Heat dissipation system of heat dissipation patch
By designing a reasonable airflow structure and power supply position on the heat dissipation pad, the problems of low heat dissipation efficiency and easy power supply damage are solved, achieving more efficient heat dissipation and safer use.
Patent Information
- Application Number
- CN202520128635.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-06-30
- Estimated Expiration
- 2035-01-20
AI Technical Summary
Existing technologies have poor heat dissipation efficiency. Hot air forms turbulence inside the heat sink housing, affecting heat dissipation efficiency. Furthermore, the power supply is prone to damage due to overheating, posing a safety hazard.
Design a heat dissipation system for a heat dissipation pad, with air vents located on both sides of the heat dissipation pad. The exhaust direction of the fan is consistent with the intake direction to avoid turbulence. The power supply is located at the end away from the main exhaust vent to prevent hot air from affecting the power supply temperature. Guide strips and baffles are used to optimize the airflow structure, improving heat dissipation efficiency and safety.
It improves heat dissipation efficiency, extends the service life of the power supply and cooling system, enhances safety, and prevents the risk of power supply overheating and spontaneous combustion or explosion.