Balanced pressure-resistant composite RFID tag

Abstract

The utility model discloses a balanced compression-resistant composite RFID tag, which comprises a base layer and a chip antenna layer, a chip and an antenna are arranged on the chip antenna layer, the balanced compression-resistant composite RFID tag further comprises a coated paper buffer layer, the base layer and the chip antenna layer are attached through a first hot melt adhesive layer, and a second hot melt adhesive layer is arranged between the base layer and the chip antenna layer. The chip antenna layer is attached to the coated paper buffer layer through a second hot melt adhesive layer, and a hole is formed in the coated paper buffer layer to accommodate a chip salient point on the chip antenna layer. According to the balanced and pressure-resistant composite RFID tag provided by the utility model, a multi-layer composite structure is adopted for thickening and buffering, so that balanced pressure distribution can be realized; the salient points of the chip are inwards arranged in the dug holes in the coated paper buffer layer, so that the chip is prevented from being damaged due to local stress concentration; and the structural stability of the RFID tag under the synergistic effect of high pressure and high temperature is improved.

Description

Technical Field

[0001] This utility model relates to an RFID tag, and more particularly to a composite RFID tag with balanced pressure resistance. Background Technology

[0002] RFID (Radio Frequency Identification) is a non-contact automatic identification technology based on radio frequency signals. It enables digital identification and data exchange of target objects through wireless communication. Its core technological advantage lies in transforming physical entities into traceable digital information, while overcoming the environmental limitations of optical recognition, allowing it to operate stably in complex media such as metals and liquids. Leveraging its contactless and batch identification characteristics, this technology significantly improves operational efficiency in supply chains, manufacturing, and public safety, becoming a key infrastructure for industrial digital transformation.

[0003] Main applications include: product anti-counterfeiting and anti-diversion, identity recognition, material / product traceability, personnel and goods positioning, transportation and distribution supervision, air baggage tracking, electronic / food traceability, production line management, warehouse management, fixed asset management, retail anti-theft management, etc.

[0004] As can be seen from the above, the advantages of RFID tags are obvious: they enable the (physical) digital identification of items, and because they use radio frequency technology, they further realize automated and contactless identification, playing a huge role in economic development and social efficiency.

[0005] Although RFID is widely used in various packaging materials, its reliability in industrial settings faces serious challenges, mainly due to defects in material structure and thermal stability. The defects of traditional RFID tags are manifested in:

[0006] (1) In industrial high-pressure processes (such as stamping, die-cutting, lamination, etc.), chips are easily crushed due to localized pressure concentration, leading to a sharp drop in recognition rate. Single-layer substrate structures on the market lack buffer design and generally have low compressive strength, failing to meet the requirements of heavy machinery processing scenarios. Please see [link to relevant documentation]. Figure 1 , Figure 2 and Figure 3 The existing RFID tag consists of two layers: a base layer 1 and a chip antenna layer 2. The base layer 1 and the chip antenna layer 2 are bonded together by a hot melt adhesive layer 3. The chip antenna layer 2 is provided with a chip 22 and an antenna 21. After encapsulation, the chip bumps 23 face outwards, resulting in insufficient local pressure resistance.

[0007] (2) Traditional RFID tags have poor high temperature resistance. Ordinary PET substrates are prone to softening and deformation in high temperature environments (>200℃), which can lead to antenna breakage or signal attenuation.

[0008] Based on the above analysis, overcoming the dual technical bottlenecks of pressure resistance and high temperature resistance is the key to expanding the industrial application boundaries of RFID tags. Utility Model Content

[0009] The technical problem to be solved by this utility model is to provide a composite RFID tag with balanced pressure resistance, which can achieve balanced pressure distribution and avoid chip damage due to local stress concentration.

[0010] The technical solution adopted by this utility model to solve the above-mentioned technical problems is to provide a composite RFID tag with balanced pressure resistance, including a base layer and a chip antenna layer. The chip antenna layer is provided with a chip and an antenna. It also includes a coated paper buffer layer. The base layer and the chip antenna layer are bonded together by a first hot melt adhesive layer, and the chip antenna layer and the coated paper buffer layer are bonded together by a second hot melt adhesive layer. Holes are cut in the coated paper buffer layer to accommodate the chip bumps on the chip antenna layer.

[0011] Furthermore, the chip bumps on the chip antenna layer are arranged inward and embedded in the holes in the copperplate paper buffer layer, and the depth of the holes is greater than or equal to the height of the chip bumps.

[0012] Furthermore, the thickness of the coated paper buffer layer is 0.08mm-2.0mm.

[0013] Furthermore, the coated paper buffer layer is engineering fiber paper. Furthermore, the base layer is a polyimide film.

