Wafer coating jig and coating device

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a wafer coating jig and a coating device, the wafer coating jig and the coating device comprise a positioning plate with a positioning hole and a back plate with a boss on the surface, the positioning plate and the back plate are attached to each other and detachably connected, a wafer is placed in the positioning hole, and the boss is arranged on the back plate. And the inner wall of the positioning hole on one side of the coating film is provided with a limiting step for bearing the wafer, and the limiting step is matched with the boss on the back plate to fix the wafer in the positioning hole. According to the scheme, the fixing mode that the wafer is pasted through a high-temperature-resistant double-faced adhesive tape and a high-temperature-resistant film material in the prior art can be completely replaced, the high-temperature-resistant double-faced adhesive tape and the high-temperature-resistant film material are saved, the wafer fixing time is shortened, the labor cost is saved, and the wafer coating machining efficiency is overall improved.

Description

Technical Field

[0001] This utility model relates to the field of mobile phone accessory processing technology, and in particular to a wafer coating fixture and coating device. Background Technology

[0002] The wafer is a crucial structure for the side buttons on mobile phones, used for signal transmission and control circuitry. The processing of coated wafers for these side buttons involves a series of steps: sandblasting, annealing, SiO2 coating, screen printing, AR coating (anti-reflective coating), AS coating (anti-scratch coating), and laser cutting, to obtain the finished product. SiO2 thin film serves as an insulating and passivation layer for semiconductor devices. In integrated circuit manufacturing, SiO2 thin film isolates transistors and other electronic components, preventing current leakage and short circuits between components. It also protects the chip surface from environmental contamination and chemical corrosion. Currently, in the SiO2 coating process for wafers, the main steps involve first attaching high-temperature resistant double-sided adhesive to a fixture, then attaching a single-sided adhesive high-temperature resistant film to the double-sided adhesive. The wafer is then fixed onto the single-sided adhesive high-temperature resistant film. Wafers are typically arranged in a 7x2 pattern on the coating fixture. After the wafers are attached, the fixture is fixed to the rollers of the SiO2 coating apparatus for SiO2 coating. After SiO2 coating, the wafers, high-temperature resistant double-sided adhesive, and single-sided adhesive high-temperature resistant film are removed sequentially. In this process, the application of both the high-temperature resistant double-sided adhesive and the single-sided adhesive high-temperature resistant film requires manual labor. This results in slow wafer clamping speed, low efficiency, and high labor and material costs, thus increasing the overall wafer processing cost. Utility Model Content

[0003] Therefore, it is necessary to address the above-mentioned shortcomings by providing a wafer coating fixture that enables rapid wafer clamping and reduces wafer processing costs. This wafer coating fixture includes:

[0004] A positioning plate, the upper surface of which has a positioning area, and at least one positioning hole is formed in the positioning area. The positioning hole penetrates the lower surface of the positioning plate and forms a coating opening below the positioning hole. The inner wall of the positioning hole is provided with a limiting step for receiving the wafer; and

[0005] A back plate is detachably connected to the positioning plate. The lower surface of the back plate is attached to the upper surface of the positioning plate. The lower surface of the back plate is provided with at least one protrusion corresponding to the positioning hole. The height of the protrusion is less than the distance from the limiting step to the upper surface of the positioning plate. When the back plate is placed on the positioning plate, the protrusion abuts against the wafer on the limiting step.

[0006] Preferably, the positioning hole has an exhaust groove that penetrates the upper surface of the positioning plate.

[0007] Preferably, the width of the limiting step is 0.2-0.25 mm.

[0008] Preferably, the width of the limiting step is 0.22 mm.

[0009] Preferably, the positioning hole is circular, elliptical, or rectangular.

[0010] Preferably, the positioning plate has a clearance notch on at least one edge.

[0011] Preferably, the positioning plate is connected to the back plate by screws, snap-fit, or magnetic attraction.

[0012] Preferably, the upper surface of the positioning plate has a first bolt hole on each of the two opposite sides of the positioning area, and the back plate has two mounting notches that correspond to the first bolt holes and penetrate the upper and lower surfaces of the back plate; the fixture also includes two sets of connectors, each set of connectors including mounting bolts that correspond to the mounting notches and first bolt holes to connect the positioning plate and the back plate, and nuts that are rotatably sleeved on the mounting bolts.

