning rod is inserted into the positioning groove, and a positioning hole is formed on the positioning rod. A protrusion is installed at the bottom of the positioning groove and at a position corresponding to the positioning hole. The upper end of the protrusion is inserted into the positioning hole.

[0008] Preferably, a telescopic groove is provided at the bottom of the positioning groove and at a position corresponding to the protrusion, and an ejector spring is fixed between the bottom of the telescopic groove and the protrusion.

[0009] Preferably, a pressure rod is fixed to the upper end of the protrusion, the upper end of the pressure rod passes through the positioning groove, and a front end groove is opened on the front side of the positioning hole, the size of the front end groove being larger than the width of the pressure rod.

[0010] Preferably, a linear track is fixed at the upper end of the detection platform and at a position corresponding to the movable frame, the bottom of the movable frame is slidably connected to the linear track, and a corrugated pipe is provided on the detection tube.

[0011] Compared with the prior art, the advantages of this utility model are: the semiconductor butterfly valve is fixed by clamping at both ends without the need for bolt tightening, making the operation simpler. When testing multiple semiconductor butterfly valves, it can greatly improve work efficiency. Furthermore, the clamping plate mold used to clamp the semiconductor butterfly valve is designed as a detachable structure, which makes it easier to fix semiconductor butterfly valves of different sizes. Attached Figure Description

[0012] Figure 1 This is a partial cross-sectional view of the side of a fixing tool for testing semiconductor butterfly valves according to this utility model.

[0013] Figure 2 This utility model relates to a fixing tool for testing semiconductor butterfly valves. Figure 1 Enlarged structural diagram at point A in the middle;

[0014] Figure 3 This is a schematic diagram of the positioning rod and protrusion structure of a fixing tool for testing semiconductor butterfly valves according to this utility model;

[0015] Figure 4 This is a schematic diagram of the front structure of the connecting plate of the fixing tool for testing semiconductor butterfly valves according to this utility model.

[0016] In the diagram: 1. Testing station; 2. Movable frame; 3. Testing tube; 4. Connecting plate; 41. Positioning groove; 42. Protrusion; 43. Telescopic groove; 44. Ejection spring; 45. Pressure rod; 46. Insertion hole; 5. Clamping plate mold; 51. Insertion tube; 52. Positioning rod; 53. Positioning hole; 54. Front end groove; 6. Arc-shaped support block; 7. Linear track; 8. Fixing frame; 9. Synchronous telescopic cylinder. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figure 1-4 This utility model provides a technical solution: including a testing platform 1 and a clamping mold 5. An arc-shaped support block 6 is fixed to the upper end of the testing platform 1. Movable frames 2 are installed on both sides of the arc-shaped support block 6 at the upper end of the testing platform 1. Testing tubes 3 are installed on the movable frames 2. A connecting plate 4 is fixed to the end of the testing tubes 3. The clamping mold 5 is fixed to the connecting plate 4 by a disassembly and assembly assembly. A fixed frame 8 is fixed to the upper end of the testing platform 1 on the side away from the movable frames 2. A synchronous telescopic cylinder 9 that drives the movable frames 2 to slide synchronously is installed on the fixed frame 8. A linear track 7 is fixed to the upper end of the testing platform 1 at a position corresponding to the movable frames 2.

[0019] The bottom of the movable frame 2 is slidably connected to the linear track 7. The detection tube 3 is equipped with a bellows. The linear track 7 can perform linear limit during the sliding process to ensure that both ends of the semiconductor butterfly valve are aligned with the clamp mold 5.

[0020] The assembly / disassembly component includes a positioning groove 41 and a positioning rod 52. The positioning groove 41 is formed on the connecting plate 4. The positioning rod 52 is fixed to the back of the clamping plate mold 5 and is aligned with the positioning groove 41. The positioning rod 52 is inserted into the positioning groove 41 and has a positioning hole 53. A protrusion 42 is installed at the bottom of the positioning groove 41 and at a position corresponding to the positioning hole 53. The upper end of the protrusion 42 is inserted into the positioning hole 53. A telescopic groove 43 is formed at the bottom of the positioning groove 41 and at a position corresponding to the protrusion 42. A spring 44 is fixed between the bottom of the groove 43 and the protrusion 42. A pressure rod 45 is fixed at the upper end of the protrusion 42. The upper end of the pressure rod 45 passes through the positioning groove 41. A front end groove 54 is provided on the front side of the positioning hole 53. The size of the front end groove 54 is larger than the width of the pressure rod 45. An insertion hole 46 is provided at the center of the side of the connecting plate 4. An insertion tube 51 that matches the insertion hole 46 is provided on the back of the clamping plate mold 5. A sealing ring is provided around the insertion tube 51. A sealing gasket is provided on the side of the clamping plate mold 5.

