Efficient heat dissipation wheel-shaped MOS device for integrated circuit

Abstract

The utility model provides an efficient heat dissipation wheel-shaped MOS device for an integrated circuit, and relates to the field of integrated circuits. Comprising a shell, a cooling device is arranged in the shell and comprises a supporting plate fixedly connected with one side of the shell, the upper surface of the supporting plate is fixedly connected with the lower end of refrigeration equipment, one side of the refrigeration equipment is fixedly communicated with an inlet of a water suction pump, and an outlet of the water suction pump is fixedly communicated with an inlet of a refrigeration pipe; an outlet of the refrigeration pipe is fixedly communicated with the return pipe, and an outlet of the return pipe is fixedly communicated with an inlet of the refrigeration equipment. According to the efficient heat dissipation wheel-shaped MOS device, through cooperative use of the refrigeration equipment, the water suction pump, the refrigeration pipe, the fixing frame and the backflow pipe, when the MOS device body works, refrigeration is carried out through the refrigeration equipment, refrigeration water is conveyed into the refrigeration pipe through the water suction pump to cool the MOS device body in work, hot air is exhausted through the fan, and the heat dissipation efficiency of the MOS device body is improved. And the heat dissipation effect of the MOS device body is effectively improved.

Description

Technical Field

[0001] This utility model relates to a wheel-shaped MOS device, specifically a high-efficiency heat-dissipating wheel-shaped MOS device for integrated circuits, belonging to the field of integrated circuit technology. Background Technology

[0002] MOS integrated circuits are a commonly used type of integrated circuit. The smallest unit is an inverter, which consists of two metal-oxide-semiconductor field-effect transistors. This integration process is primarily used in the manufacture of digital integrated circuits, allowing for very high circuit integration density.

[0003] A search revealed a MOS device disclosed in Chinese Patent Publication No. CN204332966U, comprising a silicon substrate, a source electrode spaced apart from each other, a first voltage divider ring, and a second voltage divider ring disposed on the silicon substrate. The first voltage divider ring is metal-connected to the source electrode to form an equipotential voltage ring. This application only requires the inclusion of a first voltage divider ring and a second voltage divider ring, and by metal-connecting the first voltage divider ring to the source electrode, the first voltage divider ring becomes an equipotential ring with the same voltage as the source electrode when energized. This method improves the reverse breakdown voltage of the MOS device while using a substrate with the same resistivity as existing technologies. It solves the problem of achieving high breakdown voltage in MOS devices while maintaining low on-resistance.

[0004] While the aforementioned patents can solve the problem of achieving high breakdown voltage in MOS devices while maintaining low on-resistance, the MOS devices in these patents are difficult to heat up. When the MOS devices are powered on, they generate a large amount of heat, which can easily cause the MOS devices to burn out due to high temperature. Therefore, we provide a high-efficiency heat-dissipating wheel-shaped MOS device for integrated circuits to solve the above problems. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] The purpose of this invention is to provide a high-efficiency heat-dissipating wheel-shaped MOS device for integrated circuits in order to solve the above-mentioned problems, thereby addressing the difficulty in heat dissipating MOS devices in the prior art.

[0007] (II) Technical Solution

[0008] This utility model is achieved through the following technical solution: a high-efficiency heat dissipation wheel-shaped MOS device for integrated circuits, including a housing, and a cooling device is provided inside the housing. The cooling device includes a support plate fixedly connected to one side of the housing, the upper surface of the support plate fixedly connected to the lower end of a cooling device, one side of the cooling device fixedly connected to the inlet of a water pump, the outlet of the water pump fixedly connected to the inlet of a cooling pipe, the outlet of the cooling pipe fixedly connected to a return pipe, and the outlet of the return pipe fixedly connected to the inlet of the cooling device.

[0009] Preferably, the upper end of the inner side of the housing is fixedly connected to one side of the ventilation plate, and the ventilation plate has ventilation holes inside, through which the heat is discharged, which facilitates heat dissipation for the internal MOS device body.

[0010] Preferably, the middle part of the ventilation plate is fixedly connected to one end of the fixing column, and the other end of the fixing column is fixedly connected to one side of the fan. The fan is fixed by the fixing column to prevent the fan from shaking during operation and causing damage to the MOS device body.

