Swing type feeding device for semiconductor chip testing

Abstract

The utility model discloses a swing type feeding device for semiconductor chip testing, comprising an adsorption module which comprises a support, a driving motor, a swing arm, a guide plate, a first slide rail, a second slide rail and an adsorption frame, the driving motor is fixedly installed on the support, the swing arm is fixedly installed on an output shaft of the driving motor, the guide plate is provided with an arc-shaped guide hole, and the first slide rail and the second slide rail are arranged in the arc-shaped guide hole; the first sliding rail is fixedly installed on the support, a first sliding block is arranged on the first sliding rail, a second sliding block is arranged on the first sliding block, and the second sliding rail is connected to the second sliding block in a sliding mode; the first carrying disc is connected to the first linear guide rail in a sliding manner; and the second carrying disc is fixedly installed on the sliding table of the X-axis mover, the X-axis mover is fixedly installed on the sliding table of the Y-axis mover, and the second carrying disc is arranged on one side of the first carrying disc. Compared with the prior art, the chip feeding mechanical arm solves the problems that an existing moving track of the chip feeding mechanical arm is prone to jerking, and the adsorption effect is poor.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a swing-type feeding device for semiconductor chip testing. Background Technology

[0002] After semiconductor chip manufacturing, systematic testing is required to ensure product quality and reliability, and significantly reduce product failure rates. Semiconductor chips need to undergo logic function testing, DC characteristic testing, ESD protection testing, and other tests to comprehensively evaluate their performance.

[0003] When testing semiconductor chips, multiple chips need to be transferred from a small tray to a large tray to test more chips at once and improve testing efficiency. The robotic arm uses two linear modules to move along the Z and X axes. However, when handling chips, the limited space within the testing equipment makes layout inconvenient, and the combination of two straight lines in the transport trajectory can easily cause stuttering, affecting the chip adhesion effect. Utility Model Content

[0004] The purpose of this invention is to provide a swing-type feeding device for semiconductor chip testing, so as to solve the problems of jerking and poor adsorption effect in the existing movement trajectory of chip feeding robots.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a swing-type feeding device for semiconductor chip testing, comprising:

[0006] The adsorption module includes a bracket, a drive motor, a swing arm, a guide plate, a first slide rail, a second slide rail, and an adsorption frame. The drive motor is fixedly mounted on the bracket, the swing arm is fixedly mounted on the output shaft of the drive motor, the guide plate is provided with an arc-shaped guide hole, the first slide rail is fixedly mounted on the bracket, a first slider is provided on the first slide rail, a second slider is provided on the first slider, the second slide rail is slidably connected to the second slider, the end of the second slide rail is pivotally connected to the swing arm through a connecting shaft, the back of the connecting shaft extends into the arc-shaped guide hole, and the adsorption frame is detachably mounted on the bottom of the second slide rail, and the adsorption frame is provided with several suction cups arranged in an array.

[0007] The first carrier disk is slidably connected to the first linear guide rail;

[0008] The second carrier is fixedly mounted on the slide of the X-axis mover, which is fixedly mounted on the slide of the Y-axis mover. The second carrier is located on one side of the first carrier.

[0009] As a further description of the above technical solution:

[0010] The bracket has symmetrically arranged photoelectric sensors on both sides, with the positions of the photoelectric sensors corresponding to the ends of the arc-shaped guide holes.

[0011] As a further description of the above technical solution:

[0012] The first slide rail has symmetrically arranged buffer blocks on both sides. The buffer blocks are elastically connected to the mounting bracket, and their positions correspond to the second slide rail.

[0013] As a further description of the above technical solution:

[0014] The top of the adsorption rack is provided with an installation groove, and the bottom of the second slide rail is inserted into the installation groove.

[0015] As a further description of the above technical solution:

[0016] The mounting groove extends to the surface of the adsorption rack on one side to form an opening.

[0017] As a further description of the above technical solution:

[0018] The mounting groove has raised ribs on one of its opposite sidewalls, and the bottom of the second slide rail has a groove that matches the shape of the raised ribs.

