Element heat dissipation structure

Abstract

The utility model belongs to the technical field of automobile parts, and provides an element heat dissipation structure which comprises a heat conduction substrate installed on an element, the top of the heat conduction substrate is provided with a plurality of grooves arranged in parallel, each groove is internally provided with a phase change heat conduction layer, the back face of the heat conduction substrate is provided with a plurality of first-level fins distributed in parallel at intervals, and the first-level fins are arranged in parallel at intervals. Secondary fins are arranged between the opposite surfaces of every two adjacent primary fins, the secondary fins are obliquely arranged, a flow guide channel is formed between every two secondary fins, and an airflow guide cover is arranged at the top of the heat conduction substrate; according to the utility model, by arranging the heat dissipation device, heat dissipation can be carried out on elements with insufficient heat dissipation, so that the situation that the temperature of the elements is too high is effectively avoided, and the safety is improved.

Description

Technical Field

[0001] This utility model belongs to the field of automotive parts technology, specifically a component heat dissipation structure. Background Technology

[0002] With the continuous advancement of technology, the automotive industry has undergone tremendous changes, from traditional mechanical drive to today's intelligent and electric development. Automotive technology is becoming increasingly complex and diversified, and safety, comfort, environmental protection, and performance have always been the focus of research and development.

[0003] Automobiles contain a large number of components that work together to enable the normal operation and various functions of the vehicle. These components mainly include power system components, electrical system components, and chassis system components. With the increasing electrification and intelligence of automobiles, the power density of in-vehicle electronic components (such as ECUs, power semiconductors, and sensors) has increased significantly. Some components mainly rely on natural convection, but in the high-temperature environment of the engine compartment, this may lead to insufficient heat dissipation efficiency, resulting in a decline in component performance or even failure. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a component heat dissipation structure to solve the problem that some components in automobiles cannot dissipate heat in a timely manner during operation.

[0005] A component heat dissipation structure includes a heat-conducting substrate mounted on a component. The top of the heat-conducting substrate has multiple parallel grooves, each groove containing a phase change heat-conducting layer. The back of the heat-conducting substrate has multiple parallel and spaced primary fins. A secondary fin is provided between the opposing surfaces of two adjacent primary fins. The secondary fins are inclined and form a flow channel between two secondary fins. The top of the heat-conducting substrate has an airflow guide shroud.

[0006] Preferably, the thermally conductive substrate is made of a high thermal conductivity aluminum alloy, the phase change thermally conductive layer is filled in the groove, and the phase change thermally conductive layer is made of graphene.

[0007] Preferably, the primary fin is vertically welded to the back of the substrate, and the two side walls of the primary fin are provided with turbulence patterns, which are designed in a wave shape.

[0008] Preferably, the top height of the secondary fin is lower than the height of the primary fin, and there is a gap between the tops of two adjacent secondary fins. The vertical cross-sectional profile of the two adjacent secondary fins combined is "human" shaped.

[0009] Preferably, the angle between the secondary fin and the horizontal plane is 15-20 degrees.

[0010] Preferably, the airflow guide cover covers the top of the heat-conducting substrate, and the airflow guide cover has an air inlet and an air outlet on both sides, and the area of ​​the air inlet is larger than the area of ​​the air outlet.

[0011] Preferably, mounting strips are provided on both sides of the thermally conductive substrate, and mounting grooves are provided on the side of the two mounting strips away from the thermally conductive substrate. Elastic buckles are provided in the mounting grooves at intervals, and the elastic buckles extend out of the mounting grooves.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. This utility model features a heat-conducting substrate that is bonded to the component. A groove is provided on the back of the heat-conducting substrate, and a phase change heat-conducting layer is placed within the groove. Rapid heat diffusion can be achieved through the transfer of heat through the phase change heat-conducting layer. Vertical primary fins are provided on the heat-conducting substrate. The vertical arrangement of the primary fins forms the basic heat dissipation surface. The wavy turbulence pattern on the surface of the primary fins disrupts the airflow boundary layer and increases the heat dissipation area. An inclined secondary fin is provided between two primary fins. The inclination angle of the secondary fins forces the airflow to generate turbulence between adjacent primary fins, enhancing the convective heat transfer efficiency and allowing the heat to be better discharged from the heat conduction channel. This effectively improves the heat dissipation efficiency of the component, avoids performance degradation or even failure due to insufficient heat dissipation, and extends the service life of the component.

[0014] 2. This utility model uses a primary fin as the main heat dissipation support and designs the height of the secondary fin to be lower than that of the primary fin to avoid blocking the flow channel in the primary fin. At the same time, the secondary fin fills the empty area between the primary fins, thereby increasing the effective heat dissipation area per unit volume.

[0015] Furthermore, the tops of the two secondary fins are designed with a certain gap. If the tops of the secondary fins are attached, a closed "triangular cavity" will be formed, causing hot air to stagnate, increasing local wind resistance, and weakening the forced convection effect. On the contrary, it can guide the airflow to split, so that after the airflow passes through the gap of the primary fin, it can be divided into upper and lower streams along the inclined surface of the secondary fin, extending the airflow path and expanding the heat dissipation surface coverage.

