Thermoelectric separation metal substrate structure

Abstract

The utility model provides a structure of a thermoelectric separation metal substrate, and belongs to the technical field of metal substrates. The thermoelectric separation metal substrate comprises an insulating layer and a copper foil circuit layer laid on the surface of the insulating layer. The insulating layer is bonded on the substrate, four fixing blocks are arranged at four corners of the edge of the bottom of the substrate, a plurality of heat dissipation holes and a plurality of grooves are formed in the bottom of the substrate in a staggered mode, a plurality of heat dissipation fins are arranged in the grooves at equal intervals, and four airflow ports are formed between the fixing blocks and the bottom of the substrate. A boss is arranged on the surface of the substrate and used for installing an electronic element. The depth of each heat dissipation hole is two thirds of the thickness of the substrate, and the depth of each groove is one third of the thickness of the substrate. Through the thermoelectric separation structure design and the air convection heat dissipation mechanism, the heat dissipation efficiency of the metal substrate is remarkably improved, the installation stability is enhanced, and the heat dissipation structure is suitable for heat dissipation of high-power electronic devices.

Description

Technical Field

[0001] This application relates to the field of metal substrate technology, and more specifically, to the structure of a thermoelectrically separated metal substrate. Background Technology

[0002] As electronic devices evolve towards higher power and miniaturization, heat dissipation has become a key factor limiting their performance and reliability. Traditional metal substrates, such as aluminum and copper substrates, are widely used in LEDs, high-power devices, and other fields due to their excellent thermal conductivity. However, these substrates still have significant shortcomings in terms of heat dissipation efficiency. For example, ordinary metal substrates have low thermal conductivity, and the thermal layer is not effectively separated from the circuit layer, resulting in heat not being able to be quickly conducted to the heat dissipation area, thus limiting the heat dissipation capacity of electronic devices. Utility Model Content

[0003] To overcome the above deficiencies, this application provides a structure of a thermoelectrically separated metal substrate to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the technical solution adopted by this utility model to solve its technical problem is as follows:

[0005] A structure of a thermoelectrically separated metal substrate includes an insulating layer and a copper foil circuit layer laid on the surface of the insulating layer. The insulating layer is bonded to the substrate, and four fixing blocks are integrally formed at the four corners of the bottom edge of the substrate. A plurality of heat dissipation holes and a plurality of grooves are staggered on the bottom. The plurality of heat dissipation holes are evenly divided into a plurality of grooves. A plurality of heat dissipation fins are arranged at equal intervals inside the plurality of grooves. The four fixing blocks respectively form four airflow ports between themselves and the bottom of the substrate.

[0006] Furthermore, the substrate surface has a boss, and the substrate and the end face and periphery of the boss are covered with the insulating layer.

[0007] Furthermore, four notches are respectively opened at the four corners of the surface edge of the substrate, and the four notches correspond one-to-one with the end faces of the four fixing blocks.

[0008] Furthermore, each of the four fixing blocks has a mounting hole on its end face, and the four mounting holes are located inside the four notches.

[0009] Furthermore, the depth of some of the heat dissipation holes is two-thirds of the thickness of the substrate.

[0010] Furthermore, the depth of some of the grooves is one-third of the thickness of the substrate.

[0011] This utility model has the following beneficial effects:

[0012] 1. This utility model features staggered heat dissipation holes and grooves on the bottom of the substrate, with the holes evenly dividing the grooves. This unique design significantly increases the heat dissipation area. Heat can be conducted not only through the substrate plane but also dissipated in multiple directions through the heat dissipation holes and grooves, breaking the limitations of traditional planar heat dissipation structures, fully utilizing the internal space of electronic devices, and effectively improving heat dissipation efficiency. Simultaneously, the evenly spaced heat sinks inside the grooves further increase the heat dissipation area, accelerating heat dissipation and enabling faster conduction of heat generated by electronic components, reducing the operating temperature of electronic components, and improving the stability and reliability of electronic devices.

[0013] 2. The airflow openings formed between the four fixing blocks and the bottom of the substrate in this invention provide channels for airflow. During the operation of the electronic device, air can flow through the airflow openings to form natural or forced convection at the bottom of the substrate, accelerating heat exchange and dissipation. This airflow circulation design effectively prevents heat accumulation at the bottom of the substrate, further improving heat dissipation efficiency and ensuring stable operation of electronic components in a suitable temperature environment.

[0014] 3. The depth of the heat dissipation holes in this invention is two-thirds of the substrate thickness, and the depth of the grooves is one-third of the substrate thickness. This depth setting is carefully designed. The deeper heat dissipation holes increase the airflow path inside the substrate, enhancing the heat dissipation effect; while the shallower grooves maintain the structural strength of the substrate while ensuring heat dissipation performance. The two work together to improve heat dissipation efficiency while ensuring the stability and reliability of the substrate. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of the thermoelectrically separated metal substrate provided in the embodiments of this application;

[0017] Figure 2 A schematic diagram of the boss display structure provided for an embodiment of this application;

[0018] Figure 3 A schematic diagram of the bottom structure of a thermoelectrically separated metal substrate provided for an embodiment of this application;

[0019] Figure 4 A schematic diagram of the substrate, groove, and heat dissipation holes provided in an embodiment of this application.

