Tail gas treatment device and semiconductor processing equipment

Abstract

The utility model discloses a tail gas treatment device and semiconductor processing equipment, and the tail gas treatment device comprises a reaction cavity, the top of which is provided with a first through hole; a second through hole is formed in the bottom of the tail gas collecting pipeline, a third through hole is formed in the top of the tail gas collecting pipeline, the bottom of the tail gas collecting pipeline is detachably connected with the top of the reaction cavity, and the second through hole communicates with the first through hole; the cleaning scraping ring is positioned in the tail gas collecting pipeline; the first end of the telescopic air cylinder is fixedly connected with the cleaning scraping ring, and the telescopic air cylinder penetrates through the third through hole. The cleaning scraping ring is arranged in the tail gas collecting pipeline in the tail gas treatment device and fixedly connected with the telescopic air cylinder, that is, when the telescopic air cylinder moves, the cleaning scraping ring can be driven to move up and down in the tail gas collecting pipeline, then cleaning of the inner wall of the tail gas collecting pipeline is achieved, and the tail gas introduction amount in the tail gas collecting pipeline is increased; and the working efficiency of the tail gas treatment device is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to an exhaust gas treatment device and semiconductor processing equipment. Background Technology

[0002] The gases emitted by semiconductor processing equipment are generally exhaust gases. Exhaust gases refer to toxic and harmful gases emitted during human production and daily life, particularly from chemical plants, steel mills, pharmaceutical factories, coking plants, oil refineries, and other industrial facilities, as well as from domestic waste. These exhaust gases have strong odors, severely pollute the environment, and negatively impact human health. They contain a wide variety of pollutants with complex physical and chemical properties and varying degrees of toxicity. Fuel combustion exhaust gases contain sulfur dioxide, nitrogen oxides, and hydrocarbons, among others. Different raw materials and processes in industrial production result in the emission of various harmful gases and solid wastes, containing components such as heavy metals, salts, and radioactive substances. Therefore, the exhaust gases from semiconductor processing equipment must be treated by exhaust gas treatment devices before being released.

[0003] However, the efficiency of current exhaust gas treatment devices still needs to be improved. Utility Model Content

[0004] The technical problem solved by this invention is how to improve the working efficiency of exhaust gas treatment devices.

[0005] To solve the above-mentioned technical problems, this utility model provides an exhaust gas treatment device, comprising: a reaction chamber having a first through hole at its top; an exhaust gas collection pipe having a second through hole at its bottom and a third through hole at its top, the bottom of the exhaust gas collection pipe being detachably connected to the top of the reaction chamber, and the second through hole communicating with the first through hole; a cleaning scraper ring located inside the exhaust gas collection pipe; and a telescopic cylinder having a first end fixedly connected to the cleaning scraper ring, the telescopic cylinder passing through the third through hole.

[0006] Optionally, the cleaning scraper ring is serrated.

[0007] Optionally, the exhaust gas treatment device further includes a rotary motor connected to the telescopic cylinder, the rotary motor being adapted to drive the telescopic cylinder to rotate.

[0008] Optionally, the telescopic cylinder includes: a cylinder barrel having a gas passage, a first end of the cylinder barrel having a pressurization port, a second end of the cylinder barrel having a telescopic port, and the gas passage communicating with the pressurization port; and a piston rod, the cylinder barrel being sleeved on the piston rod, the piston rod being adapted to telescopically move in a direction perpendicular to the cylinder barrel under the gas pressure of the gas passage when the telescopic cylinder is pressurized through the pressurization port.

[0009] Optionally, the cleaning scraper ring also has a sensor for monitoring the thickness of the deposits on the inner wall of the exhaust gas collection pipe.

[0010] Optionally, it may also include: a control unit, which is adapted to acquire monitoring data from the sensor and control the rotary motor to rotate and to apply pressure to the pressure port based on the monitoring data.

[0011] Optionally, it also includes: a connecting rod, the first end of which is fixedly connected to the cleaning scraper ring, and the second end of which is fixedly connected to the telescopic cylinder.

[0012] Optionally, it also includes a heating element, which is disposed on the outer wall surface of the exhaust gas collection pipe.

