Straight-through type heat pipe radiator

Abstract

The utility model provides a straight-through type heat pipe radiator, which is characterized by comprising a heat pipe main body with a vacuum cavity, an upper cover plate arranged at the top of the vacuum cavity, and an electronic refrigeration sheet arranged in the vacuum cavity and positioned below the upper cover plate. The straight-through type heat pipe radiator has the advantage of being good in radiating effect.

Description

Technical Field

[0001] This utility model relates to the field of radiators, specifically a straight-through heat pipe radiator. Background Technology

[0002] In existing technologies, CPU heat sinks mainly use three methods: aluminum fins + air cooling, aluminum fins + heat pipes + air cooling combination, and water cooling.

[0003] Among them, the heat pipe technology of heat pipe radiators is a heat transfer element called "heat pipe" that was invented by George Grover of Los Alamos National Laboratory in the United States in 1963. It makes full use of the principle of heat conduction and the rapid heat transfer properties of phase change media, and rapidly transfers the heat of the heated object to the outside of the heat source through the heat pipe. Its thermal conductivity exceeds that of any known metal.

[0004] Heat pipe technology was previously widely used in aerospace, military and other industries. Since its introduction into the radiator manufacturing industry, it has changed people's traditional radiator design thinking. It has broken away from the single heat dissipation mode that relies solely on high airflow motors to achieve better heat dissipation. With the adoption of heat pipe technology, radiators can still achieve satisfactory results even when using low-speed, low-airflow motors. This has effectively solved the noise problem that plagued air-cooled heat dissipation and opened up a new world for the heat dissipation industry.

[0005] In existing technologies, heat sinks are typically placed in contact with heat pipes to dissipate heat. Some existing technologies place electrothermal chips in contact with heat sinks, utilizing the cooling effect of the electrothermal chip to improve heat dissipation. However, due to potential gaps and limited contact area between the electrothermal chip and the heat sink, the heat dissipation effect is often unsatisfactory. Utility Model Content

[0006] The purpose of this invention is to provide a straight-through heat pipe radiator with good heat dissipation effect.

[0007] In this embodiment of the present invention, a direct-flow heat pipe radiator is provided, comprising: a heat pipe body having a vacuum chamber, an upper cover plate disposed on the top of the vacuum chamber, and an electronic cooling chip disposed in the vacuum chamber and located below the upper cover plate.

[0008] In this embodiment of the invention, the cooling surface of the electronic cooling chip faces the bottom of the vacuum chamber.

[0009] In this embodiment of the invention, the straight-through heat pipe radiator further includes a sealing ring disposed between the vacuum chamber and the upper cover plate.

[0010] In this embodiment of the invention, the heat pipe body further includes heat dissipation fins disposed on the outer wall of the vacuum cavity and integrally formed with the heat pipe body.

[0011] In this embodiment of the present invention, the heat pipe body further includes condenser fins disposed on the inner wall of the vacuum chamber and integrally formed with the heat pipe body.

[0012] In this embodiment of the utility model, the upper cover plate is provided with an air extraction hole, and a silicone plug is provided on the air extraction hole.

[0013] In this embodiment of the utility model, the upper cover plate is also provided with a through hole, and the electronic cooling chip is connected to an external circuit through an electronic tube passing through the through hole, and the electronic tube is sealed to the through hole.

[0014] In this embodiment of the present invention, the heat pipe body is further provided with a first threaded post, and the upper cover plate is provided with a fixing hole corresponding to the first threaded post. The upper cover plate and the heat pipe body are fixed by screws passing through the first threaded post and the fixing hole.

[0015] In this embodiment of the present invention, the straight-through heat pipe radiator further includes a cooling fan disposed on the heat pipe body, and the heat pipe body is also provided with a second threaded hole post for fixing the cooling fan, and the cooling fan is fixed on the heat pipe body by a screw passing through the second threaded hole post.

[0016] In this embodiment of the present invention, the direct-flow heat pipe radiator further includes a control module connected to the electronic cooler, the control module being used to perform PID adjustment of the cooling power of the electronic cooler according to the target temperature and the current temperature.