[0020] In the diagram: 1-Insulating layer; 2-Copper foil circuit layer; 3-Substrate; 4-Fixing block; 5-Heat dissipation hole; 6-Groove; 7-Heat sink; 8-Airflow port; 9-Boss; 10-Notch; 11-Mounting hole. Detailed Implementation

[0021] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0022] Example:

[0023] Please see Figure 1 , Figure 2 A structure of a thermoelectrically separated metal substrate includes an insulating layer 1 and a copper foil circuit layer 2 deposited on the surface of the insulating layer 1.

[0024] The insulating layer 1 can be made of a material with good electrical insulation properties and a certain mechanical strength. This insulating layer 1 not only achieves electrical isolation between the substrate 3 and the copper foil circuit layer 2, preventing short circuits, but its high thermal conductivity can also quickly transfer the heat generated by the electronic components on the copper foil circuit layer 2 to the substrate 3, effectively reducing thermal resistance, improving the thermoelectric separation effect, and thus enhancing the heat dissipation performance of the entire metal substrate.

[0025] The copper foil circuit layer 2 is made of copper foil with excellent conductivity. This copper foil circuit layer 2 provides a reliable electrical connection channel for electronic components, enabling signal transmission and power supply between various components within the electronic device. Its excellent conductivity ensures low signal loss and high speed, improving the performance and stability of the electronic device.

[0026] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 A structure of a thermoelectrically separated metal substrate includes an insulating layer 1 bonded to a substrate 3. Four fixing blocks 4 are integrally formed at the four corners of the bottom edge of the substrate 3, and a plurality of heat dissipation holes 5 and a plurality of grooves 6 are staggered on the bottom. The staggered heat dissipation holes 5 evenly divide the plurality of grooves 6. A plurality of heat dissipation fins 7 are arranged at equal intervals inside the plurality of grooves 6. The four fixing blocks 4 respectively form four airflow ports 8 between them and the bottom of the substrate 3. The surface of the substrate 3 has a protrusion 9. Four notches 10 are formed at the four corners of the edge of the surface of the substrate 3. Four mounting holes 11 are formed on the end faces of the four fixing blocks 4 respectively.

[0027] The substrate 3 is made of a metal material with good thermal conductivity, and its thickness can be adjusted according to heat dissipation requirements and mechanical strength. As the supporting structure for the entire metal substrate, substrate 3 provides a stable mounting platform for the insulating layer 1 and the copper foil circuit layer 2. Its high strength and hardness ensure the stability and reliability of the metal substrate during installation and use, preventing deformation and damage. Simultaneously, the excellent thermal conductivity of the aluminum alloy material facilitates the rapid transfer of heat from the insulating layer 1 to the heat dissipation structures such as the heat dissipation holes 5, grooves 6, and heat sinks 7, achieving efficient heat dissipation.

[0028] The fixing block 4 and the substrate 3 are integrally formed, and therefore the material is the same as that of the substrate 3. The fixing block 4 provides a stable support point for the installation of the metal substrate, and the metal substrate can be firmly installed inside the electronic device using screws or other fasteners through the mounting holes 11. The integrally formed structure enhances the connection strength between the fixing block 4 and the substrate 3, improving the reliability of the installation. The design of the airflow port 8 facilitates airflow at the bottom of the substrate 3, forming natural or forced convection, accelerating heat dissipation and improving heat dissipation efficiency.

[0029] In the machining process of substrate 3, heat dissipation holes 5 are machined using drilling, and grooves 6 are machined using milling. Precise machining control ensures the dimensional and positional accuracy of the heat dissipation holes 5 and grooves 6, allowing them to be evenly distributed on the bottom of substrate 3, forming an effective heat dissipation network. The design of the heat dissipation holes 5 and grooves 6 significantly increases the heat dissipation area on the bottom of substrate 3. Heat can be dissipated in multiple directions through the heat dissipation holes 5 and grooves 6, breaking the limitations of traditional planar heat dissipation structures, making full use of the internal space of electronic devices, and improving heat dissipation efficiency. Simultaneously, the staggered distribution and reasonable depth setting of the heat dissipation holes 5 and grooves 6 help optimize airflow paths and enhance the heat dissipation effect.

[0030] The heat sink 7 further increases the heat dissipation area, accelerating heat dissipation. When air flows within the groove 6, the heat sink 7 increases the contact area between the air and the substrate 3, promoting heat exchange and improving heat dissipation efficiency. Simultaneously, the equidistant arrangement of the heat sink 7 helps form uniform airflow channels, improving the uniformity of heat dissipation.