[0021] Working principle: First, connect the entire device to an external power source. Then, place the semiconductor butterfly valve onto the arc-shaped support block 6. Next, using the synchronous telescopic cylinder 9, move the clamping mold 5 towards the adjacent side, ultimately squeezing and fixing the semiconductor butterfly valve. During this process, the bellows structure increases the extensibility of the detection tube 3, allowing for free extension and retraction. Simultaneously, the linear track 7 provides linear limiting during sliding, ensuring that both ends of the semiconductor butterfly valve are aligned with the clamping mold 5. When detecting and fixing semiconductor butterfly valves of different sizes, the clamping mold 5 can... Replacement is possible. During disassembly, the pressure rod 45 can be used to press down and compress the ejector spring 44 to squeeze the protrusion 42 into the telescopic groove 43. At this time, the positioning rod 52 can be freely pulled out, and the clamping mold 5 can be disassembled. During installation, the insertion tube 51 can be inserted into the insertion hole 46, and the positioning rod 52 can be inserted into the positioning groove 41. When the positioning hole 53 is aligned with the protrusion 42, the upper end of the protrusion 42 can be inserted into the positioning hole 53 by pushing with the ejector spring 44, thus fixing the positioning rod 52 and fixing the clamping mold 5. The operation is simple and convenient.

[0022] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0023] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fixing tool for semiconductor butterfly valve testing, comprising a detection fixing table (1) and a clamping plate mold (5), characterized in that: An arc-shaped support block (6) is fixed at the upper end of the testing station (1). Movable frames (2) are installed on both sides of the arc-shaped support block (6) at the upper end of the testing station (1). A testing tube (3) is installed on the movable frame (2). A connecting plate (4) is fixed at the end of the testing tube (3). The clamping mold (5) is fixed on the connecting plate (4) by a disassembly assembly. A fixing frame (8) is fixed at the upper end of the testing station (1) on the side away from the movable frame (2). A synchronous telescopic cylinder (9) that drives the movable frame (2) to slide synchronously is installed on the fixing frame (8).

2. The semiconductor device testing fixture of claim 1, wherein: An insertion hole (46) is provided at the center of the side of the connecting plate (4), and an insertion tube (51) adapted to the insertion hole (46) is provided on the back of the clamping plate mold (5). A sealing ring is provided around the insertion tube (51), and a sealing gasket is provided on the side of the clamping plate mold (5) close to the center.

3. The semiconductor device testing fixture of claim 1, wherein: The assembly / disassembly assembly includes a positioning groove (41) and a positioning rod (52). The positioning groove (41) is formed on the connecting plate (4). The positioning rod (52) is fixed on the back of the clamping plate mold (5) and its position is aligned with the positioning groove (41). The positioning rod (52) is inserted into the positioning groove (41). The positioning rod (52) has a positioning hole (53). A protrusion (42) is installed at the bottom of the positioning groove (41) and at a position corresponding to the positioning hole (53). The upper end of the protrusion (42) is inserted into the positioning hole (53).

4. The semiconductor device testing fixture of claim 3, wherein: The bottom of the positioning groove (41) and the corresponding position of the protrusion (42) are provided with a telescopic groove (43), and a push-out spring (44) is fixed between the bottom of the telescopic groove (43) and the protrusion (42).

5. A fixing tool for testing a semiconductor butterfly valve according to claim 3, characterized in that: The upper end of the protrusion (42) is fixed with a pressure rod (45), the upper end of the pressure rod (45) passes through the positioning groove (41), and the front end groove (54) is opened on the front side of the positioning hole (53). The size of the front end groove (54) is larger than the width of the pressure rod (45).

6. The fixing tool for testing a semiconductor butterfly valve according to claim 1, characterized in that: A linear track (7) is fixed at the upper end of the fixed testing platform (1) and at a position corresponding to the movable frame (2). The bottom of the movable frame (2) is slidably connected to the linear track (7). A corrugated pipe is provided on the testing tube (3).