Narrow-frame circular display screen and smart watch

By setting a heat diffusion functional layer or a thermal conductive layer on the lower surface of the FPC or between the backlight module and the driver IC, the problem of poor heat dissipation of the driver IC is solved, achieving better heat dissipation effect and ensuring the normal operation of the driver IC and the reliability of the product.

CN224152795UActive Publication Date: 2026-04-21TRULY OPTO ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
TRULY OPTO ELECTRONICS
Filing Date
2025-05-22
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

In traditional displays, when the driver IC is bonded to the FPC, the heat dissipation performance is poor, which affects the normal operation of the driver IC and the reliability of the product.

Method used

A heat dissipation functional layer can be set on the lower surface of the FPC, or a heat-conducting layer can be set between the backlight module and the driver IC to dissipate heat through the backlight module and improve heat dissipation capacity.

Benefits of technology

This effectively reduces the temperature at the driver IC location, ensuring the normal operation of the driver IC and the reliability of the product, thereby improving the product's competitiveness.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a narrow bezel round display screen and smart watch, narrow bezel round display screen includes backlight module and set up the display module above backlight module, display module outward leads out the FPC, FPC bends downward to the backlight module below, the upper surface of FPC below backlight module is provided with drive IC, and the drive IC is provided with drive circuit. And a thermal diffusion functional layer is arranged on the lower surface of the FPC positioned at the driving IC and / or a heat conduction layer is arranged between the backlight module and the driving IC. A thermal diffusion function layer is arranged on the lower surface of the FPC, or a heat conduction layer is arranged between the backlight module and the driving IC, or the thermal diffusion function layer is arranged on the lower surface of the FPC, and the heat conduction layer is arranged between the backlight module and the driving IC. Therefore, the temperature of the position of the driving IC is reduced, the heat dissipation capability of the position of the driving IC is improved, and the normal work of the driving IC and the reliability of a product are ensured.
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Description

Technical Field

[0001] This utility model relates to the field of display technology, and more specifically, to a narrow-bezel circular display screen and a smartwatch. Background Technology

[0002] In traditional TFT displays, the driver IC is typically mounted on a large glass panel. The heat generated by the driver IC during operation is conducted to the large glass panel and the entire TFT module to dissipate heat from the driver IC.

[0003] To achieve ultra-narrow bezels or borderless display effects, especially for circular modules that require perfect roundness, there is no space on large glass surfaces to mount the driver IC. Therefore, the driver IC is mounted on the FPC (Flexible Printed Circuit), i.e., COF (Chip-on-Flush). After assembling the module, the driver IC is bent along with the FPC and pasted to the back of the backlight module. In traditional solutions, the driver IC's heat dissipation is mainly achieved through the FPC and air conduction. However, due to the circuit design requiring the etching of some copper and the low thermal conductivity of the PI (polyimide) cover film, the FPC is relatively thin, resulting in poor heat dissipation performance. Since the driver IC is the heat source of the display, its heat dissipation needs to be addressed when mounted on the FPC; otherwise, it will affect the normal operation of the driver IC and the reliability of the product. Utility Model Content

[0004] The technical problem this invention aims to solve is how to improve the heat dissipation capacity of the driver IC. This is achieved by either having a heat-diffusing layer on the lower surface of the FPC, or a thermally conductive layer between the backlight module and the driver IC, or vice versa. The thermally conductive layer conducts heat generated by the driver IC to the backlight module, which then dissipates the heat. The heat-diffusing layer evenly distributes the heat from the driver IC, achieving uniform heat distribution. This reduces the temperature at the driver IC location, improves its heat dissipation capacity, ensures normal operation of the driver IC and product reliability, and enhances product competitiveness.

[0005] The technical problem to be solved by this utility model is achieved through the following technical solution:

[0006] To solve the above-mentioned technical problems, this utility model provides a narrow-bezel circular display screen, which includes a backlight module and a display module disposed above the backlight module. The display module extends outward with an FPC, and the FPC is bent downward below the backlight module. A driver IC is disposed on the upper surface of the FPC located below the backlight module, and a heat diffusion functional layer is disposed on the lower surface of the FPC located at the driver IC and / or a heat-conducting layer is disposed between the backlight module and the driver IC.

[0007] In a preferred embodiment of the narrow bezel circular display screen provided by this utility model, the heat-conducting layer completely covers the upper surface and sides of the driver IC and extends outward.

[0008] In a preferred embodiment of the narrow-bezel circular display screen provided by this utility model, the backlight module includes a lower frame, which abuts against the heat-conducting layer.

[0009] In a preferred embodiment of the narrow-bezel circular display screen provided by this utility model, the lower frame is made of a metal with high thermal conductivity.

[0010] In a preferred embodiment of the narrow-bezel circular display screen provided by this utility model, the lower frame is made of aluminum or copper.

[0011] In a preferred embodiment of the narrow-bezel circular display screen provided by this utility model, the thermal conductive layer is thermally conductive adhesive, thermally conductive pad, or thermally conductive silicone grease.

