Sensor assembly

Abstract

The utility model discloses a sensor assembly, which comprises a sensing main body and a pin, and is characterized by comprising a heat conduction piece, a plurality of pins and a plurality of heat dissipation pieces, and is characterized in that the heat conduction piece is of a hollow tubular structure; the positioning piece is provided with a groove matched with the sensing main body, the positioning piece is arranged in the inner cavity of the heat conduction piece, and the outer contour of the positioning piece is matched with the contour of the inner cavity; wherein the opening of the groove faces the inner wall of the heat conduction piece, the sensing main body is embedded in the groove, the groove and the inner wall of the heat conduction piece form an accommodating space of the sensing main body, and the sensing main body is in contact with the inner wall of the heat conduction piece. The sensor assembly is matched with the heat conduction piece through the positioning piece to form an accommodating space with positioning and protection functions, so that the service life of the sensing main body is ensured. The direct abutting design of the sensing main body and the inner wall of the heat conduction member reduces thermal resistance, realizes rapid temperature response and high-precision measurement, and is especially suitable for application scenes sensitive to temperature change.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and specifically to a sensor assembly. Background Technology

[0002] In the production process of existing temperature sensors, especially thermistor probes, a key step is to encapsulate and fix the tiny sensing element (such as a thermistor) inside a metal shell (i.e., a thermally conductive component) for protection and heat conduction. Currently, the most common process in the industry is to first place the sensing element into the inner cavity of the thermally conductive component, then inject liquid epoxy resin, thermally conductive silicone, or other fillers into the inner cavity, and fix the sensing element by potting and waiting for it to cure.

[0003] Traditional potting methods often result in the sensor being encapsulated by a layer of solidified filler, suspended within the cavity, preventing stable and reliable direct contact with the inner wall of the heat-conducting component. This filler layer creates unavoidable thermal resistance between the sensor and the heat-conducting component, significantly lengthening the heat transfer path and slowing down the overall response speed of the temperature probe, failing to meet the requirements of rapid temperature measurement applications. During the injection of liquid filler, the sensor is highly susceptible to displacement or deflection due to fluid force, resulting in significant randomness in its final position within the heat-conducting component's cavity. This leads to performance variations (especially in response speed) among products produced in the same batch, resulting in poor product consistency and significant challenges in quality control. The potting process is relatively complex and requires skilled operation; improper handling during sensor positioning or lead wire arrangement can easily cause damage, affecting product yield. Utility Model Content

[0004] In order to overcome the technical defects of the prior art, such as poor positioning accuracy of the sensor subject due to the potting process and low thermal conductivity due to the thermal resistance formed by the filler, this utility model provides a sensor assembly.

[0005] To solve the above problems, this utility model is implemented according to the following technical solution:

[0006] The sensor assembly of this utility model includes a sensing body and pins, comprising:

[0007] A heat-conducting component, wherein the heat-conducting component is a hollow tubular structure;

[0008] A positioning element is provided with a groove adapted to the sensing body, the positioning element is disposed in the inner cavity of the heat-conducting element, and the outer contour of the positioning element is adapted to the contour of the inner cavity.

[0009] The opening of the groove faces the inner wall of the heat-conducting component, the sensing body is embedded in the groove, the groove and the inner wall of the heat-conducting component form a receiving space for the sensing body, and the outer wall of the sensing body is in contact with the inner wall of the heat-conducting component.

[0010] Preferably, the sensing element is a glass-encapsulated thermistor.

[0011] Preferably, the heat-conducting element is made of a metallic material.

[0012] Preferably, the cross-section of the inner cavity of the heat-conducting component is "D" shaped.

[0013] Preferably, the positioning member is further provided with a buffer hole, which is located above the groove.

[0014] Preferred options also include:

[0015] A cured filler is used to fill the space between the positioning groove and the sensing body.

[0016] Preferably, the cured filler is epoxy resin or silicone grease.

[0017] Preferably, the positioning element is made of silicone grease.

[0018] Preferred options also include:

[0019] An insulating sleeve is fitted over the pin, and the insulating sleeve is made of high-temperature resistant silicone.

[0020] Compared with the prior art, the beneficial effects of this utility model are:

[0021] In this invention, the sensor body is embedded in the groove of the positioning component, and the groove and the inner wall of the heat-conducting component together form a protective receiving space. This design effectively isolates the sensor body from external impacts, compression, or mechanical stress during assembly, preventing direct damage and thus improving the sensor's durability and lifespan. The sensor body directly abuts against the inner wall of the heat-conducting component, which has a hollow tubular structure, enabling rapid transfer of temperature changes from the external environment to the sensor body. This direct contact design reduces thermal resistance, improves heat conduction efficiency, and gives the sensor a faster response speed and higher measurement accuracy, making it particularly suitable for applications sensitive to temperature changes. The outer contour of the positioning component matches the contour of the inner cavity of the heat-conducting component, ensuring accurate and stable positioning of the sensor body within the assembly and preventing displacement or loosening during use. This robust fixing method ensures stable sensor performance under long-term use or harsh environments. Attached Figure Description