[0016] 3. This utility model sets an air inlet and an air outlet on the airflow guide cover. The area of ​​the air outlet is smaller than that of the air inlet. As the airflow enters the guide channel from the air inlet, the area of ​​the channel gradually decreases. The gradual shrinkage method can accelerate the airflow and finally discharge it from the air outlet, thereby further improving the heat dissipation efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall component heat dissipation structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the thermally conductive substrate and primary fins of this utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the primary fins and secondary fins of this utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the thermally conductive substrate and mounting strip of this utility model;

[0021] Figure 5 This is a schematic diagram of the airflow guide cover component of this utility model.

[0022] In the picture:

[0023] 1. Thermally conductive substrate; 2. Groove; 3. Phase change thermally conductive layer; 4. Primary fins; 5. Secondary fins; 6. Airflow channel; 7. Airflow guide shroud; 8. Turbulence pattern; 9. Air inlet; 10. Air outlet; 11. Mounting strip; 12. Mounting groove; 13. Elastic buckle. Detailed Implementation

[0024] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0025] As attached Figure 1 To be continued Figure 5 As shown:

[0026] Example 1: This utility model provides a component heat dissipation structure, including a heat-conducting substrate 1 mounted on the component. The top of the heat-conducting substrate 1 is provided with multiple parallel grooves 2, and each groove 2 is provided with a phase change heat-conducting layer 3. The back of the heat-conducting substrate 1 is provided with multiple parallel and spaced primary fins 4. A secondary fin 5 is provided between the opposite faces of two adjacent primary fins 4. The secondary fins 5 are inclined and a flow channel 6 is formed between two secondary fins 5. An airflow guide cover 7 is provided on the top of the heat-conducting substrate 1.

[0027] It should be noted that the thermally conductive substrate 1 is attached to the component. A groove 2 is provided on the back of the thermally conductive substrate 1, and a phase change thermally conductive layer 3 is provided in the groove 2. Rapid heat diffusion can be achieved through the transfer of the phase change thermally conductive layer 3. Vertical primary fins 4 are provided on the thermally conductive substrate 1. The vertical layout of the primary fins 4 forms the basic heat dissipation surface. The wavy turbulence pattern 8 on its surface breaks the airflow boundary layer and increases the heat dissipation area. An inclined secondary fin 5 is provided between two primary fins 4. The inclination angle of the secondary fin 5 forces the airflow to generate turbulence between adjacent primary fins 4, enhances the convective heat transfer efficiency, and better discharges from the thermal channel, effectively improving the heat dissipation efficiency of the component and avoiding the situation where insufficient heat dissipation leads to performance degradation or even failure, thereby improving the service life of the component.

[0028] In this embodiment, the thermally conductive substrate 1 is made of high thermal conductivity aluminum alloy, the phase change thermally conductive layer 3 is filled in the groove 2, and the phase change thermally conductive layer 3 is made of graphene.

[0029] It should be noted that by designing the thermally conductive substrate 1 as a high thermal conductivity aluminum alloy material, the heat of the component can be transferred to the phase change thermally conductive layer 3. The phase change thermally conductive layer 3 is a graphene composite phase change material, which enables rapid thermal diffusion and allows it to enter the flow channel 6.

[0030] In this embodiment, the primary fin 4 is vertically welded to the back of the substrate, and the two side walls of the primary fin 4 are provided with turbulence patterns 8, which are designed in a wave shape.

[0031] It should be noted that by setting turbulence patterns 8 on both sides of the first-stage fin 4 and designing them in a wave shape, the airflow boundary layer can be effectively disrupted while increasing the heat dissipation area and improving the heat dissipation efficiency.

[0032] In this embodiment, the top height of the secondary fin 5 is lower than the height of the primary fin 4, and there is a gap between the tops of two adjacent secondary fins 5. The vertical cross-sectional profile of the two adjacent secondary fins 5 after combination is "human" shaped.

[0033] It should be noted that the primary fin 4 serves as the main heat dissipation support, and the height of the secondary fin 5 is designed to be lower than that of the primary fin 4 to avoid obstructing the flow channel 6 inside the primary fin 4. At the same time, the secondary fin 5 fills the empty area between the primary fin 4, thereby increasing the effective heat dissipation area per unit volume.

[0034] Furthermore, the tops of the two secondary fins 5 are designed with a certain gap. If the tops of the secondary fins 5 are attached, a closed "triangular cavity" will be formed, which will cause hot air to stagnate, increase local wind resistance, and weaken the forced convection effect. On the contrary, it can guide the airflow to split, so that after the airflow passes through the gap of the primary fin 4, it can be divided into upper and lower streams along the inclined surface of the secondary fin 5, which will extend the airflow path and expand the heat dissipation surface coverage.

[0035] In this embodiment, the angle between the secondary fin 5 and the horizontal plane is 15-20 degrees.

[0036] It should be noted that the angle between the secondary fin 5 and the horizontal plane is preferably 15 degrees, so that the airflow can be better guided without interfering with the normal flow channel 6.

