Straight-through type heat pipe radiator

By placing an electronic cooling chip inside the heat pipe vacuum chamber and implementing PID control, combined with an integrally molded condenser fin and heat dissipation fin, the problem of poor contact of the electronic cooling chip is solved, achieving efficient heat conduction and temperature control, and improving the heat dissipation effect of the radiator.

CN224176951UActive Publication Date: 2026-04-28SHENZHEN WEITAI NEW ENERGY TECH CO LTD
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Patent Information

Application Number
CN202521137755.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-06-05
Publication Date
2026-04-28
Estimated Expiration
2035-06-05

AI Technical Summary

Technical Problem

In existing technologies, the contact between the electronic cooling chip and the heat sink may have gaps and limited contact surface, resulting in poor heat dissipation.

Method used

An electronic cooling chip is placed inside the vacuum chamber of a heat pipe, and the cooling power is controlled by PID regulation. Combined with condensation fins and heat dissipation fins that are integrally formed on the inner and outer walls, heat transfer without contact loss is achieved.

Benefits of technology

This improves the heat dissipation effect of the heat pipe, achieves effective control of the target temperature and maximizes heat conduction, and enhances the overall heat dissipation performance of the radiator.

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Abstract

The utility model provides a straight-through type heat pipe radiator, which is characterized by comprising a heat pipe main body with a vacuum cavity, an upper cover plate arranged at the top of the vacuum cavity, and an electronic refrigeration sheet arranged in the vacuum cavity and positioned below the upper cover plate. The straight-through type heat pipe radiator has the advantage of being good in radiating effect.
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