Heating, curing and carrying mechanism of printing machine

Abstract

The utility model discloses a heating, curing and carrying mechanism of a printing machine, and relates to the technical field of wafer processing. According to the technical scheme, the heating and curing carrying mechanism of the printing machine comprises a mounting plate and is characterized in that a grabbing mechanism, a heating and curing box and a linear sliding rail are mounted on the mounting plate, a plurality of sets of material containing discs are mounted on the linear sliding rail in a sliding mode, and a lifting structure is mounted on the mounting plate; the grabbing mechanism is installed above the lifting structure and the material containing disc, and the lifting structure is installed in the material containing disc. The lifting structure comprises a supporting seat, a connecting assembly is slidably mounted on the supporting seat, two lifting rods are fixedly mounted on the connecting assembly, and a lifting structure is mounted below the supporting seat. The utility model aims to provide the heating, curing and carrying mechanism of the printing machine, which achieves the effect of accurately controlling and positioning a wafer when the wafer is heated and cured, so that the subsequent processing and positioning are accurate.

Description

Technical Field

[0001] This utility model discloses a heating and curing conveying mechanism for a printing press, which relates to the field of wafer processing technology. Background Technology

[0002] A wafer printer is a specialized device used for printing patterns on wafers during semiconductor manufacturing. Wafers are a crucial component in semiconductor manufacturing, and printers are primarily used to print various patterns onto their surfaces, such as circuit patterns, photomasks, and protective layers. They are commonly used in the semiconductor industry, particularly in chip manufacturing, photolithography, and the production of microelectronic devices. The working principle of a wafer printer typically relies on photolithography or inkjet printing technology. In a wafer printer, curing heating is a critical process, usually occurring during photolithography or other pattern transfer processes. This process is used to cure the photoresist or other materials coated on the wafer surface, ensuring they maintain a stable shape and structure during subsequent etching, removal, or other processing steps. In advanced semiconductor manufacturing processes, curing heating is fundamental to ensuring high-precision pattern transfer and high-performance chip manufacturing.

[0003] Curing and heating in wafer printers is a crucial step, ensuring the stability and durability of the pattern on the wafer surface by heating and curing the material. This process involves precise control of temperature, time, and heating method; even slight deviations can affect subsequent wafer production processes and the quality of the final product. When transferring the wafer to the curing chamber after printing, a robotic arm is needed. However, the curing chamber cannot be opened or closed during operation, and using a conveyor line for transfer can lead to inaccurate wafer positioning during curing, affecting subsequent processing. Therefore, a suitable heating and curing handling mechanism for printers is needed to address these issues. Utility Model Content

[0004] The purpose of this invention is to provide a heating and curing conveying mechanism for a printing press, which achieves precise control and positioning of the wafer during heating and curing to ensure accurate positioning during subsequent processing.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a printing press heating and curing conveying mechanism, comprising a mounting plate, characterized in that: a gripping mechanism is mounted on the mounting plate, a heating and curing box is mounted on the mounting plate, a linear slide rail is mounted on the mounting plate, several sets of material trays are slidably mounted on the linear slide rail, a lifting structure is mounted on the mounting plate, the gripping mechanism is mounted above the lifting structure and the material trays, and the lifting structure is mounted inside the material trays; the lifting structure includes a support base, a connecting component is slidably mounted on the support base, two sets of lifting rods are fixedly mounted on the connecting component, and an upward lifting structure is mounted below the support base.

[0006] Preferably, the lifting structure includes a transmission rod, which is driven by a motor. A transmission block is mounted on the transmission rod, and a rocker arm is rotatably mounted on the transmission block. A sliding module is rotatably mounted on the other end of the rocker arm.

[0007] Preferably, the material tray is driven by a motor, and the lifting structure is driven by a motor.

[0008] Preferably, the length of the linear guide rail is greater than the total length of several sets of material trays.

[0009] Preferably, the sliding module is slidably connected to the support base, and the sliding module is fixedly connected to the connecting component.

[0010] Preferably, the lifting structure is provided in several groups.

