Wire bonding device

Abstract

The utility model discloses a wire bonding device. The device comprises an ultrasonic transducer, a head for mounting a chopper and flanges on two sides, the mounting surface at the front end of the conversion seat is connected with flanges on the two sides of the ultrasonic transducer through screws, and the rear mounting surface of the conversion seat is used for being connected with a bonding head of a wire bonding machine; according to the device, the periphery of the piezoelectric ceramic is fully surrounded by a metal material in a non-contact manner through a specific structure matching design, so that the influence of ambient air temperature change and heat radiation quantity change on the piezoelectric ceramic is reduced and buffered, meanwhile, vibration between the transducer and a bonding head is fully isolated, and the impedance stability of the transducer is improved.

Description

Technical Field

[0001] This invention relates to the technical field of ultrasonic transducers, and more particularly to a wire bonding device. Background Technology

[0002] Wire bonding machines are widely used in the semiconductor packaging industry. With the development of the semiconductor packaging industry, various ultrasonic transducers have been developed to meet different application needs. To address the impedance stability issue after a specially designed ultrasonic transducer is mounted on a wire bonding machine, the industry widely adopts the practice of equipping the transducer with a corresponding conversion mount as an intermediate mechanism between the transducer and the bonding head. This invention attempts to achieve a specific design that, after the transducer, directly mounted on this mechanism, is fixed to the bonding head of the wire bonding machine, significantly reduces the interference of the bonding head's inherent modes on the transducer's vibration modes near the operating frequency during use. Simultaneously, it reduces the impact of different temperatures on the worktable area when the transducer moves above the wire bonding machine's worktable, thus maintaining the stability and consistency of the transducer's impedance as much as possible. Summary of the Invention

[0003] This invention discloses a wire bonding device, comprising: an ultrasonic transducer with a head for mounting a wedge and two side flanges; a conversion base, the front mounting surface of which is connected to the two side flanges of the ultrasonic transducer by screws, and the rear mounting surface of which is used to connect to a wire bonding machine connector; the front mounting surface of the conversion base is integrally formed around its perimeter, while the rear mounting surface is broken in the middle; the front mounting surface has an upper protrusion mechanism and a lower protrusion mechanism, which respectively fully shield the piezoelectric ceramic in the vertical viewing direction at the upper and lower parts. This significantly reduces the interference of the connector's inherent mode on the transducer's vibration modes near the operating frequency, and also reduces the influence of different temperatures on the worktable when the transducer moves above the wire bonding machine's worktable, thus maintaining the stability and consistency of the transducer's impedance as much as possible. Attached Figure Description

[0004] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0005] Figure 1 This is a three-dimensional schematic diagram of an example of the complete device of the present invention.

[0006] Figure 2 This is a schematic diagram of the ultrasonic transducer of the device of the present invention.

[0007] Figure 3 This is a three-dimensional schematic diagram of the conversion base of the device of the present invention.

[0008] Figure 4 This is a side view of the conversion base of the device of the present invention.

[0009] Figure 5This is a schematic diagram of the rear mounting surface of the conversion seat of the device of the present invention.

[0010] Figures 6 to 9 The diagrams show the piezoelectric ceramic in the device of the present invention being obscured by four vertical viewing angles.

[0011] The components are: 1. Ultrasonic transducer, 2. Converter base, 3. Connecting screw, 11. Cleaver, 12. Flanges on both sides of the transducer, 13. Piezoelectric ceramic, 21. Front mounting surface of the converter base, 22. Rear mounting surface of the converter base, 23. Upper protruding mechanism of the front mounting surface, 24. Lower protruding mechanism of the mounting surface. Detailed Implementation

[0012] This invention consists of a transducer 1 and a conversion base 2 connected by screws 3, as shown below. Figure 1 As shown. Transducer 1 is as follows. Figure 2 As shown, the converter is as follows Figure 3 As stated above.

[0013] The transducer head is equipped with a chamfer 11, and flanges 12 are located on both sides. The front mounting surface 21 of the converter seat 2 is integrally formed around its perimeter. Figure 3 The middle part of the rear mounting surface 22 is broken as follows. Figure 5 The front mounting surface 21 is fixedly connected to the transducer 1 by screws 3, and the rear mounting surface 22 is used to connect to the wire bonding machine connector.

[0014] This invention optimizes the design by taking into account both heat transfer and vibration factors. The front mounting surface has an upper protrusion mechanism 23 and a lower protrusion mechanism 24, which completely shields the ceramic plate 13, which plays an important role in the transducer 1, from the surrounding metal of the device in four vertical viewing directions. The surrounding hot air energy and thermal radiation energy that would originally come into contact with the piezoelectric ceramic are first absorbed by the conversion base and transmitted through the connector, which plays a certain role in temperature control and reduces the temperature change of the piezoelectric ceramic. At the same time, it isolates the transducer and the connector from each other in terms of vibration mode, so that the impedance of the ultrasonic transducer remains highly stable during use.

[0015] Depending on the actual needs, a non-metallic heat insulation cover can be added to the bottom of the device to further improve the heat insulation effect.

Claims

1. A wire bonding apparatus, characterized by: An ultrasonic transducer has a head for mounting a cleaver and two side flanges; a conversion base has a front mounting surface that is connected to the two side flanges of the ultrasonic transducer by screws, and a rear mounting surface that is used to connect a wire bonding machine connector; the front mounting surface of the conversion base is continuous around the perimeter, while the rear mounting surface is broken in the middle; the front mounting surface has an upper protrusion mechanism and a lower protrusion mechanism, which fully shield the piezoelectric ceramic in the vertical viewing direction at the upper and lower parts, respectively.

2. The wire bonding apparatus of claim 1, wherein: A non-metallic heat insulation cover was added to the bottom of the device.

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