[0013] A coating apparatus includes a wafer coating fixture as described in any of the preceding claims, and further includes a roller for fixing the wafer coating fixture.

[0014] Preferably, the roller is provided with a positioning block corresponding to the clearance notch, and at least one second bolt hole is also provided on the side of the positioning plate opposite to the clearance notch. The roller is provided with at least one threaded hole corresponding to the second bolt hole. The roller also includes a screw, which passes through the second bolt hole and is threadedly connected to the roller.

[0015] The wafer coating fixture of this invention uses a positioning plate with positioning holes and a base plate with protrusions on its surface to fit together. A wafer is placed in the positioning hole. The inner wall of the positioning hole on the coating side is provided with a limiting step for receiving the wafer, thereby fixing the wafer in the positioning hole. This eliminates the need for adhesive and film bonding operations, saving consumables such as high-temperature resistant double-sided tape and high-temperature resistant film, reducing consumable costs, shortening the time for fixing the wafer and saving labor costs. It can achieve rapid wafer clamping, improve the overall efficiency of wafer processing, and reduce the processing cost of wafers. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a wafer coating fixture in one embodiment of the present invention;

[0017] Figure 2This is a schematic diagram of the back structure of the positioning plate in one embodiment of the present invention;

[0018] Figure 3 for Figure 2 A cross-sectional view at position AA in the middle;

[0019] Figure 4 for Figure 3 A magnified view of a portion of the image;

[0020] Figure 5 for Figure 4 A magnified view of a portion of the image;

[0021] Figure 6 This is a schematic diagram of the back structure of the positioning plate in one embodiment of the present invention;

[0022] Figure 7 for Figure 6 A magnified view of a portion of the image.

[0023] Explanation of reference numerals in the attached drawings: 100-positioning plate, 100a-positioning hole, 100b-first bolt hole, 100c-second bolt hole, 100d-venting groove, 100e-third bolt hole, 100f-avoidance notch, 110-limiting step, 200-back plate, 200a-mounting notch, 210-bore, 220-mounting bolt, 230-nut, 300-chip. Detailed Implementation

[0024] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0025] For ease of description, the following definitions are made: the side of the positioning plate that forms the coating opening is the lower surface of the positioning plate, the side of the positioning plate that is in contact with the back plate is the upper surface of the positioning plate, and the side of the back plate that is in contact with the positioning plate is the lower surface of the back plate.

[0026] Please combine Figure 1-7This utility model discloses a wafer coating fixture, which includes a positioning plate 100 and a back plate 200. The upper surface of the positioning plate 100 has a positioning area, and at least one positioning hole 100a is formed in the positioning area. The specific positioning hole 100a and its size and number are selected according to actual needs. In this example, a total of fourteen positioning holes 100a (7x2) are formed in the positioning area. The positioning hole 100a penetrates the lower surface of the positioning plate 100 and forms a coating opening on the lower surface. The wafer 300 is coated on this surface. A limiting step 110 is protruding along the inner wall of the positioning hole 100a on the lower surface. The limiting step 110 is used to receive the wafer 300 and prevent the wafer 300 from falling out of the lower surface of the positioning plate 100. The back plate 200 and the positioning plate 100 are detachably connected. When fixing the wafer 300, the back plate 200 and the positioning plate 100 are in contact with each other. The lower surface of the back plate 200 is provided with a boss 210 corresponding to the positioning hole 100a. The height of the boss 210 is less than the distance from the limiting step 110 to the upper surface of the positioning plate 100. When the back plate 200 and the positioning plate 100 are in contact with each other, there is space between the boss 210 and the limiting step 110 for fixing the wafer 300.

[0027] In this embodiment, the process of installing the wafer 300 in the fixture is as follows: First, the incoming wafer 300 and the coating fixture are cleaned to ensure they meet the coating work standards; Second, the positioning plate 100 is placed face down on the worktable, and the wafers 300 to be coated are placed one by one into the positioning holes 100a, at which point the edges of the wafers 300 overlap the limiting steps 110 of the positioning holes 100; Third, the back plate 200 is placed on the positioning plate 100 and abuts against it, with the protrusions 210 on the lower surface of the back plate 200 just entering the positioning holes 100a and pressing against the wafers 300 to be coated, preventing the wafers 300 to be coated from moving in the positioning holes 100a; Fourth, the back plate 200 and the positioning plate 100 are connected to form a whole. After the above work is completed, the coating fixture can be transferred to the coating apparatus for coating. Compared with the existing technology of fixing the wafer 300 by pasting, this solution can save the use of high-temperature resistant double-sided adhesive and high-temperature resistant film material, reduce labor and time costs, and improve the processing efficiency of wafer 300 coating.

