Thermal management integrated equipment

Abstract

The heat management integrated equipment comprises a heat exchange assembly, a first valve assembly, a pump assembly and a runner plate assembly, the heat exchange assembly, the first valve assembly and the pump assembly all communicate with the runner plate assembly, and the heat exchange assembly, the first valve assembly and the pump assembly are installed on the same side of the runner plate assembly in the thickness direction of the runner plate assembly; in the length direction of the runner plate assembly, the pump assembly is located on the first side of the first valve assembly, the heat exchange assembly is located on the second side of the first valve assembly, and the first side and the second side are the two opposite sides of the first valve assembly. In the application, the pump assembly is located on the first side of the first valve assembly, the heat exchange assembly is located on the second side of the first valve assembly, and the first side and the second side are two opposite sides of the first valve assembly, so that runners, leading to the first valve assembly and the pump assembly, in the runner plate assembly are arranged on the side surfaces except the second side as required, and fluid heat exchange in different runners is reduced; the heat exchange efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of thermal management technology, and more particularly to an integrated thermal management device. Background Technology

[0002] In related technologies, integrated thermal management equipment includes heat exchange components, valve components, pump components, agent-side flow channel plates, and water-side flow channel plates. The heat exchange components are installed on the agent-side flow channel plates, while the valve and pump components are installed on the water-side flow channel plates. Since the heat exchange components surround the valve and pump components, the flow channels in the water-side flow channel plates leading to the valve and pump components must pass through the agent-side flow channel plates. This can easily cause heat exchange between the fluid in the water-side flow channel plates and the fluid in the agent-side flow channel plates, affecting the heat exchange efficiency. Utility Model Content

[0003] The purpose of this application is to provide an integrated thermal management device that improves heat exchange efficiency.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] A thermal management integrated device is provided, comprising: a heat exchange component, a first valve component, a pump component, and a flow channel plate component. The heat exchange component, the first valve component, and the pump component are all connected to the flow channel plate component. The heat exchange component, the first valve component, and the pump component are installed on the same side of the flow channel plate component along the thickness direction of the flow channel plate component. Along the length direction of the flow channel plate component, the pump component is located on a first side of the first valve component, and the heat exchange component is located on a second side of the first valve component. The first side and the second side are opposite sides of the first valve component.

[0006] In this application, the pump assembly is located on the first side of the first valve assembly, and the heat exchange assembly is located on the second side of the first valve assembly. The first side and the second side are opposite sides of the first valve assembly, so that the flow channels in the flow channel plate assembly leading to the first valve assembly and the pump assembly can be set on the side other than the second side as needed, reducing fluid heat exchange in different flow channels and improving heat exchange efficiency. Attached Figure Description

[0007] Figure 1 A schematic diagram of the structure of an embodiment of the thermal management integrated device of this application;

[0008] Figure 2 yes Figure 1 The diagram shown is a structural schematic of an embodiment of the integrated thermal management device.

[0009] Figure 3 yes Figure 1 A schematic diagram of the structure of an embodiment of the second flow channel plate of the thermal management integrated device is shown.

[0010] Figure 4 This is a schematic diagram of another embodiment of the thermal management integrated device of this application;

[0011] Figure 5 yes Figure 4 The diagram shown is a structural schematic of an embodiment of the integrated thermal management device.

[0012] Figure 6 This is a schematic diagram of the structure of another embodiment of the thermal management integrated device of this application;

[0013] Figure 7 yes Figure 1 A schematic diagram of the structure of an embodiment of the thermal management system of the integrated thermal management device is shown.

[0014] Figure 8 yes Figure 4 or Figure 6 The diagram shows a structural schematic of an embodiment of the thermal management system of the integrated thermal management device. Detailed Implementation

[0015] The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0016] It should be understood that the terms "first," "second," and similar terms used in this application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one; "multiple" indicates two or more. Unless otherwise stated, terms such as "front," "rear," "lower," and / or "upper" are for illustrative purposes only and are not limited to a location or spatial orientation. Terms such as "comprising" or "including" indicate that the elements or objects preceding "comprising" encompass the elements or objects listed following "comprising" or "including" and their equivalents, but do not exclude other elements or objects.