[0037] In this embodiment, the airflow guide cover 7 covers the top of the heat-conducting substrate 1. The airflow guide cover 7 has an air inlet 9 and an air outlet 10 on both sides, and the area of ​​the air inlet 9 is larger than the area of ​​the air outlet 10.

[0038] It should be noted that an air inlet 9 and an air outlet 10 are provided on the airflow guide shroud 7. The area of ​​the air outlet 10 is smaller than that of the air inlet 9. As a result, after the air enters the airflow channel 6 from the air inlet 9, the area of ​​the channel gradually decreases. This gradual reduction can accelerate the airflow and eventually discharge it from the air outlet 10, further improving the heat dissipation efficiency.

[0039] In this embodiment, mounting strips 11 are provided on both sides of the heat-conducting substrate 1, and mounting grooves 12 are provided on the side of the two mounting strips 11 away from the heat-conducting substrate 1. Elastic buckles 13 are provided in the mounting grooves 12 at intervals, and the elastic buckles 13 extend out of the mounting grooves 12.

[0040] It should be noted that by setting mounting strips 11 on both sides of the heat-conducting substrate 1, the mounting strips 11 are fixedly connected to both sides of the heat-conducting substrate 1, and mounting grooves 12 are set on the mounting strips 11. The elastic buckles 13 are slidably installed in the mounting grooves 12. On the one hand, the elastic buckles 13 can be quickly installed with the car ECU housing, reducing installation time. On the other hand, the elastic buckles 13 can move in the mounting grooves 12, thereby adjusting different installation positions and improving installation flexibility.

[0041] The above embodiments are used in this embodiment, which takes the heat dissipation of an in-vehicle IGBT module as an example. The thermal conductive substrate 1 is attached to the IGBT surface with thermal conductive silicone grease, and the elastic buckle 13 is movably connected in the mounting groove 12. The position of the elastic buckle 13 is adjusted so that it is fastened to the car ECU housing to realize the installation of the heat dissipation structure of the component.

[0042] At the same time, the direction of the airflow guide shroud 7 is adjusted so that the air inlet 9 is aligned with the air conditioning outlet direction. When the vehicle is running, the air conditioning airflow enters from the air inlet 9 of the airflow guide shroud 7. The heat-conducting substrate 1 and the phase change heat-conducting layer 3 can transfer the heat of the components to the airflow guide shroud 7. The heat is carried out by the air conditioning airflow. Combined with the fin group disturbance, the heat dissipation efficiency is improved. When the heat is discharged from the air outlet 10, the area of ​​the air outlet 10 is smaller than that of the air inlet 9. The tapering method can accelerate the airflow to be discharged from the air outlet 10, further improving the heat dissipation efficiency.

[0043] The embodiments of this utility model are given for the purpose of illustration and description. Although embodiments of this utility model have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the utility model. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this utility model.

Claims

1. An element heat dissipating structure, characterized by comprising: include: A thermally conductive substrate (1) is mounted on the component. The top of the thermally conductive substrate (1) is provided with multiple parallel grooves (2). Each groove (2) is provided with a phase change thermally conductive layer (3). The back of the thermally conductive substrate (1) is provided with multiple parallel and spaced primary fins (4). A secondary fin (5) is provided between the opposite surfaces of two adjacent primary fins (4). The secondary fins (5) are inclined and a flow channel (6) is formed between two secondary fins (5). An airflow guide cover (7) is provided on the top of the thermally conductive substrate (1).

2. The element heat dissipating structure according to claim 1, wherein: The thermally conductive substrate (1) is made of high thermal conductivity aluminum alloy, the phase change thermally conductive layer (3) is filled in the groove (2), and the phase change thermally conductive layer (3) is made of graphene.

3. The element heat dissipating structure according to Claim 1, wherein: The primary fin (4) is vertically welded to the back of the substrate. Turbulence patterns (8) are provided on both sides of the primary fin (4). The turbulence patterns (8) are designed in a wave shape.

4. The element heat dissipating structure according to Claim 1, wherein: The top height of the secondary fin (5) is lower than the height of the primary fin (4), and there is a gap between the tops of two adjacent secondary fins (5). The vertical cross-sectional profile of the two adjacent secondary fins (5) is "human" shaped.

5. The element heat dissipating structure according to claim 4, wherein: The angle between the secondary fin (5) and the horizontal plane is 15-20 degrees.

6. The element heat dissipating structure according to Claim 1, wherein: The airflow guide cover (7) covers the top of the heat-conducting substrate (1). The airflow guide cover (7) has an air inlet (9) and an air outlet (10) on its two sides, and the area of ​​the air inlet (9) is larger than the area of ​​the air outlet (10).

7. The element heat dissipating structure according to Claim 1, wherein: The heat-conducting substrate (1) has mounting strips (11) on both sides. The two mounting strips (11) have mounting grooves (12) on the side away from the heat-conducting substrate (1). The mounting grooves (12) have elastic buckles (13) spaced apart and extend out of the mounting grooves (12).

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