[0022] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, wherein:

[0023] Figure 1 This is an exploded view of a sensor assembly according to this utility model;

[0024] Figure 2 This is a perspective view of a sensor assembly according to this utility model;

[0025] Figure 3 This is a cross-sectional view of a sensor assembly according to this utility model;

[0026] In the diagram: 10-heat conduction component, 20-positioning component, 30-sensor body, 40-insulating sleeve; 11-inner cavity; 21-groove, 22-buffer hole; 31-pin. Detailed Implementation

[0027] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0028] like Figures 1-3 As shown, a sensor assembly of this utility model includes a sensing body 30 and pins 31, comprising:

[0029] Heat-conducting component 10, which is a hollow tubular structure;

[0030] Positioning member 20, the positioning member 20 is provided with a groove adapted to the sensing body, the positioning member 20 is disposed in the inner cavity of the heat conducting member 10, and the outer contour of the positioning member 20 is adapted to the contour of the inner cavity.

[0031] The opening of the groove 21 faces the inner wall of the heat-conducting element 10, and the sensing body 30 is embedded in the groove 21. The groove and the inner wall of the heat-conducting element form a receiving space for the sensing body 30, and the sensing body 30 abuts against the inner wall of the heat-conducting element 10.

[0032] The present invention provides a sensor assembly, the core of which includes a heat-conducting element 10, a positioning element 20, and a sensing body 30 (including the sensing body 30 itself and pins 31).

[0033] like Figure 1 and Figure 2 As shown, the heat-conducting component 10 is an integral hollow tubular structure, with an inner cavity 11 forming an inner wall with a specific contour. This heat-conducting component 10 is the main component for heat exchange between the sensor and the measured environment.

[0034] The positioning element 20 is one of the key components of this invention, and it is disposed in the inner cavity 11 of the heat-conducting element 10. To ensure the stability and accuracy of installation, the outer contour of the positioning element 20 matches the contour of the inner cavity 11 of the heat-conducting element 10. The positioning element 20 is provided with a groove 21.

[0035] During assembly, the opening of the groove 21 faces the inner wall of the heat-conducting element 10. After the sensor body 30 is embedded in the groove 21, the groove wall of the groove 21 and the inner wall of the heat-conducting element 10 together form a precisely sized receiving space for placing the sensor body 30. This structure ensures that the temperature-sensing surface of the sensor body 30 is in close contact with the inner wall of the heat-conducting element 10, achieving efficient and rapid heat transfer.

[0036] In a preferred embodiment, the sensing element 30 is a glass-encapsulated thermistor. This type of thermistor has stable performance, and its cylindrical glass outer wall is well-suited for forming reliable line or surface contact with the inner wall of the heat-conducting element 10, further ensuring the reliability of heat transfer.

[0037] In a preferred embodiment, to achieve optimal thermal conductivity, the heat-conducting element 10 is made of a metallic material. For example, copper, aluminum, brass, or stainless steel, which have high thermal conductivity, can be used. Metallic materials not only conduct heat quickly but also possess good mechanical strength and machinability.

[0038] To prevent unnecessary rotation of the positioning element 20 within the inner cavity 11 and to achieve a more stable fit, in a preferred embodiment, the inner cavity cross-section of the heat-conducting element 10 is D-shaped. Correspondingly, the outer contour of the positioning element 20 is also D-shaped. This non-circular fit design ensures that both have uniquely determined orientation and height stability during assembly.

[0039] Preferably, the positioning member 20 is also provided with a buffer hole 22, which extends laterally and is located above the groove 21 for placing the sensor body.

[0040] The buffer hole acts as a mechanical buffer structure. During the process of pressing the positioning element 20 into the inner cavity 11 of the heat-conducting element 10 with an interference fit or by other means, significant mechanical stress may occur if dimensional tolerances exist. The presence of the buffer hole 22 creates a structural "flexible zone" around the positioning element 20. This zone can absorb and release the mechanical stress generated during assembly, thereby preventing the stress from being directly transmitted to the sensing body 30 below, preventing crush damage, and improving the product yield.

[0041] The presence of this buffer hole 22 creates a "thin-walled structure" around the positioning component. When under pressure, this thin wall can undergo slight elastic deformation in the direction of the hole, acting like a "spring" or "airbag" to absorb and release most of the assembly stress, thereby protecting the sensing body 30 below.

[0042] To further secure the sensor body 30 and eliminate air within the accommodating space to enhance thermal conductivity, a cured filler is also included. The cured filler (such as epoxy resin or silicone grease) fills the accommodating space formed by the groove 21 of the positioning member 20 and the sensor body 30, ensuring that the sensor body 30 will not shift during final use.