[0011] Preferably, the lower inner surface of the housing is fixedly connected to the lower end of the fixed support, the upper end of the fixed support is fixedly connected to the lower surface of the circuit board, the upper surface of the circuit board is fixedly connected to the lower surface of the MOS device body, the lower surface of the MOS device body is fixedly connected to the lower surface of the heat sink, and the upper surface of the heat sink is fixedly connected to the lower surface of the heat dissipation device. The circuit board is fixed by the fixed support, which facilitates heat dissipation of the MOS device body. The MOS device body is fixed on the circuit board for operation, and the heat dissipation device can dissipate heat from the MOS device body.

[0012] Preferably, the upper surface of the circuit board is threadedly connected to the second screw, and the outer circular surface of the second screw is rotatably connected to the middle of the upper surface of the heat dissipation device. The heat dissipation device is fixed on the circuit board by the second screw, and the heat dissipation device can dissipate heat from the MOS device body and play a fixing role.

[0013] Preferably, one side of the circuit board is fixedly connected to one end of the transmission line, and the other end of the transmission line is fixedly connected to one side of the socket. The MOS device body is connected to the equipment for operation through the transmission line and the socket, which facilitates the maintenance of the MOS device body.

[0014] Preferably, the middle part of the circuit board is rotatably connected to the outer circular surface of the first screw, and the thread of the first screw is threadedly connected to the inner lower surface of the housing. The circuit board is fixed inside the housing by the first screw to prevent the circuit board from shaking and causing damage, thus playing a fixing role.

[0015] Preferably, the outer circular surface of the cooling tube is fixedly connected to one end of the fixing bracket, the other end of the fixing bracket is fixedly connected to one side of the inner side of the outer shell, and the upper surface of the outer shell is fixedly connected to the lower surface of the filter plate. The cooling tube can be fixed by the fixing bracket, and the MOS device body can be cooled down.

[0016] This invention provides a high-efficiency heat-dissipating wheel-shaped MOS device for integrated circuits, which has the following advantages:

[0017] 1. This high-efficiency heat dissipation wheel-shaped MOS device uses a combination of cooling equipment, a water pump, cooling pipes, a mounting bracket, and a return pipe. When the MOS device is working, the cooling equipment cools it, the water pump delivers cooled water to the cooling pipes to lower the temperature of the MOS device, and the fan exhausts the hot air, effectively improving the heat dissipation of the MOS device.

[0018] 2. This high-efficiency heat dissipation wheel-shaped MOS device uses a combination of ventilation plate, ventilation holes, fan, heat pipe and heat dissipation equipment to dissipate heat from the MOS device body. The heat pipe and heat dissipation equipment conduct the heat from the MOS device body out, and the cooling device cools the emitted heat. The fan blows out the internal heat, thus circulating the internal temperature. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0020] Figure 2 This is a three-dimensional structural diagram of the cooling device of this utility model;

[0021] Figure 3 This is a cross-sectional three-dimensional structural diagram of the present invention;

[0022] Figure 4 This is a three-dimensional structural diagram of the circuit board of this utility model;

[0023] Figure 5 This utility model Figure 4 A magnified structural diagram at point A;

[0024] Figure 6 This is a three-dimensional structural diagram of the ventilation panel of this utility model.

[0025] [Explanation of Key Component Symbols]

[0026] 1. Outer shell;

[0027] 2. Cooling device; 201. Support plate; 202. Refrigeration equipment; 203. Water pump; 204. Refrigeration pipe; 205. Fixing frame; 206. Return pipe;

[0028] 3. Ventilation plate; 4. Ventilation hole; 5. Fixing column; 6. Fan; 7. Fixing support column; 8. First screw; 9. Circuit board; 10. MOS device body; 11. Second screw; 12. Heat pipe; 13. Heat dissipation equipment; 14. Transmission line; 15. Insertion plate; 16. Filter plate. Detailed Implementation

[0029] This utility model provides a high-efficiency heat dissipation wheel-shaped MOS device for integrated circuits.

