Wafer detection drying platform
By designing a connectable or detachable testing and drying platform, the impact of high-temperature radiation during wafer drying on the testing module and dotting module was resolved, achieving high-precision testing and continuous drying.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KAIHUI SEMICONDUCTOR EQUIPMENT (SHENZHEN) CO LTD
- Filing Date
- 2025-04-29
- Publication Date
- 2026-04-17
AI Technical Summary
High-temperature radiation during wafer drying affects the testing module and dotting module, leading to decreased testing accuracy and poor ink dot flow, or even interruption.
Design a wafer inspection and drying platform, including a linear module, an inspection module and a drying module. The two modules can be connected or separated by a connection structure. The drying module can be slidably set to avoid the influence of high temperature radiation on the inspection module and the dotting module.
It effectively avoids the impact of high-temperature radiation on the testing module and dot matrix module, improves detection accuracy, reduces ink dot jamming, and ensures the continuity of the testing and drying processes.
Smart Images
Figure CN224139416U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor equipment technology, and more specifically, relates to a wafer inspection and drying platform. Background Technology
[0002] In the wafer fabrication process, the test module needs to perform performance tests on the wafer, the dotting module needs to mark the defective dies on the wafer, and the drying module needs to dry the ink dots on the individual dies after dotting.
[0003] Generally, after a wafer testing machine is turned on, the drying module is in a state of continuous constant temperature heating, and both wafer testing and drying require a relatively long time. If the drying module is too close to the testing module and the dotting module during wafer testing and drying, the high temperature of the drying module will radiate and damage the precision testing components in the testing module, affecting the testing accuracy. It will also cause the ink in the dotting module to solidify due to heat, affecting the smooth flow of ink dots, thus causing dotting jams or even interruptions. Utility Model Content
[0004] The purpose of this application is to provide a wafer inspection and drying platform to solve the technical problems caused by high-temperature radiation during wafer drying in the prior art.
[0005] To achieve the above objectives, the technical solution adopted in this application is to provide a wafer inspection and drying platform for mounting on the machine base of a wafer inspection machine to carry wafers for inspection, marking, and drying, comprising:
[0006] Linear module;
[0007] The detection module is driven and configured by the linear module. The detection module is equipped with a detection station, which is used to carry the wafer for position correction and detection.
[0008] A drying module is slidably mounted on the machine tool in the same direction as the detection module. A drying station is provided on the drying module to carry the wafer for marking and drying.
[0009] The drying module and the detection module are provided with a connection structure that allows the two to be connected as one unit or separated from each other.
[0010] Optionally, a slide rail module is provided on the machine base, located on one side of the linear module, and the drying module is disposed on the slide rail module; or, the drying module is slidably disposed on the linear module.
[0011] Optionally, the detection module includes a detection frame connected to the linear module, a detection plate is provided on the detection frame, and the detection station is located on the detection plate; the drying module includes a drying frame and a heating plate provided on the drying frame, and the drying station is located on the heating plate; the connecting structure is used to connect the detection frame and the drying frame.
[0012] Optionally, the connection structure includes a gripper cylinder disposed on either the testing rack or the drying rack, and a clamped component disposed on the other of the testing rack or the drying rack. The gripper cylinder is used to clamp the clamped component to connect the testing module and the drying module.
[0013] Optionally, the connection structure includes a magnetic suction element disposed on either the testing rack or the drying rack, and an electromagnetic generating device disposed on the other of the testing rack or the drying rack.
[0014] Optionally, the connection structure includes a connection groove disposed on either the testing rack or the drying rack, and a fastening mechanism disposed on the other of the testing rack or the drying rack, wherein the fastening mechanism can fasten to the connection groove to connect the testing module and the drying module.
[0015] Optionally, the detection disc is rotatably mounted on the detection frame, and a motor for driving the detection disc to rotate is provided on the detection frame.
[0016] Optionally, the detection plate is electrically conductive, and a negative electrode connector is provided on the detection frame on one side of the detection plate, the negative electrode connector being in sliding contact with the periphery of the detection plate.
[0017] Optionally, negative pressure pipes are provided in both the detection plate and the heating plate, and adsorption ports are provided on the surfaces of both the detection plate and the heating plate.