[0028] To quickly expel air from the positioning hole 100a during the process of placing the cover plate 200 onto the positioning plate 100, in one embodiment, a plurality of venting grooves 100d penetrating the positioning plate 100 are formed on the wall of the positioning hole 100a of the positioning plate 100. In this embodiment, two venting grooves 100d are formed at each corner of the positioning hole 100a. In the third step of the aforementioned process of mounting the wafer 300 in the fixture, during the process of the back plate 200 covering the positioning plate 100, the gap between the boss 210 and the positioning hole 100a is small, making it difficult to expel air from the positioning hole 100a, which slows down the speed at which the cover plate 200 and the positioning plate 100 fit together. The venting grooves 100d can accelerate the air in the positioning hole 100a, making it easier for the cover plate 200 and the positioning plate 100 to fit together.

[0029] To effectively support the wafer 300 and ensure optimal coating results, in one embodiment, the width of the limiting step 110 is 0.2-0.25 mm. If the limiting step 110 is less than 0.2 mm, it cannot effectively support the wafer 300, and the wafer is prone to falling off during the coating process. If the limiting step 110 is greater than 0.25 mm, it will affect the coating effect of the wafer 300, resulting in waste of the wafer 300. A width of 0.2-0.25 mm for the limiting step 110 is economical and safe. Preferably, the width of the limiting step 110 is 0.22 mm, which is the most balanced width between economy and safety.

[0030] In one embodiment, the positioning hole 100a is circular, and the boss 210 on the back plate 200 is circular with the same size as the positioning hole 100a, used for coating the circular wafer 300. In another embodiment, the positioning hole 100a is elliptical, and the boss 210 on the back plate 200 is elliptical with the same size as the positioning hole 100a, used for coating the elliptical wafer 300. In yet another embodiment, the positioning hole 100a is rectangular, and the boss 210 on the back plate 200 is rectangular with the same size as the positioning hole 100a, used for coating the rectangular wafer 300. Of course, in other embodiments, depending on the shape of the wafer 300, the positioning hole can be designed in other shapes, which will not be described in detail here.

[0031] In one embodiment, the upper surface of the positioning plate 100 has a first bolt hole 100b on each of the two opposite sides of the positioning area. The back plate 200 has two mounting notches 200a that correspond to the first bolt holes 100b and penetrate the upper and lower surfaces of the back plate 200. The fixture also includes two sets of mounting bolts 220 and nuts 230 that are correspondingly inserted into the mounting notches 200a and the first bolt holes 100b to connect the positioning plate 100 and the back plate 200. After the wafer is installed into the positioning hole 100a, the back plate 200 is placed on the positioning plate 100. The mounting bolts 220 pass through the first bolt holes 100b of the positioning plate 100 and the back plate 200 in sequence, and then cooperate with the nuts 230 to install the positioning plate 100 and the back plate 200 together by bolt connection.

[0032] In one embodiment, a snap-fit ​​groove is provided on the upper surface of the positioning plate 100, and a snap-fit ​​head is provided on the lower surface of the back plate 200 at a position corresponding to the snap-fit ​​groove. After the wafer 300 is installed into the positioning hole 100a, the back plate 200 is placed on the positioning plate 100, and then the snap-fit ​​is closed, thus installing the positioning plate 100 and the back plate 200 together by snap-fit ​​connection.

[0033] In one embodiment, grooves for accommodating magnets are provided on the upper surface of the positioning plate 100 and the lower surface of the back plate 200, and magnets are installed in the grooves. After the wafer is installed into the positioning hole 100a, the back plate 200 is placed on the positioning plate 100. The magnets of the back plate 200 and the positioning plate 100 are attracted together by magnetic force, and the positioning plate 100 and the back plate 200 are installed together by magnetic attraction.

