Wind-liquid integrated heat dissipation device

Abstract

The utility model belongs to the technical field of radiators, and particularly relates to an air-liquid integrated radiating device, which comprises an air cooling mechanism and a liquid cooling mechanism, and is characterized in that the air cooling mechanism comprises a first fin assembly, a substrate and a plurality of heat pipes; a plurality of first clamping grooves which are distributed at intervals are formed in the base plate; the heat pipe comprises a first vertical pipe and a transverse pipe connected with the first vertical pipe; the liquid cooling mechanism comprises a liquid cooling box and a liquid cooling plate installed on the liquid cooling box, and a plurality of second clamping grooves distributed at intervals are formed in the side, away from the liquid cooling box, of the liquid cooling plate; the liquid cooling box is installed on the substrate, and one first clamping groove and one second clamping groove are provided with an accommodating through hole in a surrounding manner; all the first vertical pipes penetrate through the first fin assembly, and the transverse pipes are installed in the containing through holes in a one-to-one correspondence mode. According to the air-liquid integrated heat dissipation device, liquid cooling heat dissipation and air cooling heat dissipation can be achieved, and the heat dissipation efficiency of the air-liquid integrated heat dissipation device is improved.

Description

Technical Field

[0001] This utility model belongs to the field of radiator technology, and in particular relates to an integrated air-liquid heat dissipation device. Background Technology

[0002] As the power consumption of circuit boards continues to increase, the heat generated during operation also rises. Overheating can cause circuit boards to burn out, necessitating timely cooling. Current technologies typically employ either air cooling or liquid cooling systems. However, air cooling systems are limited by environmental constraints and suffer from low cooling efficiency. Liquid cooling systems, on the other hand, often require complex cooling channels, resulting in large space requirements and portability.

[0003] An existing integrated cooling system includes both air cooling and liquid cooling devices. Both devices can dissipate heat from the circuit board, improving its heat dissipation efficiency to some extent. However, the simple coupling between the air and liquid cooling devices results in low heat transfer efficiency between them, leading to the integrated cooling system's inherent low heat dissipation efficiency. Furthermore, the numerous components in an integrated cooling system also present challenges such as large space requirements and difficulty in portability. Summary of the Invention

[0004] The technical problem to be solved by this utility model is: to address the problem of low heat dissipation efficiency in existing integrated heat dissipation systems, a fan-liquid integrated heat dissipation device is provided.

[0005] To solve the above-mentioned technical problems, one embodiment of the present invention provides an integrated air-liquid cooling device, including an air-cooling mechanism and a liquid-cooling mechanism. The air-cooling mechanism includes a first fin assembly, a substrate, and a plurality of heat pipes. The substrate is provided with a plurality of first slots spaced apart. The heat pipes include a first vertical pipe and a horizontal pipe connected to the first vertical pipe.

[0006] The liquid cooling mechanism includes a liquid cooling box and a liquid cooling plate installed on the liquid cooling box. The liquid cooling plate has a plurality of second slots spaced apart on the side opposite to the liquid cooling box.

[0007] The liquid cooling box is mounted on the base plate, and a first slot and a second slot surround a receiving through hole; all the first vertical tubes pass through the first fin assembly, and the horizontal tubes are installed one-to-one in the receiving through hole.

[0008] Optionally, the air-cooling mechanism further includes a second fin assembly, wherein the first fin assembly and the second fin assembly are respectively located on opposite sides of the liquid cooling box;

[0009] The heat pipe also includes a second vertical pipe connected to the end of the horizontal pipe away from the first vertical pipe; the second vertical pipe passes through all the second fin assemblies.

[0010] Optionally, the integrated air-liquid cooling device further includes a first fan and a second fan; the first fan is mounted on the first fin assembly, and the air outlet of the first fan faces the first fin assembly; the second fan is mounted on the second fin assembly, and the air outlet of the second fan faces the second fin assembly.

[0011] Optionally, the first fin assembly and the second fin assembly are symmetrically arranged about the liquid cooling box as an axis of symmetry;

[0012] The first fan and the second fan are symmetrically arranged with the liquid cooling box as the axis of symmetry.

[0013] Optionally, the air-cooling mechanism further includes a fixing bracket mounted on the substrate, the fixing bracket being used to mount the substrate on an external heat source.

[0014] Optionally, the substrate has a cooling plane that is in contact with an external heat source on the side opposite to the liquid cooling box.

[0015] Optionally, the liquid cooling box is provided with a cooling channel, and the liquid cooling mechanism further includes a first connector and a second connector, both installed on the liquid cooling box. The first connector is connected to the inlet of the cooling channel, and the second connector is connected to the outlet of the cooling channel.