[0012] In a preferred embodiment of the narrow-bezel circular display screen provided by this utility model, the heat diffusion functional layer completely covers the driver IC and extends beyond the edge of the driver IC.

[0013] In a preferred embodiment of the narrow-bezel circular display screen provided by this utility model, the heat diffusion functional layer is a graphite sheet, copper foil, or multilayer graphene.

[0014] As a preferred embodiment of the narrow bezel circular display screen provided by this utility model, the display module includes a lower polarizer, a lower substrate, a liquid crystal layer, an upper substrate, and an upper polarizer stacked sequentially from bottom to top. The lower substrate is longer than the upper substrate and extends outward to form a step. The FPC is bonded to the upper surface of the lower substrate located at the step.

[0015] This invention provides a smartwatch that includes a narrow-bezel circular display screen as described in any of the preceding claims.

[0016] This utility model has the following beneficial effects:

[0017] The FPC's lower surface may have a heat-diffusing layer, or a thermally conductive layer between the backlight module and the driver IC; alternatively, the FPC's lower surface may have a heat-diffusing layer, and a thermally conductive layer may be used between the backlight module and the driver IC. The thermally conductive layer conducts heat generated by the driver IC to the backlight module, which then dissipates the heat. The heat-diffusing layer, on the other hand, evenly distributes heat from the driver IC, achieving uniform heat distribution. This reduces the temperature at the driver IC location, improves its heat dissipation capacity, ensures normal operation of the driver IC and product reliability, and enhances product competitiveness. Attached Figure Description

[0018] To more clearly illustrate the solutions in this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a structural schematic diagram of Embodiment 1 of a narrow-bezel circular display screen provided by this utility model.

[0020] Figure 2 This is a schematic diagram of the structure of Embodiment 2 of a narrow-bezel circular display screen provided by this utility model.

[0021] Figure 3 This is a structural schematic diagram of Embodiment 3 of a narrow-bezel circular display screen provided by this utility model.

[0022] Figure 4 for Figure 1 A structural diagram of the display module.

[0023] Explanation of icon numbers:

[0024] Backlight module 1; Display module 2; FPC 3; Driver IC 4; Thermal diffusion functional layer 5; Thermal conductive layer 6;

[0025] Lower polarizer 21; lower substrate 22; upper substrate 23; upper polarizer 24. Detailed Implementation

[0026] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0027] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] This utility model provides a narrow-bezel circular display screen, which includes a backlight module and a display module disposed above the backlight module. The display module extends outward with an FPC, and the FPC bends downward to below the backlight module. A driver IC is disposed on the upper surface of the FPC located below the backlight module, and a heat diffusion functional layer is disposed on the lower surface of the FPC located at the driver IC and / or a heat-conducting layer is disposed between the backlight module and the driver IC.

[0030] The FPC's lower surface may have a heat-diffusing layer, or a thermally conductive layer between the backlight module and the driver IC; alternatively, the FPC's lower surface may have a heat-diffusing layer, and a thermally conductive layer may be used between the backlight module and the driver IC. The thermally conductive layer conducts heat generated by the driver IC to the backlight module, which then dissipates the heat. The heat-diffusing layer, on the other hand, evenly distributes heat from the driver IC, achieving uniform heat distribution. This reduces the temperature at the driver IC location, improves its heat dissipation capacity, ensures normal operation of the driver IC and product reliability, and enhances product competitiveness.

[0031] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. The present invention will be described in detail below with reference to the accompanying drawings and embodiments, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0032] Example 1, please refer to Figure 1 This utility model provides a narrow-bezel circular display screen, which includes a backlight module 1 and a display module 2 disposed above the backlight module 1. An FPC 3 extends outward from the display module 2 and bends downward below the backlight module 1. A driver IC 4 is disposed on the upper surface of the FPC 3 located below the backlight module 1, and a heat dissipation functional layer 5 is disposed on the lower surface of the FPC 3 located at the driver IC 4. Because the heat dissipation functional layer 5 is disposed on the lower surface of the FPC 3, the heat dissipation functional layer 5 can evenly diffuse the heat of the driver IC 4, thereby reducing the temperature at the location of the driver IC 4, improving the heat dissipation capacity of the driver IC 4, ensuring the normal operation of the driver IC 4 and the reliability of the product, and improving the competitiveness of the product.

[0033] Furthermore, the heat diffusion functional layer 5 completely covers the driver IC4 and extends beyond the edge of the driver IC4, thereby increasing the heat dissipation area and improving the heat dissipation capacity. This reduces the temperature at the location of the driver IC4, improves the heat dissipation capacity at the driver IC4, ensures the normal operation of the driver IC4 and the reliability of the product, and enhances the competitiveness of the product.

[0034] Furthermore, the heat diffusion functional layer 5 is made of graphite sheet, copper foil or multilayer graphene, all of which have good heat diffusion capabilities and can effectively dissipate heat evenly and avoid heat accumulation.