[0034] Furthermore, this embodiment provides a coating apparatus, which includes the aforementioned wafer coating fixture. The coating apparatus also includes a roller for fixing the wafer coating fixture. A second bolt hole 100c is provided on one side of the fixture, and a clearance notch 100f is provided on the other side. A third bolt hole 100e is also provided next to the clearance notch 100f. The roller has threaded holes corresponding to the second bolt hole 100c and the third bolt hole 100e, and a positioning block corresponding to the clearance notch 100f. The roller also includes mounting bolts 220 and 220. The mounting bolts 220 pass through the second bolt hole 100c and the third bolt hole 100e of the fixture and are threadedly connected to the threaded hole of the roller. The clearance notch 100f is engaged with the positioning block to fix the fixture.

[0035] The wafer coating fixture of this utility model consists of a positioning plate 100 with a positioning hole 100a and a base plate 200 with a protrusion 210 on its surface, which are attached to each other. A wafer 300 is placed in the positioning hole 200a. The inner wall of the positioning hole 100a on the coating side is provided with a limiting step 110 for receiving the wafer 300, so as to fix the wafer 300 in the positioning hole 100a. It eliminates the bonding operation of adhesive and film materials, saves consumables such as high temperature resistant double-sided tape and high temperature resistant film materials, reduces consumable costs, shortens the time for fixing the wafer 300 and saves labor costs, realizes rapid wafer clamping, improves the overall processing efficiency of the wafer 300 and reduces the processing cost of the wafer 300.

[0036] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0037] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A wafer coating fixture, characterized in that, include: A positioning plate (100) has a positioning area on its upper surface, and at least one positioning hole (100a) is provided in the positioning area. The positioning hole (100a) penetrates the lower surface of the positioning plate (100) and forms a coating opening below the positioning hole (100a). The inner wall of the positioning hole (100a) is provided with a limiting step (110) for receiving the wafer. A back plate (200) is detachably connected to the positioning plate (100). The lower surface of the back plate (200) is attached to the upper surface of the positioning plate (100). The lower surface of the back plate (200) is provided with at least one boss (210) corresponding to the positioning hole (100a). The height of the boss (210) is less than the distance from the limiting step (110) to the upper surface of the positioning plate (100). When the back plate (200) is placed on the positioning plate (100), the boss (210) abuts against the wafer on the limiting step (110).

2. The wafer coating fixture according to claim 1, characterized in that, The positioning hole (100a) has an exhaust groove (100d) that penetrates the upper surface of the positioning plate (100) through the hole wall.

3. The wafer coating fixture according to claim 1, characterized in that, The width of the limiting step (110) is 0.2-0.25mm.

4. The wafer coating fixture according to claim 3, characterized in that, The width of the limiting step (110) is 0.22 mm.

5. The wafer coating fixture according to claim 1, characterized in that, The positioning hole (100a) is circular, elliptical, or rectangular.

6. The wafer coating fixture according to claim 1, characterized in that, At least one edge of the positioning plate (100) is provided with a clearance notch (100f).

7. The wafer coating fixture according to claim 1, characterized in that, The positioning plate (100) is connected to the back plate (200) by screws, snaps, or magnetic attraction.

8. The wafer coating fixture according to claim 7, characterized in that, The upper surface of the positioning plate (100) has a first bolt hole (100b) on each of the two opposite sides of the positioning area. The back plate (200) has two mounting notches (200a) that correspond to the first bolt holes (100b) and penetrate the upper and lower surfaces of the back plate (200). The fixture also includes two sets of connectors. Each set of connectors includes mounting bolts (220) that correspond to the mounting notches (200a) and the first bolt holes (100b) to connect the positioning plate (100) and the back plate (200), and nuts (230) that are rotatably sleeved on the mounting bolts (220).

9. A coating apparatus, characterized in that, The wafer coating fixture as described in claim 6 further includes a roller for fixing the wafer coating fixture.

10. The coating apparatus according to claim 9, characterized in that, The roller is provided with a positioning block corresponding to the clearance notch (100f). The positioning plate is also provided with at least one second bolt hole (100c) on the side opposite to the clearance notch (100f). The roller is provided with at least one threaded hole corresponding to the second bolt hole (100c). The roller also includes a screw, which passes through the second bolt hole (100c) and is threadedly connected to the roller.

Images