Automatic sorting machine for semiconductor packaging appearance defects

Abstract

The utility model discloses an automatic sorting machine for semiconductor packaging appearance defects, which relates to the technical field of semiconductor manufacturing and detection and comprises a conveying component, a detection module, a sorting mechanism and an image acquisition unit connected with the detection module. The two sides of the conveying assembly are provided with clamping devices used for fixing a to-be-tested packaging piece, and the two clamping devices are connected through a sliding rail and can transversely move in the direction of the sliding rail. A plurality of positioning pins are arranged at the top end of the clamping device, and the bottom ends of the positioning pins are perpendicular to the surface of the clamping device. According to the automatic sorting machine for the semiconductor packaging appearance defects, the clamping device can transversely move along the sliding rail to adjust the detection range of the to-be-detected packaging piece, the to-be-detected packaging piece is fixed through the positioning pin arranged at the top end of the clamping device, and the automatic sorting machine is suitable for detecting packaging pieces of different sizes and shapes; and meanwhile, batch detection can be carried out on a plurality of packaging pieces, and the detection efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing and testing technology, specifically to an automatic sorting machine for semiconductor packaging appearance defects. Background Technology

[0002] Automated sorting machines for semiconductor package appearance defects are typically used for efficient inspection and classification of packaged products, achieving precise sorting through automation to improve production efficiency and product quality. However, existing sorting equipment still has certain limitations in practical applications. For example, current sorting machines on the market mainly rely on physical dimensions or electrical performance parameters for sorting, making it difficult to meet the high-precision identification requirements of complex appearance defects (such as cracks and scratches). This leads to a high misjudgment rate during the sorting process, affecting overall production efficiency and product reliability.

[0003] A search revealed a fully automated semiconductor chip testing and sorting machine with publication number CN119035113B, published on January 21, 2025. This design achieves automated chip testing and sorting through a loading / unloading robot, testing components, and a tray conveying assembly. However, this solution focuses more on detecting the chip's electrical performance parameters, and its detection capability is limited when faced with micro-cracks or surface defects, making it difficult to meet the requirements for high-precision sorting of appearance defects.

[0004] A search revealed an automatic sorting machine for battery cell modules, with publication number CN109701907B and publication date November 3, 2020. This design employs a double-clamp structure with a voltmeter for battery cell module testing and utilizes a support mechanism for multi-directional detection. While capable of multi-angle detection of electrical performance parameters, it lacks a high-resolution imaging system or intelligent image processing algorithms, thus limiting its performance in handling complex surface defect detection tasks.

[0005] The aforementioned problems indicate that current sorting equipment on the market has certain limitations in detecting appearance defects in semiconductor packages, particularly in terms of high-precision and intelligent detection, where there is still room for improvement. Therefore, this invention provides an automatic sorting machine for semiconductor package appearance defects to address the shortcomings of existing technologies and meet the demands of modern industry for high-quality, high-efficiency sorting equipment. Utility Model Content

[0006] This invention provides an automatic sorting machine for semiconductor package appearance defects, aiming to overcome the shortcomings of existing sorting equipment in detecting complex appearance defects, especially its limitations in meeting the high-precision identification requirements of micro-cracks and scratches. The specific solution is as follows:

[0007] An automatic sorting machine for semiconductor package appearance defects includes a conveying assembly, a detection module, and a sorting mechanism, and further includes an image acquisition unit connected to the detection module. The conveying assembly has clamping devices on both sides for fixing the packages to be tested. The two clamping devices are connected by a slide rail and can move laterally along the slide rail. The top of each clamping device has multiple positioning pins, the bottom of which are perpendicularly mounted to the surface of the clamping device and connected to the inside of the clamping device by springs. The image acquisition unit is located above the conveying assembly, and its bottom has a light source assembly whose light is directed towards the surface of the package to be tested. When the two clamping devices are moved laterally apart and extended, they are used to adjust the detection range of the package to be tested.