[0017] like Figure 1 As shown, this embodiment proposes a thermal management integrated device, which includes a heat exchange component 21, a first valve component 23, a pump component 24, and a flow channel plate component 1. The heat exchange component 21, the first valve component 23, and the pump component 24 are all connected to the flow channel plate component 1. The heat exchange component 21, the first valve component 23, and the pump component 24 are installed on the same side of the flow channel plate component 1 along the thickness direction. Along the length direction of the flow channel plate component 1, the pump component 24 is located on the first side of the first valve component 23, and the heat exchange component 21 is located on the second side of the first valve component 23. The first side and the second side are opposite sides of the first valve component 23.

[0018] In this application, the pump assembly 24 is located on the first side of the first valve assembly 23, and the heat exchange assembly 21 is located on the second side of the first valve assembly 23. The first side and the second side are opposite sides of the first valve assembly 23, so that the flow channels in the flow channel plate assembly 1 leading to the first valve assembly 23 and the pump assembly 24 can be set on the side other than the second side as needed, reducing the heat exchange of fluid in different flow channels and improving the heat exchange efficiency.

[0019] The heat exchange assembly 21, the first valve assembly 23, and the pump assembly 24 are all connected through the flow channel plate assembly 1, thereby reducing connecting pipes and optimizing the pipe connection method. By switching the conduction state of the first valve assembly 23, different modes are achieved to meet thermal management requirements. At the same time, the space occupied by the entire thermal management system is optimized, assembly steps are reduced, assembly cycle is shortened, which is conducive to the rapid assembly of the whole machine, saving costs, reducing processing difficulty, and improving strength. This reduces pipe connections, makes the size compact, saves space, and reduces the risk of leakage.

[0020] The heat exchange assembly 21, the first valve assembly 23, and the pump assembly 24 are mounted on the same side of the flow channel plate assembly 1 along its thickness direction, forming a compact three-dimensional structure. This structure achieves efficient utilization of three-dimensional space while maintaining conventional planar dimensions, making it particularly suitable for installation in confined spaces. The heat exchange assembly 21, the first valve assembly 23, and the pump assembly 24 are concentrated on a single mounting plane. Combined with the integrated interface design of the flow channel plate assembly 1, this allows for quick disassembly and replacement of individual components without affecting the overall system's sealing performance. A thermal gradient isolation layer is formed inside the flow channel plate assembly 1, which, along with the physical spacing between the components, effectively prevents the mutual conduction of mechanical heat from the first valve assembly 23 and the pump assembly 24 with the working heat from the heat exchange assembly 21.

[0021] In some embodiments, the thermal management integrated device further includes a filter assembly 26 and a storage device 25. Both the filter assembly 26 and the storage device 25 are connected to the flow channel plate assembly 1 and are mounted on the same side of the flow channel plate assembly 1 along its thickness direction. Along the length direction of the flow channel plate assembly 1, the filter assembly 26 is located on a first side of the first valve assembly 23, and the storage device 25 is located on a second side of the first valve assembly 23. The axial arrangement of the flow channel plate assembly 1 creates a natural pressure gradient, utilizing the volume effect of the storage device 25 to autonomously balance filtration pressure drop fluctuations. The filter assembly 26 forms a particulate trapping barrier, blocking the path of impurities migrating to the storage device 25 through spatial isolation design.

