Frame for bypass diode

Abstract

The utility model discloses a frame for a bypass diode, which relates to the technical field of photovoltaic modules and specifically structurally comprises a first metal sheet, a second metal sheet and a third metal sheet, the second metal sheet and the first metal sheet are arranged at an interval, and the opposite ends of the second metal sheet and the first metal sheet are L-shaped; the first metal sheet comprises a first substrate section, and one side of the first substrate section is L-shaped; the first pin section is positioned on the other side of the first substrate section; the second metal sheet comprises a second substrate section, and one side, close to the first substrate section, of the second substrate section is L-shaped; and the second pin section is positioned on one side, far away from the first substrate section, of the second substrate section. The technical problem that an existing frame is insufficient in heat dissipation performance is solved.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic module technology, and in particular to a frame for a bypass diode. Background Technology

[0002] A bypass diode is a diode connected in reverse parallel across the two ends of a solar silicon cell array in a solar module. It effectively prevents the silicon cells from burning out due to hot spot effects and is an important component of photovoltaic solar modules. Bypass diodes are used to prevent some solar cells from becoming overheated and damaged due to shading under strong sunlight, causing them to become a load. They are commonly used in bypass diodes of monocrystalline and polycrystalline silicon photovoltaic (PV) panels to protect overheated photovoltaic cells when low shunt current and high shunt impedance occur.

[0003] The existing bypass diodes typically use the frame structure with authorization notice number CN213878107U. The upper and lower surfaces of the frame are uneven, which is not conducive to subsequent mating with the junction box. Moreover, the heat dissipation performance of the frame itself is insufficient, which has a certain impact on the performance of the bypass diode. Utility Model Content

[0004] The purpose of this invention is to provide a frame for bypass diodes, which solves the technical problem of insufficient heat dissipation performance of existing frames.

[0005] This application discloses a frame for a bypass diode, comprising:

[0006] First metal sheet;

[0007] The second metal sheet is spaced apart from the first metal sheet, and the opposite ends of the second metal sheet and the first metal sheet are both L-shaped.

[0008] The first metal sheet includes:

[0009] The first substrate segment has an L-shaped side.

[0010] The first pin segment is located on the other side of the first substrate segment;

[0011] The second metal sheet includes:

[0012] The second substrate segment has an L-shaped side closer to the first substrate segment;

[0013] The second pin segment is located on the side of the second substrate segment away from the first substrate segment.

[0014] This application designs the first metal sheet and the second metal sheet. The L-shaped design facilitates the subsequent welding of the grains and also increases the heat dissipation area and improves heat dissipation.

[0015] Based on the above technical solution, the embodiments of this application can be further improved as follows:

[0016] Furthermore, the opposite ends of the first and second metal sheets are complementary structures. The advantage of this step is that it facilitates the subsequent processing of the frame.

[0017] Furthermore, the upper surfaces of the first metal sheet and the second metal sheet are on the same horizontal plane, and the lower surfaces of the first metal sheet and the second metal sheet are on the same horizontal plane; the first metal sheet and the second metal sheet are integrally formed. The beneficial effect of this step is to improve flatness, facilitate the reduction of shear force after the combination of multiple frame pieces, and thus ensure the electrical properties of the material.

[0018] Furthermore, a first heat dissipation strip is provided at the free end of the first substrate segment, and a second heat dissipation strip is provided at the free end of the second substrate segment. The beneficial effect of this step is that the heat dissipation effect can be improved through the heat dissipation strip.

[0019] Furthermore, a connecting rib is provided between the first heat dissipation strip segment and the second substrate segment;

[0020] A connecting rib is provided between the second heat dissipation strip and the first substrate segment. The advantage of this step is that it facilitates subsequent production and manufacturing.

[0021] Furthermore, grooves are provided at the connecting ribs of the first substrate segment and the connecting ribs of the second substrate segment. The advantage of this step is that it facilitates the subsequent filling of sealant.

[0022] Furthermore, the first metal sheet and the second metal sheet have the same structure.

[0023] Furthermore, the width of the first substrate segment is the same as the width of the first pin segment.

[0024] Furthermore, the width of the first substrate segment is greater than the width of the first pin segment.

[0025] Furthermore, neither the first metal sheet nor the second metal sheet has positioning holes.

[0026] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0027] 1. This application designs the first metal sheet and the second metal sheet to improve flatness, thereby reducing the shear force that occurs after the multi-piece frame is assembled and avoiding poor electrical properties of the materials.