[0013] Optionally, the heating temperature range of the heating element is 150°C to 200°C.

[0014] Optionally, the exhaust gas collection pipe also has an exhaust gas inlet, which is located on the side wall surface of the exhaust gas collection pipe; and an exhaust gas intake pipe, which is connected to the exhaust gas inlet.

[0015] Optionally, the top surface of the reaction chamber has a gas outlet adapted to discharge the gas after the reaction.

[0016] Optionally, the reaction chamber further includes a sedimentation tank adapted to contain precipitates after the reaction, and the sidewall of the sedimentation tank has an opening for discharging the precipitates from the sedimentation tank.

[0017] Optionally, the cleaning scraper ring is made of stainless steel.

[0018] Accordingly, this utility model also provides a semiconductor processing equipment, including the exhaust gas treatment device described above.

[0019] Compared with the prior art, the technical solution of this utility model embodiment has the following beneficial effects:

[0020] In this utility model, a cleaning scraper ring is installed in the exhaust gas collection pipe within the exhaust gas treatment device, and the cleaning scraper ring is fixedly connected to the telescopic cylinder. When the telescopic cylinder moves, it drives the cleaning scraper ring to move up and down within the exhaust gas collection pipe, thereby cleaning the inner wall of the exhaust gas collection pipe, preventing it from being covered by deposits, increasing the exhaust gas flow rate within the pipe, and improving the working efficiency and safety of the exhaust gas treatment device. Furthermore, since the cleaning scraper ring is located inside the exhaust gas collection pipe, the pipe does not need to be disassembled when cleaning its inner wall, further improving the working efficiency of the exhaust gas treatment device.

[0021] Furthermore, the cleaning scraper ring in this invention is serrated with sharp angles, which can effectively clean hard deposits, ensuring the cleanliness of the inner wall of the exhaust gas collection pipe, thereby improving the working efficiency of the exhaust gas treatment device.

[0022] Furthermore, the rotary motor in this invention can drive the telescopic cylinder to rotate, thereby causing the cleaning scraper ring to rotate and clean inside the exhaust gas collection pipe, effectively grinding hard deposits, preventing damage to the cylinder from stress, ensuring the integrity of the device, and improving the working efficiency of the exhaust gas treatment device.

[0023] Furthermore, in this invention, a heating element is provided on the outer wall surface of the exhaust gas collection pipe. The heating element can heat the gas inside the exhaust gas collection pipe, which can reduce the rapid condensation of exhaust gas due to cooling and its adhesion to the inner wall of the pipe, thus reducing blockage. This improves the working efficiency and safety of the exhaust gas treatment device. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of a tail gas treatment device;

[0025] Figure 2 This is a schematic diagram of the structure of a tail gas treatment device in an embodiment of this utility model;

[0026] Figure 3 This is a schematic diagram of another exhaust gas treatment device in an embodiment of this utility model;

[0027] Figure 4 This is a schematic diagram of the structure of a telescopic cylinder in an exhaust gas treatment device according to an embodiment of this utility model;

[0028] Figure 5 This is a schematic diagram of the cleaning scraper ring in an exhaust gas treatment device according to an embodiment of this utility model;

[0029] Figure 6 This is a schematic diagram of the structure of another exhaust gas treatment device in the implementation of this utility model. Detailed Implementation

[0030] It should be noted that the terms "surface" and "on" in this specification are used to describe the relative spatial position and are not limited to whether there is direct contact.

[0031] For the structure of current exhaust gas treatment devices, please refer to [reference needed]. Figure 1 The exhaust gas treatment device includes: a reaction chamber 100, the top of which has a first through hole 1001; and an exhaust gas collection pipe 101, the bottom of which has a second through hole 1011 and the top of which has a third through hole. The top of the exhaust gas collection pipe 101 is detachably connected to the top of the reaction chamber 100, and the second through hole 1011 communicates with the first through hole 1001.

[0032] In this embodiment, the exhaust gas collection pipe 101 also has an exhaust gas inlet 102, which is located on the side wall surface of the exhaust gas collection pipe 101; and an exhaust gas intake pipe, which is connected to the exhaust gas inlet 102.