[0008] As a preferred embodiment of the automatic sorting machine for semiconductor packaging appearance defects described in this utility model, wherein: a support beam is installed in the middle of the conveying assembly and arranged parallel thereto, and both ends of the support beam extend to the outside of the conveying assembly; rotatable rollers are installed at both ends of the support beam; the rollers are located between two clamping devices and mesh with the clamping devices, and the rotation of the rollers is used to drive the two clamping devices to move laterally on the slide rail.

[0009] As a preferred embodiment of the automatic sorting machine for semiconductor packaging appearance defects described in this utility model, the clamping device has guide posts with upward openings installed at the middle of the top of both sides. A piston rod is provided inside the guide post. The top of the piston rod is connected to the inner wall of the guide post through an elastic element. One end of the elastic element is fixedly connected to the inner wall of the tail of the guide post, and the other end of the elastic element is fixedly connected to the top of the piston rod. A probe is installed at the bottom of the piston rod. A through hole is provided at the top of the clamping device along its thickness. One end of the probe contacts the surface of the package to be tested after passing through the through hole.

[0010] In a preferred embodiment of the automatic sorting machine for semiconductor packaging appearance defects described in this utility model, the bottom end of the clamping device is equipped with multiple sets of air nozzles, the number of which corresponds to the probe; the nozzles face downwards from the probe; and the multiple sets of air nozzles are connected to the tail of the guide post via air pipes.

[0011] As a preferred embodiment of the automatic sorting machine for semiconductor packaging appearance defects described in this utility model, the clamping device is equipped with a flow divider located on one side of the guide post at its top end; the top opening of the flow divider is connected to an external air source through an air pipe; the bottom opening of the flow divider is connected to a probe through an air pipe; one side opening of the flow divider faces the piston rod, and a sealing rod is installed laterally inside one side of the flow divider, with a limiting plate located outside the piston rod installed at the end of the sealing rod.

[0012] In a preferred embodiment of the automatic sorting machine for semiconductor packaging appearance defects described in this utility model, a reset spring is sleeved on the rod portion of the sealing rod, and the reset spring is located between the end face of one side of the shunt and the limiting plate.

[0013] In a preferred embodiment of the automatic sorting machine for semiconductor packaging appearance defects described in this utility model, a rubber pad is attached to the outer wall of the piston rod away from the shunt, and the rubber pad is arranged along the length of the piston rod.

[0014] In a preferred embodiment of the automatic sorting machine for semiconductor packaging appearance defects described in this utility model, an adjusting rod is rotatably mounted on the top of the clamping device, and the outer wall of the adjusting rod is in contact with the top wall of the clamping device; one end of the adjusting rod is always connected to one end of the clamping device.

[0015] In a preferred embodiment of the automatic sorting machine for semiconductor packaging appearance defects described in this utility model, the top of the support beam is equipped with a transmission wheel that is concentric and coaxial with the roller; the transmission wheels are connected by a synchronous belt; and a servo motor for driving the synchronous belt transmission is provided above the clamping device.

[0016] In a preferred embodiment of the automatic sorting machine for semiconductor packaging appearance defects described in this utility model, the top of the clamping device is provided with a sliding groove along its length, and the sliding groove is slidably connected to the slide rail.

[0017] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0018] 1. This device uses a clamping device that can move laterally along the slide rail to adjust the detection range of the package to be tested, and fixes the package to be tested by the positioning pin set at its top. It is suitable for testing packages of different sizes and shapes, and can perform batch testing of multiple packages, thus improving testing efficiency.

[0019] 2. The device uses rollers, which can not only drive the two clamping devices that mesh with it to move apart or towards each other, but also limit the clamping devices through meshing when the packaged part shakes or stops suddenly during the conveying process, so as to prevent the clamping devices from sliding on the slide rail and causing the packaged part to deviate in position, thereby improving the detection accuracy.

[0020] 3. The device uses a probe to perform contact detection on the surface of the package, which, combined with the non-contact detection of the image acquisition unit, forms a dual detection mechanism to improve the reliability of the detection results. At the same time, the probe can be pre-positioned on the surface of the package to be tested by the elastic force of the elastic element before detection.