[0028] 2. In this application, the first metal sheet and the second metal sheet are designed with L-shaped ends, which facilitates subsequent die assembly and increases the heat dissipation area.

[0029] 3. This application also includes a heat dissipation strip to further improve the heat dissipation effect. Attached Figure Description

[0030] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of a bypass diode frame according to a specific embodiment of the present invention;

[0032] Figure 2 This is another structural schematic diagram of a bypass diode frame according to a specific embodiment of the present utility model;

[0033] Figure label:

[0034] 1-First metal sheet; 2-Second metal sheet; 3-Connecting rib; 4-Groove;

[0035] 101 - First substrate segment; 102 - First pin segment; 103 - First heat sink segment;

[0036] 201 - Second substrate segment; 202 - Second pin segment; 203 - Second heat sink segment. Detailed Implementation

[0037] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0038] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] To better understand the above technical solutions, the following will provide a detailed description of the technical solutions in conjunction with the accompanying drawings and specific embodiments.

[0041] Example:

[0042] like Figure 1-2 As shown, this application discloses a frame for a bypass diode. Compared with existing frames, it facilitates die soldering and increases the heat dissipation area, thereby improving the performance of the bypass diode. The top and bottom surfaces of the frame in this application are both flat, which improves flatness, reduces shearing forces that occur when multiple frames are combined, thus preventing material electrical defects, and also facilitates production operations and integrated installation, making installation efficient and simple. In the subsequent assembly of the frame into a housing, this application does not require diode production and then wire box encapsulation; instead, it is directly encapsulated with the wire box, thus simplifying the steps and improving efficiency.

[0043] The specific structure of this application includes:

[0044] First metal sheet 1;

[0045] The second metal sheet 2 is spaced apart from the first metal sheet 1, which facilitates the subsequent packaging to form a bypass diode. At the same time, the opposite ends of the second metal sheet 2 and the first metal sheet 1 are both L-shaped, which can form a complementary structure in the future.

[0046] The first metal sheet 1 includes:

[0047] First substrate segment 101; one side of the first substrate segment 101 is L-shaped;

[0048] The first pin segment 102 is located on the other side of the first substrate segment 101;

[0049] The second metal sheet 2 includes:

[0050] The second substrate segment 201 has an L-shaped side near the first substrate segment 101.

[0051] The second pin segment 202 is located on the side of the second substrate segment 201 away from the first substrate segment 101; while the first substrate segment 101 and the second substrate segment 201 are positioned opposite each other, thus forming a complementary structure.

[0052] The framework in this application is divided into two parts, namely, a first metal sheet 1 and a second metal sheet 2. The first metal sheet 1 is used for welding dies. When welding a die, the die can be located on the first substrate segment 101. Similarly, when welding two dies, they are staggered and welded to the two ends of the L-shape of the first substrate segment 101 to avoid heat accumulation and improve heat dissipation.

[0053] The frame in this application is subsequently directly packaged and connected to the junction box. Compared with the existing diode packaging and the junction box packaging, the frame area can be further increased, thereby improving heat dissipation performance.

[0054] Existing photovoltaic diode frames are usually uneven because they need to be packaged into photovoltaic diodes first and then assembled. In this application, the upper surface of the first metal sheet 1 and the upper surface of the second metal sheet 2 are on the same horizontal plane, and the lower surface of the first metal sheet 1 and the lower surface of the second metal sheet 2 are on the same horizontal plane. That is, the first metal sheet 1 and the second metal sheet 2 are flush, which improves flatness, reduces shearing force after multiple frames are combined, and ensures the quality of the entire product during subsequent packaging.

[0055] To facilitate production, the framework of this application is an integrally formed part, namely, the first metal sheet 1 and the second metal sheet 2 are integrally formed, which simplifies the processing steps.

[0056] To further improve the heat dissipation effect, this application also provides heat dissipation strips, that is, both the first metal sheet 1 and the second metal sheet 2 include heat dissipation strip segments, the free end of the first substrate segment 101 is provided with a first heat dissipation strip segment 103, and the free end of the second substrate segment 201 is provided with a second heat dissipation strip segment 203. That is, both the first heat dissipation strip segment 103 and the second heat dissipation strip segment 203 are elongated and can form heat dissipation channels to further improve the heat dissipation effect.

[0057] In order to better control the size of the entire metal sheet and maximize the heat dissipation effect, the first heat dissipation segment 103 and the second heat dissipation segment 203 are diagonally distributed. Specifically, the first heat dissipation segment 103 and the second heat dissipation segment 203 are rotationally symmetrical about the center between the first metal sheet 1 and the second metal sheet 2, which can further improve the heat dissipation effect.