[0017] Compared with existing technologies, the direct-flow heat pipe radiator of this invention places the electronic cooling chip inside the vacuum chamber of the heat pipe, allowing the cooling capacity of the electronic cooling chip to be completely released within the heat pipe, thus improving the heat dissipation effect of the heat pipe. Furthermore, by performing PID adjustment of the cooling power of the electronic cooling chip based on the target temperature and the current temperature, the heat dissipation effect can be effectively controlled, and the target temperature can be effectively controlled. Additionally, the heat pipe body is equipped with integrally formed condensation fins and heat dissipation fins, respectively, ensuring no contact loss in heat exchange between the inner and outer walls of the heat pipe, maximizing the heat dissipation conduction effect and further improving the heat dissipation effect. Attached Figure Description

[0018] Figure 1 This is a partial exploded view of a straight-through heat pipe radiator according to an embodiment of this utility model.

[0019] Figure 2 This is an exploded view of a straight-through heat pipe radiator according to an embodiment of this utility model.

[0020] Figure 3 This is a cross-sectional structural diagram of a straight-through heat pipe radiator according to an embodiment of the present invention.

[0021] Figure 4 This is a schematic diagram of the installation structure of a straight-through heat pipe radiator according to an embodiment of the present invention.

[0022] Figure 5 This is a schematic diagram of the control flow of the electronic cooling chip according to an embodiment of the present invention. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0024] The implementation of this utility model will be described in detail below with reference to specific embodiments.

[0025] like Figure 1 As shown in the embodiment of this utility model, a direct-flow heat pipe radiator is provided, which includes: a heat pipe body 1 having a vacuum chamber, an upper cover plate 2 disposed on the top of the vacuum chamber, an electronic cooling chip 3 disposed in the vacuum chamber, and a lower cover plate 4 disposed at the bottom of the vacuum chamber.

[0026] Both the upper cover plate 2 and the lower cover plate 2 of the heat pipe are sealed to the vacuum chamber via sealing rings 5. It should be noted that the bottom of the heat pipe body 1 may not have a lower cover plate, but can be formed into a bottom seal by integral molding, so that it can directly contact the circuit to be cooled, thereby achieving a better heat dissipation effect.

[0027] The cooling surface of the electronic cooling chip 3 faces the bottom of the vacuum chamber, thereby allowing the cooling capacity to be better released into the heat pipe.

[0028] The upper cover plate 2 is also provided with a through hole 21, through which the electronic cooling chip 3 is connected to an external circuit via an electronic conduit 31 passing through the through hole 21. The electronic conduit 31 and the through hole 21 are sealed together with sealant to maintain the airtightness of the vacuum chamber. Furthermore, the upper cover plate 2 is provided with a vacuum evacuation hole 22, on which a silicone plug 23 is provided. The vacuum evacuation hole 22 is used to evacuate the vacuum chamber of the heat pipe body 1.

[0029] The heat pipe body 1 is also provided with a first threaded post 11, and the upper cover plate 2 is provided with a fixing hole 24 corresponding to the first threaded post. The upper cover plate 2 and the heat pipe body 1 are fixed by screws 10 passing through the first threaded post 11 and the fixing hole 24.

[0030] Furthermore, such as Figure 2 As shown, the straight-through heat pipe radiator also includes a cooling fan 6 disposed on the heat pipe body 1. The heat pipe body 1 is also provided with a second threaded post 12 for fixing the cooling fan, and the cooling fan 5 is fixed to the heat pipe body 1 by a screw 61 passing through the second threaded post 12.

[0031] Furthermore, such as Figure 3 As shown in the embodiment of this utility model, the heat pipe body 1 further includes a heat dissipation fin 13 disposed on the outer wall of the vacuum chamber and integrally formed with the heat pipe body 1, and a condensation fin 14 disposed on the inner wall of the vacuum chamber and integrally formed with the heat pipe body 1. This arrangement enables contactless heat exchange between the inner and outer walls of the heat pipe, optimizes the heat dissipation and conduction effect, and improves the heat dissipation performance.

[0032] It should be noted that a heat-conducting liquid is placed inside the vacuum chamber of the heat pipe body 1. Functionally, the vacuum chamber of the heat pipe body 1 can be divided into an evaporation section and a condensation section. The evaporation section is the bottom of the heat pipe body 1, which is in direct contact with the electronic device to be cooled, and the heat from the electronic device causes the heat-conducting liquid to evaporate. The condensation section is the top of the heat pipe body 1, where the evaporated gas is condensed into a heat-conducting liquid by the action of the electronic cooling element 3.