[0030] Please see Figure 3 and Figure 4 The device includes a housing 1. The lower inner surface of the housing 1 is fixedly connected to the lower end of the fixed support 7. The upper end of the fixed support 7 is fixedly connected to the lower surface of the circuit board 9. The middle part of the circuit board 9 is rotatably connected to the outer circular surface of the first screw 8. The thread of the first screw 8 is threadedly connected to the lower inner surface of the housing 1. The circuit board 9 is fixed inside the housing 1 by the first screw 8, which serves to fix the circuit board 9 and prevent it from shaking during operation. One side of the circuit board 9 is fixedly connected to one end of the transmission line 14. The other end of the transmission line 14 is fixedly connected to one side of the plug-in plate 15. Data is transmitted to the next step through the transmission line 14 and the plug-in plate 15, which facilitates the maintenance of the MOS device body 10.

[0031] Please see Figure 5 The upper surface of the circuit board 9 is threadedly connected to the second screw 11. The outer circular surface of the second screw 11 is rotatably connected to the middle of the upper surface of the heat dissipation device 13. The heat dissipation device 13 is fixed to the circuit board 9 through the second screw 11, and the heat dissipation device 13 transfers the temperature generated by the MOS device body 10 to the outside, so as to facilitate the cooling of the MOS device body 10. The upper surface of the circuit board 9 is fixedly connected to the lower surface of the MOS device body 10. The lower surface of the MOS device body 10 is fixedly connected to the lower surface of the heat pipe 12. The upper surface of the heat pipe 12 is fixedly connected to the lower surface of the heat dissipation device 13. The circuit board 9 is supported and fixed by the fixing pillar 7, so as to facilitate the heat dissipation of the bottom of the circuit board 9. The heat on the MOS device body 10 is transferred to the housing 1 through the heat pipe 12 and the heat dissipation device 13. The temperature inside the housing 1 is cooled by the cooling device 2, and then the heat is dissipated by the fan 6.

[0032] Please see Figure 6The upper end of one side of the inner side of the outer casing 1 is fixedly connected to one side of the ventilation plate 3. The middle part of the ventilation plate 3 is fixedly connected to one end of the fixing column 5, and the other end of the fixing column 5 is fixedly connected to one side of the fan 6. The fan 6 is fixed by the fixing column 5, and the temperature inside the outer casing 1 is circulated by the fan 6, so that the MOS device body 10 can always be kept at a low temperature. The ventilation plate 3 has ventilation holes 4 inside, and the ventilation holes 4 on the ventilation plate 3 ventilate the inside of the outer casing 1. The internal temperature of the outer casing 1 can be circulated by the fan 6, so that the MOS device body 10 can always be kept at a low temperature and can operate, which helps to reduce the damage of the MOS device body 10 due to high temperature.

[0033] Please see Figure 1 and Figure 2 The outer casing 1 is equipped with a cooling device 2. The cooling device 2 includes a support plate 201 fixedly connected to one side of the outer casing 1. The upper surface of the support plate 201 is fixedly connected to the lower end of the refrigeration equipment 202. One side of the refrigeration equipment 202 is fixedly connected to the inlet of the water pump 203. The outlet of the water pump 203 is fixedly connected to the inlet of the refrigeration pipe 204. The outer surface of the refrigeration pipe 204 is fixedly connected to one end of the fixing frame 205. The other end of the fixing frame 205 is fixedly connected to one side of the inner casing 1. The upper surface of the outer casing 1 is fixedly connected to the lower surface of the filter plate 16. The fixing frame 205 fixes the refrigeration pipe 204 inside the outer casing 1 to prevent the refrigeration pipe 204 from shaking during operation, which would result in poor cooling effect. The filter plate 16 can prevent external dust from entering the interior of the outer casing 1, achieving a good filtration effect. The outlet of the cooling pipe 204 is fixedly connected to the return pipe 206, and the outlet of the return pipe 206 is fixedly connected to the inlet of the cooling equipment 202. When the MOS device body 10 is working, it will generate a lot of temperature, which may cause damage to the MOS device body 10. The cooling equipment 202 cools the water, and the water pump 203 delivers the cold water to the cooling pipe 204 to cool down the temperature emitted by the heat dissipation device 13. The fan 6 blows air into the rubber inside the outer casing 1, which can circulate and cool the inside of the outer casing 1, effectively preventing the MOS device body 10 from being damaged due to high temperature.