[0033] In the above scheme, the semiconductor furnace tube process requires a large amount of process gas to grow a film on the wafer surface, which will generate a large amount of waste gas and byproducts. A tail gas treatment device is needed to treat the waste gas and byproducts. The working principle of the tail gas treatment device is to collect the tail gas through the tail gas collection pipe 101, decompose it at high temperature, and then absorb it with water for secondary treatment. However, during the treatment process, there are deposits 103 on the inner wall of the tail gas collection pipe 101, which cause the equipment pipeline to be blocked, resulting in equipment downtime, untimely tail gas treatment, and low efficiency.

[0034] To address the aforementioned technical problems, this utility model provides an exhaust gas treatment device. By installing a cleaning scraper ring within the exhaust gas collection pipe of the device, and fixing the cleaning scraper ring to the telescopic cylinder, the device can achieve cleaning of the inner wall of the exhaust gas collection pipe by moving the telescopic cylinder up and down within the pipe when the cylinder moves. This prevents the pipe from being covered by deposits, increases the exhaust gas flow rate, and improves the efficiency and safety of the device. Furthermore, since the cleaning scraper ring is located inside the exhaust gas collection pipe, the pipe does not need to be disassembled for cleaning, further enhancing the device's efficiency.

[0035] To make the above-mentioned objectives, features and beneficial effects of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0036] Please refer to Figure 2 The exhaust gas treatment device includes: a reaction chamber 200, the top of which has a first through hole 2001; an exhaust gas collection pipe 201, the bottom of which has a second through hole 2011, and the top of which has a third through hole (not shown in the figure), the bottom of which is detachably connected to the top of which is the reaction chamber 200, and the second through hole 2011 communicates with the first through hole 2001; a cleaning scraper ring 204, which is located inside the exhaust gas collection pipe 201; and a telescopic cylinder 205, the first end of which is fixedly connected to the cleaning scraper ring 204, and the telescopic cylinder 205 passes through the third through hole.

[0037] In some embodiments of this utility model, the exhaust gas in the exhaust gas collection pipe 201 includes one or more combinations of HF, HCl and SO2.

[0038] In some embodiments of this utility model, the reaction chamber 200 is used to decompose the exhaust gas into harmless substances through high-temperature oxidation (800°C to 1200°C). Specifically, the exhaust gas is directly burned at a high temperature of 800°C to 1200°C, which usually requires auxiliary fuel (such as natural gas or hydrogen) to maintain the high temperature.

[0039] In some embodiments of this utility model, the bottom of the exhaust gas collection pipe 201 is connected to the top of the reaction chamber 200 by bolts.

[0040] In some embodiments of this utility model, the cleaning scraper ring 204 is made of stainless steel.

[0041] In some embodiments of this utility model, the cleaning scraper ring 204 is cylindrical in shape.

[0042] In some embodiments of this utility model, the diameter of the cleaning scraper ring 204 is equal to the diameter of the exhaust gas collection pipe 201.

[0043] In a specific embodiment of this utility model, the diameter of the cleaning scraper ring 204 ranges from 4 cm to 6 cm.

[0044] Please Figure 2 Based on reference Figure 3 Under the control of the telescopic cylinder 205, the cleaning scraper ring 204 can move up and down along the inner wall of the exhaust gas collection pipe 201. During the movement, the cleaning scraper ring 204 can clean the deposits 203 on the inner wall of the exhaust gas collection pipe 201 to keep the inner wall of the exhaust gas collection pipe 201 clean and avoid the accumulation of deposits that could cause pipe blockage.

[0045] Please refer to Figure 4 The telescopic cylinder 205 includes: a cylinder 2051, which has a gas passage 2054, a first end of which has a pressurization port 2053, and a second end of which has a telescopic port, and the gas passage 2054 is connected to the pressurization port 2053; and a piston rod 2052, which is sleeved on the cylinder 2051. The piston rod 2052 is adapted to telescopically move in a direction perpendicular to the cylinder 2051 when the telescopic cylinder 205 is pressurized through the pressurization port 2053 and is subjected to the gas pressure of the gas passage 2054.

