Heat dissipation structure and terminal device

Abstract

A heat dissipation structure comprises a first cover plate, a second cover plate, a heat pipe and a first capillary structure. The second cover plate and the first cover plate form an accommodating cavity; the heat pipe is located on the side, deviating from the first cover plate, of the second cover plate. The first capillary structure comprises a first part and a second part which are connected with each other, the first part is located in the heat pipe, and the second part penetrates through the second cover plate and extends into the containing cavity. The utility model further provides a terminal device. The first capillary structure of the heat dissipation structure can quickly guide the condensed working medium from the condensation area to the heat source area, circulation of the working medium is facilitated, and therefore the heat dissipation performance of the heat dissipation structure can be improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to heat dissipation structures and terminal devices. Background Technology

[0002] With the development of AI technology, the computing power of servers has increased, the operating power of chips has increased, and the heat flux density has become greater. In traditional heat dissipation structures, there are difficulties in connecting the capillary structures in different areas, which leads to obstruction of gas and liquid flow within the heat dissipation structure, reduces the heat transfer performance of the heat dissipation structure, and makes it difficult to meet the heat dissipation requirements. Utility Model Content

[0003] Therefore, it is necessary to provide a heat dissipation structure with good heat dissipation performance to solve the above problems.

[0004] A heat dissipation structure includes a first cover plate, a second cover plate, a heat pipe, and a first capillary structure. The second cover plate and the first cover plate form a receiving cavity; the heat pipe is located on the side of the second cover plate opposite to the first cover plate; the first capillary structure includes a first part and a second part connected to each other, the first part being located in the heat pipe, and the second part passing through the second cover plate and extending into the receiving cavity.

[0005] In one possible embodiment of this application, the second portion includes a notch formed by a recess in the second portion from one end away from the first portion toward the side where the second portion is located.

[0006] In one possible embodiment of this application, the heat dissipation structure further includes a second capillary structure located in the receiving cavity and on the surface of the first cover plate, with the second portion connected to the second capillary structure.

[0007] In one possible embodiment of this application, the heat dissipation structure further includes a third capillary structure located in the receiving cavity and on the surface of the second cover plate.

[0008] In one possible embodiment of this application, the first cover plate includes a first main body and a support column, the first main body and the second cover plate forming a receiving cavity; the support column is located in the receiving cavity and connects the first main body and the second cover plate.

[0009] In one possible embodiment of this application, the heat dissipation structure further includes a powder ring, which is sleeved on the support column and connects the second capillary structure and the third capillary structure.

[0010] In one possible implementation of this application, the projection of the first part onto the first cover plate is located within the projection area of ​​the second part onto the first cover plate.

[0011] In one possible embodiment of this application, the second cover plate has a through hole, through which the heat pipe communicates with the receiving cavity, and the heat pipe extends toward the side away from the first cover plate.

[0012] In one possible embodiment of this application, a receiving groove is provided on the second cover plate. The receiving groove is formed by the recess of the second cover plate toward the surface of the first cover plate. The receiving groove surrounds the through hole and communicates with the through hole. The heat pipe includes a second body portion and a flange. The flange surrounds the second body portion. The second body portion passes through the through hole into the second cover plate. The flange is received in the receiving groove and connected to the second cover plate.

[0013] A terminal device, the terminal device including a heat dissipation structure.

[0014] The heat dissipation structure provided in this application embodiment has a first capillary structure in the heat pipe extending into the receiving cavity, which can quickly guide the condensed working medium from the condensation area to the heat source area, which is beneficial to the circulation of the working medium and thus can improve the heat dissipation performance of the heat dissipation structure. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the terminal device provided in the embodiments of this application.

[0016] Figure 2 for Figure 1 The exploded view of the heat dissipation structure shown.

[0017] Figure 3 for Figure 1 The exploded view of the heat dissipation structure shown in the image is taken from another angle.

[0018] Figure 4 for Figure 1 The diagram shows a cross-sectional view of the heat dissipation structure along the AA direction.

[0019] Figure 5 This is a schematic diagram of the structure of the first capillary structure made by using a mold, provided in an embodiment of this application. Detailed Implementation

[0020] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0022] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0023] Please see Figure 1 This application provides a terminal device 200, which includes a working element 210 and a heat dissipation structure 100. The working element 210 and the heat dissipation structure 100 are connected, and the working element 210 can be fixed to the heat dissipation structure 100 by means of nuts or other fasteners. The working element 210 generates heat during operation. The working element 210 can be a chip, battery, CPU, etc. The heat dissipation structure 100 is used to quickly dissipate the heat generated by the working element 210 to maintain the working environment of the working element 210 within a suitable temperature range.