[0058] Furthermore, a connecting rib 3 is provided between the first heat dissipation segment 103 and the second substrate segment 201 in this application;

[0059] A connecting rib 3 is provided between the second heat dissipation strip 203 and the first substrate segment 101. At the same time, grooves 4 are provided at the connecting ribs of the first substrate segment 101 and the connecting ribs of the second substrate segment 201. This facilitates subsequent processing, and the corresponding grooves 4 facilitate efficient filling of sealant.

[0060] The framework of this application has various forms. The first metal sheet 1 and the second metal sheet 2 have the same structure; the first metal sheet 1 can also be combined with the second metal sheet 2 to form a frame structure.

[0061] In one embodiment, the width of the first substrate segment 101 is the same as the width of the first pin segment 102.

[0062] In another embodiment, the width of the first substrate segment 101 is greater than the width of the first pin segment 102, and the first pin segment 102 has an opening to facilitate subsequent placement on the material carrier.

[0063] Compared to existing structures, neither the first substrate segment 101 nor the second substrate segment 201 in this application has positioning holes, because this application does not require positioning and packaging into a diode, but instead directly encapsulates it with the housing, thus improving the heat dissipation effect of the product.

[0064] Further explanation is provided regarding this application:

[0065] First, this application adopts an integrated frame design, that is, the first metal sheet 1, the second metal sheet 2, the heat dissipation section, etc. are formed as one piece. This can improve flatness, reduce the shear force that occurs after the combination of multiple frame pieces, thereby reducing the problem of poor material electrical properties. It can also facilitate production operations, integrated installation, and is efficient and simple.

[0066] Secondly, this application designs the first metal sheet 1 and the second metal sheet 2 to increase the heat dissipation area of ​​the substrate segment, which enables the welding of larger grains;

[0067] Finally, this application also adds heat dissipation strips, specifically, a first heat dissipation strip segment and a second heat dissipation strip, such as a longer heat dissipation channel design structure, to ensure that the heat of the overall material is more uniform and to improve heat dissipation performance.

[0068] Numerous specific details are set forth in this specification. However, it will be understood that embodiments of this invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0069] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model, and they should all be covered within the scope of the claims and specification of this utility model.

Claims

1. A frame for a bypass diode, characterized by, include: First metal sheet (1); The second metal sheet (2) is spaced apart from the first metal sheet (1), and the opposite ends of the second metal sheet (2) and the first metal sheet (1) are both L-shaped; The first metal sheet (1) includes: The first substrate segment (101) has an L-shaped side; The first pin segment (102) is located on the other side of the first substrate segment (101); The second metal sheet (2) includes: The second substrate segment (201) has an L-shaped side near the first substrate segment (101); The second pin segment (202) is located on the side of the second substrate segment (201) away from the first substrate segment (101).

2. The frame for a bypass diode according to claim 1, characterized by The opposite ends of the first metal sheet (1) and the second metal sheet (2) are complementary structures.

3. The frame for a bypass diode according to claim 1, characterized by The upper surface of the first metal sheet (1) and the upper surface of the second metal sheet (2) are on the same horizontal plane, and the lower surface of the first metal sheet (1) and the lower surface of the second metal sheet (2) are on the same horizontal plane; the first metal sheet (1) and the second metal sheet (2) are integrally formed.

4. The frame for a bypass diode according to claim 1, characterized in that, The free end of the first substrate segment (101) is provided with a first heat dissipation strip segment (103), and the free end of the second substrate segment (201) is provided with a second heat dissipation strip segment (203).

5. The frame for a bypass diode according to claim 4, characterized by A connecting rib is provided between the first heat dissipation strip segment (103) and the second substrate segment (201); A connecting rib is provided between the second heat dissipation strip (203) and the first substrate segment (101).

6. The frame for a bypass diode according to claim 5, characterized by The first metal sheet (1) and the second metal sheet (2) have the same structure.

7. The frame for a bypass diode according to claim 6, characterized by Grooves are provided at the connecting ribs of the first substrate segment (101) and the connecting ribs of the second substrate segment (201).

8. The frame for a bypass diode according to claim 5, characterized by The width of the first substrate segment (101) is the same as the width of the first pin segment (102).

9. The frame for a bypass diode according to claim 7, characterized by The width of the first substrate segment (101) is greater than the width of the first pin segment (102).

10. The frame for a bypass diode according to claim 1, characterized by Neither the first metal sheet (1) nor the second metal sheet (2) has a positioning hole.

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