Gas cooling device for semiconductor high-temperature processing equipment

Abstract

The utility model discloses a gas cooling device for semiconductor high-temperature processing equipment. And the cooling device is arranged in an exhaust pipeline of the semiconductor high-temperature processing equipment. The cooling device comprises a flange piece arranged at the air outlet end of the exhaust pipeline through a screw, and a cooling structure fixedly installed in the flange piece. The cooling structure comprises a plurality of cooling pieces, a fixing piece, a cooling pipeline which is arranged among the cooling pieces in a wall-attached and winding mode, a liquid inlet and a liquid outlet, wherein the liquid inlet and the liquid outlet are formed in the flange piece. According to the cooling device, flowing heat dissipation of the cooling medium and heat transfer cooling of the cooling fins are combined, so that when high-temperature gas passes through the cooling device, part of heat is taken away through the flowing cooling medium, then heat transfer cooling continues to be conducted through the cooling fins, the good cooling effect is achieved, too many cooling water pipes do not need to be wound around the whole cooling device, and cooling efficiency is improved. The cooling device is simple in structure and small in occupied space.

Description

Technical Field

[0001] This utility model relates to the field of gas cooling technology, and in particular to a gas cooling device for semiconductor high-temperature processing equipment. Background Technology

[0002] Semiconductors processed by semiconductor processing equipment such as high-temperature furnaces, oxidation, or annealing have improved performance. In order to maintain stable pressure inside the furnace at high temperatures, the equipment's gas filling valve and exhaust valve will automatically open and close. In order to ensure that the valves are not damaged by the high-temperature gas inside the furnace, the high-temperature gas inside the furnace needs to be cooled before entering the valves.

[0003] Currently, the common practice is to wrap cooling water pipes around the intake and exhaust pipes to cool the gas flowing through them. However, due to the limited contact area between the cooling water pipes and the gas inside the pipes, the gas temperature inside the pipes cannot be effectively reduced, which in turn affects the lifespan of valves such as the charging valve and the exhaust valve. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a gas cooling device for semiconductor high-temperature processing equipment to achieve a better cooling effect and overcome the adverse effects of high-temperature gas on the valve body.

[0005] A gas cooling device for a semiconductor high-temperature processing equipment is installed in the exhaust pipe of the semiconductor high-temperature processing equipment, the cooling device comprising:

[0006] Flange components; and

[0007] The cooling structure, which is fixedly installed in the flange, includes several cooling fins, a fixing member, cooling pipes that are wrapped around the wall between the cooling fins, and an inlet and an outlet on the flange.

[0008] As a further improvement to the above solution, the flange is installed at the exhaust end of the exhaust pipe by screws.

[0009] As a further improvement to the above solution, the cooling fin is arranged vertically and is made of copper.

[0010] As a further improvement to the above solution, several cooling plates are connected by fasteners, and the fasteners and flanges are welded together.

[0011] As a further improvement to the above scheme, several cooling plates form cooling section I and cooling section II, with cooling section I located on the corresponding side of cooling section II.

[0012] As a further improvement to the above scheme, the number of cooling fins in cooling section I and cooling section II is the same, and the inclination directions of the cooling fins in cooling section I and cooling section II are opposite.

[0013] As a further improvement to the above solution, the cooling plate is provided with an installation groove, and the cooling pipes are arranged in an S-shape through the installation groove.

[0014] As a further improvement to the above solution, the liquid inlet is located on the opposite side of the liquid outlet, and the liquid inlet is connected to the liquid inlet end of the cooling pipe, and the liquid outlet is connected to the liquid outlet end of the cooling pipe.

[0015] As a further improvement to the above solution, a conduit I is fixedly connected to the flange through the liquid inlet, and a conduit II is fixedly connected to the flange through the liquid outlet.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows: a cooling surface is provided in the exhaust pipe of the semiconductor high-temperature processing equipment. This cooling surface combines the heat dissipation of the cooling medium flow and the heat transfer and cooling of the cooling plate. When the high-temperature gas passes through the cooling surface, it first carries away some heat through the flowing cooling medium and then continues to pass through the cooling plate for heat transfer and cooling, thereby achieving a better cooling effect. While overcoming the adverse effects of high-temperature gas on the valve body, compared with wrapping cooling water pipes around the inlet and outlet pipes, the entire cooling device does not need to wrap too many cooling water pipes. Instead, it concentrates the cooling in a channel, which is simple in structure and occupies little space. Attached Figure Description

[0017] Figure 1 The diagram shows a gas cooling device for semiconductor high-temperature processing equipment provided by this utility model. The arrows in the diagram indicate the gas flow direction.

[0018] Figure 2 The present invention is shown. Figure 1 A structural diagram of the intermediate cooling fins and cooling pipes.

[0019] Explanation of main component symbols

[0020] 1. Flange; 2. Cooling fins; 3. Fixtures; 4. Cooling pipes; 5. Liquid inlet; 6. Liquid outlet.

[0021] The above description of the main component symbols, together with the accompanying drawings and specific embodiments, provides a further detailed explanation of this utility model. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. Additional aspects and advantages of this utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. It should be understood that the following description is merely illustrative and not intended to limit the utility model.

[0023] The specific embodiments of this utility model are described in detail below.

[0024] Please see Figure 1-2 This embodiment provides a gas cooling device for a semiconductor high-temperature processing equipment, which is installed in the exhaust pipe of the semiconductor high-temperature processing equipment. The cooling device includes a flange 1 that is screwed to the exhaust end of the exhaust pipe, and a cooling structure fixedly installed in the flange 1.