[0018] The wafer inspection and drying platform provided in this application embodiment has at least the following beneficial effects:
[0019] The testing module can be connected to the drying module to move it to the drying position, so as to avoid the high temperature radiation during wafer drying from affecting the testing module and dotting module on the wafer tester; at the same time, only one testing station is set on each linear module, and the wafer can be tested immediately after loading and position correction without transfer, resulting in high testing accuracy. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 and Figure 2 This is a schematic diagram showing the different positions and connection states of the detection module and the drying module in some embodiments of this application;
[0022] Figure 3 This is a schematic diagram of a wafer inspection and drying platform in some other embodiments of this application;
[0023] Figure 4 This is a perspective view of the wafer inspection and drying platform in some embodiments of this application;
[0024] Figure 5 These are perspective views of the connection structures in some embodiments of this application;
[0025] Figure 6 This is a schematic diagram of a wafer testing machine in some embodiments of this application. Detailed Implementation
[0026] To make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following describes this application in further detail with reference to the accompanying drawings and embodiments.
[0027] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.
[0028] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or indirectly on that other component.
[0029] When a component is said to be "connected to" another component, it can be directly connected to the other component or indirectly connected to that other component.
[0030] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.
[0032] In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically defined.
[0033] Please refer to the following: Figures 1 to 6 The wafer inspection and drying platform provided in the embodiments of this application will now be described.
[0034] It is understood that the wafer inspection and drying platform provided in this application embodiment is used on a wafer testing machine, specifically for wafer testing, dot marking and dot drying processes.
[0035] refer to Figure 6 The aforementioned wafer testing machine includes at least one wafer inspection and drying platform, a transfer module 520, a testing module 530, and a marking module 540. The transfer module 520 is used to transfer the wafer to inspection station a or drying station b; the testing module 530 is used to inspect the wafer at inspection station a; and the marking module 540 is used to mark defective dies on the wafer at drying station b.
[0036] A gantry 510 is fixedly installed on the wafer testing machine, spanning each wafer inspection and drying platform. The transfer module 520, testing module 530, and marking module 540 are all located within the gantry 510. More specifically, each of the transfer module 520, testing module 530, and marking module 540 is equipped with Y-axis and Z-axis drive devices. The transfer module 520 is used for loading and unloading wafers, the testing module 530 is used for performance testing of the wafers on the inspection module 200, and the marking module 540 is used to mark defective dies found after wafer testing with ink dots. It should be understood that the working principles of the transfer module 520, testing module 530, and marking module 540 have been described in detail in relevant prior applications and will not be repeated here.
[0037] refer to Figures 1 to 5 It is understood that the wafer inspection and drying platform provided in this application embodiment includes a linear module 110, an inspection module 200, and a drying module 300.
[0038] Specifically, in practical applications, the linear module 110 can be a ball screw module, which includes a drive system, a transmission system, and a sliding system. The transmission system is connected to the drive system. The drive system is a motor. The transmission system includes a ball screw device. The screw and the motor are connected by a coupling. The sliding system includes guide rails set on one or both sides of the screw and sliders slidably set on the guide rails.
[0039] refer to Figures 1 to 3 The detection module 200 is equipped with one detection station a to carry the wafer for position correction and detection. Specifically, wafer position correction is achieved by adjusting the angular position of the wafer; the drying module 300 is equipped with one drying station b that can heat the wafer, and the drying station b is used to dry the wafer for ink dot application and marking.
[0040] Specifically, the detection module 200 is connected to both the transmission system and the sliding system in the linear module 110. Specifically, the detection module 200 is fixedly connected to the ball nut and simultaneously slidably mounted on the guide rail so that it can follow the transmission system to move back and forth in a straight line.
[0041] refer to Figures 1 to 4 The drying module 300 can be slidably mounted on the machine in the same direction as the detection module 200, and the drying station b and the detection station a are located in the same straight line direction.
[0042] The sliding connection of the drying module 300 on the machine base can be implemented in the following ways. For example, refer to... Figure 3 In the first embodiment, a slide rail module 120 is provided on the machine base, located on one side of the linear module 110, and the drying module 300 is disposed on the slide rail module 120. Furthermore, the drying station b of the drying module 300 is located above the linear module 110. Alternatively, refer to... Figure 1 , Figure 2 and Figure 4 In the second embodiment, the drying module 300 is connected to a sliding system on the linear module 110, which allows it to slide freely on the linear module 110 without power.