[0016] Optionally, the liquid cooling plate has a plurality of protrusions spaced apart at one end away from the second slot, and the liquid cooling box has a receiving groove, in which all the protrusions are inserted.

[0017] In this invention, the bottom surface of the substrate is in contact with the heat source. The substrate absorbs heat from the heat source through thermal conduction and transfers it to the heat pipe. The heat pipe, possessing superconducting thermal properties, transfers heat to the first fin assembly. The first fin assembly then convects with the air, transferring heat into the air, thus completing the air-cooled portion of the heat dissipation. Coolant flows in the cooling channels within the liquid cooling box to lower its temperature. The liquid cooling box further reduces the substrate temperature through thermal conduction, and the substrate then cools the heat source through thermal conduction, thus completing the liquid-cooled portion of the heat dissipation. This invention provides an integrated air-liquid cooling system that combines liquid and air cooling, improving its overall heat dissipation efficiency. Furthermore, the substrate is provided with a plurality of first slots spaced apart, and the liquid cooling plate is provided with a plurality of second slots spaced apart on the side opposite to the liquid cooling box. The liquid cooling box is mounted on the substrate. A first slot and a second slot surround a receiving through hole. The horizontal tubes of the heat pipe are installed in the receiving through holes one by one, so that the horizontal tubes can fully contact the substrate and the liquid cooling plate, thereby improving the heat exchange efficiency between the air cooling mechanism and the liquid cooling mechanism, further improving the cooling efficiency of the air-liquid integrated heat dissipation device, and ensuring the stability of the horizontal tubes installed between the liquid cooling plate and the substrate. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is a schematic diagram of the integrated air-liquid heat dissipation device provided in the first embodiment of this utility model;

[0020] Figure 2 This is an exploded structural diagram of the integrated air-liquid heat dissipation device provided in the first embodiment of this utility model;

[0021] Figure 3 This is an exploded structural diagram of the integrated air-liquid heat dissipation device provided in the first embodiment of this utility model.

[0022] The reference numerals in the accompanying drawings are as follows:

[0023] 1. Air-cooling mechanism; 11. First fin assembly; 12. Substrate; 121. First slot; 13. Heat pipe; 131. First vertical pipe; 132. Horizontal pipe; 133. Second vertical pipe; 14. Second fin assembly; 15. First fan; 16. Second fan; 17. Fixing bracket;

[0024] 2. Liquid cooling mechanism; 21. Liquid cooling box; 22. Liquid cooling plate; 221. Second slot; 222. Protrusion; 23. First connector; 24. Second connector; Detailed Implementation

[0025] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0026] It should be understood that the terms "upper", "lower", "left", "right", "front", "rear", "middle", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of this utility model.

[0027] like Figures 1 to 3 As shown, an embodiment of this utility model provides an integrated air-liquid cooling device, including an air-cooling mechanism 1 and a liquid-cooling mechanism 2. The air-cooling mechanism 1 includes a first fin assembly 11, a substrate 12, and a plurality of heat pipes 13. The substrate 12 is provided with a plurality of first slots 121 spaced apart. The heat pipes 13 include a first vertical pipe 131 and a horizontal pipe 132 connecting the first vertical pipe 131. It can be understood that the first fin assembly 11 is composed of a plurality of first fins stacked together. The number of heat pipes 13 can be set according to actual needs. Further, the heat pipes 13 utilize the principle of heat conduction and the rapid heat transfer property of the phase change of the cooling medium to quickly transfer the heat of the heat-generating object to the heat source through the heat pipes 13.

[0028] The liquid cooling mechanism 2 includes a liquid cooling box 21 and a liquid cooling plate 22 mounted on the liquid cooling box 21. The liquid cooling plate 22 has a plurality of second slots 221 spaced apart on the side opposite to the liquid cooling box 21. It can be understood that the liquid cooling box 21 is provided with a cooling channel, which is connected to an external pump body, etc., so that the coolant can circulate in the cooling channel. Both the first slot 121 and the second slot 221 can be semi-circular arc-shaped grooves, and the number of the first slot 121 and the second slot 221 can be set according to actual needs, and the number of both is equal.

[0029] The liquid cooling box 21 is mounted on the base plate 12, and a first slot 121 and a second slot 221 surround a receiving through hole; all the first vertical tubes 131 pass through the first fin assembly 11, and the horizontal tubes 132 are installed one-to-one in the receiving through holes.