[0021] 4. The device uses a limiting plate. When the probe contacts the surface of the package to be tested and forms a testing state, the limiting plate will adhere to the outer wall of the piston rod to prevent the probe from damaging the surface of the package due to excessive pressure. After the test is completed, the limiting plate will disengage from the piston rod, and the piston rod will drive the probe to reset under the action of the elastic element, thereby achieving the effect of quickly switching the testing state.

[0022] 5. The device uses an adjusting rod, one end of which is attached to the top of the clamping device and the other end is connected to the end of the clamping device, thus providing support for the clamping device. At the same time, it can reduce the wear between the clamping device and the slide rail, keep the air nozzles at the bottom of the clamping device on the same horizontal plane, and always keep multiple sets of air nozzles at a certain distance from the surface of the packaged part during the inspection process, thereby improving the stability of the inspection.

[0023] This invention solves the shortcomings of existing sorting equipment in detecting complex appearance defects through the above-mentioned technical solution, especially the technical challenge of high-precision identification of micro-cracks, scratches, etc., and provides a more accurate and efficient solution for modern industry. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention, showing the layout relationship of the conveying component, detection module, sorting mechanism and clamping device.

[0026] Figure 2 This utility model Figure 1 Enlarged view of point A in the middle.

[0027] Figure 3 This utility model Figure 1 Enlarged view of point B in the middle.

[0028] Figure 4 This is a schematic diagram of the positioning pin in this utility model.

[0029] Figure 5 This is a schematic diagram of the adjusting rod in this utility model.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Conveying assembly; 2. Detection module; 3. Sorting mechanism; 4. Image acquisition unit; 5. Clamping device; 6. Positioning pin; 7. Slide rail; 8. Support beam; 9. Roller; 10. Guide post; 11. Piston rod; 12. Probe; 13. Air nozzle; 14. Diverter; 15. Sealing rod; 16. Limiting plate; 17. Adjusting rod; 18. Transmission wheel; 19. Synchronous belt; 20. Servo motor. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0033] This utility model relates to an automatic sorting machine for appearance defects in semiconductor packaging, and its specific implementation method is described in detail with reference to the accompanying drawings. Figure 1 As shown, the sorting machine mainly includes a conveying assembly 1, a detection module 2, a sorting mechanism 3, an image acquisition unit 4, and a clamping device 5. The conveying assembly 1 carries and transports the packages to be tested, the detection module 2 identifies appearance defects, and the sorting mechanism 3 classifies the packages according to the detection results. The clamping device 5 is installed on both sides of the conveying assembly 1 and moves laterally via slide rails 7 to adjust the detection range of the packages to be tested. The image acquisition unit 4 is located above the conveying assembly 1, and its bottom is equipped with a light source assembly. The light from the light source assembly is directed towards the surface of the package to be tested to provide stable illumination conditions.

[0034] The structural design of the clamping device 5 is one of the core components of this utility model. For example... Figure 2 As shown, the clamping device 5 has multiple positioning pins 6 at its top. The bottom ends of the positioning pins 6 are vertically mounted on the surface of the clamping device 5 and connected to the interior of the clamping device 5 via springs. The function of the positioning pins 6 is to fix the package to be tested, ensuring that the package remains stable during the testing process. Guide posts 10 with upward openings are installed at the middle of the top ends on both sides of the clamping device 5. A piston rod 11 is located inside the guide post 10. The top of the piston rod 11 is connected to the inner wall of the guide post 10 via an elastic element. One end of the elastic element is fixedly connected to the inner wall of the tail of the guide post 10, and the other end is fixedly connected to the top of the piston rod 11. A probe 12 is installed at the bottom end of the piston rod 11. One end of the probe 12 contacts the surface of the package to be tested after passing through a through hole at the top of the clamping device 5. The design of the probe 12 allows it to form a contact test on the surface of the package, while the presence of the elastic element provides the probe 12 with a certain buffering capacity, preventing damage to the surface of the package due to excessive pressure.