[0043] refer to Figure 4 and Figure 5 Furthermore, a connecting structure 400 is provided between the detection module 200 and the drying module 300, enabling them to be connected as one unit or separated, thereby allowing the detection module 200 to drive the drying module 300 to slide relative to the machine platform. The connecting structure 400 includes, but is not limited to, any of the following: a clamping structure, a snap-fit structure, or a magnetic attraction structure; other components capable of connection and separation are also acceptable.
[0044] refer to Figure 4 and Figure 5In some embodiments, the clamping structure includes a gripper cylinder 410 and a clamped component 420. The gripper cylinder 410 is disposed in one of the detection module 200 and the drying module 300, and the clamped component 420 is disposed in the other of the detection module 200 and the drying module 300. When the detection module 200 and the drying module 300 need to be connected, the gripper cylinder 410 clamps the clamped component 420; when the detection module 200 and the drying module 300 need to be separated, the gripper cylinder 410 releases the clamped component 420.
[0045] In some embodiments, the fastening structure includes a fastening member and a slot. The fastening member may include a driving component such as a cylinder or motor, and a locking block disposed on the driving component. The driving component drives the locking block to engage in the slot. The fastening member is disposed in one of the detection module 200 and the drying module 300, and the slot is disposed in the other. When the detection module 200 and the drying module 300 need to be connected, the fastening member drives the locking block to engage in the slot; when the detection module 200 and the drying module 300 need to be separated, the fastening member drives the locking block to release from the slot.
[0046] In some embodiments, the magnetic attraction structure includes an electromagnet and a permanent magnet. The electromagnet is disposed in one of the detection module 200 and the drying module 300, and the permanent magnet is disposed in the other of the detection module 200 and the drying module 300. When the detection module 200 and the drying module 300 need to be connected, the electromagnet is energized to attract the electromagnet to the permanent magnet; when the detection module 200 and the drying module 300 need to be separated, the electromagnet is de-energized.
[0047] By providing a connection structure 400 between the detection module 200 and the drying module 300, and by driving the detection module 200 with the linear module 110 while allowing the drying module 300 to slide freely, the drying module 300 can be selectively connected to or separated from the detection module 200. Thus, when the drying module 300 continuously heats and dries the wafer, it can be moved to any position away from the test module 530 and the dot matrix module 540 on the wafer testing machine.
[0048] refer to Figures 1 to 3 , Figure 6 It is understandable that the axial position of the gantry 510 on the wafer testing machine relative to the linear module 110 is defined as the first position A. It should be understood that since the gantry 510 has a certain width, the aforementioned first position A has a certain segment distance and is not a fixed point position; the end of the linear module 110 away from the gantry 510 is defined as the second position B.
[0049] By setting up the wafer inspection and drying platform in this way, at least the following advantages are achieved:
[0050] Firstly, when the wafer is loaded to the inspection station a, the inspection module 200 and the drying module 300 can be connected or separated. Preferably, the inspection module 200 and the drying module 300 are separated and far apart from each other. When the inspection module 200 carries the wafer and performs wafer inspection at the first position A, the drying module 300 can be pushed to the second position B. This is to avoid the high temperature affecting the test module 530 and the dot-matrix module 540.
[0051] Secondly, the detection module 200 is equipped with a single detection station a. After the wafer completes the position correction at the detection station a, it can be detected without further transfer, resulting in high wafer detection accuracy.
[0052] Thirdly, the transfer of wafers between inspection station a and drying station b is carried out at the first position A, which eliminates the drive requirement of gantry 510 on the X-axis. The drive load of linear module 110 on the X-axis is also small. Under the condition of small drive load, the drive accuracy of the X-axis can be effectively improved.
[0053] refer to Figure 4 In some embodiments, the testing module 200 includes a testing frame 210, which is connected to the ball nut and slider in the linear module 110. A testing disk 220 is disposed on the testing frame 210, and the testing disk 220 is electrically conductive. Testing station a is disposed on the testing disk 220. During wafer testing, a conductive circuit is formed between the testing module 530 and the testing disk 220 to test the electrical performance of each die.