[0046] Specifically, the telescopic cylinder 205, through the expansion or pressure change of compressed air, pushes the piston rod 2052 to perform linear reciprocating motion or oscillating motion within the sealed cylinder 2051. When the pressurization port 2053 is pressurized, allowing compressed air to enter the gas passage 2054, the pressure difference acts on the piston rod 2052 to generate thrust, outputting mechanical work.

[0047] In the above solution, by installing a cleaning scraper ring 204 in the exhaust gas collection pipe 201 within the exhaust gas treatment device, and fixing the cleaning scraper ring 204 to the telescopic cylinder 205, the cleaning scraper ring 204 can move up and down within the exhaust gas collection pipe 201 when the telescopic cylinder 205 moves. This cleans the inner wall of the exhaust gas collection pipe 201, preventing it from being covered by deposits 203, increasing the exhaust gas flow rate within the exhaust gas collection pipe 201, and improving the working efficiency and safety of the exhaust gas treatment device. Furthermore, since the cleaning scraper ring 204 is located within the exhaust gas collection pipe 201, it is not necessary to disassemble the exhaust gas collection pipe 201 when cleaning its inner wall, further improving the working efficiency of the exhaust gas treatment device.

[0048] Please refer to Figure 5 The cleaning scraper ring 304 is serrated.

[0049] In some embodiments of this utility model, the deposits 203 on the inner wall of the exhaust gas collection pipe 201 have high hardness and sharp angles, so that the cleaning scraper ring 304 can effectively clean the hard deposits 203 during the up-and-down movement inside the exhaust gas collection pipe 201, ensuring the cleanliness of the inner wall of the exhaust gas collection pipe 201, thereby improving the working efficiency of the exhaust gas treatment device.

[0050] Please refer to Figure 6The exhaust gas treatment device further includes a rotary motor 206, which is connected to the telescopic cylinder 205 and is adapted to drive the telescopic cylinder 205 to rotate.

[0051] In this embodiment, the rotary motor 206 can drive the telescopic cylinder 205 to rotate, thereby driving the cleaning scraper ring 204 to rotate and clean inside the exhaust gas collection pipe 201, effectively grinding the hard deposits 203, preventing damage to the cylinder, ensuring the integrity of the device and improving the working efficiency of the exhaust gas treatment device.

[0052] In the above scheme, under the simultaneous control of the rotary motor 206 and the telescopic cylinder 205, the cleaning scraper ring 204 can achieve up-and-down cleaning and rotational cleaning, further effectively grinding the hard deposits 203, preventing damage to the cylinder under force, ensuring the integrity of the device and improving the working efficiency of the exhaust gas treatment device.

[0053] In some embodiments of this utility model, the cleaning scraper ring 204 is further provided with a sensor 209, which is used to monitor the thickness of the deposits 203 on the inner wall of the exhaust gas collection pipe 201; the exhaust gas treatment device further includes a control unit 207, which is adapted to acquire the monitoring data of the sensor 209, and control the rotary motor 206 to rotate and pressurize the pressurization port 2053 according to the monitoring data.

[0054] In a specific embodiment, the sensor 209 on the cleaning scraper ring 204 monitors the thickness of the deposits 203 on the inner wall of the exhaust gas collection pipe 201 in real time, and sends a warning signal to the control unit 207 when the thickness of the deposits 203 reaches a preset value. The control unit 207 cleans the deposits 203 on the inner wall of the exhaust gas collection pipe 201 according to the warning signal, thereby realizing the periodic cleaning of the exhaust gas collection pipe 201 and improving the cleaning efficiency.

[0055] In some embodiments of this utility model, the exhaust gas treatment device further includes: a connecting rod 208, the first end of which is fixedly connected to the cleaning scraper ring 204, and the second end of which is fixedly connected to the telescopic cylinder 205.

[0056] Specifically, a connecting rod 208 is provided between the telescopic cylinder 205 and the cleaning scraper ring 204 to ensure a tight connection between the cleaning scraper ring 204 and the telescopic cylinder 205, preventing the cleaning scraper ring 204 from falling off the telescopic cylinder 205 during the movement of the cleaning scraper ring 204, ensuring the integrity of the device and improving the working efficiency of the exhaust gas treatment device.

[0057] In some embodiments of the present invention, the exhaust gas treatment device further includes a heating part 210, which is disposed on the outer wall surface of the exhaust gas collection pipe 201.