[0030] In this invention, the bottom surface of the substrate 12 is in contact with the heat source. The substrate 12 absorbs heat from the heat source through thermal conduction and transfers it to the heat pipe 13. The heat pipe 13 has superconducting thermal properties and transfers the heat to the first fin assembly 11. The first fin assembly 11 convects with the air and transfers the heat into the air, thus completing the air-cooled portion of the heat dissipation. Coolant flows in the cooling channels of the liquid cooling box 21 to reduce the temperature of the liquid cooling box 21. The liquid cooling box 21 further reduces the temperature of the substrate 12 through thermal conduction. The substrate 12 then cools the heat source through thermal conduction, thus completing the liquid-cooled portion of the heat dissipation. In this invention, the integrated air-liquid cooling device can achieve both liquid cooling and air cooling, improving the heat dissipation efficiency of the integrated air-liquid cooling device. Furthermore, the substrate 12 is provided with a plurality of first slots 121 spaced apart, and the liquid cooling plate 22 is provided with a plurality of second slots 221 spaced apart on the side opposite to the liquid cooling box 21. The liquid cooling box 21 is mounted on the substrate 12. A first slot 121 and a second slot 221 surround a receiving through hole. The horizontal tubes 132 of the heat pipe 13 are installed in the receiving through holes one by one, so that the horizontal tubes 132 can fully contact the substrate 12 and the liquid cooling plate 22, thereby improving the heat exchange efficiency between the air cooling mechanism 1 and the liquid cooling mechanism 2, further improving the cooling efficiency of the air-liquid integrated heat dissipation device, and ensuring the stability of the horizontal tubes 132 installed between the liquid cooling plate 22 and the substrate 12.

[0031] In one embodiment, such as Figures 1 to 3 As shown, the air-cooling mechanism 1 further includes a second fin assembly 14, with the first fin assembly 11 and the second fin assembly 14 located on opposite sides of the liquid cooling box 21. Understandably, the second fin assembly 14 is composed of a plurality of stacked second fins, with the first fin assembly 11 and the second fin assembly 14 located on the left and right sides of the liquid cooling box 21, respectively.

[0032] The heat pipe 13 further includes a second vertical pipe 133 connected to the end of the horizontal pipe 132 away from the first vertical pipe 131; the second vertical pipe 133 passes through all the second fin assemblies 14. Understandably, both the first vertical pipe 131 and the second vertical pipe 133 are perpendicular to the horizontal pipe 132, and the first vertical pipe 131, the horizontal pipe 132, and the second vertical pipe 133 are integrally formed; furthermore, a first bend is provided between the first vertical pipe 131 and the horizontal pipe 132, and a second bend is provided between the second vertical pipe 133 and the horizontal pipe 132, and the first vertical pipe 131 and the second vertical pipe 133 are symmetrically connected to opposite sides of the horizontal pipe 132.

[0033] In this embodiment, the first fin assembly 11 and the second fin assembly 14 are respectively installed on opposite sides of the liquid cooling mechanism 2, so that the center of gravity of the air cooling mechanism 1 is on the liquid cooling mechanism 2, which facilitates the transportation of the integrated air-liquid heat dissipation device.

[0034] In one embodiment, such as Figure 1 As shown, the integrated air-liquid cooling device further includes a first fan 15 and a second fan 16. The first fan 15 is mounted on the first fin assembly 11, and the air outlet of the first fan 15 faces the first fin assembly 11. The second fan 16 is mounted on the second fin assembly 14, and the air outlet of the second fan 16 faces the second fin assembly 14. Understandably, the first fan 15 blows air towards the first fin assembly 11, increasing the convection velocity between the first fin assembly 11 and the air, allowing the first fin assembly 11 to transfer heat to the air more efficiently. The second fan 16 blows air towards the second fin assembly 14, increasing the convection velocity between the second fin assembly 14 and the air, allowing the second fin assembly 14 to transfer heat to the air more efficiently. In this embodiment, the design of the first fan 15 and the second fan 16 further improves the cooling efficiency of the air-cooling mechanism 1.

[0035] In one embodiment, such as Figure 1 As shown, the first fin assembly 11 and the second fin assembly 14 are symmetrically arranged about the liquid cooling box 21 as an axis of symmetry; the first fan 15 and the second fan 16 are also symmetrically arranged about the liquid cooling box 21 as an axis of symmetry. Understandably, the first fin assembly 11 and the second fin assembly 14 are symmetrically arranged on the left and right sides of the liquid cooling mechanism 2, and the first fan 15 and the second fan 16 are symmetrically arranged on the left and right sides of the liquid cooling mechanism 2, thus placing the center of gravity of the air-cooling mechanism 1 on the liquid cooling mechanism 2, further improving the ease of transporting this integrated air-liquid cooling device.

[0036] In one embodiment, such as Figures 1 to 3 As shown, the air-cooling mechanism 1 further includes a fixing bracket 17 mounted on the substrate 12. The fixing bracket 17 is used to mount the substrate 12 onto an external heat source. Further, the side of the substrate 12 facing away from the liquid cooling tank 21 has a cooling surface that contacts the external heat source. Understandably, the fixing bracket 17 extends outwards from the periphery of the substrate 12, and the substrate 12 is secured to the external heat source by the fixing bracket 17, ensuring that the cooling surface of the substrate 12 is in contact with the external heat source and maintains a certain securing pressure, further improving the heat transfer efficiency between the substrate 12 and the external heat source.