[0034] Working Principle: During the power-on process of the MOS device body 10, a large amount of heat is generated, which can easily cause damage to the MOS device body 10. The cooling device 2 can cool the outer casing 1, and the fan 6 can then expel the heat from inside the outer casing 1, keeping the MOS device body 10 at a low temperature. Cooling is further achieved through the refrigeration equipment 202, and a water pump 203 delivers cooled water to the cooling pipe 204, cooling the surrounding air. The high temperature generated by the MOS device body 10 itself is dissipated through the heat sink 12 and the heat dissipation equipment 13, which further cools the MOS device body 10. This facilitates the cooling process for the MOS device body 10. The circuit board 9 is fixed inside the housing 1 by the first screw 8, and the circuit board 9 is supported by the fixing pillar 7, leaving a gap between the circuit board 9 and the housing 1 bracket to facilitate cooling of the MOS device body 10. The hot air is discharged by the fan 6 through the ventilation holes 4 on the ventilation plate 3, so that the inside of the housing 1 is always kept at a low temperature. The filter plate 16 can prevent external dust from entering the inside of the housing 1, which can easily cause a large amount of dust to accumulate on the MOS device body 10, making it impossible to dissipate the high temperature generated by the MOS device body 10, causing damage to the MOS device body 10. This solves the problem of the inability to dissipate heat from the MOS device body 10.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency heat-dissipating wheel-shaped MOS device for integrated circuits, comprising a housing (1), characterized in that: The outer shell (1) is equipped with a cooling device (2). The cooling device (2) includes a support plate (201) fixedly connected to one side of the outer shell (1). The upper surface of the support plate (201) is fixedly connected to the lower end of the refrigeration equipment (202). One side of the refrigeration equipment (202) is fixedly connected to the inlet of the water pump (203). The outlet of the water pump (203) is fixedly connected to the inlet of the refrigeration pipe (204). The outlet of the refrigeration pipe (204) is fixedly connected to the return pipe (206). The outlet of the return pipe (206) is fixedly connected to the inlet of the refrigeration equipment (202).

2. The high efficiency heat dissipation wheel-shaped MOS device for integrated circuits according to claim 1, characterized in that: The upper end of the inner side of the outer shell (1) is fixedly connected to one side of the ventilation plate (3), and the ventilation plate (3) has ventilation holes (4) inside.

3. The high-efficiency heat-dissipating wheel-shaped MOS device for integrated circuits according to claim 2, characterized in that: The middle part of the ventilation plate (3) is fixedly connected to one end of the fixed column (5), and the other end of the fixed column (5) is fixedly connected to one side of the fan (6).

4. The high efficiency heat dissipation wheel-shaped MOS device for integrated circuits according to claim 1, characterized in that: The lower inner surface of the outer shell (1) is fixedly connected to the lower end of the fixed support (7), the upper end of the fixed support (7) is fixedly connected to the lower surface of the circuit board (9), the upper surface of the circuit board (9) is fixedly connected to the lower surface of the MOS device body (10), the lower surface of the MOS device body (10) is fixedly connected to the lower surface of the heat sink (12), and the upper surface of the heat sink (12) is fixedly connected to the lower surface of the heat dissipation device (13).

5. The high efficiency heat dissipation wheel-shaped MOS device for integrated circuits according to claim 4, characterized in that: The upper surface of the circuit board (9) is threadedly connected to the second screw (11), and the outer circular surface of the second screw (11) is rotatably connected to the middle of the upper surface of the heat dissipation device (13).

6. The high efficiency heat dissipation wheel-shaped MOS device for integrated circuits according to claim 4, characterized in that: One side of the circuit board (9) is fixedly connected to one end of the transmission line (14), and the other end of the transmission line (14) is fixedly connected to one side of the plug plate (15).

7. The high efficiency heat dissipation wheel-shaped MOS device for integrated circuits according to claim 4, characterized in that: The middle part of the circuit board (9) is rotatably connected to the outer circular surface of the first screw (8), and the thread of the first screw (8) is threadedly connected to the inner lower surface of the outer shell (1).

8. The high efficiency heat dissipation wheel-shaped MOS device for integrated circuits according to claim 1, characterized in that: The outer circular surface of the refrigeration pipe (204) is fixedly connected to one end of the fixing bracket (205), the other end of the fixing bracket (205) is fixedly connected to one side of the inner side of the outer shell (1), and the upper surface of the outer shell (1) is fixedly connected to the lower surface of the filter plate (16).

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