[0011] Preferably, the material tray has two sets of grooves.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: All the placement trays are driven by a motor to move along a linear slide rail. When they reach the designated position, the lifting structure lifts them upwards, causing the wafer to move upwards and leave the placement tray, then be placed on the lifting structure. Subsequently, the motor drives all the placement trays to move along the linear slide rail back to their original positions, and the lifting structure descends back to its original position. At this point, the wafer, initially placed on the first placement tray, is transferred to the next placement tray, i.e., into the heat curing chamber. In the heat curing chamber, the material is heated and cured to ensure the stability and durability of the wafer surface pattern. Subsequent steps are as described above until the wafer is sequentially placed on the last placement tray. Then, the gripping mechanism grips the wafer to the next station. The placement trays always have a gap of one tray length while moving along the linear slide rail, making the position control more precise during wafer transfer. This achieves precise control and positioning of the wafer during heat curing, ensuring accurate positioning in subsequent processing. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of an overall heating, curing, and conveying mechanism for a printing press.

[0014] Figure 2 for Figure 1 A schematic diagram of the internal structure of a heating, curing, and conveying mechanism for a printing press.

[0015] Figure 3 for Figure 1 A schematic diagram of a lifting mechanism in a printing press heating and curing conveying mechanism;

[0016] Figure 4 for Figure 3 Top view of the lifting structure in the middle;

[0017] The following are the labeling elements in the figure:

[0018] 1. Mounting plate; 2. Gripping mechanism; 3. Heating and curing box; 4. Lifting structure; 41. Support base; 42. Connecting assembly; 43. Lifting rod; 44. Lifting structure; 441. Transmission rod; 442. Transmission block; 443. Rocker arm; 445. Sliding module; 5. Material tray; 51. Groove; 6. Linear slide rail. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Specific implementation examples:

[0021] like Figures 1-2 As shown, a printing press heating and curing conveying mechanism includes a mounting plate 1, a gripping mechanism 2 mounted on the mounting plate 1, a heating and curing box 3 mounted on the mounting plate 1, a linear slide rail 6 mounted on the mounting plate 1, several sets of material trays 5 slidably mounted on the linear slide rail 6, a lifting structure 4 mounted on the mounting plate 1, the gripping mechanism 2 mounted above the lifting structure 4 and the material trays 5, and the lifting structure 4 mounted inside the material trays 5.

[0022] The material tray 5 is driven by a motor, and the lifting structure 4 is driven by a motor.

[0023] When the mechanism is not in operation, the lifting structure 4 is hidden inside the placement tray 5. When it starts working, the gripping mechanism 2 first grips the wafer and places it on the placement tray 5. Then, the motor drives all the placement trays 5 to move along the linear slide rail 6. When they reach the designated position, the lifting structure 4 lifts them upward, causing the wafer to move upward and leave the placement tray 5 and be placed on the lifting structure 4. Then, the motor drives all the placement trays 5 to move along the linear slide rail 6 back to their original positions. The lifting structure 4 descends and returns to its original position. At this time, the wafer is transferred from the first placement tray 5 to the next placement tray 5, that is, into the heat curing chamber 3. In the heat curing chamber 3, the material is cured by heating to ensure the stability and durability of the wafer surface pattern. The subsequent steps are as described above until the wafer is placed sequentially on the last placement tray 5. Then, the gripping mechanism 2 grips the wafer and moves it to the next station.

[0024] like Figure 2 As shown, the length of the linear slide rail 6 is greater than the total length of several sets of material trays 5;

[0025] For ease of description, the material tray 5 is set to "n" groups, and the length of the linear slide rail 6 is the total length of "n+1" groups of material trays 5. That is, the material tray 5 always has a gap of one group of material trays 5 when it moves on the linear slide rail 6, which makes the position control more precise when transferring wafers.

[0026] like Figures 3-4 As shown, the lifting structure 4 includes a support base 41, a connecting component 42 is slidably mounted on the support base 41, two sets of lifting rods 43 are fixedly mounted on the connecting component 42, and an upward lifting structure 44 is installed below the support base 41.

[0027] The lifting structure 44 includes a transmission rod 441, which is driven by a motor. A transmission block 442 is mounted on the transmission rod 441, and a rocker arm 443 is rotatably mounted on the transmission block 442. A sliding module 445 is rotatably mounted on the other end of the rocker arm 443.

[0028] When the lifting structure 4 is working, the motor drives the lifting structure 44, that is, drives the transmission rod 441 to rotate counterclockwise. The transmission rod 441 is fixedly connected to the transmission block 442, so the transmission rod 441 drives the transmission block 442 to rotate counterclockwise, and the transmission block 442 pulls the rocker arm 443 to lift the sliding module 445.