[0037] In one embodiment, such as Figures 1 to 3 As shown, the liquid cooling box 21 is provided with a cooling channel (not shown in the figure). The liquid cooling mechanism 2 also includes a first connector 23 and a second connector 24, both installed on the liquid cooling box 21. The first connector 23 connects to the inlet of the cooling channel, and the second connector 24 connects to the outlet of the cooling channel. Preferably, the first connector 23 and the second connector 24 are quick connectors. A quick connector is a connector that can connect or disconnect pipelines without tools. In this case, a leak-free plug-in quick connector is used. When the collar of the female body moves to the other end, the stainless steel ball automatically rolls outward, and the male body is disconnected due to the force of the valve spring of the female and male bodies. The valves of the male and female bodies close respectively, instantly blocking the fluid flow. When the male body is inserted into the female body, the collar returns to its original position under the action of the spring, the steel ball rolls and locks the male body tightly connected, and at the same time, the valves of the female and male bodies push each other open, allowing fluid to flow. The O-ring can completely block the leakage of fluid. In this embodiment, the design of the first connector 23 and the second connector 24 facilitates the ease of disassembly and assembly between the liquid cooling mechanism 2 and external devices.

[0038] In one embodiment, such as Figure 3 As shown, the liquid cooling plate 22 has a plurality of protrusions 222 spaced apart at one end opposite to the second slot 221, and the liquid cooling box 21 has a receiving groove (not shown in the figure), in which all the protrusions 222 are inserted. It can be understood that the array of protrusions 222 protrudes from the top surface of the liquid cooling plate 22, and the design of the protrusions 222 improves the heat exchange efficiency between the liquid cooling box 21 and the liquid cooling plate 22.

[0039] The above are merely embodiments of the integrated air-liquid heat dissipation device and container of this utility model, and are not intended to limit this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wind and liquid integrated heat dissipation device, characterized in that, It includes an air-cooling mechanism and a liquid-cooling mechanism. The air-cooling mechanism includes a first fin assembly, a substrate, and multiple heat pipes. The substrate is provided with multiple first slots spaced apart. The heat pipes include a first vertical pipe and a horizontal pipe connected to the first vertical pipe. The liquid cooling mechanism includes a liquid cooling box and a liquid cooling plate installed on the liquid cooling box. The liquid cooling plate has a plurality of second slots spaced apart on the side opposite to the liquid cooling box. The liquid cooling box is mounted on the base plate, and a first slot and a second slot surround a receiving through hole; all the first vertical tubes pass through the first fin assembly, and the horizontal tubes are installed one-to-one in the receiving through hole.

2. The wind and liquid integrated heat radiating device according to claim 1, wherein, The air-cooling mechanism further includes a second fin assembly, with the first fin assembly and the second fin assembly respectively located on opposite sides of the liquid cooling box; The heat pipe also includes a second vertical pipe connected to the end of the horizontal pipe away from the first vertical pipe; the second vertical pipe passes through all the second fin assemblies.

3. The wind liquid integrated heat dissipating device according to claim 2, characterized in that, The integrated air-liquid cooling device further includes a first fan and a second fan; the first fan is mounted on the first fin assembly, and the air outlet of the first fan faces the first fin assembly; the second fan is mounted on the second fin assembly, and the air outlet of the second fan faces the second fin assembly.

4. The wind and liquid integrated heat dissipating device according to claim 3, wherein, The first fin assembly and the second fin assembly are symmetrically arranged about the liquid cooling box as an axis of symmetry. The first fan and the second fan are symmetrically arranged with the liquid cooling box as the axis of symmetry.

5. The integrated air-liquid cooling device according to claim 1, characterized in that, The air-cooling mechanism also includes a fixing bracket mounted on the substrate, which is used to mount the substrate on an external heat source.

6. The wind liquid integrated heat radiating device according to claim 5, wherein, The substrate has a cooling plane that is in contact with an external heat source on the side opposite to the liquid cooling box.

7. The integrated air-liquid cooling device according to claim 1, characterized in that, The liquid cooling box is provided with a cooling channel. The liquid cooling mechanism also includes a first connector and a second connector, both of which are installed on the liquid cooling box. The first connector is connected to the inlet of the cooling channel, and the second connector is connected to the outlet of the cooling channel.

8. The wind liquid integrated heat radiating device according to claim 1, wherein, The liquid cooling plate has a plurality of protrusions spaced apart at one end away from the second slot, and the liquid cooling box has a receiving groove, in which all the protrusions are inserted.

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