[0019] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0020] 1. In this utility model, the adsorption module is small in size, and when the adsorption module adsorbs and picks up semiconductor chips, the drive motor drives the swing arm to swing back and forth, so that the second slide rail moves along the first slide rail in the X-axis direction and moves up and down in the Z-axis direction at the same time. The transfer speed of semiconductor chips is fast and stable, effectively solving the problems of the existing movement trajectory of chip loading robot being prone to stuttering and poor adsorption effect.

[0021] 2. In this utility model, during the swing of the swing arm, the back of the connecting shaft that is pivotally connected to the second slide rail and the swing arm is extended into the arc-shaped guide hole. The arc-shaped guide hole is used to limit the swing stroke of the swing arm 13, thereby improving the accuracy of the position when the semiconductor chip is adsorbed and placed. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of a swing-type feeding device for semiconductor chip testing.

[0024] Figure 2 This is a schematic diagram illustrating the state changes of a swing-type feeding device for semiconductor chip testing.

[0025] Figure 3 This is a schematic diagram of the installation of the adsorption rack in a swing-type feeding device for semiconductor chip testing.

[0026] Legend:

[0027] 1. Adsorption module; 11. Bracket; 111. Photoelectric sensor; 12. Drive motor; 13. Swing arm; 14. Guide plate; 141. Arc-shaped guide hole; 15. First slide rail; 151. First slider; 152. Second slider; 16. Second slide rail; 161. Connecting shaft; 162. Groove; 17. Adsorption frame; 171. Suction cup; 172. Mounting slot; 173. Rib; 18. Buffer block; 181. Mounting frame;

[0028] 2. First carrier plate; 21. First linear guide rail;

[0029] 3. Second carrier disk; 31. X-axis mover; 32. Y-axis mover. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0031] Example 1

[0032] Please see Figure 1-3 This utility model provides a technical solution: a swing-type feeding device for semiconductor chip testing, comprising:

[0033] The adsorption module 1 includes a bracket 11, a drive motor 12, a swing arm 13, a guide plate 14, a first slide rail 15, a second slide rail 16, and an adsorption frame 17. The drive motor 12 is fixedly mounted on the bracket 11, the swing arm 13 is fixedly mounted on the output shaft of the drive motor 12, the guide plate 14 is provided with an arc-shaped guide hole 141, the first slide rail 15 is fixedly mounted on the bracket 11, the first slide rail 15 is provided with a first slider 151, the first slider 151 is provided with a second slider 152, the second slide rail 16 is slidably connected to the second slider 152, the end of the second slide rail 16 is pivotally connected to the swing arm 13 through a connecting shaft 161, the back of the connecting shaft 161 extends into the arc-shaped guide hole 141, and the adsorption frame 17 is detachably mounted on the bottom of the second slide rail 16. The adsorption frame 17 is provided with a plurality of suction cups 171 arranged in an array.

[0034] The first carrier plate 2 is slidably connected to the first linear guide rail 21;

[0035] The second carrier 3 is fixedly mounted on the slide of the X-axis mover 31, which is fixedly mounted on the slide of the Y-axis mover 32. The second carrier 3 is located on one side of the first carrier 2.

[0036] The first slide rail 15 has symmetrically arranged buffer blocks 18 on both sides. The buffer blocks 18 are elastically connected to the mounting bracket 181. The position of the buffer blocks 18 corresponds to the second slider 152. The buffer blocks 18 help limit the stroke of the second slide rail 16.

[0037] Working principle: When the swing-type feeding device is working, the adsorption frame 17 of the adsorption module 1 adsorbs the semiconductor chip on the first carrier plate 2 through the suction cup 171 and transfers it to the second carrier plate 3. The second carrier plate 3 moves in the XY direction through the X-axis mover 31 and the Y-axis mover 32 to facilitate subsequent testing. The adsorption module 1 is small in size, and when the adsorption module 1 adsorbs and picks up and puts up the semiconductor chip, the drive motor 12 drives the swing arm 13 to swing back and forth, so that the second slide rail 16 moves along the first slide rail 15 in the X-axis direction and moves up and down in the Z-axis direction at the same time. The transfer speed of the semiconductor chip is fast and stable, effectively solving the problems of stuttering and poor adsorption effect of the existing movement trajectory of the chip feeding robot.