[0031] The shape of the airflow port 8 is determined by the space between the fixing block 4 and the bottom of the substrate 3, such as square or rectangular. Its size can be adjusted according to airflow requirements. The airflow port 8 is used to promote airflow at the bottom of the substrate 3 and enhance heat dissipation.

[0032] The boss 9 increases the contact area between the substrate 3 and the electronic components, which is beneficial for rapid heat transfer. Furthermore, the structure of the boss 9 can be customized to suit different shapes and sizes of electronic components, improving the versatility and adaptability of the metal substrate. The insulating layer 1 covering the boss 9 achieves thermoelectric separation, avoiding thermoelectric coupling problems, reducing heat loss during transfer, and improving heat dissipation efficiency.

[0033] In the machining process of substrate 3, a notch 10 is machined using a milling process. Precise positioning and machining control ensure the positional and dimensional accuracy of the notch 10, allowing it to accurately mate with the end face of the fixing block 4 and the mounting hole 11. The design of the notch 10 allows the mounting hole 11 to better fit with the internal mounting structure of the electronic device, avoiding potential interference problems during installation. Simultaneously, the presence of the notch 10 provides operating space for installation tools, facilitating the installation and removal of the metal substrate and improving installation efficiency and accuracy.

[0034] The working principle of this thermoelectrically separated metal substrate is as follows: During use, electronic components are mounted on the protrusions 9 on the surface of substrate 3. The pins of the components are fixedly connected to the corresponding lines on the copper foil circuit layer 2 to ensure the reliability of the electrical connection. When the electronic components operate, the heat generated is first conducted to the insulating layer 1 through the copper foil circuit layer 2 in direct contact with them. Since the insulating layer 1 is made of a material with excellent thermal conductivity, the heat can be quickly and evenly transferred to substrate 3. As the main heat sink, substrate 3 adopts a unique heat dissipation structure at its bottom: several heat dissipation holes 5 and several grooves 6 are arranged alternately, and several heat sinks 7 are evenly spaced inside the grooves 6. This design greatly increases the effective heat dissipation area at the bottom of substrate 3. Heat is quickly conducted to the bottom of substrate 3 through the heat dissipation holes 5 and further diffused between the heat sinks 7 inside the grooves 6. At the same time, the four fixed blocks 4 integrally formed at the four corners of the bottom edge of substrate 3 and the four airflow ports 8 formed between the bottom of substrate 3 provide channels for air convection. Outside cold air enters the bottom of substrate 3 through the airflow ports 8, exchanges heat with the heat sinks 7, and carries away the heat. The hot air rises and is discharged from the bottom of substrate 3, forming a continuous air convection. This design significantly enhances airflow at the bottom of substrate 3, effectively removing heat rapidly from the heat source and significantly improving overall heat dissipation efficiency. Compared to traditional metal substrates, the thermoelectric separation metal substrate in this embodiment achieves faster and more efficient heat dissipation through ingenious structural design and air convection utilization, thereby ensuring the stable operation of electronic components in high-temperature environments and extending their service life.

[0035] It should be noted that the specific model and specifications of the copper foil circuit layer 2 need to be selected and determined according to the actual specifications of the device. The specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0036] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A structure of a metal substrate separated by thermoelectricity, comprising an insulating layer (1) and a copper foil circuit layer (2) laid on the surface of the insulating layer (1), characterized in that: The insulating layer (1) is bonded to the substrate (3). Four fixing blocks (4) are integrally formed at the four corners of the bottom edge of the substrate (3). A number of heat dissipation holes (5) and a number of grooves (6) are staggered at the bottom. The staggered heat dissipation holes (5) evenly divide the number of grooves (6). A number of heat dissipation fins (7) are equally spaced inside the number of grooves (6). The four fixing blocks (4) respectively form four airflow ports (8) between the bottom of the substrate (3).

2. The structure of a metal substrate for thermoelectric separation according to claim 1, wherein The substrate (3) has a boss (9) on its surface, and the end face and periphery of the substrate (3) and the boss (9) are covered with the insulating layer (1).

3. The structure of a metal substrate separated by thermoelectricity according to claim 2, wherein The substrate (3) has four notches (10) at the four corners of its surface edge, and the four notches (10) correspond one-to-one with the end faces of the four fixing blocks (4).

4. The structure of a metal substrate for thermoelectric separation according to claim 3, wherein The four fixing blocks (4) have four mounting holes (11) on their end faces, and the four mounting holes (11) are located inside the four notches (10).

5. The structure of a thermoelectrically separated metal substrate according to claim 4, characterized in that, The depth of some of the heat dissipation holes (5) is two-thirds of the thickness of the substrate (3).

6. The structure of a metal substrate for thermoelectric separation according to claim 5, wherein The depth of some of the grooves (6) is one-third of the thickness of the substrate (3).

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