[0024] Please see Figure 2 , Figure 3 and Figure 4 The heat dissipation structure 100 may include a second cover plate 20, a first cover plate 10, a heat pipe 30, and a working medium (not shown). The second cover plate 20 and the first cover plate 10 together form a receiving cavity 25. The heat pipe 30 is connected to the receiving cavity 25. The working medium is located in the receiving cavity 25 and the heat pipe 30. The working medium can undergo a phase change and circulate within the receiving cavity 25 and the heat pipe 30 to achieve a heat dissipation effect. The side of the heat dissipation structure 100 and the side closest to the working element 210 is the heat source region M, and the side of the heat pipe 30 is the condensation region N.

[0025] In some embodiments, the working medium can be water, ethanol, etc. When the heat dissipation structure 100 is working, the working medium absorbs heat and evaporates to form a gaseous state in the heat source region M, and releases heat and condenses into a liquid state in the condensation section. The efficient transfer of heat is achieved through the phase change process of the liquid.

[0026] The second cover plate 20 is generally plate-shaped. The first cover plate 10 has a groove, and the second cover plate 20 is disposed on the surface of the first cover plate 10 where the groove is formed. The second cover plate 20 and the first cover plate 10 are fixed together to form a receiving cavity 25. The working element 210 is located on the side of the first cover plate 10 away from the second cover plate 20. The working element 210 can be directly fixed to the first cover plate 10, or it can be indirectly connected by a heat-conducting element between the first cover plate 10 and the working element 210.

[0027] The second cover plate 20 has through holes 21, the number of which is the same as the number of heat pipes 30. The heat source is located on the side of the second cover plate 20 away from the first cover plate 10, and the heat pipes 30 extend toward the side away from the first cover plate 10. The heat pipes 30 are hollow inside and have openings. The openings of the heat pipes 30 correspond to the through holes 21, and the through holes 21 of the heat pipes 30 are connected to the receiving cavity 25.

[0028] The second cover plate 20 is provided with a receiving groove 22, which is formed by a recess in the surface of the second cover plate 20 facing the first cover plate 10. The receiving groove 22 surrounds the through hole 21 and communicates with the through hole 21. The heat pipe 30 includes a second body portion 31 and a flange 32. The second body portion 31 is generally cylindrical with one end sealed and the other end open. The flange 32 is located at the open end of the second body portion 31 and surrounds the second body portion 31. The second body portion 31 passes through the through hole 21 into the second cover plate 20. The flange 32 is received in the receiving groove 22 and connected to the second cover plate 20, which helps to improve the tightness of the connection between the second cover plate 20 and the heat pipe 30.

[0029] The heat dissipation structure 100 may further include a first capillary structure 40, a second capillary structure (not shown), and a third capillary structure (not shown). The first capillary structure 40 is located in the heat pipe 30 and extends into the receiving cavity 25; the second capillary structure is located in the receiving cavity 25 and is located on the surface of the first cover plate 10; the third capillary structure is located in the receiving cavity 25 and is located on the surface of the second cover plate 20. The first capillary structure 40, the second capillary structure, and the third capillary structure are typically composed of tiny capillary channels. The material of the capillary structure can be copper, aluminum, etc. The capillary structure facilitates the return of the working medium from the condensation zone N to the heat source zone M, which is beneficial to the circulation of the working medium.

[0030] The first capillary structure 40 may include a first portion 41 and a second portion 42. The first portion 41 is located in the heat pipe 30, and its interior is hollow. The first portion 41 is attached to the inner wall of the heat pipe 30. The second portion 42 protrudes from the heat pipe 30, and the portion of the second portion 42 protruding from the heat pipe 30 extends into the receiving cavity 25. The end of the second portion 42 opposite to the first portion 41 is connected to the second capillary structure, which facilitates the rapid return of the working medium condensed in the heat pipe 30 to the heat source area M through the first capillary structure 40 for the next cycle, thereby improving the heat dissipation efficiency and temperature uniformity of the heat dissipation structure 100.

[0031] The second part 42 has a notch 43, which is formed by a recess in the second part 42 from the end opposite to the first part 41 toward the side where the second part 42 is located. The notch 43 is connected to the receiving cavity 25, which means that the inside and outside of the first capillary structure 40 are connected through the notch 43. The notch 43 is used to realize the gas circulation in the inside and outside (i.e., the receiving cavity 25) of the first capillary structure 40, thereby improving the heat dissipation efficiency and temperature uniformity of the heat dissipation structure 100.

[0032] The projection of the first part 41 onto the first cover plate 10 is located within the projection area of ​​the second part 42 onto the first cover plate 10, which is equivalent to being in the plane of the second cover plate 20. The second part 42 protrudes relative to the first part 41, which helps to increase the connection area between the second part 42 and the second capillary structure, thereby increasing the return flow rate of the working medium and thus increasing the heat dissipation efficiency and temperature uniformity of the heat dissipation structure 100.