[0022] In some embodiments, the filter assembly 26 includes a first filter 261 and a second filter 262, and the pump assembly 24 includes a first pump 241 and a second pump 242. The first filter 261 and the second filter 262 are arranged along the length of the flow channel plate assembly 1, and the first pump 241 and the second pump 242 are arranged along the width of the flow channel plate assembly 1. At least a portion of the first filter 261 and at least a portion of the second filter 262 are located between the first pump 241 and the second pump 242. The filter assembly 26 and the pump assembly 24 adopt an orthogonal axial arrangement strategy to form an interwoven grid structure, establishing a bidirectional compact device matrix in the plane, significantly improving the functional integration density per unit area. The filter assembly 26 is embedded in the working area of ​​the pump assembly 24 to construct an axisymmetric fluid distribution network, allowing the medium to naturally form a counter-current energy dissipation field at the pump pressure output end, effectively suppressing pressure pulsation peaks. The centrally located layout of the filter assembly 26 forms a bidirectional operating window, which, combined with the symmetrical distribution characteristics of the pump assembly 24 in the width direction, enables a convenient operation mode where the power module does not need to be removed during filter unit maintenance. The pump assembly 24 expands in width to form a heat source isolation zone, which, together with the physical barrier effect of the centrally located filter assembly 26, effectively separates the heat-affected areas of the two pumps and prevents the superposition effect of heat flow.

[0023] In some embodiments, the first valve assembly 23 includes a nine-way water valve 231 and a five-way water valve 232, which are arranged along the width direction of the flow channel plate assembly 1; or, the first valve assembly 23 includes a ten-way water valve and a five-way water valve 232, which are arranged along the width direction of the flow channel plate assembly 1; or, the first valve assembly 23 includes a twelve-way water valve and a five-way water valve 232, which are arranged along the width direction of the flow channel plate assembly 1; or, the first valve assembly 23 includes an eight-way water valve and a four-way water valve, which are arranged along the width direction of the flow channel plate assembly 1. The combination of different multi-way valves forms a topology-variable flow channel control hub, adapting to diverse operating conditions ranging from basic circulation to multi-branch linkage. The valve body forms an integrated flow channel trunk area along the width axis, so that each branch circuit maintains a parallel and independent topological structure, avoiding disorderly intersection of multi-level flow channels.

[0024] In some embodiments, the thermal management integrated device further includes a first heat exchanger 22, which is connected to the heat exchange component 21. The first heat exchanger 22 is installed on the same side of the flow channel plate assembly 1 along the thickness direction of the flow channel plate assembly 1, and is located on the second side of the first valve assembly 23. Along the width direction of the flow channel plate assembly 1, the heat exchange component 21 and the first heat exchanger 22 are located on one side of the storage device 25. The two heat exchange units and the storage device 25 are located on opposite sides of the width axis, forming a physical isolation buffer for the hot and cold media. The heat exchange units on the same side are continuously arranged to form a U-shaped composite flow channel, shortening the fluid conduction path while maintaining pressure drop balance. In some embodiments, the first heat exchanger 22 is a dehumidifying evaporator. The refrigerant-side flow channel plate is located on the left side of the first valve assembly 23, away from water pumps, filters, etc., which are unrelated to the refrigerant side, resulting in a compact size.

[0025] In some embodiments, such as Figure 5 As shown, the integrated thermal management device also includes a capillary tube 40, which is installed on the same side of the flow channel plate assembly 1 along its thickness direction. The first heat exchanger 22 is connected to the flow channel plate assembly 1, the flow channel plate assembly 1 is connected to the capillary tube 40, and the capillary tube 40 is connected to the heat exchange assembly 21. The capillary tube 40 acts as a buffer interface to effectively mitigate sudden flow shocks and improve the thermal inertia regulation capability of the integrated thermal management device.