[0035] To further improve the stability and efficiency of the detection, multiple sets of air nozzles 13 are installed at the bottom of the clamping device 5, the number of which corresponds to the number of probes 12. The nozzles 13 face downwards from the probes 12, and the multiple sets of air nozzles 13 are connected to the tail of the guide post 10 via air tubes. Figure 4 As shown, a diverter 14 is installed at the bottom of the clamping device 5. The top opening of the diverter 14 is connected to an external air source through an air pipe, and the bottom opening is connected to the probe 12 through an air pipe. One side opening of the diverter 14 faces the piston rod 11, and a sealing rod 15 is installed laterally inside one side of the diverter 14. A limiting plate 16 is installed at the end of the sealing rod 15, and the limiting plate 16 is located outside the piston rod 11. A return spring is sleeved on the sealing rod 15, and the return spring is located between the end face of one side of the diverter 14 and the limiting plate 16. This design allows the probe 12 to be protected by the limiting plate 16 when it contacts the surface of the package, preventing the probe 12 from damaging the surface of the package due to excessive pressure. After the test is completed, the limiting plate 16 disengages from the piston rod 11, and the piston rod 11 drives the probe 12 to reset under the action of the elastic element, thereby achieving the effect of quickly switching the test state.

[0036] The lateral movement of the clamping device 5 is achieved by the cooperation of the support beam 8 and the roller 9. For example... Figure 3 As shown, a support beam 8 is installed in the middle of the conveying assembly 1, parallel to it, with both ends of the support beam 8 extending to the outside of the conveying assembly 1. Rotatable rollers 9 are installed at both ends of the support beam 8, located between and engaging with the two clamping devices 5. The rotation of the rollers 9 drives the two clamping devices 5 to move laterally on the slide rail 7. A drive wheel 18, concentric and coaxial with the rollers 9, is installed at the top of the support beam 8, and the drive wheels 18 are connected by a synchronous belt 19. A servo motor 20 is provided above the clamping devices 5 to drive the synchronous belt 19. The servo motor 20 drives the drive wheel 18 to rotate via the synchronous belt 19, thereby driving the rollers 9 to rotate. The rotation of the rollers 9 not only drives the clamping devices 5 to move apart or towards each other, but also limits the engagement of the clamping devices 5 when the package shakes or stops suddenly during conveying, preventing the clamping devices 5 from sliding on the slide rail 7 and causing deviation in the position of the package.

[0037] The top of the clamping device 5 has a groove along its length, which is slidably connected to the slide rail 7 to ensure the stability of the clamping device 5 during lateral movement. Figure 5As shown, an adjusting rod 17 is rotatably mounted on the top of the clamping device 5. The outer wall of the adjusting rod 17 fits against the top wall of the clamping device 5, and one end of the adjusting rod 17 is always connected to one end of the clamping device 5. The design of the adjusting rod 17 allows it to provide additional support for the clamping device 5, reducing wear between the clamping device 5 and the slide rail 7. At the same time, the presence of the adjusting rod 17 also ensures that the air nozzles 13 at the bottom of the clamping device 5 remain on the same horizontal plane, and that the multiple sets of air nozzles 13 always maintain a certain distance from the surface of the package during the inspection process, thereby improving the stability of the inspection.

[0038] In actual operation, the package to be tested is placed on the conveying assembly 1 and moved to the detection area. The clamping device 5 fixes the package to be tested with the positioning pin 6. Then, the servo motor 20 starts and drives the transmission wheel 18 to rotate through the synchronous belt 19, which in turn drives the roller 9 to rotate. The rotation of the roller 9 drives the clamping device 5 to move laterally along the slide rail 7, adjusting the detection range of the package to be tested. During this process, the light source assembly of the image acquisition unit 4 provides stable illumination conditions for the surface of the package, and the image acquisition unit 4 performs non-contact detection on the surface of the package. At the same time, the probe 12 is pre-positioned on the surface of the package to be tested by the elastic force of the elastic element, and completes contact detection after contacting the surface of the package. After the detection is completed, the limiting plate 16 disengages from the piston rod 11, and the piston rod 11 drives the probe 12 to reset under the action of the elastic element. The distributor 14 delivers gas to the jet nozzle 13 through the air pipe. The jet nozzle 13 blows the surface of the package to remove any small particles or impurities that may be present. The detection module 2 determines whether the package has any appearance defects based on the detection results of the image acquisition unit 4 and the probe 12, and transmits the results to the sorting mechanism 3. The sorting mechanism 3 classifies the package according to the detection results, completing the entire sorting process.