[0014] Compared with the prior art, the present invention has the following advantages: The composite RFID tag with balanced pressure resistance provided by the present invention adopts a multi-layer composite structure for thickened buffering, which can achieve balanced pressure distribution; the chip bumps are set inward in the holes on the coated paper buffer layer to avoid chip damage due to local stress concentration; and the structural stability of the RFID tag is improved under the combined action of high pressure and high temperature. Attached Figure Description

[0015] Figure 1 A schematic diagram of an existing RFID tag structure;

[0016] Figure 2 This is a schematic diagram of the cross-sectional structure of an existing RFID tag;

[0017] Figure 3 A schematic diagram of the breakdown structure of an existing RFID tag;

[0018] Figure 4 This is a schematic diagram of the composite RFID tag structure with balanced compressive strength according to this utility model;

[0019] Figure 5This is a schematic diagram of the cross-sectional structure of the composite RFID tag with balanced compressive strength according to this utility model;

[0020] Figure 6 This is an exploded view of the composite RFID tag with balanced compressive strength according to this utility model. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Figure 4 This is a schematic diagram of the composite RFID tag structure with balanced compressive strength according to this utility model; Figure 5 This is a schematic diagram of the cross-sectional structure of the composite RFID tag with balanced compressive strength according to this utility model; Figure 6 This is an exploded view of the composite RFID tag with balanced compressive strength according to this utility model.

[0023] Please see Figure 4 , Figure 5 and Figure 6 The present invention provides a balanced and pressure-resistant composite RFID tag, comprising a base layer 1 and a chip antenna layer 2. The chip antenna layer 2 is provided with a chip 22 and an antenna 21. The base layer 1 and the chip antenna layer 2 are bonded together by a first hot melt adhesive layer 31, and the chip antenna layer 2 and the coated paper buffer layer 4 are bonded together by a second hot melt adhesive layer 32. The coated paper buffer layer 4 has holes cut out to accommodate the chip bumps 23 on the antenna layer.

[0024] This invention achieves high-temperature and high-pressure collaborative protection through a multi-layer composite structure design and optimized chip layout. The three-layer composite structure includes a base layer 1 (polyimide film), a chip antenna layer 2 (containing a chip antenna), and a coated paper buffer layer 4 (engineering fiber paper with a central hole to accommodate the chip bumps). The optimized chip layout differs from the traditional outward-facing layout of RFID tag chip bumps 23. Instead, the chip bumps 23 are positioned inward and embedded in the holes in the coated paper buffer layer 4. The depth of these holes is greater than or equal to the height of the chip bumps 23. This effectively distributes pressure through the buffer layer's hole structure, transforming the localized pressure on the chip bumps 23 into a load across the entire tag surface. The thickness of the coated paper buffer layer 4 is ≥0.08mm, preferably 0.08mm-2.0mm.

[0025] This invention significantly improves the recognition rate of RFID tags after they are adapted to high-pressure processes (such as stamping, injection molding, and lamination), reduces the deformation rate under high-temperature environments, and thus ensures the quality compliance of RFID tags in packaging materials, further helping enterprises reduce losses and save costs. Specific improvements and effects are as follows:

[0026] (1) Hierarchical optimization: The separation of the functions of “pressure bearing-signal transmission-pressure dispersion” is achieved by using the base layer → chip antenna layer → buffer layer.

[0027] (2) Dynamic pressure adaptation: The newly added microporous buffer layer transforms local pressure into surface load, significantly improving compressive strength. By adjusting the chip orientation, the combination of chip bump 23 and the microporous buffer layer maximizes the 3D buffering effect to protect the chip.

[0028] (3) High temperature compatibility: The addition of a copper paper buffer layer 4 increases the thickness and heat dissipation, which can protect the antenna 21 and the chip 22 in high temperature environments.

[0029] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A composite RFID tag with balanced pressure resistance, comprising a base layer and a chip antenna layer, wherein a chip and an antenna are disposed on the chip antenna layer, characterized in that, It also includes a coated paper buffer layer, wherein the base layer and the chip antenna layer are bonded together by a first hot melt adhesive layer, and the chip antenna layer and the coated paper buffer layer are bonded together by a second hot melt adhesive layer, and the coated paper buffer layer has holes cut out to accommodate the chip bumps on the chip antenna layer.

2. The balanced compression-resistant composite RFID tag as described in claim 1, characterized in that, The chip bumps on the chip antenna layer are arranged inward and embedded in the holes in the copperplate paper buffer layer, and the depth of the holes is greater than or equal to the height of the chip bumps.

3. The composite RFID tag with balanced compressive strength as described in claim 2, characterized in that, The thickness of the coated paper buffer layer is 0.08mm-2.0mm.

4. The composite RFID tag with balanced compressive strength as described in claim 1, characterized in that, The coated paper buffer layer is made of engineering fiber paper.

5. The composite RFID tag with balanced compressive strength as described in claim 1, characterized in that, The base layer is a polyimide film.

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