[0054] The drying module 300 includes a drying rack 310 and a heating plate 320 disposed on the drying rack 310. The drying station b is disposed on the heating plate 320. Specifically, the heating plate 320 is made of conductive material and an electric heating rod is disposed in the heating plate 320. The aforementioned connection structure 400 is used to connect the detection rack 210 and the drying rack 310.
[0055] Generally, wafers need to be adjusted in angle and position during testing to eliminate possible positional errors during transport. For this purpose, testing station A can be dynamically rotated to adjust the position and angle of the wafer.
[0056] Specifically, the detection disc 220 is rotatably mounted on the detection frame 210, and a motor 231 for driving the detection disc 220 to rotate is mounted on the detection frame 210. The motor 231 can be directly mounted on the bottom of the detection disc 220 to directly drive the detection disc 220, or the motor 231 can be mounted on one side of the detection disc 220 and drive the detection disc 220 to rotate through the synchronous belt mechanism 232.
[0057] refer to Figure 4Furthermore, a negative electrode connector 240 is provided on one side of the test tray 220 on the test rack 210, making sliding contact with the periphery of each test tray 220. Exemplarily, the negative electrode connector 240 includes a conductive spring that maintains continuous contact with the test tray 220, and the conductive spring is in an elastically compressed state. When the test tray 220 rotates, the conductive spring can maintain contact with the test tray 220 under the action of elastic force, thereby ensuring the stability of the conductive path during wafer testing.
[0058] In some embodiments, negative pressure pipes are provided in both the detection plate 220 and the heating plate 320, and adsorption ports are provided on the surfaces of both the detection plate 220 and the heating plate 320. The negative pressure pipes are connected to an external negative pressure generating device. In this way, the wafer can be better fixed during detection, marking, and drying.
[0059] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A wafer inspection and drying platform, used for mounting on the machine base of a wafer inspection machine to support wafers for inspection, marking, and drying, characterized in that, include: Linear module; The detection module is driven and configured by the linear module. The detection module is equipped with a detection station, which is used to carry the wafer for position correction and detection. A drying module is slidably mounted on the machine tool in the same direction as the detection module. A drying station is provided on the drying module to carry the wafer for marking and drying. The drying module and the detection module are provided with a connection structure that allows the two to be connected as one unit or separated from each other.
2. The wafer inspection baking platform of claim 1, wherein: A slide rail module is provided on the machine platform, located on one side of the linear module, and the drying module is disposed on the slide rail module; or, the drying module is slidably disposed on the linear module.
3. The wafer inspection baking platform of claim 1 or 2, wherein: The detection module includes a detection frame connected to the linear module, a detection plate is provided on the detection frame, and the detection station is located on the detection plate; the drying module includes a drying frame and a heating plate provided on the drying frame, and the drying station is located on the heating plate; the connecting structure is used to connect the detection frame and the drying frame.
4. The wafer inspection baking platform of claim 3, wherein: The connection structure includes a gripper cylinder disposed on either the testing rack or the drying rack, and a clamped component disposed on the other of the testing rack or the drying rack. The gripper cylinder is used to clamp the clamped component to connect the testing module and the drying module.
5. The wafer inspection baking platform of claim 3, wherein: The connection structure includes a magnetic suction element disposed on either the testing rack or the drying rack, and an electromagnetic generating device disposed on the other of the testing rack or the drying rack.
6. The wafer inspection baking platform of claim 3, wherein: The connection structure includes a connection groove disposed on either the testing rack or the drying rack, and a fastening mechanism disposed on the other of the testing rack or the drying rack. The fastening mechanism can fasten to the connection groove to connect the testing module and the drying module.
7. The wafer inspection baking platform of claim 3, wherein: The detection disc is rotatably mounted on the detection frame, and a motor for driving the detection disc to rotate is provided on the detection frame.
8. The wafer inspection baking platform of claim 7, wherein: The detection plate is electrically conductive, and a negative electrode connector is provided on the detection frame on one side of the detection plate, and the negative electrode connector slides in contact with the periphery of the detection plate.
9. The wafer inspection baking platform of claim 3, wherein: Negative pressure pipes are provided in both the detection plate and the heating plate, and adsorption ports are provided on the surface of both the detection plate and the heating plate.