[0039] This invention achieves efficient detection of surface defects in semiconductor packages through the specific embodiments described above, providing a reliable solution, particularly for high-precision identification of minute cracks and scratches. The connections, positions, and coordination between all components have been carefully designed to ensure the stability of the equipment and the accuracy of the detection.

[0040] To enable those skilled in the art to fully understand and implement this utility model, the following supplementary explanation of the implementation principle of this utility model is provided in conjunction with specific application scenarios.

[0041] In actual operation, the package to be tested is first placed on the conveying assembly 1 and then transferred to the testing area. The clamping device 5 fixes the package to be tested using the positioning pin 6. At this time, the spring at the bottom of the positioning pin 6 is compressed to ensure that the package remains stable during the testing process. Subsequently, the servo motor 20 starts and drives the transmission wheel 18 to rotate via the synchronous belt 19, which in turn drives the roller 9 to rotate. The rotation of the roller 9 drives the two clamping devices 5 to move apart or toward each other along the slide rail 7, thereby adjusting the testing range of the package to be tested. During this process, the cooperation structure between the support beam 8 and the roller 9 ensures that the lateral movement of the clamping device 5 on the slide rail 7 is smooth and accurate, avoiding positional deviations caused by package shaking or sudden stops during transport.

[0042] Once the packaged component enters the inspection area, the light source assembly of the image acquisition unit 4 provides stable illumination to the surface of the packaged component, improving the clarity and accuracy of image acquisition. The image acquisition unit 4 performs non-contact inspection of the packaged component surface using a high-resolution imaging system to acquire its appearance information. Simultaneously, the probe 12 inside the clamping device 5 moves downwards under the action of an elastic element until it contacts the packaged component surface. The design of the probe 12 allows it to provide a certain buffering capacity upon contact with the packaged component surface, preventing damage due to excessive pressure. Furthermore, the limiting plate 16 inside the shunt 14 adheres to the outer wall of the piston rod 11 when the probe 12 contacts the packaged component surface, preventing the probe 12 from applying excessive pressure and thus protecting the integrity of the packaged component surface.

[0043] After the test is completed, the limiting plate 16 disengages from the piston rod 11 under the action of the return spring, and the piston rod 11 then drives the probe 12 to reset under the action of the elastic element. This process achieves the effect of quickly switching the test state through the cooperation of the sealing rod 15 in the diverter 14 and the return spring, ensuring that the equipment can efficiently complete continuous test tasks. The diverter 14 delivers gas from an external gas source to the jet nozzle 13 through the air pipe. The jet nozzle 13 blows the surface of the package to remove any possible small particles or impurities, further improving the accuracy of the test.

[0044] The detection module 2 comprehensively judges whether the package has appearance defects based on the detection results of the image acquisition unit 4 and the probe 12. The image acquisition unit 4 is responsible for identifying complex defects such as cracks and scratches on the surface of the package, while the probe 12 obtains the physical characteristics of the package surface through contact detection. The combination of these two mechanisms forms a dual detection mechanism, significantly improving the reliability of the detection results. The sorting mechanism 3 classifies the packages according to the results of the detection module 2, completing the entire sorting process.

[0045] The design of the adjusting rod 17 further enhances the stability of the clamping device 5. One end of the adjusting rod 17 is always connected to one end of the clamping device 5, while the other end is in contact with the top wall of the clamping device 5, thus providing additional support for the clamping device 5 and reducing wear between the clamping device 5 and the slide rail 7. At the same time, the adjusting rod 17 ensures that the air nozzles 13 at the bottom of the clamping device 5 remain on the same horizontal plane and that the multiple sets of air nozzles 13 maintain a constant distance from the surface of the package during the inspection process, thereby improving the stability of the inspection.