[0058] In some embodiments, the heating method of the heating unit 210 is hot fluid circulation heating. Specifically, several hot flow channels are provided on the outer wall surface of the exhaust gas collection pipe 201, and heat transfer oil is introduced into the hot flow channels. The high-temperature heat transfer oil flows in a closed circulation system and heats the exhaust gas collection pipe 201 through a heat exchanger.

[0059] In other embodiments, the heating method of the heating part 210 is electric heating. Specifically, an electric heating cable is provided on the outer wall surface of the exhaust gas collection pipe 201, which heats the pipe uniformly by resistive heating or self-regulating heating (PTC material) in close contact with the outer wall of the pipe.

[0060] In other embodiments, the heating element 210 is heated by electromagnetic induction heating, specifically by using a high-frequency electromagnetic field to heat the metal of the pipe itself (eddy current effect).

[0061] In some embodiments of this utility model, the heating temperature range of the heating part 210 is 150°C to 200°C.

[0062] In the above scheme, by setting a heating part 210 on the outer wall surface of the exhaust gas collection pipe 201, the heating part 210 can heat the gas in the exhaust gas collection pipe 201, which can reduce the rapid condensation of exhaust gas due to cooling and its adhesion to the inner wall of the pipe, thus reducing blockage. This improves the working efficiency and safety of the exhaust gas treatment device.

[0063] In some embodiments of this utility model, the exhaust gas collection pipe 201 also has an exhaust gas inlet 202, which is located on the side wall surface of the exhaust gas collection pipe 201; and an exhaust gas inlet pipe 2021, which is connected to the exhaust gas inlet 202.

[0064] In some embodiments of this utility model, the top surface of the reaction chamber 200 has an outlet 211, which is adapted to discharge the gas after the reaction.

[0065] In a specific embodiment, the gas discharged from the outlet 211 meets the emission standards.

[0066] In other embodiments of this invention, the air outlet is further provided with a filter (not shown in the figure) to filter ultrafine particles (particles with a diameter of less than 0.3µm).

[0067] In some embodiments of the present invention, the reaction chamber 200 further includes a sedimentation tank 212, which is adapted to contain the precipitate 213 after the reaction. The side wall of the sedimentation tank 212 also has an opening 214 for discharging the precipitate 213 in the sedimentation tank 212.

[0068] In a specific embodiment, the sedimentation tank 212 contains water or alkaline solution (NaOH) to capture dust in the reaction chamber 200 and neutralize acidic gases.

[0069] In the above scheme, by setting up exhaust gas treatment equipment after combustion in the reaction chamber 200, the exhaust gas after combustion is ensured to meet emission standards and secondary pollution is avoided. Furthermore, by setting up different treatment equipment, multiple technologies can be combined to treat exhaust gases with different components (such as particulate matter, acid gases, NOx, CO, etc.), further ensuring that the exhaust gas after combustion meets emission standards and avoiding secondary pollution.

[0070] Accordingly, this utility model also provides a semiconductor processing equipment, including the exhaust gas treatment device described above.

[0071] The semiconductor processing equipment is equipment that generates exhaust gas (waste gas) during the semiconductor manufacturing process.

[0072] In some embodiments of this utility model, the semiconductor processing equipment is a dry etching equipment. Specifically, the exhaust gas is a volatile byproduct generated by the chemical reaction between the reactive gas and the silicon wafer material during the plasma etching process. The exhaust gas composition includes one or more combinations of fluorine / chlorine compounds (such as CF4, SF6, Cl2, BCl3) and acidic gases (HF, HCl).

[0073] In some other embodiments of this utility model, the semiconductor processing equipment is a chemical vapor deposition equipment. Specifically, the exhaust gas is the gas and byproducts that have not fully reacted during the CVD deposition process. The components of the exhaust gas include one or more combinations of unreacted silicon source gases (such as SiH4, TEOS), greenhouse gases (NF3, CF4), and particulate matter (nanoscale dust).

[0074] In some other embodiments of this utility model, the semiconductor processing equipment is an ion implanter, and specifically, the exhaust gas composition includes one or more combinations of dopant gases (such as BF3, AsH3, PH3), fluorides, and hydrides.