[0033] The connection method between the direct-flow heat pipe radiator and the circuit board of this utility model is as follows: Figure 4 As shown, its heat dissipation principle is as follows:

[0034] After being heated in the evaporation section of the heat pipe, the working liquid in the vacuum chamber evaporates under near-vacuum conditions, carrying away heat—the latent heat of vaporization of the working liquid. The vapor flows from the central channel to the condensation section of the heat pipe and contacts the condensation surface of the electronic cooling chip at its tip. The latent heat is released on the cooling surface of the electronic cooling chip 3, forming liquid. Under capillary action, the liquid flows back to the evaporation section. This completes a closed loop. Repeating this process transfers a large amount of heat from the evaporation section to the condensation section.

[0035] Furthermore, in this embodiment of the present invention, the direct-flow heat pipe radiator further includes a control module connected to the electronic cooling plate 3. The control module is used to perform PID adjustment of the cooling power of the electronic cooler based on the target temperature and the current temperature. The control module can be a microprocessor. It should be noted that the target temperature can be the target temperature of the device to be cooled, or it can be the target temperature at a certain location on the direct-flow heat pipe radiator. By performing PID control on the power of the electronic cooling plate based on the set target temperature and the target temperature detected by the sensor, the target temperature can be stably maintained. The control flow is as follows: Figure 5 As shown, the control process is as follows:

[0036] The control module acquires temperature sensor data via AD acquisition, processes and modulates the temperature data to obtain the actual heat dissipation target temperature T1, subtracts the set temperature T0 from T1 to obtain the deviation value, and inputs the deviation value into the set PID algorithm to output a control quantity (0-100%). The control quantity then controls the output PWM part of the control module, and outputs a variable voltage value by adjusting the duty cycle, thereby changing the cooling intensity of the electronic cooling chip.

[0037] In summary, this utility model's direct-flow heat pipe radiator places the electronic cooling chip inside the vacuum chamber of the heat pipe, allowing the cooling capacity of the electronic cooling chip to be completely released within the heat pipe, thus improving the heat dissipation effect. Furthermore, by using PID control to adjust the cooling power of the electronic cooling chip based on the target temperature and the current temperature, the heat dissipation effect can be effectively controlled, and the target temperature can be effectively controlled. Additionally, the heat pipe body is equipped with integrally molded condenser fins and heat dissipation fins, respectively, ensuring contactless heat exchange between the inner and outer walls of the heat pipe. The heat dissipation and conduction effect of the heat pipe reaches the theoretical maximum value under the current structural condition, further improving the heat dissipation effect.

[0038] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A straight-through heat pipe radiator, characterized in that, include: The heat pipe body has a vacuum chamber, an upper cover plate disposed at the top of the vacuum chamber to seal the vacuum chamber, and an electronic cooling chip disposed inside the vacuum chamber and located below the upper cover plate. The cooling surface of the electronic cooling chip is arranged facing the bottom of the vacuum chamber. The heat pipe body also includes a heat dissipation fin disposed on the outer wall of the vacuum chamber and integrally formed with the heat pipe body, and a condensation fin disposed on the inner wall of the vacuum chamber and integrally formed with the heat pipe body.

2. The straight-through heat pipe radiator as described in claim 1, characterized in that, It also includes a sealing ring disposed between the vacuum chamber and the upper cover plate.

3. The straight-through heat pipe radiator as described in claim 1, characterized in that, The upper cover plate is provided with an air extraction hole, and a silicone plug is provided on the air extraction hole.

4. The straight-through heat pipe radiator as described in claim 1, characterized in that, The upper cover plate is also provided with a through hole, and the electronic cooling chip is connected to an external circuit through an electronic tube passing through the through hole. The electronic tube and the through hole are sealed together with sealant.

5. The straight-through heat pipe radiator as described in claim 1, characterized in that, The heat pipe body is also provided with a first threaded post, and the upper cover plate is provided with a fixing hole corresponding to the first threaded post. The upper cover plate and the heat pipe body are fixed by screws passing through the first threaded post and the fixing hole.

6. The straight-through heat pipe radiator as described in claim 1, characterized in that, It also includes a cooling fan disposed on the heat pipe body, and the heat pipe body is further provided with a second threaded hole post for fixing the cooling fan, and the cooling fan is fixed to the heat pipe body by a screw passing through the second threaded hole post.

7. The straight-through heat pipe radiator as described in claim 1, characterized in that, It also includes a control module connected to the electronic cooling chip, which is used to perform PID adjustment of the cooling power of the electronic cooling chip according to the target temperature and the current temperature.

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