[0026] In some embodiments, the flow channel plate assembly 1 includes a first flow channel plate 20 and a second flow channel plate 10, which are stacked together. A heat exchange assembly 21 is bolted to either the first or second flow channel plate 20, a first valve assembly 23 is bolted to the first flow channel plate 20, and a pump assembly 24 is bolted to the first flow channel plate 20. In some embodiments, the first flow channel plate 20 is a water-side flow channel plate, and the second flow channel plate 10 is a solvent-side flow channel plate. The stacked arrangement of the first and second flow channel plates 20 achieves vertical spatial isolation between the solvent-side and water-side flow channel plates, constructing a three-dimensional fluid transport network. The dual-channel layer forms a thermal expansion buffer zone through the interface, effectively absorbing the anisotropic deformation stress generated during the operation of the thermal management integrated equipment. The bolted connection system establishes a standard mechanical interface platform between the first and second flow channel plates 20 and 10, enabling plug-and-play integration of various functional components.

[0027] In some embodiments, such as Figure 4As shown, the integrated thermal management device also includes a heater 30, which is connected to the first flow channel plate 20. The heater 30 is installed on the same side of the flow channel plate assembly 1 along the thickness direction of the flow channel plate assembly 1 and is bolted to the first flow channel plate 20. The heat exchange assembly 21 and the heater 30 are arranged along the length direction of the flow channel plate assembly 1. The heater 30 can be an electric heater, such as a positive temperature coefficient thermistor (PTC). The external heater 30 and the built-in flow channel form an adjustable thermal bridge to achieve coordinated modulation of active heating and passive heat dissipation. The mounting surface of the heater 30 is offset from the mounting surface of the heat exchange assembly 21 in the height direction, and the thermal expansion is absorbed autonomously by the flexible deformation of the flow channel plate assembly 1.

[0028] In some embodiments, the thermal management integrated device further includes a second valve assembly 27, which is connected to the second flow channel plate 10. The second valve assembly 27 is installed on the same side of the flow channel plate assembly 1 along the thickness direction of the flow channel plate assembly 1 and is bolted to the second flow channel plate 10. The second valve assembly 27 is located on the second side of the first valve assembly 23. The first valve assembly 23 and the second valve assembly 27 form a three-dimensional control matrix along the thickness direction, realizing vertical spatial decoupling and coordinated control of the agent-side flow channel plate and the water-side flow channel plate. The second valve assembly 27, the second flow channel plate 10, and the first valve assembly 23 form a physical isolation unit, which can quickly cut off the energy interaction path between the upper and lower layers under abnormal operating conditions.

[0029] In some embodiments, such as Figure 6 As shown, the integrated thermal management device also includes a first heat exchanger 22, which is connected to the heat exchange component 21 via a pipeline; or, the flow channel plate assembly 1 includes a second flow channel plate 10, which connects the first heat exchanger 22 and the heat exchange component 21. The multimodal heat conduction architecture provides a dual-mode connection interface of either pipelines or flow channel plates, forming a flexible heat conduction topology network to adapt to different operating conditions. The flexible pipeline connection and the rigid flow channel plate connection form a complementary mechanism, collaboratively mitigating structural stress caused by temperature gradients. The dual-mode connection interface of either pipelines or flow channel plates provides optional technical paths for different maintenance scenarios, achieving the goal of minimizing functional unit replacement.

[0030] In some embodiments, the thermal management integrated device includes a flow channel plate assembly 1 and a fluid management unit. The fluid management unit is fixedly connected or limit-connected to the flow channel plate assembly 1. The fluid management unit has a channel for the flow medium or a cavity for storing the flow medium, and the channel or cavity of the fluid management unit communicates with the flow channel of the flow channel plate assembly 1. The fluid management unit includes a heat exchange assembly 21, a first heat exchanger 22, a first valve assembly 23, a pump assembly 24, a filter assembly 26, a storage device 25, and a second valve assembly 27. The second valve assembly 27 can be an electronic expansion valve. The first valve assembly 23 includes at least one valve. In some embodiments, the first valve assembly 23 includes a nine-way water valve 231 and a five-way water valve 232. In other embodiments, the nine-way water valve 231 can also be replaced by a ten-way water valve, a twelve-way water valve, or other multi-way water valves with other numbers of channels, or a combination of multiple multi-way water valves. For example, the first valve assembly 23 includes an eight-way water valve and a four-way water valve.