[0033] Please see Figure 5 The second part 42 of the first capillary structure 40 can be formed by sintering using a mold 60 with a specific structure. The mold 60 is provided with a receiving hole of a specific shape. Before sintering, the raw material is placed in the receiving hole for sintering to form the second part 42.

[0034] The first cover plate 10 includes a first main body 11 and a support column 12. The first main body 11 forms a groove, and the second cover plate 20 and the first main body 11 form a receiving cavity 25. The support column 12 is connected to the first main body 11 and extends from the surface of the first main body 11 toward the second cover plate 20. The support column 12 serves as a support, ensuring the structural strength of the heat dissipation structure 100 and maintaining the shape of the receiving cavity 25, so as to ensure that the heat dissipation structure 100 will not deform due to pressure or other factors during operation. The support column 12 can also serve as an auxiliary channel for heat conduction, further promoting the uniform distribution of heat in the heat dissipation structure 100, enabling the heat dissipation structure 100 to maintain a relatively uniform temperature over a large area, effectively solving the problem of local overheating and improving the temperature uniformity of the heat dissipation structure 100.

[0035] The heat dissipation structure 100 may further include a powder ring 50, which is sleeved on the support column 12 and connects the second capillary structure and the third capillary structure. On one hand, the powder ring 50's capillary structure increases the surface area and capillary force of the capillary structure, effectively guiding the working medium's flow within the heat dissipation structure 100. This allows the condensed working medium to quickly return to the heat source region M via capillary action, ensuring smooth circulation and improving the heat dissipation efficiency and temperature uniformity of the heat dissipation structure 100. On the other hand, the powder ring 50 increases the contact area between the support column 12 and the working medium, facilitating more thorough heat exchange between the working medium and the support column 12 during evaporation and condensation. This allows the working medium to absorb and release heat more quickly, further improving the heat transfer rate and temperature uniformity of the heat dissipation structure 100.

[0036] The heat dissipation structure 100 provided in this application embodiment has a first capillary structure 40 located in the heat pipe 30 extending into the receiving cavity 25, which can quickly guide the condensed working medium from the condensation zone N to the heat source zone M, which is beneficial to the circulation of the working medium and thus can improve the heat dissipation performance of the heat dissipation structure 100.

[0037] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the scope of the technical solutions of this application.

Claims

1. A heat dissipating structure, characterized by comprising: include: First cover plate; The second cover plate, together with the first cover plate, forms a receiving cavity; A heat pipe is located on the side of the second cover plate opposite to the first cover plate; as well as The first capillary structure includes a first part and a second part that are interconnected, the first part being located in the heat pipe and the second part passing through the second cover plate and extending into the receiving cavity.

2. The heat dissipating structure according to claim 1, wherein The second part includes a notch formed by a recess in the second part from one end opposite to the first part toward the side where the second part is located.

3. The heat dissipating structure according to claim 1 or 2, characterized by, The heat dissipation structure further includes a second capillary structure, which is located in the receiving cavity and on the surface of the first cover plate, and the second part is connected to the second capillary structure.

4. The heat dissipating structure according to claim 3, wherein The heat dissipation structure further includes a third capillary structure located in the receiving cavity and on the surface of the second cover plate.

5. The heat dissipating structure according to claim 4, wherein The first cover plate includes a first main body and a support column, the first main body and the second cover plate forming the receiving cavity; the support column is located in the receiving cavity and connects the first main body and the second cover plate.

6. The heat dissipating structure according to claim 5, wherein The heat dissipation structure also includes a powder ring, which is sleeved on the support column and connects the second capillary structure and the third capillary structure.

7. The heat dissipating structure according to any one of claims 1, 2, 4-6, wherein The projection of the first part onto the first cover plate is located within the projection area of ​​the second part onto the first cover plate.

8. The heat dissipating structure according to any one of claims 1, 2, 4-6, wherein The second cover plate has a through hole, through which the heat pipe communicates with the receiving cavity, and the heat pipe extends toward the side away from the first cover plate.

9. The heat dissipating structure according to claim 8, wherein The second cover plate is provided with a receiving groove, which is formed by the recess of the second cover plate toward the surface of the first cover plate. The receiving groove surrounds the through hole and communicates with the through hole. The heat pipe includes a second body portion and a flange, which surrounds the second body portion. The second body portion passes through the through hole into the second cover plate, and the flange is received in the receiving groove and connected to the second cover plate.

10. A terminal device, characterized by comprising: The terminal device includes the heat dissipation structure as described in any one of claims 1 to 9.

Images