[0025] In this embodiment, flange 1 is provided to connect the exhaust pipe connected to the high-temperature semiconductor processing equipment and the exhaust pipe connected to the gas valve. On the other hand, it provides support for the installation of the cooling structure in the exhaust pipe. Furthermore, the cooling structure can be removed by disassembling flange 1, which provides good flexibility in use.

[0026] The cooling structure includes several cooling fins 2, a fixing member 3, a cooling pipe 4 that is attached to the wall and wound between the cooling fins 2, an inlet 5 and an outlet 6 opened on the flange 1.

[0027] The cooling fin 2 is vertically arranged and is made of copper. This embodiment uses a copper cooling fin 2 as an example for explanation. Based on the fact that the cooling fin 2 increases the heat dissipation area, when high-temperature gas passes through the cooling fin 2, the surface temperature of the cooling fin 2 rises, forming a temperature difference with the surrounding cold air, which triggers natural convection. The cold air is heated, its density decreases, and it rises and flows, while the cooler air above sinks to replenish it, forming a natural air circulation flow, thereby improving heat dissipation efficiency. In other embodiments, other materials with good thermal conductivity can also be used, which will not be elaborated here.

[0028] Several cooling fins 2 are connected by fasteners 3, and the fasteners 3 are welded to the flange 1. The several cooling fins 2 form cooling section I and cooling section II, with cooling section I located on the corresponding side of cooling section II. The number of cooling fins 2 in cooling section I and cooling section II is the same, and the inclination directions of the cooling fins 2 in cooling section I and cooling section II are opposite. Based on the aforementioned design, the cooling pipe 4 can be smoothly pressed into the space between two adjacent cooling fins 2 along the mounting groove, thereby facilitating the layout of the cooling pipe 4.

[0029] The cooling fin 2 has an installation groove, and the cooling pipe 4 is arranged in an S-shape through the installation groove. The liquid inlet 5 is located on the opposite side of the liquid outlet 6, and the liquid inlet 5 is connected to the liquid inlet end of the cooling pipe 4, and the liquid outlet 6 is connected to the liquid outlet end of the cooling pipe 4. A conduit I is fixedly connected to the flange 1 through the liquid inlet 5, and a conduit II is fixedly connected to the flange 1 through the liquid outlet 6. In this embodiment, the ends of conduits I and II facing away from the cooling pipe 4 are both connected to a water pump, which allows the cooling medium to flow in the cooling pipe 4.

[0030] In summary, the cooling device of this embodiment has the following advantages: a cooling surface is provided in the exhaust pipe of the semiconductor high-temperature processing equipment. This cooling surface combines the heat dissipation of the cooling medium flow with the heat transfer and cooling of the cooling plate 2. When the high-temperature gas passes through the cooling surface, it first carries away some heat through the flowing cooling medium and then continues to pass through the cooling plate 2 for heat transfer and cooling, thereby achieving a better cooling effect. While overcoming the adverse effects of high-temperature gas on the valve body, compared with wrapping cooling water pipes around the inlet and outlet pipes, the entire cooling device does not need to wrap too many cooling water pipes. Instead, it concentrates the cooling in a channel, which is simple in structure and occupies little space.

[0031] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A gas cooling device for a semiconductor high-temperature processing apparatus, which is installed in an exhaust duct of a semiconductor high-temperature processing apparatus, characterized by, The cooling device includes: Flange (1); and The cooling structure is fixedly installed in the flange (1), which includes several cooling fins (2), a fixing member (3), a cooling pipe (4) that is attached to the wall and wound between the several cooling fins (2), an inlet (5) and an outlet (6) opened on the flange (1).

2. The gas cooling device for semiconductor high temperature processing equipment according to claim 1, characterized in that, The flange (1) is installed at the exhaust outlet of the exhaust pipe by screws.

3. The gas cooling device for semiconductor high temperature processing equipment according to claim 1, wherein The cooling plate (2) is arranged vertically and is made of copper.

4. The gas cooling device for semiconductor high temperature processing equipment according to claim 1, characterized in that, Several cooling plates (2) are connected to each other by fasteners (3), and the fasteners (3) and flanges (1) are welded together.

5. The gas cooling device for semiconductor high temperature processing equipment according to claim 4, wherein Several cooling plates (2) form cooling section I and cooling section II, with cooling section I located on the opposite side of cooling section II.

6. The gas cooling device for semiconductor high temperature processing equipment according to claim 5, wherein The number of cooling plates (2) in cooling section I and cooling section II is the same, and the tilting directions of the cooling plates (2) in cooling section I and cooling section II are opposite.

7. The gas cooling device for semiconductor high-temperature processing equipment according to claim 1, characterized in that, The cooling plate (2) has an installation groove, and the cooling pipe (4) is arranged in an S-shape through the installation groove.

8. The gas cooling device for semiconductor high temperature processing equipment according to claim 1, wherein The liquid inlet (5) is located on the opposite side of the liquid outlet (6), and the liquid inlet (5) is connected to the liquid inlet end of the cooling pipe (4), and the liquid outlet (6) is connected to the liquid outlet end of the cooling pipe (4).

9. The gas cooling device for semiconductor high temperature processing equipment according to claim 1, wherein The flange (1) is fixedly connected to a conduit I through a liquid inlet (5), and the flange (1) is fixedly connected to a conduit II through a liquid outlet (6).

Images