[0029] The sliding module 445 is slidably connected to the support base 41, and the sliding module 445 is fixedly connected to the connecting component 42;

[0030] The sliding connection between the sliding module 445 and the support base 41 limits the movement direction of the sliding module 445 to only linear upward and downward movement. Therefore, when the sliding module 445 is lifted, the fixed connection between the sliding module 445 and the connecting component 42 causes the connecting component 42 to drive the lifting rod 43 to lift upward, that is, to lift the wafer upward away from the surface of the material tray 5.

[0031] The lifting structure 44 is provided with several groups;

[0032] To make the lifting process of the lifting structure 44 more stable, several groups of lifting structures 44 are set up, and all the lifting structures 44 are controlled by the same transmission rod 441 to ensure that the movement distance and range of each group of lifting structures 44 are the same.

[0033] The lifting rod 43 is set in the groove 51 and does not contact any of its surface, so that the lifting rod 43 can move up and down in the material tray 5 and the sliding of the material tray 5 is not interfered with by the movement.

[0034] In summary, all the placement trays 5 are driven by a motor to move along the linear slide rail 6. When they reach the designated position, the lifting structure 4 lifts them upward, causing the wafer to move upward and leave the placement tray 5 and be placed on the lifting structure 4. Then, the motor drives all the placement trays 5 to move along the linear slide rail 6 back to their original positions, and the lifting structure 4 descends back to its original position. At this time, the wafer, which was initially placed on the first placement tray 5, is transferred to the next placement tray 5, i.e., enters the heat curing chamber 3. In the heat curing chamber 3, the material is heated and cured to ensure the stability and durability of the wafer surface pattern. The subsequent steps are as described above until the wafer is sequentially placed on the last placement tray 5. Then, the gripping mechanism 2 grips the wafer and moves it to the next station. The placement tray 5 always has a gap of one set of placement tray 5 length when moving on the linear slide rail 6, which makes the control position more precise when transferring the wafer. This achieves the effect of precise control and positioning of the wafer during heat curing, so as to ensure accurate positioning in subsequent processing.

[0035] The above description is merely a preferred embodiment of this application. The scope of protection of this application is not limited to the above embodiments. All technical solutions within this concept are within the scope of protection of this application. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of this application should also be considered within the scope of protection of this application.

Claims

1. A printing press heat setting handling mechanism comprising a mounting plate (1), characterised in that: A gripping mechanism (2) is installed on the mounting plate (1), a heating curing box (3) is installed on the mounting plate (1), a linear slide rail (6) is installed on the mounting plate (1), several sets of material trays (5) are slidably installed on the linear slide rail (6), a lifting structure (4) is installed on the mounting plate (1), the gripping mechanism (2) is installed above the lifting structure (4) and the material trays (5), and the lifting structure (4) is installed inside the material trays (5); The lifting structure (4) includes a support base (41), on which a connecting component (42) is slidably mounted, and two sets of lifting rods (43) are fixedly mounted on the connecting component (42). An upward lifting structure (44) is installed below the support base (41).

2. A print engine heating and fixing transport mechanism according to claim 1 wherein: The lifting structure (44) includes a transmission rod (441), which is driven by a motor. A transmission block (442) is installed on the transmission rod (441), and a rocker arm (443) is rotatably installed on the transmission block (442). A sliding module (445) is rotatably installed on the other end of the rocker arm (443).

3. A print engine heating and fixing transport mechanism as claimed in claim 1, wherein: The material tray (5) is driven by a motor, and the lifting structure (4) is driven by a motor.

4. A print engine heating and fixing transport mechanism as claimed in claim 1, wherein: The length of the linear slide rail (6) is greater than the total length of several sets of material trays (5).

5. A print engine heating and fixing transport mechanism as claimed in claim 2, wherein: The sliding module (445) is slidably connected to the support base (41), and the sliding module (445) is fixedly connected to the connecting component (42).

6. A print engine heating and fixing transport mechanism as claimed in claim 1, wherein: The lifting structure (44) is provided in several groups.

7. A print engine heating and fixing transport mechanism as claimed in claim 1, wherein: The material tray (5) is provided with two sets of grooves (51).

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