[0031] like Figure 2 As shown, the first flow channel plate 20 includes a second substrate 20a, a connecting plate 20b, and a third substrate 20c. The second substrate 20a and the third substrate 20c include flow channel grooves. The second substrate 20a is located on one side of the connecting plate 20b, and the third substrate 20c is located on the opposite side of the connecting plate 20b. The connecting plate 20b can cover the flow channel grooves to form the first flow channel 11. The connecting plate 20b has connecting holes, defining the flow channel formed by the second substrate 20a and the connecting plate 20b as the upper flow channel, and the flow channel formed by the third substrate 20c and the connecting plate 20b as the lower flow channel. The connecting holes allow for communication between a portion of the upper flow channel and a portion of the lower flow channel. The second substrate 20a, the connecting plate 20b, and the third substrate 20c are welded together, specifically by hot plate welding, etc. The first flow channel plate 20 has load-bearing mounting holes, which are used for the installation and fixing of the thermal management system.

[0032] like Figure 3 As shown, the second flow channel plate 10 includes a first substrate 10a and a cover plate 10b. The first substrate 10a includes a flow channel groove, and the shape of the cover plate 10b corresponds to the flow channel groove. The cover plate 10b can seal the opening of the flow channel groove to form a second flow channel. The first substrate 10a and the cover plate 10b are welded together, specifically by laser welding or the like.

[0033] The heat exchange assembly 21 includes one or more plate heat exchangers. In some embodiments, the heat exchange assembly 21 includes a second heat exchanger 211 and a third heat exchanger 212, one of which is an evaporator and the other is a condenser. In some embodiments, the mounting plate of the heat exchange assembly 21 is bolted to the second flow channel plate 10. In other embodiments, the mounting plate of the heat exchange assembly 21 may also be bolted to the first flow channel plate 20. The plate heat exchanger has a refrigerant channel and a coolant channel. The mounting plate is provided with a refrigerant interface and a coolant interface. The refrigerant interface is connected to the corresponding interface of the second flow channel plate 10, and the coolant interface is connected to the corresponding interface of the first flow channel plate 20. This allows the refrigerant channel of the plate heat exchanger to communicate with the second flow channel of the second flow channel plate 10, and the coolant channel of the plate heat exchanger to communicate with the first flow channel 11 of the first flow channel plate 20. The refrigerant flowing in the refrigerant channel of the plate heat exchanger and the coolant flowing in the coolant channel of the plate heat exchanger can exchange heat.

[0034] In some embodiments, the first heat exchanger 22 is a microchannel heat exchanger. The first heat exchanger 22 has a refrigerant channel that communicates with the second flow channel, allowing the refrigerant in the refrigerant channel to exchange heat with the outside air. The first valve assembly 23 includes a nine-way water valve 231 and a five-way water valve 232. The first valve assembly 23 is bolted to the first flow channel plate 20. The first valve assembly 23 has channel openings; specifically, the nine-way water valve 231 has nine channel openings, each communicating with an interface of the first flow channel plate 20, allowing the first valve assembly 23 to adjust its communication with the first flow channel 11. The five-way water valve 232 has five channel openings, each communicating with an interface of the first flow channel plate 20, allowing the first valve assembly 23 to adjust its communication with the first flow channel 11.

[0035] Pump assembly 24 is bolted to the first flow channel plate 20, and the channel of pump assembly 24 communicates with the first flow channel 11. Pump assembly 24 is used to power the coolant flowing in the first flow channel 11. In some embodiments, the integrated device can be used in a thermal management system including two independent coolant heat exchange circuits. Pump assembly 24 includes a first pump 241 and a second pump 242, which are used to power the two coolant heat exchange circuits respectively.