[0046] Through the above steps and the coordinated operation of each component, this invention achieves efficient detection of surface defects in semiconductor packaging, providing a reliable solution, particularly for high-precision identification of minute cracks and scratches. The connections, positions, and coordination between the various components are meticulously designed to ensure the stability of the equipment and the accuracy of the detection, providing modern industry with a more precise and efficient sorting device.

[0047] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An automatic sorting machine for semiconductor package appearance defects, comprising a conveying assembly (1), a detection module (2), and a sorting mechanism (3), characterized in that: It also includes an image acquisition unit (4) connected to the detection module (2); The conveying assembly (1) is provided with clamping devices (5) on both sides for fixing the package to be tested. The two clamping devices (5) are connected by a slide rail (7) and can move laterally along the slide rail (7). The top of the clamping device (5) is provided with a plurality of positioning pins (6), the bottom end of the positioning pins (6) is installed perpendicularly to the surface of the clamping device (5) and is connected to the inside of the clamping device (5) by a spring; The image acquisition unit (4) is located above the conveying component (1), and a light source component is provided at its bottom. The light from the light source component is directed toward the surface of the package to be tested. Among them, after the two clamping devices (5) are separated and horizontally extended, they are used to adjust the detection range of the package to be tested.

2. The semiconductor package cosmetic defect automatic handler according to claim 1, wherein The middle part of the conveying assembly (1) is equipped with a support beam (8) arranged parallel to it, and both ends of the support beam (8) extend to the outside of the conveying assembly (1). Rotatable rollers (9) are installed at both ends of the support beam (8); The roller (9) is located between the two clamping devices (5) and engages with the clamping devices (5). The rotation of the roller (9) is used to drive the two clamping devices (5) to move laterally on the slide rail (7).

3. The semiconductor package cosmetic defect automatic handler of claim 1, wherein The clamping device (5) has guide posts (10) with openings facing upwards installed at the middle of the top of both sides. Inside the guide post (10) is a piston rod (11). The top of the piston rod (11) is connected to the inner wall of the guide post (10) through an elastic element. One end of the elastic element is fixedly connected to the inner wall of the tail of the guide post (10), and the other end of the elastic element is fixedly connected to the top of the piston rod (11). A probe (12) is installed at the bottom of the piston rod (11). The top of the clamping device (5) has a through hole along its thickness. One end of the probe (12) contacts the surface of the package to be tested after passing through the through hole.

4. The semiconductor package cosmetic defect automatic handler according to claim 3, wherein The bottom end of the clamping device (5) is equipped with multiple sets of air nozzles (13) and their number corresponds to the probe (12); The nozzle (13) faces downwards from the probe (12); The multiple sets of jet nozzles (13) are connected to the tail of the guide post (10) via air tubes.

5. The automatic semiconductor package cosmetic defect sorter of claim 1, wherein The top of the clamping device (5) is equipped with a diverter (14) located on one side of the guide post (10). The top opening of the splitter (14) is connected to an external air source through a trachea; The bottom opening of the shunt (14) is connected to the probe (12) through the trachea; One side opening of the distributor (14) faces the piston rod (11), and a sealing rod (15) is installed laterally inside one side of the distributor (14). A limiting plate (16) located outside the piston rod (11) is installed at the end of the rod of the sealing rod (15).

6. The semiconductor package cosmetic defect automatic handler according to claim 5, wherein The sealing rod (15) has a reset spring sleeved on its rod portion, and the reset spring is located between one end face of the diverter (14) and the limiting plate (16).

7. The semiconductor package cosmetic defect automatic handler of claim 6, wherein A rubber pad is attached to the outer wall of the piston rod (11) away from the splitter (14), and the rubber pad is arranged along the length of the piston rod (11).

8. The semiconductor package cosmetic defect automatic handler of claim 1, wherein An adjusting rod (17) is rotatably mounted on the top of the clamping device (5), and the outer wall of the adjusting rod (17) is in contact with the top wall of the clamping device (5). One end of the adjusting rod (17) is always connected to one end of the clamping device (5).

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