[0075] In a specific embodiment of this utility model, the dry etching equipment, the chemical vapor deposition equipment, and the ion implanter are provided with exhaust gas outlets. The exhaust gas outlets are connected to the exhaust gas inlet pipes on the exhaust gas treatment device to allow the exhaust gas to be introduced into the exhaust gas collection pipes and the reaction chamber.

[0076] In summary, by installing a cleaning scraper ring in the exhaust gas collection pipe within the exhaust gas treatment device, and fixing the cleaning scraper ring to the telescopic cylinder, the cleaning scraper ring can move up and down within the exhaust gas collection pipe when the telescopic cylinder moves. This achieves cleaning of the inner wall of the exhaust gas collection pipe, preventing it from being covered by deposits, increasing the exhaust gas flow rate within the pipe, and improving the working efficiency and safety of the exhaust gas treatment device. Furthermore, since the cleaning scraper ring is located inside the exhaust gas collection pipe, the pipe does not need to be disassembled when cleaning its inner wall, further improving the working efficiency of the exhaust gas treatment device.

[0077] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. An exhaust gas treatment device, characterized by, include: A reaction chamber, the top of which has a first through hole; The exhaust gas collection pipe has a second through hole at the bottom and a third through hole at the top. The bottom of the exhaust gas collection pipe is detachably connected to the top of the reaction chamber, and the second through hole communicates with the first through hole. A cleaning scraper ring is located inside the exhaust gas collection pipe; A telescopic cylinder, the first end of which is fixedly connected to the cleaning scraper ring, and the telescopic cylinder passes through the third through hole.

2. The exhaust treatment device of claim 1, wherein, The cleaning scraper ring is serrated.

3. The exhaust treatment device of claim 1, wherein, Also includes: A rotary motor is connected to the telescopic cylinder, and the rotary motor is adapted to drive the telescopic cylinder to rotate.

4. The exhaust treatment device of claim 3, wherein, The telescopic cylinder includes: A cylinder barrel, wherein the cylinder barrel has a gas passage, a first end of the cylinder barrel has a pressurization port, a second end of the cylinder barrel has a telescopic port, and the gas passage is connected to the pressurization port; A piston rod is fitted with a cylinder. The piston rod is adapted to extend and retract in a direction perpendicular to the cylinder when the telescopic cylinder is pressurized through the pressurization port, under the gas pressure of the gas passage.

5. The exhaust treatment device of claim 4, wherein, The cleaning scraper ring is also equipped with a sensor, which is used to monitor the thickness of the deposits on the inner wall of the exhaust gas collection pipe.

6. The exhaust treatment device of claim 5, wherein, Also includes: The control unit is adapted to acquire the monitoring data of the sensor and control the rotary motor to rotate and apply pressure to the pressure port based on the monitoring data.

7. The exhaust treatment device of claim 1, wherein, Also includes: A connecting rod, the first end of which is fixedly connected to the cleaning scraper ring, and the second end of which is fixedly connected to the telescopic cylinder.

8. The exhaust treatment device of claim 1, wherein, Also includes: A heating element is provided on the outer wall surface of the exhaust gas collection pipe.

9. The exhaust treatment device of claim 8, wherein, The heating temperature range of the heating element is 150°C to 200°C.

10. The exhaust treatment device of claim 1, wherein, The exhaust gas collection pipe also has an exhaust gas inlet, which is located on the side wall surface of the exhaust gas collection pipe. An exhaust gas intake pipe is connected to the exhaust gas inlet.

11. The exhaust treatment device of claim 1, wherein, The top surface of the reaction chamber has an outlet for discharging the gas produced after the reaction.

12. The exhaust treatment device of claim 1, wherein, The reaction chamber also includes a sedimentation tank, which is adapted to contain the precipitate after the reaction. The side wall of the sedimentation tank also has an opening for discharging the precipitate from the sedimentation tank.

13. The exhaust treatment device of claim 1, wherein, The cleaning scraper ring is made of stainless steel.

14. A semiconductor processing apparatus, characterized by comprising: Includes the exhaust gas treatment device as described in any one of claims 1 to 13.

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