[0038] During the swing of the swing arm 13, the back of the connecting shaft 161, which is pivotally connected to the second slide rail 16 and the swing arm 13, extends into the arc-shaped guide hole 141. The arc-shaped guide hole 141 is used to limit the swing stroke of the swing arm 13, thereby improving the accuracy of the position when the semiconductor chip is adsorbed and placed.

[0039] Example 2

[0040] Based on the above embodiments, this embodiment further improves upon the following technical solution: photoelectric sensors 111 are symmetrically arranged on both sides of the bracket 11, and the positions of the photoelectric sensors 111 correspond to the ends of the arc-shaped guide holes 141.

[0041] The photoelectric sensor 111 is used to detect the second slide rail 16 moving into position in the horizontal direction, and after the second slide rail 16 moves into position, the suction cup 171 starts to adsorb or release adsorption, so as to realize the precise picking and placing of semiconductor chips.

[0042] Example 3

[0043] This embodiment further improves upon the above embodiment by providing the following technical solution: The top of the adsorption rack 17 is provided with a mounting groove 172, and the bottom of the second slide rail 16 is inserted into the mounting groove 172. The bottom of the second slide rail 16 is inserted into the mounting groove 172 and fixed with bolts, enabling the adsorption rack 17 to be detachably installed. Furthermore, one side of the mounting groove 172 extends to the surface of the adsorption rack 17 to form an opening, facilitating the assembly of the adsorption rack 17 and the second slide rail 16.

[0044] Example 4

[0045] Based on the above embodiments, this embodiment further improves upon the following technical solutions: a rib 173 is provided on one opposite side wall of the mounting groove 172, and a groove 162 with a matching shape to the rib 173 is provided at the bottom of the second slide rail 16, thereby improving the connection strength between the adsorption rack 17 and the second slide rail 16, preventing loosening of the installation, and thus ensuring the accuracy of the position when adsorbing and placing the semiconductor chip.

[0046] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A swing-type feeding device for semiconductor chip testing, characterized in that, include: An adsorption module includes a bracket, a drive motor, a swing arm, a guide plate, a first slide rail, a second slide rail, and an adsorption frame. The drive motor is fixedly mounted on the bracket, and the swing arm is fixedly mounted on the output shaft of the drive motor. The guide plate is provided with an arc-shaped guide hole. The first slide rail is fixedly mounted on the bracket, and a first slider is provided on the first slide rail. A second slider is provided on the first slider. The second slide rail is slidably connected to the second slider. The end of the second slide rail is pivotally connected to the swing arm through a connecting shaft. The back of the connecting shaft extends into the arc-shaped guide hole. The adsorption frame is detachably mounted on the bottom of the second slide rail, and the adsorption frame is provided with a plurality of suction cups arranged in an array. The first carrier disk is slidably connected to the first linear guide rail; The second carrier is fixedly mounted on the slide of the X-axis mover, which is fixedly mounted on the slide of the Y-axis mover, and the second carrier is disposed on one side of the first carrier.

2. The swing-up loading device for testing semiconductor chips according to claim 1, wherein The bracket is provided with symmetrically arranged photoelectric sensors on both sides, and the positions of the photoelectric sensors correspond to the ends of the arc-shaped guide holes.

3. The swing-up loading device for testing semiconductor chips according to claim 1, wherein The first slide rail is provided with symmetrically arranged buffer blocks on both sides. The buffer blocks are elastically connected to the mounting bracket and the positions of the buffer blocks correspond to the second slider.

4. The swing-up loading device for testing semiconductor chips according to claim 1, wherein The top of the adsorption rack is provided with an installation groove, and the bottom of the second slide rail is inserted into the installation groove.

5. The swing-up loading device for testing semiconductor chips according to claim 4, wherein The mounting groove extends to the surface of the adsorption rack on one side to form an opening.

6. The swing-up loading device for testing semiconductor chips according to claim 5, wherein A raised rib is provided on one of the opposite side walls of the mounting groove, and a groove with a shape matching the raised rib is provided at the bottom of the second slide rail.

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