[0043] In a preferred embodiment, the positioning element 20 is made of silicone grease. A high-temperature resistant, high-strength silicone grease with excellent insulation properties can be used. Using silicone grease ensures that the pins 31 of the sensor body 30 will not short-circuit with the metal heat-conducting component 10. The silicone grease material of the positioning element 20 is ideally suited for high-volume, high-precision production using modern processes such as injection molding. This ensures that each positioning element is dimensionally consistent, guaranteeing consistency in precise positioning and thermal response speed in the final product—a prerequisite for high-quality mass production. Furthermore, it is easy to replace and can be adapted to thermistors of different sizes.

[0044] To provide insulation protection for the pins 31 of the sensing body 30, an insulating sleeve 40 is further included in a preferred embodiment. The insulating sleeve 40 is respectively fitted onto the pins 31 of the sensing body 30 to prevent short circuits between the two pins 31. The insulating sleeve is made of high-temperature resistant silicone. Since the sensor itself is used to measure temperature, its internal components must be able to withstand a wide temperature range. High-temperature resistant silicone can maintain its physical and electrical properties stably within a temperature range of -60℃ to 200℃ or even higher, unlike ordinary plastics which melt or soften at high temperatures or become brittle or crack at low temperatures, thus ensuring the long-term reliability of the sensor under various harsh temperature environments.

[0045] During operation, external heat is rapidly transferred to the inner wall of the heat-conducting component 10 and directly to the sensing body 30 in contact with it, achieving a rapid temperature response. The entire assembly process is simplified by the precise fit of the pre-formed positioning component 20, resulting in high reliability.

[0046] The working principle of the sensor assembly described in this utility model is as follows:

[0047] The working principle of this sensor assembly is mainly reflected in two aspects: positioning principle and heat conduction principle.

[0048] 1. Positioning and Protection Principles:

[0049] During assembly, a positioning component, pre-fabricated through processes such as injection molding, is placed into the hollow cavity of the heat-conducting component. Since the outer contour of the positioning component matches the inner contour (preferably D-shaped) of the heat-conducting component, a stable, non-rotational fit is ensured, laying the foundation for precise positioning of the sensor. Subsequently, the sensor is placed into a specific accommodating space formed by the groove of the positioning component and the inner wall of the heat-conducting component. The dimensions of this space ensure that the temperature-sensing surface of the sensor can firmly and reliably contact the inner wall of the heat-conducting component. During this process, the buffer hole above the positioning component plays a crucial protective role. When the positioning component is pressed in with an interference fit or fixed in other ways, this buffer hole acts as a mechanical stress absorption zone, undergoing slight elastic deformation to absorb the compressive force caused by assembly tolerances or fit. This ensures that mechanical stress is not transmitted to the sensor below, effectively preventing compressive damage to the sensitive element.

[0050] 2. Principle of efficient heat conduction and temperature measurement:

[0051] During operation, when measuring the temperature of the external environment (such as liquid, gas, or solid surfaces), the heat from that environment is first transferred to the heat-conducting component. Because the sensing surface of the sensor is in contact with the inner wall of the heat-conducting component, heat can be transferred from the heat-conducting component to the sensor almost without delay via the most efficient solid-to-solid direct conduction, allowing its temperature to quickly synchronize with that of the heat-conducting component. This method avoids the drawback of existing technologies where heat must pass through a layer of potting compound with low thermal conductivity to reach the sensor, eliminating the main source of thermal resistance and thus greatly improving the temperature measurement response speed. When the temperature of the sensor (thermostat) changes, its resistance value changes accordingly with precision and predictability. The external measurement circuit detects this change in resistance value in real time through its pins and calculates it into an accurate temperature reading based on a preset algorithm or resistance-temperature curve, thus completing a fast and accurate temperature measurement process.

[0052] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A sensor assembly comprising a sensing body and a pin, characterized in that, include: A heat-conducting component, wherein the heat-conducting component is a hollow tubular structure; A positioning element is provided with a groove adapted to the sensing body, the positioning element is disposed in the inner cavity of the heat-conducting element, and the outer contour of the positioning element is adapted to the contour of the inner cavity. The opening of the groove faces the inner wall of the heat-conducting component, the sensing body is embedded in the groove, the groove and the inner wall of the heat-conducting component form a receiving space for the sensing body, and the outer wall of the sensing body is in contact with the inner wall of the heat-conducting component.

2. A sensor assembly according to claim 1, characterized in that: The sensing element is a glass-encapsulated thermistor.

3. A sensor assembly according to claim 1, characterized in that: The heat-conducting component is made of metallic material.

4. A sensor assembly according to claim 1, characterized in that: The inner cavity cross-section of the heat-conducting component is "D" shaped.

5. A sensor assembly according to claim 1, characterized in that: The positioning element is also provided with a buffer hole, which is located above the groove.

6. The sensor assembly of claim 1, wherein, Also includes: A cured filler is used to fill the space between the positioning groove and the sensing body.

7. A sensor assembly according to claim 6, characterized in that: The cured filler is epoxy resin or silicone grease.

8. A sensor assembly according to claim 1, characterized in that: The positioning element is made of silicone grease.

9. The sensor assembly of claim 1, wherein, Also includes: An insulating sleeve is fitted over the pin, and the insulating sleeve is made of high-temperature resistant silicone.

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