[0036] The storage device 25 is bolted to the first flow channel plate 20. The storage device 25 is used to store coolant. The cavity of the storage device 25 is connected to the first flow channel 11. In addition, when the coolant in the circuit decreases after the integrated equipment has been running for a period of time, it can be replenished through the storage device 25. The filter assembly 26 is bolted to the first flow channel plate 20. The filter channel of the filter assembly 26 is connected to the first flow channel 11. The filter assembly 26 is used to filter the coolant flowing through the channel to ensure that no impurities in the coolant enter the water pump, water valve, etc.

[0037] like Figure 2 As shown, the integrated thermal management device is applied to a thermal management system. The first flow channel plate 20 includes a first interface portion 13 for connecting to other devices in the thermal management system. The first flow channel plate 20 also includes an interface component 130, which is welded to the first interface portion 13. When other devices are connected to the first interface portion 13 via pipelines, the pipelines can be directly fixedly connected to or limited by the interface component 130. In other embodiments, the first interface portion 13 may also be integrally formed with the interface component 130.

[0038] The fluid management unit also includes a first sensor assembly 28 and a second sensor assembly 29. The first sensor assembly 28 is mounted on the first flow channel plate 20, and the second sensor assembly 29 is mounted on the second flow channel plate 10. The first sensor assembly 28 can detect the temperature and / or pressure parameters of the medium flowing in the first flow channel 11, and the second sensor assembly 29 can detect the temperature and / or pressure parameters of the medium flowing in the second flow channel.

[0039] The heat exchange assembly 21, the first valve assembly 23, the pump assembly 24, the filter assembly 26, and at least part of the storage device 25 are mounted on the same side of the flow channel plate assembly 1 along the thickness direction of the flow channel plate assembly 1. Along the length direction of the flow channel plate assembly 1, the pump assembly 24 and the filter assembly 26 are located on the first side of the first valve assembly 23, the heat exchange assembly 21, the first heat exchanger 22, and the storage device 25 are located on the second side of the first valve assembly 23, with the first side and the second side being opposite sides of the first valve assembly 23; along the width direction of the flow channel plate assembly 1, the five-way water valve 232 is located on one side of the nine-way water valve 231, the second pump 242 is located on one side of the first pump 241, and the heat exchange assembly 21 and the first heat exchanger 22 are located on one side of the storage device 25.

[0040] like Figure 7 and Figure 8 As shown, the thermal management system of the thermal management integrated device includes, in addition to the above-mentioned components, a first load 41, a second load 42 and a third load 43. The first load 41 can be a battery, the second load 42 can be a power device, and the third load 43 can be a dry cooler.

[0041] In this application, the "connection" between two components can be a direct connection or a connection via a pipeline. The two components may only have a pipeline between them, or they may have a valve or other component in addition to a pipeline. Similarly, the "connection" between two components in this application can be a direct connection or a connection via a pipeline. The two components may only have a pipeline connection, or they may have a valve or other component in addition to a pipeline connection.

[0042] The above examples illustrate the principles and implementation methods of this utility model. The descriptions of these embodiments are merely for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of this utility model.

Claims

1. A thermal management integrated device, comprising: include: The heat exchange assembly (21), the first valve assembly (23), the pump assembly (24) and the flow channel plate assembly (1) are connected to the flow channel plate assembly (1). The heat exchange assembly (21), the first valve assembly (23) and the pump assembly (24) are installed on the same side of the flow channel plate assembly (1) along the thickness direction of the flow channel plate assembly (1). Along the length of the flow channel plate assembly (1), the pump assembly (24) is located on the first side of the first valve assembly (23), and the heat exchange assembly (21) is located on the second side of the first valve assembly (23). The first side and the second side are opposite sides of the first valve assembly (23).