[0035] Example 2, please refer to Figure 2 The difference between this embodiment and embodiment 1 is that the lower surface of FPC3 does not have a heat diffusion functional layer 5, but a heat-conducting layer 6 is provided between the backlight module 1 and the driver IC4. The heat-conducting layer 6 can conduct the heat generated by the driver IC4 to the backlight module 1, and then dissipate the heat through the backlight module 1, thereby reducing the temperature at the location of the driver IC4, improving the heat dissipation capacity at the driver IC4, ensuring the normal operation of the driver IC4 and the reliability of the product, and improving the competitiveness of the product.

[0036] Furthermore, the thermal conductive layer 6 completely covers the upper surface and sides of the driver IC4 and extends outwards, so that the heat on the upper surface and sides of the driver IC4 can be transferred out, increasing the thermal conductive area and improving the thermal conductivity, thereby reducing the temperature at the location of the driver IC4, improving the heat dissipation capacity at the driver IC4, ensuring the normal operation of the driver IC4 and the reliability of the product, and improving the competitiveness of the product.

[0037] Furthermore, the backlight module 1 includes a lower frame that abuts against the heat-conducting layer 6 to improve heat conduction. The lower frame is made of a metal with high thermal conductivity. In this embodiment, the lower frame is made of aluminum, copper, or a casting. Aluminum and copper have high thermal conductivity and good thermal performance, which can quickly dissipate heat and improve heat dissipation capacity. This reduces the temperature at the location of the driver IC4, improves the heat dissipation capacity at the driver IC4, ensures the normal operation of the driver IC4 and the reliability of the product, and enhances the competitiveness of the product.

[0038] Furthermore, the thermal conductive layer 6 is made of thermally conductive adhesive, thermally conductive pad, or thermally conductive grease, all of which have good thermal conductivity and can quickly transfer the heat from the driver IC4 to the backlight module 1, thus possessing excellent heat dissipation capabilities.

[0039] Example 3, please refer to Figure 3 The difference between this embodiment and Embodiment 1 is that the lower surface of FPC3 not only has a heat diffusion layer 5, but also a heat-conducting layer 6 between the backlight module 1 and the driver IC4. The heat-conducting layer 6 can conduct the heat generated by the driver IC4 to the backlight module 1, and then dissipate the heat through the backlight module 1. The heat diffusion layer 5 can evenly diffuse the heat from the driver IC4, achieving uniform heat distribution. This reduces the temperature at the driver IC4 location, improves the heat dissipation capacity of the driver IC4, ensures the normal operation of the driver IC4 and the reliability of the product, and enhances the product's competitiveness.

[0040] Please see Figure 4 Furthermore, the display module 2 includes a lower polarizer 21, a lower substrate 22, a liquid crystal layer, an upper substrate 23, and an upper polarizer 24, which are stacked sequentially from bottom to top. The lower substrate 22 is longer than the upper substrate 23 and extends outward to form a step. The FPC 3 is bonded to the upper surface of the lower substrate 22 located at the step.

[0041] This utility model also provides a smartwatch, which includes a narrow-bezel circular display screen as described in any of the above claims.

[0042] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] Obviously, the embodiments described above are only some embodiments of this application, not all embodiments. The accompanying drawings show preferred embodiments of this application, but do not limit the patent scope of this application. This application can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this application's specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the scope of patent protection of this application.

Claims

1. A narrow-bezel circular display screen, characterized by, It includes a backlight module and a display module disposed above the backlight module. The display module extends outward with an FPC. The FPC bends downward to below the backlight module. A driver IC is disposed on the upper surface of the FPC located below the backlight module. A heat diffusion functional layer is disposed on the lower surface of the FPC located at the driver IC and / or a heat-conducting layer is disposed between the backlight module and the driver IC.

2. The narrow-bezel circular display of claim 1, wherein, The thermal conductive layer completely covers the upper surface and sides of the driver IC and extends outward.

3. The narrow-bezel circular display of claim 1, wherein, The backlight module includes a lower frame that abuts against the thermally conductive layer.

4. The narrow-bezel circular display of claim 3, wherein, The lower frame is made of a metal with high thermal conductivity.

5. The narrow-bezel circular display defined in claim 4, wherein The lower frame is made of aluminum or copper.

6. The narrow-bezel circular display screen according to claim 1, characterized in that, The thermally conductive layer is a thermally conductive adhesive, a thermally conductive pad, or a thermally conductive silicone grease.

7. The narrow-bezel circular display of claim 1, wherein, The heat diffusion functional layer completely covers the driver IC and extends beyond the edge of the driver IC.

8. The narrow-bezel circular display of claim 1, wherein, The heat-diffusing functional layer is a graphite sheet, copper foil, or multilayer graphene.

9. The narrow-bezel circular display of claim 1, wherein, The display module includes a lower polarizer, a lower substrate, a liquid crystal layer, an upper substrate, and an upper polarizer stacked sequentially from bottom to top. The lower substrate is longer than the upper substrate and extends outward to form a step. The FPC is bonded to the upper surface of the lower substrate located at the step.

10. A smart watch, characterized by It includes a narrow-bezel circular display as described in any one of claims 1-9.