2. The thermal management integrated device of claim 1, wherein, Also includes: The filter assembly (26) and the storage device (25) are both connected to the flow channel plate assembly (1). The filter assembly (26) and the storage device (25) are installed on the same side of the flow channel plate assembly (1) along the thickness direction of the flow channel plate assembly (1). Along the length direction of the flow channel plate assembly (1), the filter assembly (26) is located on the first side of the first valve assembly (23), and the storage device (25) is located on the second side of the first valve assembly (23).

3. The thermal management integrated device of claim 2, wherein, The filter assembly (26) includes a first filter (261) and a second filter (262), and the pump assembly (24) includes a first pump (241) and a second pump (242). The first filter (261) and the second filter (262) are arranged along the length direction of the flow channel plate assembly (1), and the first pump (241) and the second pump (242) are arranged along the width direction of the flow channel plate assembly (1). At least a portion of the first filter (261) and at least a portion of the second filter (262) are located between the first pump (241) and the second pump (242).

4. The thermal management integrated device of claim 1, wherein, The first valve assembly (23) includes a nine-way water valve (231) and a five-way water valve (232), which are arranged along the width direction of the flow channel plate assembly (1); or, the first valve assembly (23) includes a ten-way water valve and a five-way water valve (232), which are arranged along the width direction of the flow channel plate assembly (1); or, the first valve assembly (23) includes a twelve-way water valve and a five-way water valve (232), which are arranged along the width direction of the flow channel plate assembly (1); or, the first valve assembly (23) includes an eight-way water valve and a four-way water valve, which are arranged along the width direction of the flow channel plate assembly (1).

5. The thermal management integrated device of claim 2, wherein, It also includes a first heat exchanger (22), which is connected to the heat exchange assembly (21). The first heat exchanger (22) is installed on the same side of the flow channel plate assembly (1) along the thickness direction of the flow channel plate assembly (1). The first heat exchanger (22) is located on the second side of the first valve assembly (23). Along the width direction of the flow channel plate assembly (1), the heat exchange assembly (21) and the first heat exchanger (22) are located on one side of the storage device (25).

6. The thermal management integrated device of claim 5, wherein, It also includes a capillary tube (40) which is installed on the same side of the flow channel plate assembly (1) along the thickness direction of the flow channel plate assembly (1), the first heat exchanger (22) is connected to the flow channel plate assembly (1), the flow channel plate assembly (1) is connected to the capillary tube (40), and the capillary tube (40) is connected to the heat exchange assembly (21).

7. The thermal management integrated device of any one of claims 1 to 4, wherein, The flow channel plate assembly (1) includes a first flow channel plate (20) and a second flow channel plate (10), the first flow channel plate (20) and the second flow channel plate (10) are stacked, the heat exchange assembly (21) is bolted to the first flow channel plate (20) or the second flow channel plate (10), the first valve assembly (23) is bolted to the first flow channel plate (20), and the pump assembly (24) is bolted to the first flow channel plate (20).

8. The thermal management integrated device of claim 7, wherein, It also includes a heater (30), which is connected to the first flow channel plate (20). The heater (30) is installed on the same side of the flow channel plate assembly (1) along the thickness direction of the flow channel plate assembly (1). The heater (30) is bolted to the first flow channel plate (20). The heat exchange assembly (21) and the heater (30) are arranged along the length direction of the flow channel plate assembly (1).

9. The thermal management integrated device of claim 7, wherein, It also includes a second valve assembly (27), which is connected to the second flow channel plate (10). The second valve assembly (27) is installed on the same side of the flow channel plate assembly (1) along the thickness direction of the flow channel plate assembly (1). The second valve assembly (27) is bolted to the second flow channel plate (10). The second valve assembly (27) is located on the second side of the first valve assembly (23).

10. The thermal management integrated device of any one of claims 1 to 4, wherein, It also includes a first heat exchanger (22), which is connected to the heat exchange assembly (21) via a pipeline; or, the flow channel plate assembly (1) includes a second flow channel plate (10), which is connected to the heat exchange assembly (21) via the second flow channel plate (10).

Images